STW82100B [STMICROELECTRONICS]
RF down converter with embedded integer-N synthesizer; 射频降频转换器采用嵌入式整数N频率合成型号: | STW82100B |
厂家: | ST |
描述: | RF down converter with embedded integer-N synthesizer |
文件: | 总67页 (文件大小:753K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
STW82100B
RF down converter with embedded integer-N synthesizer
Datasheet −production data
Features
■ High linearity:
– IIP3: +25.5 dBm
– 2FRF-2FLO spurious rejection: 77 dBc
VFQFPN-44
■ Noise figure:
Applications
– NF: 10.5 dB
■ Cellular infrastructure equipment:
– IF sampling receivers
■ Conversion gain
– CG: 8 dB
– Digital PA linearization loops
■ RF range: 1620 MHz to 2400 MHz
■ Other wireless communication systems.
■ Wide IF amplifier frequency range: 70 MHz to
400 MHz
Table 1.
Device summary
■ Integrated RF balun with internal matching
Part number
Package
Packaging
Tray
Tape and reel
■ Dual differential integrated VCOs with
STW82100B
VFQFPN-44
VFQFPN-44
automatic center frequency calibration:
STW82100BTR
– LOA: 1650 to 1950 MHz
– LOB: 2050 to 2370 MHz
Description
■ Embedded integer-N synthesizer
– Dual modulus programmable prescaler
(16/17 or 19/20)
– Programmable reference frequency divider
(10 bits)
The STMicroelectronics STW82100B is an
integrated down converter providing 8 dB of gain,
10.5 dB NF, and a very high input linearity by
means of its passive mixer.
– Adjustable charge pump current
– Digital lock detector
– Excellent integrated phase noise
– Fast lock time: 150 µs
Embedding two wide band auto calibrating VCOs
and an integer-N synthesizer, the STW82100B is
suitable for both Rx and Tx requirements for
Cellular infrastructure equipment.
The integrated RF balun and internal matching
permit direct 50 ohm single-ended interface to RF
port. The IF output is suitable for driving 200-ohm
impedance filters.
■ Integrated DAC with dual current output
■ Supply: 3.3 V and 5 V analog,
3.3 V Digital
2
■ Dual digital bus interface: SPI and I C bus (fast
By embedding a DAC with dual current output to
drive an external PIN diode attenuator, the
STW82100B replaces several costly discrete
components and offers a significant footprint
reduction.
mode) with 3 bit programmable address
(1101A A A )
2
1 0
■ Process: 0.35 µm BICMOS SiGe
o
■ Operating temperature range -40 to +85 C
The STW82100B device is designed with
STMicroelectronics advanced 0.35 µm
SiGe process. Its performance is specified over a
-40 °C to +85 °C temperature range.
■ 44-lead exposed pad VFQFPN
package7x7x1.0 mm
May 2012
Doc ID 018355 Rev 5
1/67
This is information on a product in full production.
www.st.com
1
Contents
STW82100B
Contents
1
2
3
4
5
6
7
8
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Test conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Typical performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
8.1
Circuit description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
8.1.1
8.1.2
8.1.3
8.1.4
8.1.5
8.1.6
8.1.7
8.1.8
8.1.9
Reference input stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Reference divider . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Prescaler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
A and B counters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Phase frequency detector (PFD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Lock detect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Mute until lock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Charge pump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Voltage controlled oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
8.1.10 Output stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
8.1.11 External VCO buffer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
8.1.12 Mixer and IF amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
8.1.13 Dual output current DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
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9
I2C bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
9.1
I2C general features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
9.1.1
9.1.2
9.1.3
9.1.4
9.1.5
9.1.6
9.1.7
Data validity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
START and STOP conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Byte format and acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Device addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Single-byte write mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Multi-byte write mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Current byte address read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
9.2
I2C timing specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
9.2.1
9.2.2
9.2.3
Data and clock timing specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
2
I C START and STOP timing specification . . . . . . . . . . . . . . . . . . . . . . 36
2
I C acknowledge timing specification . . . . . . . . . . . . . . . . . . . . . . . . . . 37
9.3
9.4
I2C registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
2
9.3.1
I C register summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
2
9.3.2
I C register definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Device calibration through the I2C interface . . . . . . . . . . . . . . . . . . . . . . . 45
2
9.4.1
9.4.2
9.4.3
VCO calibration procedure (I C interface) . . . . . . . . . . . . . . . . . . . . . . . 45
2
Power ON sequence (I C interface) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
2
VCO calibration auto-restart procedure (I C interface) . . . . . . . . . . . . . 46
10
SPI digital interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
10.1 SPI general features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
10.2 SPI timing specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
10.2.1 Data, clock and load timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
10.3 SPI registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
10.3.1 SPI register summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
10.3.2 SPI register definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
10.4 Device calibration through the SPI interface . . . . . . . . . . . . . . . . . . . . . . 53
10.4.1 VCO calibration procedure (SPI interface) . . . . . . . . . . . . . . . . . . . . . . . 53
10.4.2 Power ON sequence (SPI interface) . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
10.4.3 VCO calibration auto-restart procedure (SPI interface) . . . . . . . . . . . . . 54
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Contents
STW82100B
11
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
11.1 Application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
11.2 Standard Mode Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
11.3 Diversity mode operation with same LO frequency . . . . . . . . . . . . . . . . . 58
11.4 Diversity mode operation with different LO frequencies . . . . . . . . . . . . . . 59
11.5 External VCO standard mode operation . . . . . . . . . . . . . . . . . . . . . . . . . 60
11.6 External VCO diversity mode operation with same LO . . . . . . . . . . . . . . 61
12
13
14
Evaluation kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
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List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Device summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pin list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Operating conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Digital logic levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Down converter mixer and IF amplifier electrical characteristics . . . . . . . . . . . . . . . . . . . . 15
Pin diode attenuator driver (dual output current DAC) electrical characteristics. . . . . . . . . 16
Integer-N synthesizer electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Phase noise performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Current values for CPSEL[2:0] selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
VCOA performance against amplitude setting (frequency = 3.6 GHz) . . . . . . . . . . . . . . . . 30
VCOB performance against amplitude setting (frequency = 4.3 GHz) . . . . . . . . . . . . . . . . 30
Suggested CAP[2:0] values for LO Frequency range mixer. . . . . . . . . . . . . . . . . . . . . . . . 31
Linearity performance against IFAMP[1:0] configuration (typical condition). . . . . . . . . . . . 32
2
I C data and clock timing parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
2
I C START and STOP timing parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
2
I C acknowledge timing parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
2
I C register list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Address decoder and outputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
SPI timing parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
SPI register list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Application circuit component values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Evaluation kit order code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
VFQFPN-44 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
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List of figures
STW82100B
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
STW82100B block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
STW82100B pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Conversion gain against RF frequency. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Noise figure against RF frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
IIP3 against RF frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2RF-2LO response against RF frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
LOA (VCOA div. by 2) closed-loop phase noise at 1.8 GHz
(F
= 200 kHz, I = 2 mA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
STEP
CP
Figure 8.
LOB (VCOB div. by 2) closed-loop phase noise at 2.2 GHz
(F = 200 kHz, I = 2 mA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
STEP
CP
Figure 9.
Reference frequency input buffer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 10. VCO divider diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 11. PFD diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 12. Loop filter connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 13. VCO typical sub-band characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 14. Data validity waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 15. START and STOP condition waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 16. Byte format and acknowledge waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
2
Figure 17. I C data and clock waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
2
Figure 18. I C START and STOP timing waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
2
Figure 19. I C acknowledge timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
2
Figure 20. I C first programming timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Figure 21. SPI input and output bit order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Figure 22. SPI data structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Figure 23. SPI timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Figure 24. SPI first programming timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Figure 25. Typical STW82100B application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Figure 26. Standard mode operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Figure 27. Diversity mode operation with same LO frequencies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Figure 28. Diversity mode operation with different LO frequencies . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Figure 29. External VCO standard mode operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Figure 30. External VCO diversity mode operation with same LO. . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Figure 31. VFQFPN-44 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
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1
Block diagram
Block diagram
Figure 1.
STW82100B block diagram
VDD_RFESD
VSS_RFESD
DAC
IF_OUTP
IF_OUTN
RF_IN
IF
AMP
RF_VSS
RF_CT
MIXDRV_CT
DBUS_SEL
VDD_MIXDRV
VSS_MIXDRV
MIX
DRV
SDA/DATA
SCL/CLK
DBUS
VDD_DIV
VSS_DIV
LOAD
ADD0
ADD1
ADD2
VCO
calibrator
VDD_OUTBUF
VSS_OUTBUF
LO
DIV2
OUT
CAL_VCO
VDD_DIG
VSS_DIG
OUTBUFN
OUTBUFP
LOCK_DET
LO/2xLO
OUT
VCO
divider
UP
DN
EXTVCO_INP
EXTVCO_INN
EXT
LO/VCO
BUF
PFD
CHP
ICP
REF
divider
VDD_VCO
VSS_VCO
VCO
BUFF
VDD_PLL
VSS_PLL
VDD_IO
VSS_IO
BUF
CAL_VCO
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Pin description
STW82100B
2
Pin description
Figure 2.
STW82100B pin configuration
44 43 42 41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
VDD_DAC
REXT_DAC
VDD_DIV
VDD_IFAMP
1
2
IF_OUTP
IF_OUTN
NC
3
VDD_VCO
4
EXTVCO_INN
EXTVCO_INP
EXT_PD
ADD2
LOAD
5
STW82100B
VFQFPN44
SCL/CLK
SDA/DATA
VDD_DIG
DBUS_SEL
VDD_PLL
REF_CLK
6
7
8
9
ADD1
10
11
ADD0
VDD_IO
12
13
14
15
16
17
18
19
20
21
22
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Pin description
Table 2.
