Z1M100-RM-10_17 [SUPERWORLD]
Ferrite Chip Bead â Z1 Large Current Application Series;型号: | Z1M100-RM-10_17 |
厂家: | SUPERWORLD ELECTRONICS |
描述: | Ferrite Chip Bead â Z1 Large Current Application Series |
文件: | 总5页 (文件大小:256K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
P1
Ferrite Chip Bead – Z1 Large Current Application Series
1. Part No. Expression:
Z 1 M 1 0 0 - R M -
(a)(b)(c) (d) (e)(f) (g)
(a) Series Code
(e) R: Reel
(b) Dimension Code
(c) Material Code
(d) Impedance Code
(f) Rated Current
(g) Internal Control Number
2. Configuration & Dimensions :
Unit: mm
A
B
C
D
G
H
L
1.00 ± 0.10
0.50 ± 0.10
0.50 ± 0.10
0.25 ± 0.10
0.40 Ref.
0.55 Ref.
1.50 Ref.
3. Schematic
4. Material List
NOTE: Specifications subject to change without notice. Please check our website for latest information.
Proprietary and Confidential
Document of Superworld
10/01/2017
P2
Ferrite Chip Bead – Z1 Large Current Application Series
5. General Specification
a) Operating Temperature: - 40°C to +125°C (including self-temperature rise)
b) Storage Condition (component in its packaging)
i) Temperature: Less than 40°C
ii) Humidity: 60% RH
6. Electrical Characteristics
Test Frequency
DCR
(Ω) Max.
Rated Current
(mA) Max.
Part No.
Impedance (Ω)
(MHz)
100
Z1M100-RM-10
Z1K121-RL-10
Z1K221-RK-10
10 ± 25%
120 ± 25%
220 ± 25%
0.05
0.095
0.15
2500
2000
1500
100
100
7. Characteristics Curves
Z1K121‐RL‐10
Z1M100‐RM‐10
Z1K221‐RK‐10
NOTE: Specifications subject to change without notice. Please check our website for latest information.
Proprietary and Confidential
Document of Superworld
10/01/2017
P3
Ferrite Chip Bead – Z1 Large Current Application Series
8. Soldering
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand
soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note:
If wave soldering is used, there will be some risk.
Re-flow soldering temperatures below 240°C, there will be non-wetting risk
8-1.1 Solder Re-flow:
Recommended temperature profiles for lead free re-flow soldering in Figure 1.
8-1.2 Soldering Iron (Figure 2):
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In
the event that a soldering iron must be employed the following precautions are recommended.
Note:
a) Preheat circuit and products to 150°C.
b) 350°C tip temperature (Max.)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (Max.)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 4~5 secs.
8-1.3 Soldering Volume:
Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding
solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to
be exceeding as shown in the Figure 3. Minimum fillet height = soldering thickness + 25% product height.
NOTE: Specifications subject to change without notice. Please check our website for latest information.
Proprietary and Confidential
Document of Superworld
10/01/2017
P4
Ferrite Chip Bead – Z1 Large Current Application Series
9. Packaging Information
9-1. Reel Dimension
Type
A (mm)
B (mm)
C (mm)
D (mm)
60.0 ± 2.0
7” x 8mm
9.0 ± 0.5
13.5 ± 0.5
178.0± 2.0
9-2. Tape Dimension
0
P :4±0.1
t
P
A0
Ko
Size
Z1
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
1.12±0.03 0.62±0.03
0.60±0.03
2.0±0.05
0.60±0.03
9-3. Packaging Quantity
Size
Z1
Chip/ Reel
Inner Box
Middle Box
Carton
10,000
50,000
250,000
500,000
NOTE: Specifications subject to change without notice. Please check our website for latest information.
Proprietary and Confidential
Document of Superworld
10/01/2017
P5
Ferrite Chip Bead – Z1 Large Current Application Series
9-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams in the arrow
direction under the following conditions.
Room Temp
(°C)
Room
Humidity (%)
Room atm
(hPa)
Tearing Speed
(mm/min)
5 - 35
45 - 85
860 - 1060
300
Application Notice:
1. Storage Conditions:
To maintain the solderabililty of terminal electrodes:
a) Recommended products should be used within 12 months from the time of delivery.
b) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation:
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) Vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE: Specifications subject to change without notice. Please check our website for latest information.
Proprietary and Confidential
Document of Superworld
10/01/2017
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