Z1M100-RM-10_17 [SUPERWORLD]

Ferrite Chip Bead – Z1 Large Current Application Series;
Z1M100-RM-10_17
型号: Z1M100-RM-10_17
厂家: SUPERWORLD ELECTRONICS    SUPERWORLD ELECTRONICS
描述:

Ferrite Chip Bead – Z1 Large Current Application Series

文件: 总5页 (文件大小:256K)
中文:  中文翻译
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P1  
Ferrite Chip Bead Z1 Large Current Application Series  
1. Part No. Expression:  
Z 1 M 1 0 0 - R M -  
(a)(b)(c) (d) (e)(f) (g)  
(a) Series Code  
(e) R: Reel  
(b) Dimension Code  
(c) Material Code  
(d) Impedance Code  
(f) Rated Current  
(g) Internal Control Number  
2. Configuration & Dimensions :  
Unit: mm  
A
B
C
D
G
H
L
1.00 ± 0.10  
0.50 ± 0.10  
0.50 ± 0.10  
0.25 ± 0.10  
0.40 Ref.  
0.55 Ref.  
1.50 Ref.  
3. Schematic  
4. Material List  
NOTE: Specifications subject to change without notice. Please check our website for latest information.  
Proprietary and Confidential  
Document of Superworld  
10/01/2017  
P2  
Ferrite Chip Bead Z1 Large Current Application Series  
5. General Specification  
a) Operating Temperature: - 40°C to +125°C (including self-temperature rise)  
b) Storage Condition (component in its packaging)  
i) Temperature: Less than 40°C  
ii) Humidity: 60% RH  
6. Electrical Characteristics  
Test Frequency  
DCR  
() Max.  
Rated Current  
(mA) Max.  
Part No.  
Impedance ()  
(MHz)  
100  
Z1M100-RM-10  
Z1K121-RL-10  
Z1K221-RK-10  
10 ± 25%  
120 ± 25%  
220 ± 25%  
0.05  
0.095  
0.15  
2500  
2000  
1500  
100  
100  
7. Characteristics Curves  
Z1K121RL10  
Z1M100RM10  
Z1K221RK10  
NOTE: Specifications subject to change without notice. Please check our website for latest information.  
Proprietary and Confidential  
Document of Superworld  
10/01/2017  
P3  
Ferrite Chip Bead Z1 Large Current Application Series  
8. Soldering  
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand  
soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.  
Note:  
If wave soldering is used, there will be some risk.  
Re-flow soldering temperatures below 240°C, there will be non-wetting risk  
8-1.1 Solder Re-flow:  
Recommended temperature profiles for lead free re-flow soldering in Figure 1.  
8-1.2 Soldering Iron (Figure 2):  
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In  
the event that a soldering iron must be employed the following precautions are recommended.  
Note:  
a) Preheat circuit and products to 150°C.  
b) 350°C tip temperature (Max.)  
c) Never contact the ceramic with the iron tip  
d) 1.0mm tip diameter (Max.)  
e) Use a 20 watt soldering iron with tip diameter of 1.0mm  
f) Limit soldering time to 4~5 secs.  
8-1.3 Soldering Volume:  
Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding  
solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to  
be exceeding as shown in the Figure 3. Minimum fillet height = soldering thickness + 25% product height.  
NOTE: Specifications subject to change without notice. Please check our website for latest information.  
Proprietary and Confidential  
Document of Superworld  
10/01/2017  
P4  
Ferrite Chip Bead Z1 Large Current Application Series  
9. Packaging Information  
9-1. Reel Dimension  
Type  
A (mm)  
B (mm)  
C (mm)  
D (mm)  
60.0 ± 2.0  
7” x 8mm  
9.0 ± 0.5  
13.5 ± 0.5  
178.0± 2.0  
9-2. Tape Dimension  
0
P :4±0.1  
t
P
A0  
Ko  
Size  
Z1  
Bo(mm)  
Ao(mm)  
Ko(mm)  
P(mm)  
t(mm)  
1.12±0.03 0.62±0.03  
0.60±0.03  
2.0±0.05  
0.60±0.03  
9-3. Packaging Quantity  
Size  
Z1  
Chip/ Reel  
Inner Box  
Middle Box  
Carton  
10,000  
50,000  
250,000  
500,000  
NOTE: Specifications subject to change without notice. Please check our website for latest information.  
Proprietary and Confidential  
Document of Superworld  
10/01/2017  
P5  
Ferrite Chip Bead Z1 Large Current Application Series  
9-4. Tearing Off Force  
The force for tearing off cover tape is 15 to 60 grams in the arrow  
direction under the following conditions.  
Room Temp  
(°C)  
Room  
Humidity (%)  
Room atm  
(hPa)  
Tearing Speed  
(mm/min)  
5 - 35  
45 - 85  
860 - 1060  
300  
Application Notice:  
1. Storage Conditions:  
To maintain the solderabililty of terminal electrodes:  
a) Recommended products should be used within 12 months from the time of delivery.  
b) The packaging material should be kept where no chlorine or sulfur exists in the air.  
2. Transportation:  
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.  
b) Vacuum pick up is strongly recommended for individual components.  
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.  
NOTE: Specifications subject to change without notice. Please check our website for latest information.  
Proprietary and Confidential  
Document of Superworld  
10/01/2017  

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