Pin list
Name
Pin No
Description
DAC power supply
Observation
1
2
3
4
VDD_DAC
REXT_DAC
VDD_DIV
Vsupply analog1= 3.3 V
External resistance connection for DAC
Divider by 2 power supply
-
Vsupply analog1= 3.3 V
VDD_VCO
VCOs and External VCO Buffer power supply Vsupply analog1= 3.3 V
Diversity Slave Mode and External
5
EXTVCO_INN
External VCO (LO) negative input
VCO Modes; otherwise it must be
connected to GND
Diversity Slave Mode and External
VCO Modes; otherwise it must be
connected to GND
6
7
EXTVCO_INP
EXT_PD
External VCO (LO) positive input
Hardware power down:
CMOS Input
‘0’ device ON; ‘1’ device OFF
8
ADD2
I2CBUS address select pin
I2CBUS address select pin
I2CBUS address select pin
Digital IO power supply
CMOS Input
9
ADD1
CMOS Input
10
11
12
13
14
15
16
17
18
19
ADD0
CMOS Input
VDD_IO
VDD_PSCBUF
NC
Vsupply digital = 3.3 V
Prescaler input buffer power supply
Not connected
Vsupply analog1= 3.3 V
-
NC
Not connected
-
VDD_OUTBUF
OUTBUFN
OUTBUFP
VCTRL
ICP
Power supply for LO buffer
LO Output buffer negative output
LO Output buffer positive output
Control voltage for VCOs
PLL charge pump output
Vsupply analog1=3.3 V
Open collector @3.3 V
Open collector @ 3.3 V
-
-
External resistance connection for PLL charge
pump current
20
REXT_CP
-
21
22
23
24
25
26
27
28
29
30
31
VDD_CP
LOCK_DET
REF_CLK
VDD_PLL
DBUS_SEL
VDD_DIG
SDA/DATA
SCL/CLK
LOAD
Power supply for charge pump
Lock detector
Vsupply analog1= 3.3 V
CMOS Output
Reference frequency input
PLL digital power supply
Digital Bus Interface select
Power supply for digital bus interface
I2CBUS /SPI data line
I2CBUS /SPI clock line
SPI load line
-
Vsupply analog1= 3.3 V
CMOS Input
Vsupply digital = 3.3 V
CMOS Bidir Schmitt triggered
CMOS Input Schmitt triggered
CMOS Input Schmitt triggered
-
NC
Not connected
IF_OUTN
IF amplifier negative output
Open collector @ 5 V(1)
Doc ID 018355 Rev 5
9/67
Pin description
STW82100B
Table 2.
Pin list (continued)
Name
IF_OUTP
Pin No
32
Description
IF Amplifier positive output
Observation
Open collector @ 5 V(1)
33
VDD_IFAMP
TEST2
IF Amplifier power supply
Test input 2
Vsupply analog1 = 3.3 V
Test purpose only; it must be
connected to GND
34
35
36
Test purpose only; it must be
connected to GND
TEST1
Test input 1
Test output
Test purpose only; it must be
connected to GND
TEST_ALC
37
38
39
40
41
42
RF_CT
RF balun central tap
-
RF_IN
RF input
-
VDD_RFESD
MIXDRV_CT
VDD_ALC
VDD_MIXDRV
RF ESD positive rail power supply
Mixer driver balun central tap
ALC power supply
Vsupply analog1 = 3.3 V
Vsupply analog2 = 5 V(1)
Vsupply analog1 = 3.3 V
Vsupply analog1 = 3.3 V
Mixer driver power supply
DAC current output for external PIN Diode
attenuator
43
44
I_PINDRV1
I_PINDRV2
PMOS Open drain
PMOS Open drain
DAC current output for external PIN Diode
attenuator
1. Supply voltage @ 3.3 V in low-current mode operation
10/67
Doc ID 018355 Rev 5
STW82100B
3
Absolute maximum ratings
Absolute maximum ratings
Table 3.
Absolute maximum ratings
Symbol
Parameter
Analog Supply voltage
Values
0 to 4.6
0 to 6
0 to 4.6
+150
0.8
Unit
AVCC1
AVCC2
DVCC
Tstg
V
Analog Supply voltage
V
Digital Supply voltage
V
Storage temperature
°C
HBM on pins 16, 17, 31, 32, 37, 40
HBM on pin 38
1
HBM on all remaining pins
CDM-JEDEC Standard on pin 38
CDM-JEDEC Standard on all remaining pins
MM
2
ESD
kV
(Electro-static discharge)
0.25
0.5
0.2
Doc ID 018355 Rev 5
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Operating conditions
STW82100B
4
Operating conditions
Table 4.
Symbol
Operating conditions
Parameter
Test conditions
Min
Typ
Max
Unit
AVCC1
AVCC2
DVCC
Analog Supply voltage
Analog Supply voltage
Digital Supply voltage
-
-
-
3.15
3.3
5
3.45
5.25
3.45
V
4.75
V
V
3.15
3.3
130
110
105
155
Standard mode
-
-
-
-
150 mA
130 mA
120 mA
180 mA
External VCO standard mode
Diversity slave mode
Diversity master mode
ICC3.3V
Current Consumption at 3.3 V
Current Consumption
External VCO diversity master
mode
-
140
160 mA
High current mode at 5 V
-
-
170
100
195 mA
115 mA
ICC5V
Low current mode at 3.3 V
TA
TJ
Operating ambient temperature
Maximum junction temperature
-
-
-40
-
85
°C
125 °C
Junction to ambient package thermal
resistance(1)
Θ
Multi-layer JEDEC board
Multi-layer JEDEC board
Multi-layer JEDEC board
Multi-layer JEDEC board
Multi-layer JEDEC board
-
-
-
-
-
33
19
3
-
-
-
-
-
°C/W
JA
Junction to board package thermal
resistance(1)
Θ
°C/W
°C/W
°C/W
°C/W
JB
Junction to case package thermal
resistance(1)
Θ
JC
Thermal characterization parameter
junction to board(1)
Ψ
18
0.3
JB
Thermal characterization parameter
junction to top case(1)
Ψ
JT
1. Refer to JEDEC standard JESD 51-12 for a detailed description of the thermal resistances and thermal parameters.
Data here presented are referring to a Multi-layer board according to JEDEC standard.
TJ = TA + ΘJA * Pdiss (in order to estimate TJ if ambient temperature TA and dissipated power Pdiss are known)
TJ = TB + ΨJB * Pdiss (in order to estimate TJ if board temperature TB and dissipated power Pdiss are known)
TJ = TT + ΨJT * Pdiss (in order to estimate TJ if top case temperature TT and dissipated power Pdiss are known)
12/67
Doc ID 018355 Rev 5
STW82100B
Operating conditions
T
Table 5.
Digital logic levels
Symbol
Parameter
Test conditions
Min
Typ
Max
Unit
Vil
Low level input voltage
High level input voltage
Schmitt trigger hysteresis
Low level output voltage
High level output voltage
-
-
-
-
-
-
0.8*Vdd
0.8
-
-
-
-
-
0.2*Vdd
V
Vih
-
-
V
V
V
V
Vhyst
Vol
-
0.4
-
Voh
0.85*Vdd
Doc ID 018355 Rev 5
13/67
Test conditions
STW82100B
5
Test conditions
Unless otherwise specified the following test conditions are applied:
●
●
●
●
●
●
Vsupply digital = 3.3 V
Vsupply analog1 = 3.3 V
Vsupply analog2 = 5 V
F
= 150 MHz
IF
MIX = 0111
T ambient = 27 °C
Refer also to Section 11: Application information.
14/67
Doc ID 018355 Rev 5
STW82100B
Electrical characteristics
6
Electrical characteristics
Note:
Vsupply digital = 3.3 V, Vsupply analog1 = 3.3 V, Vsupply analog2 = 5 V, F = 2100 MHz,
RF
F
= 1950 MHz, T = +25 *C, RF power = 0 dBm, unless otherwise specified.
LO
A
)
(1)
Table 6.
Down converter mixer and IF amplifier electrical characteristics
Parameter Conditions
RF Frequency
Symbol
Min Typ Max Unit
FRF
-
1620
1650
2050
70
-
-
-
-
2400 MHz
1950 MHz
2370 MHz
400 MHz
VCOA divided by 2
VCOB divided by 2
FIF = ABS(FLO-FRF)
FLO
LO Frequency
FIF
IF Center Frequency(2)
Power Conversion Gain
Rin = 50 ohm, Rout = 200 ohm
RFin = 0 dBm
CG
7.5
-
8
8.5 dB
Power Conversion Gain over
Temperature(3)
CGΔT
IP1dB
T= -40 to +85 °C
0.7
-
dB
High current Mode
Low current Mode
High current Mode
Low current Mode
-
-
13.5
8
-
-
-
-
Input P1dB
dBm
24.5 25.5
18.5 19.5
Third-order input intercept
point(4)
IIP3
dBm
IIP3 variation over
temperature(3)
IIP3ΔT
T= -40 to +85 °C
-
-
-
0.5
77
-
-
-
dB
2FRF-2FLO FRFin = -5 dBm,
FIF = 150 MHz
dBc
dBc
nFRF-nFLO Spurious rejection at IF(3)
3FRF-3FLO FRFin = -5 dBm,
FIF = 150 MHz
77
High-current mode, MIX = 0011
-
-
-
10.5
10.5
-35
-33
-29
58
11 dB
11 dB
NFSSB
Noise figure
Low-current mode, MIX = 0011
1xLO
-
dBm
-
LO to IF Leakage
2xLO
-
LO to RF Leakage
RF to IF Isolation
RF Return Loss
IF Return Loss
-
-
-
-
-
-
-
-
-
dBm
dB
-
-
RFRL
IFRL
Matched to 50 ohm
Matched to 200 ohm
20
dB
25
dB
Maximum deviation from Fc over 10
MHz. For any Fc within each TX
observation path band.
-0.05
-0.10
-
-
+0.05 dB
+0.10 dB
Gain Flatness for TX
observation path(5)
-
Maximum deviation from Fc over 30
MHz. For any Fc within each TX
observation path band.
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15/67
Electrical characteristics
STW82100B
(1)
Table 6.
Down converter mixer and IF amplifier electrical characteristics (continued)
Symbol
Parameter
Conditions
Min Typ Max Unit
Maximum deviation from linear phase
at Fc over 10 MHz. For any Fc within -0.3
each TX observation path band.
-
-
+0.3 deg
+0.7 deg
Phase Flatness for TX
observation path(5)
-
Maximum deviation from linear phase
at Fc over 30 MHz. For any Fc within -0.7
each TX observation path band.
Maximum ripple over a 4 MHz band.
For any Fc within each RX path band.
dB
pk-pk
-
-
Gain Flatness for RX path(5)
Phase Flatness for RX path(5)
-
-
-
0.1
Maximum ripple over a 4 MHz band.
For any Fc within each RX path band.
deg
pk-pk
-
0.6
3.3 V Supply (pin 41, 42)
5 V Supply (pin 40)
-
-
-
49
60
20
-
-
-
mA
mA
mA
Mixer Driver Current
Consumption
ICCMD
Mixer Driver Current
Consumption (Low Current
Mode)
3.3 V Supply (pin 41, 42)
3.3 V Supply (pin 40)
-
35
-
mA
3.3 V Supply (pin 33)
5 V Supply (pin 31, 32)
3.3 V Supply (pin 33)
3.3 V Supply (pin 31, 32)
-
-
-
-
10
108
6
-
-
-
-
mA
mA
mA
mA
IFAMP Current Consumption
ICCIFAM
IFAMP Current Consumption
(Low Current Mode)
55
1. All linearity and NF performances are intended at maximum LO amplitude (LO_A[1:0]=[11]), tuning capacitors (CAP[2:0])
programmed according to the selected frequency, mixer bias (MIX[3:0]) set to maximize performance and the device
operated in high current mode. The performances of conversion gain, NF and linearity are intended at the SMA connectors
of a typical application board.
2. The IF frequency range supported by the IF Amplifier is from 70 to 400 MHz. The exact IF frequency range supported for a
specific RF frequency can be calculated as FIF = ABS(FLO-FRF) where FLO is inside the specified LO frequency range.
3. Guaranteed by design and characterization
4. RFin = 0 dBm/tone, RF tone spacing = 5 MHz
5. Guaranteed by design
Table 7.
Symbol
Pin diode attenuator driver (dual output current DAC) electrical characteristics
Parameters
Resolution
Conditions
Min Typ Max Unit
R
-
-
-
-
-
-
10
-
-
Bit
DNL
INL
IFS
-
Differential non linearity
Integral non linearity
Full Scale current (1)
Current Mismatch
-0.05
-0.45
0.28
-
0.05 LSB
0.45 LSB
2.8 mA
-
-
-
2
3
%
V
Output voltage compliance
range
-
-
0
-
VREXT_DAC Voltage Reference
-
-
-
10
-
1.19
-
V
REXT_DAC
Iccstatic
REXT DAC Range
100 kΩ
mA
Static current consumption
(Iout = 0 mA; pin 1)
2.5
-
1. See relationship between IDAC and REXT_DAC in the Circuit Description section (Dual Output Current DAC)
16/67
Doc ID 018355 Rev 5
STW82100B
Electrical characteristics
Table 8.
Symbol
Integer-N synthesizer electrical characteristics
Parameter Conditions
Min
Typ
Max
Unit
VCO dividers
Prescaler 16/17
256
361
-
-
65551
77836
-
-
N
VCO Divider Ratio (N)
Prescaler 19/20
Reference clock and phase frequency detector
Fref
-
Reference input frequency
Reference input sensitivity
Reference Divider Ratio
PFD input frequency
-
-
-
-
10
0.35
2
19.2
200
1.5
MHz
1
-
Vpeak
R
1023
16
FPFD
-
-
MHz
Hz
FLO
/
FLO
/
Prescaler 16/17
Prescaler 19/20
-
-
65551
256
FSTEP
Frequency step (1)
FLO
/
FLO
/
Hz
77836
361
Charge pump
ICP
ICP sink/source (2)
3bit programmable
-
0.4
-
-
-
5
mA
V
VOCP
-
Output voltage compliance range
Spurious(3)
-
-
Vdd-0.3
-
-70
dBc
VCOs
Higher frequency range
-
-
100
85
-
-
MHz/V
MHz/V
Intermediate frequency
range
KVCOA
VCOA sensitivity
VCOB sensitivity
Lower frequency range
Higher frequency range
-
-
70
75
-
-
MHz/V
MHz/V
Intermediate frequency
range
KVCOB
-
65
-
MHz/V
Lower frequency range
-
55
-
-
125
125
95
MHz/V
° C
CALTYPE [0]
-
VCOA Maximum Temperature
variation for continuous lock (4)
ΔTLKA
ΔTLKB
-
CALTYPE [1]
-
-
° C
CALTYPE [0]
-
-
° C
VCOB Maximum Temperature
variation for continuous lock (4)
CALTYPE [1]
-
-
-
125
-
° C
VCO A Pushing
-
-
-
-
8
14
MHz/V
MHz/V
V
VCO B Pushing
-
-
VCTRL
-
VCO control voltage
LO Harmonic Spurious
0.4
-
Vdd-0.3
-20
dBc
VCO and VCO buffer current
consumption
IVCO
Amplitude [11] (pin 4)
(pin 3)
-
-
35
20
-
-
mA
mA
IDIV
DIVIDER by 2 consumption
2
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Electrical characteristics
STW82100B
Table 8.
Symbol
Integer-N synthesizer electrical characteristics (continued)
Parameter
Conditions
Min
Typ
Max
Unit
2 x LO output buffer (test purpose only)
FOUT
POUT
RL
Frequency range
Output level
-
-
3.3
-
4.74
GHz
-
-
-
0
-
-
-
dBm
dB
Return Loss
Matched to 50ohm
(pin 15, 16, 17)
15
26
I2LOBUF
Current Consumption
mA
LO output buffer
FOUT
POUT
RL
Frequency range
-
1.65
-
2.37
GHz
dBm
dB
Output level
-
-
-
-
3
-
-
-
Return Loss
Matched to 50ohm
(pin 15, 16, 17)
14
26
ILOBUF
Current Consumption
mA
External VCO (LO) buffer
fINVCO
PIN
Frequency range
Input level
-
-
1.65
-
-
2.37
-
GHz
dBm
0
External VCO Buffer
(pin 4)
IEXTBUF
Current Consumption
-
25
-
mA
PLL miscellaneous
Input Buffer, Prescaler,
Digital Dividers, misc.
(pin 24)
IPLL
PLL Current Consumption
-
8
-
mA
Prescaler input buffer Current
Consumption
IPRE
ICP
(pin 12)
-
-
3
4
-
-
mA
mA
CPSEL=[111], REXT_CP
= 4.7 kΩ (pin 21)
Charge Pump Current Consumption
Lock up time(5)
25 kHz PLL bandwidth;
within 1ppm of frequency
error
tLOCK
-
150
-
µs
1. The frequency step is related to the PFD input frequency as follows: FSTEP=FPFD/2)
2. See relationship between ICP and REXT_CP in the Circuit Description section (Charge Pump)
3. The level of spurs may change depending on PFD frequency, Charge Pump current, selected channel and PLL loop BW.
4. When setting a specified output frequency, the VCO calibration procedure must be run first in order to select the best
subrange for the VCO covering the desired frequency. Once programmed at the initial temperature T0 inside the operating
temperature range (-40 oC to +85 oC), the synthesizer is able to maintain the lock status if the temperature drift (in either
direction) is within the limit specified by ΔTLKA or ΔTLKB, provided that the final temperature T1 is still inside the nominal
range.
5. Frequency jump form 1950 to 1800 MHz; it includes the time required by the VCO calibration procedure (7 x FPFD cycles
=17.5 µs with FPFD =400 kHz))
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Doc ID 018355 Rev 5
STW82100B
Table 9.
Electrical characteristics
(1)
Phase noise performance
Parameters
Conditions
Min.
Typ.
Max.
Unit
In band phase noise floor, closed loop(2)
Normalized In Band Phase Noise
Floor (LO)
I
CP=4 mA, PLL BW = 50 kHz
-
-230
-
dBc/Hz
(including reference clock
contribution)
In Band Phase Noise Floor (LO)
-230+20log(N)+10log(FPFD) dBc/Hz
PLL integrated phase noise
Integrated Phase Noise
(single sided)
-
-
-45
-
-
dBc
FLO=2.200 GHz, FSTEP=200 kHz,
ICP=3 mA, PLL BW = 25 kHz
0.48
° rms
100 Hz to 40 MHz
LOA (1650 MHz to 1950 MHz) – open loop
Phase Noise @ 1 kHz
-
-
-
-
-
-
-
-
-
-
-
-
-69
-95
-
-
-
-
-
-
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
Phase Noise @ 10 kHz
Phase Noise @ 100 kHz
Phase Noise @ 1 MHz
Phase Noise @ 10 MHz
Phase Noise Floor @ 40 MHz
-118
-139
-152
-154
LOB (2050 MHz to 2370 MHz) – open loop
Phase Noise @ 1 kHz
-
-
-
-
-
-
-
-
-
-
-
-
-62
-88
-
-
-
-
-
-
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
Phase Noise @ 10 kHz
Phase Noise @ 100 kHz
Phase Noise @ 1 MHz
Phase Noise @ 10 MHz
Phase Noise Floor @ 40 MHz
-112
-134
-150
-153
1. Phase Noise SSB. VCO amplitude set to maximum value [11]. All the closed-loop performances are specified using a
Reference Clock signal at 76.8 MHz with phase noise of -144 dBc/Hz @1 kHz offset, -157 dBc/Hz @10 kHz offset and
-168 dBc/Hz of noise floor.
2. Normalized PN = Measured LO PN – 20log(N) – 10log(FPFD) where N is the VCO divider ratio (N=B*P+A) and FPFD is the
comparison frequency at the PFD input
Doc ID 018355 Rev 5
19/67
Typical performance characteristics
STW82100B
7
Typical performance characteristics
Note:
Vsupply digital = 3.3 V, Vsupply analog1 = 3.3 V, Vsupply analog2 = 5 V, F = 150 MHz,
IF
T = +25 °C, RF power = 0 dBm, unless otherwise specified.
A
Figure 3.
Conversion gain against RF frequency
RF frequency (MHz)
Figure 4.
Noise figure against RF frequency
RF frequency (MHz)
20/67
Doc ID 018355 Rev 5
STW82100B
Figure 5.
Typical performance characteristics
IIP3 against RF frequency
RF frequency (MHz)
Figure 6.
2RF-2LO response against RF frequency
RF frequency (MHz)
Doc ID 018355 Rev 5
21/67
Typical performance characteristics
Figure 7. LOA (VCOA div. by 2) closed-loop phase noise at 1.8 GHz (F
STW82100B
=
STEP
200 kHz, I = 2 mA)
CP
Figure 8.
LOB (VCOB div. by 2) closed-loop phase noise at 2.2 GHz (F
=
STEP
200 kHz, I = 2 mA)
CP
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Doc ID 018355 Rev 5
STW82100B
General description
8
General description
The STW82100B (see Figure 1: STW82100B block diagram on page 7) consists of a high
linearity passive CMOS mixer with integrated RF balun, an IF amplifier, a 10-bit current
steering DAC with dual output, and an integrated integer-N synthesizer.
The synthesizer embeds 2 internal low-noise VCOs with buffer blocks, a divider by 2, a low
noise PFD (Phase Frequency Detector), a precise charge pump, a 10-bit programmable
reference divider, two programmable counters and a dual-modulus prescaler. The A-counter
(5 bits) and B counter (12 bits) counters, in conjunction with the dual modulus prescaler
P/P+1 (16/17 or 19/20), implement an N integer divider, where N = B*P+A.
The device is controlled through a digital interface (I2C bus interface or SPI digital interface).
All internal devices operate with a power supply of 3.3 V except for the IF Amplifier output
stage and the mixer driver stage operating at 5 V power supply in order to maximize the
linearity performance. If the application requires a reduced linearity and noise figure
performance the device is programmed in a low-current mode by using the minimum LO
amplitude and the minimum biasing current in the IF amplifier. In low-current mode
operation the device can use only the 3.3 V power supply thus dissipating less power.
8.1
Circuit description
8.1.1
Reference input stage
The reference input stage is shown in Figure 9. The resistor network feeds a DC bias at the
F
input while the inverter used as the frequency reference buffer is AC coupled.
ref
Figure 9.
Reference frequency input buffer
VDD
Fref
Inverter
Buffer
Power Down
Doc ID 018355 Rev 5
23/67
General description
STW82100B
8.1.2
Reference divider
The 10-bit programmable reference counter allows the input reference frequency to be
divided to produce the input clock to the PFD. The division ratio is programmed through the
digital interface.
8.1.3
Prescaler
The dual-modulus prescaler P/P+1 takes the CML clock from the VCO buffer and divides it
down to a manageable frequency for the CMOS A and B counters. The modulus (P) is
programmable and can be set to 16 or 19. It is based on a synchronous 4/5 core which
division ratio depends on the state of the modulus input.
8.1.4
A and B counters
The A (5 bits) and B (12 bits) counters, in conjunction with the selected dual modulus (16/17
or 19/20) prescaler make it possible to generate output frequencies which are spaced only
by the reference frequency divided by the reference division ratio. Thus, the division ratio
and the VCO output frequency are given by the following formulae:
N = B × P + A
(B × P + A) × Fref
FVCO = -----------------------------------------------
R
where:
F
: VCO output frequency.
VCO
P: modulus of dual modulus prescaler (16 or 19 selected through the digital interface).
B: division ratio of the main counter.
A: division ratio of the swallow counter.
F : input reference frequency.
ref
R: division ratio of the reference counter.
N: division ratio of the PLL
The following points should be noted:
●
●
●
For the VCO divider to work correctly, B must be higher than A.
A can take any value from 0 to 31.
Two PLL division ratio (N) ranges are possible, depending on the value of P:
–
–
256 to 65551 (when P=16)
361 to 77836 (when P=19).
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Doc ID 018355 Rev 5
STW82100B
General description
Figure 10. VCO divider diagram
VCOBUF-
VCOBUF+
Prescaler
16/17 or 19/20
To PFD
modulus
12-bit
B counter
5-bit
A counter
8.1.5
Phase frequency detector (PFD)
The PFD takes inputs from the reference and the VCO dividers and produces an output
proportional to the phase error. The PFD includes a delay gate that controls the width of the
anti-backlash pulse. This pulse ensures that there is no dead zone in the PFD transfer
function.
Figure 11 is a simplified schematic of the PFD.
Figure 11. PFD diagram
VDD
D
Q
Up
F
ref_DIV
R
Delay
R
F
VCO_div
Q
VDD
D
Down
ABL
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General description
STW82100B
8.1.6
Lock detect
This signal indicates that the difference between rising edges of both UP and DOWN PFD
signals is found to be shorter than the fixed delay (roughly 5 ns). The Lock Detect signal is
high when the PLL is locked. The Lock Detector consumes current only during PLL
transients.
8.1.7
Mute until lock
This (software controlled) function shuts down the following elements until the PLL achieves
the lock status:
●
●
●
●
RF output stage
LO output buffer
mixer
IF amplifier circuitry
Under this setting there is no signal at the IF output stage or the LO output during a
frequency jump.
8.1.8
Charge pump
This block drives two matched current sources, Iup and Idown, which are controlled
respectively by the UP and DOWN PFD outputs. The nominal value of the output current is
controlled by an external resistor (to be connected to the REXT input pin) and the selection
of one of 8 possible values by a 3-bit word.
The minimum value of the output current is: IMIN = 2*VBG/REXT_CP (VBG~1.17 V)
Table 10. Current values for CPSEL[2:0] selection
CPSEL2
CPSEL1
CPSEL0
Current
Value for REXT=4.7 kΩ
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
IMIN
0.5 mA
1.00 mA
1.50 mA
2.00 mA
2.50 mA
3.00 mA
3.50 mA
4.00 mA
2*IMIN
3*IMIN
4*IMIN
5*IMIN
6*IMIN
7*IMIN
8*IMIN
Note:
The current is output on pin ICP. During the VCO auto calibration, ICP and VCTRL pins are
forced to VDD/2.
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STW82100B
General description
Figure 12. Loop filter connection
VDD
VCTRL
C3
R3
Buffer
Charge
pump
ICP
R1
C1
C2
Buffer
Cal bit
8.1.9
Voltage controlled oscillators
VCO selection
Within the STW82100B two low-noise VCOs are integrated to cover a wide band from
1650 MHz to 1950 MHz, and from 2050 MHz to 2370 MHz after the division by 2:
●
VCO A frequency range is 3300 MHz to 3900 MHz
VCO B frequency range is 4100 MHz to 4740 MHz
●
VCO frequency calibration
Both VCOs can operate on 32 frequency ranges that are selected by adding or subtracting
capacitors to the resonator. These frequency ranges are intended to cover the wide band of
operation and compensate for process variations on the VCO center frequency.
An automatic range selection is performed when the bit SERCAL rises from ‘0’ to ‘1’ . The
charge pump is inhibited and the pins ICP and VCTRL are set at a fixed calibration voltage
(VCAL). The frequency ranges are then tested to select the nearest one to the desired
output frequency (FOUT= N*Fref/R) with VCAL input voltage applied. After this selection, the
charge pump is once again enabled and the PLL performs a fine adjustment around VCAL
on the loop filter voltage to lock FOUT, thus enabling a fast settling time.
Two calibration algorithms are selectable by setting the CALTYPE bit.
Setting the CALTYPE to ’1’ guarantees the PLL lock versus temperature variations. Once
programmed at the initial temperature, T , within the operating temperature range (-40 °C to
0
+85 °C), the synthesizer is able to maintain the lock status if the temperature drift (in either
direction) is within the limit specified by ΔT , and provided that the final temperature, T , is
LK
1
still inside the nominal range.
Setting the CALTYPE bit to ‘0’ fixes VCAL to the mid point of the charge pump output
(VDD/2). Optimum PLL phase noise performance versus temperature variations with a
reduced ΔT is guaranteed in this case. The ΔT parameter, specific to each VCO and
LK
LK
calibration type, in the STW82100B is specified in Table 8: Integer-N synthesizer electrical
characteristics.
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General description
STW82100B
Figure 13. VCO typical sub-band characteristics
00000
00001
01111
11111
Calibrator lock
range
3.50
0.00
0.50
2.50
3.00
1.00
1.50
VCTRL (V)
2.00
The SERCAL bit should be set to ’1’ at each division ratio change. The calibration takes
approximately 7 periods of the Comparison Frequency and the SERCAL bit is automatically
reset to ’0’ at the end of each calibration.
The maximum allowed F
to perform the calibration process is 1 MHz. If a higher F
is
PFD
PFD
used the following procedure should be adopted:
1. Calibrate the VCO at the desired frequency with an F
lower than 1 MHz
PFD
2. Set the A, B and R dividers ratio for the desired F
PFD
For calibration details refer to Section 9.4.1: VCO calibration procedure (I2C interface) or
Section 10.4.1: VCO calibration procedure (SPI interface).
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STW82100B
General description
VCO calibration auto-restart feature
The VCO Calibration Auto-Restart feature, once activated, allows the calibration procedure
to be restarted when the Lock Detector reports that the PLL has moved to an unlock
condition (trigger on ‘1’ to ‘0’ transition of Lock Detector signal).
This situation could happen if the device experiences a significant temperature variation and
the CALTYPE bit is set for optimum PLL phase noise performance (CALTYPE [0]).
By enabling the VCO Calibration Auto-Restart feature (through the AUTO_CAL bit), the
device re-selects the proper VCO frequency sub-range without any external user command.
This feature can be enabled only when the F
is lower than 1 MHz.
PFD
VCO voltage amplitude control
The voltage swing of the VCOs can be adjusted over 4 levels by means of two dedicated
programming bits (PLL_A1 and PLL_A0). This setting trades current consumption with
phase noise performances of the VCO. Higher amplitudes provide best phase noise while
lower ones save power.
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General description
STW82100B
Table 11 and Table 12 give the current consumption and the phase noise at 1 MHz.
Table 11. VCOA performance against amplitude setting (frequency = 3.6 GHz)
Current
PLL_A[1:0]
PN @ 1 MHz
Consumption (mA)
00
01
10
11
23
24
32
35
-127
-128
-131
-132
Table 12. VCOB performance against amplitude setting (frequency = 4.3 GHz)
Current
PLL_A[1:0]
PN @ 1 MHz
Consumption (mA)
00
01
10
11
16
18
27
30
-124
-126
-128
-129
8.1.10
8.1.11
Output stage
The differential output signal of the synthesizer after the Divider by 2 is available on
pins 16 and 17.
The output stage is selected by programming the PD[4:0] bits.
The output stage is an open-collector structure which is able to meet different requirements
over the desired output frequency range by proper connections on the PCB. See Figure 27:
Diversity mode operation with same LO frequencies.
External VCO buffer
Although the STW82100B includes two wideband and low-noise VCOs, external VCO use
capability is also provided.
The external VCO buffer can be used to manage a signal coming from an external VCO in
order to build a local oscillator signal by using the STW82100B internal synthesizer as a
PLL. This is only possible when External VCO standard mode or External VCO diversity
master mode operation are selected. See Figure 29: External VCO standard mode
operation and Figure 30: External VCO diversity mode operation with same LO.
If the STW82100B is operated in Diversity slave mode, the external VCO buffer manage the
signal coming from the synthesizer output stage of another STW82100B device See
Figure 27: Diversity mode operation with same LO frequencies and Figure 30: External
VCO diversity mode operation with same LO.
The selection of the external VCO buffer is done by setting the PD[4:0] bits.
The external VCO signal can range from 1650 MHz to 2370 MHz and its minimum power
level must be -10 dBm.
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STW82100B
General description
8.1.12
Mixer and IF amplifier
LO mixer driver
The LO signal is fed through a driver in order to achieve the high power level needed to drive
the passive mixer for maximum performance of linearity and NF.
The LO Mixer Driver is coupled to the mixer with an integrated LO balun. The LO signal level
is adjusted by means of an Automatic Level Control loop (ALC) controlled by the bits
LO_A[1:0].
In low current mode the configuration LO_A[1:0]=’00’ (minimum LO amplitude) should be
selected and the power supply on pin 40 can be set to 3.3 V.
The LO balun resonating frequency can be adjusted by means of the bits CAP[2:0] in order
to match the selected LO frequency.
Table 13. Suggested CAP[2:0] values for LO Frequency range mixer
CAP[2:0]
LO frequency range
000
001
010
011
100
101
110
111
2225MHz ÷ 2370MHz
2100MHz ÷ 2225MHz
2000MHz ÷ 2100MHz
1900MHz ÷ 2000MHz
1825MHz ÷ 1900MHz
1750MHz ÷ 1825MHz
1700MHz ÷ 1750MHz
1650MHz ÷ 1700MHz
Mixer
A doubly balanced CMOS passive mixer is internally driven by the high level LO signal in
order to achieve high linearity and low noise performance.
The RF integrated balun permits the removal of external components and it is internally
matched to 50 ohms.
The gate bias of the CMOS devices in the mixer is programmable with 4 bits (MIX[3:0]) to
optimize the input matching and the gain of the signal chain.
Higher values of gate bias (higher decimal values of MIX[3:0]) are suggested to maximize
linearity and lower values to maximize the performance of Gain and NF.
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General description
STW82100B
IF amplifier
The integrated IF stage permits a 200-ohm load to be driven (typically a SAW filter) ensuring
high linearity.
It is an open collector stage (pin 31, 32) and should be biased to 5 V with choke inductors.
The typical output impedance is 200 ohms. The linearity performances are controlled by the
bits IFAMP[1:0]. In low current mode the configuration IFAMP[1:0]=’00’ (minimum linearity)
should be selected and the open collector stage can be biased to 3.3 V with choke
inductors.
Table 14. Linearity performance against IFAMP[1:0] configuration (typical
condition)
IFAMP[1:0]
Linearity performance
00
01
10
11
19.5 dB
21.5 dB
23.5dB
25.5dB
8.1.13
Dual output current DAC
The STW82100B embeds a 10-bit Dual Output steering current DAC especially suited to
drive an external PIN diode attenuator. This provides power level calibration capability at the
RF input for the TX observation path applications.
The current sourced by the DAC is related to the R
resistor according to the
EXT_DAC
following formulae (where VR
is approximately 1.19 V):
EXT_DAC
3 × VREXT_DAC
1
2
1
64
-- ---------------------------------------- ------
IDACLSB
=
×
×
LSB DAC current
REXT_DAC
3 × VREXT_DAC
-- ---------------------------------------- ------------
1
2
1023
64
IDACFS
=
×
×
Full scale current
REXT_DAC
With a 10 kΩ R
the FS current is approximately 2.8 mA.
EXT_DAC
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STW82100B
I2C bus interface
2
9
I C bus interface
2
The I C bus interface is selected by hardware connection of the pin 25 (DBUS_SEL) to 0 V.
Data transmission from a microprocessor to the STW82100B takes place through the 2
2
wires (SDA and SCL) I C-bus interface. The STW82100B is always a slave device.
2
The I C-bus protocol defines any device that sends data on to the bus as a transmitter and
any device that reads the data as receiver. The device that controls the data transfer is
known as the master and the others as slaves. The master always initiates the transfer and
provides the serial clock for synchronization.
2
The STW82100B I C bus supports Fast Mode operation (clock frequency up to 1 MHz).
9.1
I2C general features
9.1.1
Data validity
Data changes on the SDA line must only occur when the SCL is LOW. SDA transitions while
the clock is HIGH identify START or STOP conditions.
Figure 14. Data validity waveform
SDA
SCL
Change
data allowed
Data line stable
data valid
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I2C bus interface
STW82100B
9.1.2
START and STOP conditions
Figure 15. START and STOP condition waveform
SCL
SDA
START
STOP
START condition
A START condition is identified by a HIGH to LOW transition of the data bus SDA while the
clock signal SCL is stable in the HIGH state. A Start condition must precede any command
for data transfer.
STOP condition
A STOP condition is identified by a transition of the data bus SDA from LOW to HIGH while
the clock signal SCL is stable in the HIGH state.. A STOP condition terminates
communications between the STW82100B and the Bus Master.
9.1.3
Byte format and acknowledge
Every byte (8 bits long) transferred on the SDA line must contain bits. Each byte must be
followed by an acknowledge bit. The MSB is transferred first.
An acknowledge bit indicates a successful data transfer. The transmitter, either master or
slave, releases the SDA bus after sending 8 bits of data. During the 9th clock pulse the
receiver pulls the SDA low to acknowledge the receipt of 8 bits of data.
Figure 16. Byte format and acknowledge waveform
SCL
2
7
1
3
8
9
SDA
MSB
Acknowledgement
from receiver
START
STOP
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STW82100B
I2C bus interface
9.1.4
Device addressing
To start the communication between the Master and the STW82100B, the master must
initiate with a START condition. Following this, the master sends onto the SDA line 8 bits
(MSB first) corresponding to the device select address and read or write mode.
2
The first 7 MSBs are the device address identifier, corresponding to the I C-Bus definition.
For the STW82100B the address is set as ’1101A A A ’, 3-bits programmable. The 8th bit
2
1 0
(LSB) is the read or write operation bit (the RW bit is set to 1 in read mode and to 0 in write
mode).
After a START condition the STW82100B identifies the device address on the bus and, if
matched, it acknowledge the identification on SDA bus during the 9th clock pulse.
9.1.5
9.1.6
9.1.7
Single-byte write mode
Following a START condition the master sends a device select code with the RW bit set to 0.
The STW82100B gives an acknowledge and waits for the internal sub-address (1 byte). This
byte provides access to any of the internal registers.
After reception of the internal byte sub-address the STW82100B again responds with an
acknowledge. A single-byte write to sub-address 0x00 would affect DATA_OUT[47:40], a
single-byte write with sub-address 0x04 would affect DATA_OUT[15:8] and so on.
sub-address
S
1101A2A1A0
0
ack
ack
DATA IN
ack
P
byte
Multi-byte write mode
The multi-byte write mode can start from any internal address. The master sends the data
bytes and each one is acknowledged. The master terminates the transfer by generating a
STOP condition.
The sub-address determines the starting byte. For example, a multi-byte write with sub-
address 0x01 and 4 DATA_IN bytes affects 4 bytes starting at address 0x01 (registers at
addresses 0x01, 0x02, 0x03 and 0x04 are modified).
sub-address
byte
DATA
IN
S
1101A2A1A0 0 ack
ack
DATA IN
ack
..
ack
P
Current byte address read
In the current byte address read mode, following a START condition, the master sends the
device address with the RW bit set to 1 (No sub-address is needed as there is only 1 byte
read register). The STW82100B acknowledges this and outputs the data byte. The master
does not acknowledge the received byte, but terminates the transfer with a STOP condition.
S
1101A2A1A0
1
ack
DATA OUT
No ack
P
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I2C bus interface
STW82100B
9.2
I2C timing specifications
9.2.1
Data and clock timing specification
2
Figure 17. I C data and clock waveforms
SDA
SCL
tcwl
tcs
tch
tcwh
2
Table 15. I C data and clock timing parameters
Symbol
Tcs
Parameter
Data to clock set up time
Min
2
Unit
Tch
Data to clock hold time
Clock pulse width high
Clock pulse width low
2
ns
Tcwh
Tcwl
10
5.5
2
9.2.2
I C START and STOP timing specification
2
Figure 18. I C START and STOP timing waveforms
SDA
SCL
tstop
tstart
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STW82100B
I2C bus interface
2
Table 16. I C START and STOP timing parameters
Symbol
start
Parameter
Clock to data start time
Data to clock down stop time
Min
Unit
T
T
2
2
ns
stop
2
9.2.3
I C acknowledge timing specification
2
Figure 19. I C acknowledge timing waveforms
SDA
SCL
8
9
td1
td2
2
Table 17. I C acknowledge timing parameters
Symbol
Parameter
Ack begin delay
Ack end delay
Max
Unit
Td1
Td2
2
2
ns
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I2C bus interface
STW82100B
9.3
I2C registers
STW82100B has 9 write-only registers and 1 read-only register.
2
9.3.1
I C register summary
The following table gives a short description of the write-only registers list.
2
Table 18. I C register list
Offset
0x00
Register name
Description
Functional mode register
Page
FUNCTIONAL_MODE
B_COUNTER
on page 39
on page 39
on page 40
on page 40
on page 41
on page 42
on page 42
on page 43
on page 43
on page 44
0x01
0x02
0x03
0x04
0x05
0x06
0x07
0x08
0x09
B counter register
A_COUNTER
A counter register
REF_DIVIDER
Reference clock divider ratio register
PLL control register
CONTROL
MUTE_&_CALIBRATION
DAC_CONTROL
Mute and calibration control register
DAC control register
MIXER_CONTROL
IFAMP_LO_CONTROL
READ_ONLY_REGISTER
Mixer control register
IF amplifier LO control register
Device ID and calibration status register
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STW82100B
I2C bus interface
2
9.3.2
I C register definitions
FUNCTIONAL_MODE
Functional mode register
7
ALC_PD
W
6
PKD_EN
W
5
4
3
PD[4:0]
W
2
1
0
B11
W
Address:
Type:
0x00
W
Reset:
0x00
[7] ALC_PD: for test purpose only must be set to ’0’. (ALC ON)
[6] PKD_EN: for test purpose only must be set to ’0’. (Peak detector output on pin 36 OFF)
[5:1] PD[4:0]: bits used to select different functional modes for the STW82100B according to
the following table
00000: (0 decimal) Power down mode
00001: (1 decimal) Standard Mode VCOA (VCOA and RX chain ON)
00010: (2 decimal) Standard Mode VCOB (VCOB and RX chain ON)
00011: (3 decimal). Diversity Slave Mode (ExtVCO/LO input buffer and RX Chain ON;
internal synthesizer OFF)
00100: (4 decimal) Diversity Master Mode VCOA (VCOA, RX Chain and LO output
buffer ON)
00101: (5 decimal) Diversity Master Mode VCOB (VCOB, RX Chain and LO output
buffer ON)
00110: (6 decimal) External LO Standard Mode (RX Chain ON; PLL and ExtVCO/LO
input buffer ON)
00111: (7 decimal) External LO Diversity Master Mode (RX Chain ON; PLL, ExtVCO/LO
input buffer and LO output buffer ON)
[0] B11: B counter value (bits B[10:0] in the B_COUNTER and A_COUNTER registers)
B_COUNTER
B counter register
7
6
5
4
3
2
1
0
B[10:3]
W
Address:
Type:
0x01
W
Reset:
0x00
Description:
Most significant bits of the B counter value
[7:0] B[10:3]: B counter value (bit B11 in the FUNCTIONAL_MODE register, bits B[2:0] in the
A_COUNTER register)
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I2C bus interface
STW82100B
A_COUNTER
A counter register
7
6
5
4
3
2
A[4:0]
W
1
0
B[2:0]
W
Address:
Type:
0x02
W
Reset:
0x00
Description:
Least significant bits of the B-counter value. A-counter value.
[7:5] B[2:0]: B Counter value (bit B11 in the FUNCTIONAL_MODE register, bits B[10:3] in
the B_COUNTER register).
[4:0] A[4:0]: A counter value
REF_DIVIDER
Reference clock divider ratio register
7
6
5
4
3
2
1
0
R[9:2]
W
Address:
Type:
0x03
W
Reset:
0x00
Description:
Most significant bits of the reference clock divider ratio value.
[7:0] R[9:2]: Reference clock divider ratio (bits R[1:0] in the CONTROL register)
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STW82100B
I2C bus interface
CONTROL
PLL control register
7
6
5
4
3
2
CPSEL[2:0]
W
1
0
PSC_SEL
W
[R1:0]
PLL_A[1:0]
W
W
Address:
Type:
0x04
W
Reset:
0x00
Description:
Least significant bits of the reference clock divider ratio value and PLL control bits.
[7:6] R[1:0]: Reference clock divider ratio (bits R[9:2] in the REF_DIVIDER register)
[5:4] PLL_A[1:0]: VCO amplitude
[3:1] CPSEL[2:0]: Charge Pump output current
[0] PSC_SEL: Prescaler Modulus select (‘0’ for P=16, ‘1’ for P=19)
The LO output frequency is programmed by setting the proper value for A, B and R
according to the following formula:
Fref
---------
FLO = DR ⋅ (B ⋅ P + A) ⋅
R
where DR equals 0.5 (VCOs output frequency divided by 2)
and P is the selected Prescaler Modulus
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I2C bus interface
STW82100B
MUTE_&_CALIBRATION
Mute and calibration control register
7
6
5
4
3
2
1
0
W
W
W
W
W
W
W
W
Address:
Type:
0x05
W
Reset:
0x00
Description:
For test purposes only
[7] CALTYPE: Calibration algorithm selection
0: standard calibration to optimize the phase noise versus temperature
1: enhanced calibration to maximize the ΔTLK range
[6] SERCAL:
1: starts the VCO auto-calibration (automatically reset to ’0’ at the end of calibration)
[5] SELEXTCAL: test purpose only; must be set to ‘0’
[4] MUTE_EN:
0: mute function disabled
1: mute function enabled
[3] MUTE_TYPE: must be set to '1' while the mute function is enabled (mute the IF output
on Unlock state)
[2] MUTE_LOOUT_EN:
To be set to ’1’ to mute the LO output buffer
[1] MUTE_MIX_EN:
To be set to ’1’ mute the Mixer circuitry
[0] MUTE_IFAMP_EN: To be set to '1' to mute the IF amplifier circuitry
DAC_CONTROL
DAC control register
7
6
5
4
3
2
1
0
DAC[9:2]
W
Address:
Type:
0x06
W
Reset:
0x00
Description:
Most significant bits of the DAC control word
[7:0] DAC[9:2]: DAC input word for DAC current control (bits DAC[1:0] in the
MIXER_CONTROL register).
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STW82100B
I2C bus interface
MIXER_CONTROL
Mixer control register
7
6
5
4
3
2
1
0
W
W
W
W
Address:
Type:
0x07
W
Reset:
0x00
Description:
Least significant bits of DAC control word and mixer control bit fields
[7:6] DAC[1:0]: DAC input word for DAC current control (bits DAC[9:2] in the DAC_CONTROL
register)
[5:2] MIX[3:0]: Mixer bias control value
[1] PD_DAC: DAC power down
[0] CAL_AUTOSTART_EN: VCO calibration auto-restart enable (’1’ active), permits to
automatically restart the VCO calibration procedure in case of PLL unlock
IFAMP_ LO_CONTROL
IF amplifier LO control register
7
6
5
4
CAP[2:0]
W
3
2
1
0
LPMUX_EN
W
IFAMP[1:0]
W
LO_A[1:0]
W
Address:
Type:
0x08
W
Reset:
0x00
[7:6] IFAMP[1:0]: power consumption/linearity control
[5:3] CAP[2:0]: Tuning capacitors control
[2:1] LO_A[1:0]: LO amplitude control
[0] LPMUX_EN: for test purpose only (low power mode for MUX). Must be set to ’0’
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I2C bus interface
STW82100B
READ-ONLY REGISTER
Device ID and calibration status register
7
6
5
LOCK_DET
R
4
3
2
INTCAL[4:0]
R
1
0
ID[1:0]
R
Address:
Type:
0x09
R
Reset:
0x00
Description:
This register is automatically addressed in the ‘current byte address read mode’
[7:6] ID[1:0]: device identification ’00’ for STW82100B
[5] LOCK_DET: ’1’ when PLL is locked
[4:0] INTCAL[4:0]: internal value of the VCO calibration control word
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STW82100B
I2C bus interface
9.4
Device calibration through the I2C interface
2
9.4.1
VCO calibration procedure (I C interface)
The calibration of the VCO center frequency is activated by setting the SERCAL bit of the
MUTE & CALIBRATION register to ’1’.
To program the device ensuring a correct VCO calibration, the following procedure is
required before every channel change:
1. Program all the Registers using a multi-byte write sequence with the desired setting:
–
–
–
–
–
–
–
–
–
Functional Mode
B and A counters
R counter
VCO amplitude
Charge Pump
Prescaler Modulus
DAC
Mixer and LO Control
all bits of the MUTE & CALIBRATION Register (0x05) set to ’0’.
2. Program the MUTE & CALIBRATION register using a single-byte write sequence (sub-
address 0x05) with the SERCAL bit set to ’1’.
The maximum allowed PFD frequency (F
) to perform the calibration process is 1 MHz. If
PFD
the desired F
is higher than 1 MHz the following steps are needed:
PFD
3. Perform all the step of the above calibration procedure programming the desired VCO
frequency with a proper setting of R, B and A counter so that F
1 MHz.
results lower than
PFD
4. Once calibration is completed, program all the Registers by using a multi-byte write
sequence (Functional Mode, B and A counters, R counter, VCO amplitude, Charge
Pump, Prescaler Modulus, DAC, Mixer and LO Control) with the proper settings for the
desired VCO and PFD frequencies.
2
9.4.2
Power ON sequence (I C interface)
At power-on the device is configured in power-down mode.
In order to guarantee correct setting of the internal circuitry after the power on, the following
steps must be followed:
1. Power up the device
2. Provide the Reference clock
3. Implement the first programming sequence with a proper delay time between the STOP
condition of the multi-byte write sequence and that of the single-byte write sequence
(see Figure 20). The T
value must respect the following condition:
delay
1
Fref
---------
Tdelay >1023 ×
F
is the reference clock frequency.
ref
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I2C bus interface
STW82100B
2
Figure 20. I C first programming timing
START
START
STOP
STOP
CLK
Tdelay > 1023/F
ref
LSB
MSB
LSB
MSB
DATA
Multi-byte sequence
Single-byte sequence
2
9.4.3
VCO calibration auto-restart procedure (I C interface)
The VCO calibration auto-restart feature is enabled in two steps:
1. Set the desired frequency ensuring VCO calibration procedure as described above
(Section 9.4.1).
2. Program the MIXER_CONTROL register (sub-address 0x07) using a single-byte write
sequence with the CAL_AUTOSTART_EN bit set to '1' while keeping the others
unchanged.
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STW82100B
SPI digital interface
10
SPI digital interface
10.1
SPI general features
The SPI digital interface is selected by hardware connection of the pin 25 (DBUS_SEL) to
3.3 V.
The STW82100B IC is programmed by means of a high-speed serial-to-parallel interface
with write option only. The 3-wires bus can be clocked at a frequency as high as 100 MHz to
allow fast programming of the registers containing the data for RF IC configuration.
The programming of the chip is done through serial words with whole length of 26 bits. The
first 2 MSB represent the address of the registers. The others 24 LSB represent the value of
the registers.
Each data bit is stored in the internal shift register on the rising edge of the CLOCK signal.
On the rising edge of the LOAD signal the outputs of the selected register are sent to the
device.
Figure 21. SPI input and output bit order
Last
bit sent
(LSB) 0
25 (MSB)
23
2
1
24
DATA
A1
LOAD
Address
decoder
LOAD #4
00 (LSB)
Reg. #0
Reg. #1
Reg. #4
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SPI digital interface
STW82100B
Figure 22. SPI data structure
LSB
MSB
Address
Data for register (24 bits)
A1 A0 D23 D22 D21 D20 D19 D18 D17 D16 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
Note: MSB is sent first
Table 19. Address decoder and outputs
Address
Outputs
DATABITS
D23-D0
A1
A0
No
Name
ST1
Function
0
0
0
1
24
24
0
1
DAC, Mixer, Tuning capacitors, LO_amplitude
Reference divider, VCO amplitude, VCO Calibration, Charge
Pump current, Prescaler Modulus, Mute functions
ST2
1
1
0
1
24
24
2
3
ST3
ST4
Functional modes, VCO dividers
Reserved
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STW82100B
SPI digital interface
10.2
SPI timing specification
10.2.1
Data, clock and load timing
Figure 23. SPI timing waveforms
t
t
setup
hold
MSB
MSB - 1
LSB
DATA
CLOCK
t
clk_loadr
t
clk
LOAD
t
t
clk_loadf
load
Table 20. SPI timing parameters
Parameter Description
tsetup
Min.
Typ.
Max.
Unit
DATA to CLOCK setup time
DATA to clock hold time
CLOCK cycle period
1
-
-
-
-
-
-
-
-
-
-
-
-
ns
ns
ns
ns
ns
ns
thold
0.5
10
3
tclk
tload
LOAD pulse width
tclk_loadr
tclk_loadf
CLOCK to LOAD rising edge
CLOCK to LOAD falling edge
0.6
2.5
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SPI digital interface
STW82100B
10.3
SPI registers
10.3.1
SPI register summary
Table 21. SPI register list
Offset Register name
0x00
Description
Page
ST1
ST2
ST3
SPI register 1
SPI register 2
SPI register 3
on page 50
on page 51
on page 52
0x01
0x10
10.3.2
ST1
SPI register definitions
SPI register 1
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
W
W
W
W
W
W
W
W
Address:
Type:
0x00
W
Reset:
0x00
[23:14] DAC[9:0]: DAC input word
[13:10] MIX[3:0]: Mixer bias control
[9] PWD_DAC: DAC power down
[8] CAL_AUTOSTART_EN: VCO calibration auto-restart enable
[7:6] IF[1:0]: Power consumption/linearity control
[5:3] CAP[2:0]: Tuning capacitors control
[2:1] LO_A[1:0]: LO amplitude control
[0] LPMUX_EN: For test purpose only. Must be set to ‘0’
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STW82100B
SPI digital interface
ST2
SPI register 2
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
W
W
W
W
W
W
W
W
W
W
W
W
Address:
Type:
0x01
W
Reset:
0x00
[23:14] R[9:0]: Reference clock divider ratio
[13:12] PLL_A[1:0]: VCO amplitude control
[11:9] CPSEL[2:0]: Charge pump output current control
[8] PSC_SEL: Prescaler modulus select (‘0’ for P=16, ‘1’ for P=19)
[7] CAL_TYPE: Calibration algorithm selection
0: standard calibration to optimize the phase noise versus temperature
1: enhanced calibration to maximize the ΔTLK range
[6] SERCAL:
at ‘1’ starts the VCO auto-calibration (automatically reset to ‘0’ at the end of calibration)
[5] SELEXTCAL: test purpose only. Must be set to ‘0’
[4] MUTE_EN:
0: mute function disabled
1: mute function enabled
[3] MUTE_TYPE: must be set to '1' while the mute function is enabled (mute the IF output
on Unlock state)
[2] MUTE_LOOUT_EN:
To be set to ’1’ to mute the LO output buffer
[1] MUTE_MIX_EN:
To be set to ’1’ to mute the Mixer circuitry
[0] MUTE_IFAMP_EN:
To be set to ’1’ to mute the IF amplifier circuitry
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SPI digital interface
STW82100B
ST3
SPI register 3
23
22
W
21
20
19
W
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
W
W
W
Address:
Type:
0x10
W
Reset:
0x00
[23] ALC_PD: Test purpose only; must be set to ‘0’ (ALC ON)
[22] PKD_EN: for test purpose only; must be set to ‘0’
[21:17] PD[4:0]:
00000: (0 decimal) Power down mode
00001: (1 decimal) Standard Mode VCOA (VCOA and RX chain ON)
00010: (2 decimal) Standard Mode VCOB (VCOB and RX chain ON)
00011: (3 decimal). Diversity Slave Mode (ExtVCO/LO input buffer and RX Chain ON;
internal synthesizer OFF)
00100: (4 decimal) Diversity Master Mode VCOA (VCOA, RX Chain and LO output
buffer ON)
00101: (5 decimal) Diversity Master Mode VCOB (VCOB, RX Chain and LO output
buffer ON)
00110: (6 decimal) External LO Standard Mode (RX Chain ON; PLL and ExtVCO/LO
input buffer ON)
00111: (7 decimal) External LO Diversity Master Mode (RX Chain ON; PLL, ExtVCO/LO
input buffer and LO output buffer ON)
[16:5] B[11:0]: B counter bits
[4:0] A[4:0]: A Counter Bits
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Doc ID 018355 Rev 5
STW82100B
SPI digital interface
10.4
Device calibration through the SPI interface
10.4.1
VCO calibration procedure (SPI interface)
The calibration of the VCO center frequency is activated by setting to ’1’ the SERCAL bit
(ST2 Register bit [6]).
In order to program properly the device while ensuring the VCO calibration, the following
procedure is required before every channel change:
1. Program the ST1 Register with the desired setting (DAC, Mixer, LO Control)
2. Program the ST3 Register with the desired setting (Functional mode, B and A counters)
3. Program the ST2 Register with the desired setting (R counter, VCO amplitude, Charge
Pump, Prescaler Modulus) and SERCAL bit set to ’1’
The maximum allowed PFD frequency (F
) to perform the calibration process is 1 MHz; if
PFD
the desired F
is higher than 1 MHz the following steps are needed:
PFD
4. Perform all the steps of the above calibration procedure programming the desired VCO
frequency with a proper setting of R, B and A counter so that F
MHz.
results lower than 1
PFD
5. Once calibration is completed program the device with the proper setting for the desired
VCO and PFD frequencies according to the following steps:
a) Program the ST3 Register with the desired setting (Functional mode, B and A
counters)
b) Program the ST2 Register with the desired setting (R counter, VCO amplitude,
Charge Pump, Prescaler Modulus) with the SERCAL bit set to ’0’.
10.4.2
Power ON sequence (SPI interface)
At power-on the device is configured in power-down mode.
In order to guarantee correct setting of the internal circuitry after the power on, the following
steps must be followed:
1. Power up the device
2. Provide the reference clock
3. Implement the first programming sequence with a proper delay time between the ST3
and ST2 load rising edges (see Figure 24). The T
value must respect the following
delay
condition:
1
Fref
---------
Tdelay >1023 ×
F
is the reference clock frequency.
ref
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SPI digital interface
STW82100B
Figure 24. SPI first programming timing
ST2
ST3
LSB-1
MSB
MSB-1
LSB
LSB-1
DATA
MSB
MSB-1
LSB
T
> 1023/F
delay
ref
LOAD
10.4.3
VCO calibration auto-restart procedure (SPI interface)
The VCO calibration auto-restart feature is enabled in two steps:
1. Set the desired frequency ensuring VCO calibration as described in Section 10.4.1.
2. Program the ST1 register with the CAL_AUTOSTART_EN bit set to '1' while keeping
unchanged the others.
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STW82100B
Application information
11
Application information
11.1
Application circuit
Figure 25. Typical STW82100B application circuit
3.3V_LN4
C1
C2 C3
RF_IN
C19
5V_1
C1
C2 C3
C1
C2 C3
3.3V_LN1
C1
C2 C3
3.3V_LN3
40
38
42
44 43
39
36
35
34
41
37
C1
C2 C3
1
2
VDD_DAC
REXT_DAC
VDD_DIV
VDD_IFAMP
33
U3
IF_out
3.3V_LN1
5V_2
C15 C16 C17
1
2
3
6
L3
L4
32
31
30
IF_OUTP
IF_OUTN
C18
NC
5
4
C1
C2 C3
3
4
VDD_VCO
NC
C4
C14
C13
C12
NC
6
LOAD
5
EXTVCO_INN
EXTVCO_INP
EXT_PD
ADD2
LOAD
29
28
4
5
2
R1
C5
R10
R9
SLC/CLK
U1
1
3
X1
SLC/CLK
X3
6
VFQFPN-44
SDA/DATA
7
SDA/DATA 27
VDD_DIG 26
External VCO
X4
X2
R8
3.3V_LN2
8
3.3V_LN2
SPI
I2C
3.3V_LN1
C1
C2 C3
DBUS_SEL
25
9
ADD1
3.3V_LN2
VDD_PLL 24
REF_CLK 23
ADD0
10
11
REF_CLK
C11
C1 C2 C3
VDD_IO
R7
12
22
13
20
14 15
16 17 18 19
3.3V_LN1
21
LOCK_DET
3.3V_LN1
R6
C1
C2 C3
3.3V_LN1
3.3V_LN1
C2 C3
C1
C2 C3
R2
L1
R3
L2
C1
R4
C9
C1 C2
C3
C10
C8
R5
C6
C7
3
2
1
4
5
6
NC
U2
X5
X7
X6
X8
LO_Output
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Application information
STW82100B
Table 22. Application circuit component values
Designation
C1, C15
Quantity
Description
Supplier
2
2
1
2
3
1
1
1
3
1
1
1
4
3
1
1
1
1
1
1
2
1
1
0
1
1
1
2
2
4.7 µF capacitors COG (0402)
1 nF capacitors COG (0402)
10 pF capacitor COG (0402)
3.6 pF capacitors COG (0402)
6.8 pF capacitors COG (0402)
270 pF capacitor COG (0402)
2.7 nF capacitor COG (0402)
68 pF capacitor COG (0402)
15 pF capacitors COG (0402)
100 nF capacitor COG (0402)
100 pF capacitor COG (0402)
180 pF capacitor COG (0402)
100 Ohm resistors (0402)
51 Ohm resistors (0402)
2.2 kohm resistor (0402)
8.2 kohm resistor (0402)
4.7 kohm resistor (0402)
Balun JTI - 2450BL15B100
Balun JTI - 1600BL15B100
Balun ADT4-5WT
C2, C11
C3
C4,C5
C6, C7, C19
C8
Murata Manufacturing Co., Ltd
C9
C10
C12, C13, C14
C16
C17
C18
R1, R8, R9, R10
-
-
-
-
-
R2, R3, R7
R4
R5
R6
U1
JOHANSON TECHNOLOGY
U2
U3
Mini Circuits
X1, X8
X2
3.3 nH inductors CS (0402)
1.2 pF capacitor COG (0402)
0 Ohm resistor (0402)
Coilcraft, Inc
Murata Manufacturing Co., Ltd
X3
-
X4
NC
-
X5
1.6 pF capacitor COG (0402)
3.9 nH inductor CS (0402)
2 pF capacitor COG (0402)
3.7 nH inductors HQ (0402)
220 nH inductors CS (1206)
Murata Manufacturing Co., Ltd
Coilcraft, Inc
X6
X7
Murata Manufacturing Co., Ltd
L1, L2
L3, L4
Coilcraft, Inc
Note:
1
2
For optimum performance a low-noise 3.3 V power supply must be used.
The 3.3 V and 5 V power supplies are split in order to maximize the isolation between RF,
LO, IF and digital sections.
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Doc ID 018355 Rev 5
STW82100B
Application information
11.2
Standard Mode Operation
The STW82100B can be used in Standard Mode for both RX path and TX observation path
(RX Chain ON and Synthesizer ON).
In such a case the 10-bit internal DAC can drive an external PIN diode attenuator in order to
calibrate the signal level at the input of the device.
Figure 26. Standard mode operation
I_PINDRV1
STW82100B
DAC
I_PINDRV2
5V
RF_IN2
RF_IN
RF_IN
4:1
IF_OUT
IF_OUTP
IF_OUTN
IF AMP
DBUS
RF_VSS
RF_CT
50 Ω
DBUS_SEL
SDA/DATA
SCL/CLK
LOAD
5V
MIXDRV_CT
VCO
calibrator
MIX
DRV
CAL_VCO
REF_CLK
BUF
DIV2
LOCK_DET
UP
DN
PLL
PFD
CHP
REXT_CP
VCO
BUFF
CAL_VCO
ICP
VCTRL
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Application information
STW82100B
11.3
Diversity mode operation with same LO frequency
The STW82100B supports the Diversity mode with the same LO frequency by using one
STW82100B in Master Mode (RX Chain ON, Synthesizer ON and LO output buffer ON) and
the other in Slave Mode (RX Chain ON, Synthesizer OFF and EXT VCO/LO buffer ON). This
operation mode is suitable for antenna diversity.
Figure 27. Diversity mode operation with same LO frequencies
5V
STW82100B Master
RF_IN_M
RF_IN
4:1
IF_M
IF_OUTP
IF_OUTN
IF AMP
DBUS
RF_VSS
RF_CT
50 Ω
DBUS_SEL
to DAC
SDA/DATA
SCL/CLK
LOAD
5V
MIXDRV_CT
MIX
DRV
VCO
calibrator
CAL_VCO
3.3V
REF_CLK
50 Ω
50 Ω
BUF
OUTBUFP
LO
OUT
DIV2
OUTBUFN
LOCK_DET
UP
DN
PLL
PFD
CHP
REXT_CP
VCO
BUFF
CAL_VCO
ICP
VCTRL
STW82100B Slave
EXTVCO_INP
EXT
LO/VCO
BUF
100 Ω
EXTVCO_INN
DBUS_SEL
SDA/DATA
SCL/CLK
LOAD
DBUS
MIX
DRV
5V
5V
MIXDRV_CT
RF_IN_S
RF_IN
4:1
IF_S
IF_OUTP
IF_OUTN
IF AMP
RF_VSS
RF_CT
50 Ω
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Doc ID 018355 Rev 5
STW82100B
Application information
11.4
Diversity mode operation with different LO frequencies
The STW82100B is particularly suitable for Diversity schemes using different LO
frequencies such as the Interferer Diversity. In these schemes two STW82100Bs are used,
each one set in Standard Mode and with different LO frequencies.
Figure 28. Diversity mode operation with different LO frequencies
5V
STW82100B Master
RF_IN1
RF_IN
RF_VSS
RF_CT
4:1
IF_OUT1
IF_OUTP
IF_OUTN
IF AMP
DBUS
50 Ω
LO1
DBUS_SEL
SDA/DATA
SCL/CLK
LOAD
5V
MIXDRV_CT
MIX
DRV
VCO
calibrator
CAL_VCO
REF_CLK
BUF
DIV2
LOCK_DET
UP
DN
PLL
PFD
CHP
REXT_CP
VCO
BUFF
CAL_VCO
ICP
VCTRL
5V
RF_IN2
RF_IN
RF_VSS
RF_CT
4:1
IF_OUT2
STW82100B Diversity
IF_OUTP
IF_OUTN
IF AMP
50 Ω
LO2
DBUS_SEL
SDA/DATA
SCL/CLK
LOAD
5V
DBUS
MIXDRV_CT
MIX
DRV
VCO
calibrator
CAL_VCO
REF_CLK
BUF
DIV2
LOCK_DET
UP
DN
PLL
PFD
CHP
REXT_CP
VCO
BUFF
CAL_VCO
ICP
VCTRL
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Application information
STW82100B
11.5
External VCO standard mode operation
The STW82100B can be used in Ext VCO Mode for both RX path and TX observation path
(RX Chain ON, Synthesizer ON, EXT VCO/LO buffer ON and with an external VCO).
In such a case the 10-bit internal DAC can drive an external PIN diode attenuator in order to
calibrate the signal level at the input of the device.
Figure 29. External VCO standard mode operation
I_PINDRV1
STW82100B
DAC
I_PINDRV2
5V
RF_IN2
RF_IN
4:1
IF_OUT
RF_IN
RF_VSS
RF_CT
IF_OUTP
IF_OUTN
IF AMP
DBUS
50 Ω
DBUS_SEL
SDA/DATA
SCL/CLK
LOAD
5V
MIXDRV_CT
MIX
DRV
REF_CLK
BUF
LOCK_DET
REXT_CP
UP
DN
PLL
PFD
CHP
EXT
LO/VCO
BUF
ICP
EXTVCO_INP
EXTVCO_INN
EXTERNAL
VCO
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Doc ID 018355 Rev 5
STW82100B
Application information
11.6
External VCO diversity mode operation with same LO
The STW82100B can be used in Diversity mode using one STW82100B in Master Mode
(RX Chain ON, Synthesizer ON, EXT VCO/LO buffer ON, LO output buffer ON and with an
external VCO) and the other one in Slave Mode (RX Chain ON, Synthesizer OFF and EXT
VCO/LO buffer ON).
Figure 30. External VCO diversity mode operation with same LO
STW82100B Master
5V
RF_IN_M
RF_IN
4:1
IF_M
IF_OUTP
IF_OUTN
IF AMP
RF_VSS
50 Ω
RF_CT
to DAC
DBUS_SEL
SDA/DATA
SCL/CLK
LOAD
5V
DBUS
MIXDRV_CT
MIX
DRV
REF_CLK
3.3V
BUF
50 Ω
50 Ω
LO/2xLO
OUT
OUTBUFP
OUTBUFN
LOCK_DET
REXT_CP
UP
DN
PLL
PFD
CHP
VCO
BUFF
ICP
EXTVCO_INP
EXTVCO_INN
EXTERNAL
VCO
EXTVCO_INP
100 Ω
STW82100B Slave
EXT
LO/VCO
BUF
EXTVCO_INN
DBUS_SEL
SDA/DATA
SCL/CLK
LOAD
DBUS
MIX
DRV
5V
5V
MIXDRV_CT
RF_IN_S
4:1
IF_S
RF_IN
IF_OUTP
IF_OUTN
IF AMP
RF_VSS
RF_CT
50 Ω
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Evaluation kit
STW82100B
12
Evaluation kit
An evaluation kit can be delivered upon request, including the following:
●
●
●
Evaluation board
GUI (graphical user interface) to program the device
PLLSim software for PLL loop filter design and noise simulation
When ordering, please specify the following order code:
Table 23. Evaluation kit order code
Part number
Description
STW82100B evaluation kit, 1.6 to 2.4 GHz RF frequency range
STW82100B-EVB
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Doc ID 018355 Rev 5
STW82100B
Package mechanical data
13
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
®
ECOPACK is an ST trademark.
Figure 31. VFQFPN-44 package outline
Doc ID 018355 Rev 5
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Package mechanical data
STW82100B
Table 24. VFQFPN-44 package dimensions
Dimensions in mm
Typ
Symbol
Min
Max
A
0.80
0.90
0.02
0.65
0.200
0.25
7.00
6.750
3.90
4.90
7.00
6.750
3.90
4.90
0.50
0.55
-
1.00
0.05
1.00
-
A1
A2
A3
b
-
-
-
0.18
0.30
7.15
-
D
6.85
D1
D2
D3
E
-
3.80
4.00
-
-
6.85
7.15
-
E1
E2
E3
e
-
3.80
4.00
-
-
-
-
L
0.35
0.75
0.60
12
P
-
-
-
K (degree)
ddd
-
-
0.08
Note:
1
2
VFQFPN stands for Thermally Enhanced Very thin Fine pitch Quad Flat Package No lead.
Very thin: A=1.00 Max.
Details of terminal 1 identifier are optional but must be located on the top surface of the
package by using either a mold or marked features.
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STW82100B
Revision history
14
Revision history
Table 25. Document revision history
Date
Revision
Changes
14-Jan-2011
1
First release
Corrected cover-page description paragraph tag
Table 11 and Table 12:
07-Mar-2011
2
– corrected introductory sentence
– aligned titles with corporate rules
Corrected RF range on cover page and in Table 6: Down converter mixer and
IF amplifier electrical characteristics
Updated description of bitfield MUTE_TYPE in Mute and calibration control
register
Removed Section 4.4.1: Default configuration
Added Section 9.4.2: Power ON sequence (I2C interface)
Updated Figure 23: SPI timing waveforms
29-Jun-2011
3
Updated Table 20: SPI timing parameters
Updated description of bitfield MUTE_TYPE in SPI register 2
Updated description of bitfield PD[4:0] in SPI register 3
Removed Section 5.4.1: Default configuration
Added Section 10.4.2: Power ON sequence (SPI interface)
Removed ‘Preliminary Data’ tags from cover page.
Table 3 moved to new Section 3: Absolute maximum ratings
Section 2.1 becomes Section 4: Operating conditions
Secction 2.2 becomes Section 5: Test conditions
Section 2.3 becomes Section 6: Electrical characteristics
Table 3: Absolute maximum ratings pins 31 and 32 changed from 0.7 to 0.8 kV
ESD rating.
Table 4: Operating conditions updated current consumption:
– ICC3.3V. Updated typical values for Diversity Master mode and external VCO
diversity master mode. Added maximum values.
10-Jan-2012
4
– ICC5V. Added maximum values.
Section 6: Electrical characteristics. Added note about Vsupply, RF frequency
range, ambient temperature and RF power conditons.
Table 6: Down converter mixer and IF amplifier electrical characteristics :
– added Max value for CG
– added Min values for IIP3
– modified typical value of nFRF-nFLO at 3FRF-3FLO FRFin = -5 dBm,
FIF = 150 MHz condition.
– modified LO to IF leakage typical value
– modified IFRL typical value
– modified ICCMD typical value on 3.3 V supply (pin 41, 42)
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Revision history
STW82100B
Table 25. Document revision history (continued)
Date
Revision
Changes
Table 8: Integer-N synthesizer electrical characteristics updated:
– KVCOA and KVCOB value
– ΔTLK split into ΔTLK A and ΔTLK B (for VCOA and VCOB). Specified as
maximum values.
– I2LOBUF, LOBUF, PLL and IPRE values
I
I
– Added table footnote 4
Table 9: Phase noise performance updated values of:
– Integrated Phase Noise (single sided) 100 Hz to 40 MHz
– LOA open-loop phase noise @ 1 kHz and 10 kHz
– LOB open-loop phase noise @ 1 kHz and 100 kHz
Added Section 7: Typical performance characteristics.
Modified sub-sections;
10-Jan-2012
4
– VCO frequency calibration
– VCO calibration auto-restart feature
Updated description of bitfield CALTYPE in registers
– MUTE_&_CALIBRATION
– ST2
Added Section 12: Evaluation kit.
Corrected RF range lower value on cover page.
Replaced occurrences of ‘STI register’ with ‘SPI register’ in section headers:
– Section 10.3: SPI registers
10-May-2012
5
– Section 10.3.1: SPI register summary
– Section 10.3.2: SPI register definitions.
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STW82100B
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