STS10NF30L [STMICROELECTRONICS]

N - CHANNEL 30V - 0.011ohm - 10A SO-8 STripFET POWER MOSFET; N - CHANNEL 30V - 0.011ohm - 10A型SO-8的STripFET功率MOSFET
STS10NF30L
型号: STS10NF30L
厂家: ST    ST
描述:

N - CHANNEL 30V - 0.011ohm - 10A SO-8 STripFET POWER MOSFET
N - CHANNEL 30V - 0.011ohm - 10A型SO-8的STripFET功率MOSFET

晶体 晶体管 功率场效应晶体管 开关 脉冲 光电二极管
文件: 总6页 (文件大小:47K)
中文:  中文翻译
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STS10NF30L  
N - CHANNEL 30V - 0.011- 10A SO-8  
STripFET POWER MOSFET  
PRELIMINARY DATA  
TYPE  
VDSS  
RDS(on)  
ID  
STS10NF30L  
30 V  
< 0.0135 Ω  
10 A  
TYPICAL RDS(on) = 0.011 Ω  
STANDARD OUTLINE FOR EASY  
AUTOMATED SURFACE MOUNT ASSEMBLY  
LOW THRESHOLD DRIVE  
DESCRIPTION  
This Power MOSFET is the second generation of  
STMicroelectronics unique ” Single Feature  
Size  
” strip-based process. The resulting  
transistor shows extremely high packing density  
for low on-resistance, rugged avalanche  
characteristics and less critical alignment steps  
SO-8  
therefore  
a
remarkable  
manufacturing  
reproducibility.  
INTERNAL SCHEMATIC DIAGRAM  
APPLICATIONS  
DC MOTOR DRIVE  
DC-DC CONVERTERS  
BATTERY MANAGMENT IN NOMADIC  
EQUIPMENT  
POWER MANAGEMENT IN  
PORTABLE/DESKTOPPCs  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
VDS  
Parameter  
Value  
30  
Unit  
V
Drain-source Voltage (VGS = 0)  
Drain- gate Voltage (RGS = 20 k)  
Gate-source Voltage  
VDGR  
VGS  
30  
V
± 20  
V
o
ID  
Drain Current (continuous) at Tc = 25 C  
10  
6.5  
A
A
o
Drain Current (continuous) at Tc = 100 C  
IDM()  
Drain Current (pulsed)  
40  
A
Ptot  
Total Dissipation at Tc = 25 oC  
2.5  
W
() Pulse width limited by safe operating area  
1/6  
June 2000  
STS10NF30L  
THERMAL DATA  
Rthj-amb (*)Thermal Resistance Junction-ambient  
50  
150  
-55 to 150  
oC/W  
oC  
Maximum Operating Junction Temperature  
Tj  
Storage Temperature  
oC  
T
stg  
(*)  
10  
sec)  
Mounted on FR-4board (t  
ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwisespecified)  
OFF  
Symbol  
V(BR)DSS Drain-source  
Breakdown Voltage  
Zero Gate Voltage  
Drain Current (VGS = 0) VDS = Max Rating  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
ID = 250 µA VGS = 0  
30  
V
IDSS  
IGSS  
VDS = Max Rating  
1
10  
µA  
A
µ
o
Tc = 125 C  
Gate-body Leakage  
Current (VDS = 0)  
VGS = ± 20 V  
± 100  
nA  
ON (  
)
Symbol  
VGS(th)  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Gate Threshold Voltage VDS = VGS ID = 250 µA  
1
1.6  
2.5  
V
RDS(on)  
Static Drain-source On VGS = 10 V ID = 5 A  
0.011 0.0135  
0.016 0.0220  
Resistance  
VGS = 4.5 V ID = 5 A  
ID(on)  
On State Drain Current VDS > ID(on) x RDS(on)max  
VGS = 10 V  
10  
A
DYNAMIC  
Symbol  
Parameter  
Forward  
Test Conditions  
VDS > ID(on) x RDS(on)max ID = 5 A  
Min.  
Typ.  
Max.  
Unit  
gfs ( )  
20  
S
Transconductance  
Ciss  
Coss  
Crss  
Input Capacitance  
Output Capacitance  
Reverse Transfer  
Capacitance  
VDS = 25 V f = 1 MHz VGS = 0 V  
1450  
390  
150  
pF  
pF  
pF  
2/6  
STS10NF30L  
ELECTRICAL CHARACTERISTICS  
(continued)  
SWITCHING ON  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
td(on)  
tr  
Turn-on Delay Time  
Rise Time  
VDD = 15 V  
RG = 4.7  
ID = 5 A  
VGS = 4.5 V  
25  
280  
ns  
ns  
(Resistive Load, see fig. 3)  
Qg  
Qgs  
Qgd  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
VDD = 24 V ID = 10 A VGS = 10 V  
25  
11  
12  
35  
nC  
nC  
nC  
SWITCHING OFF  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
td(off)  
tf  
Turn-off Delay Time  
Fall Time  
VDD = 15 V  
RG = 4.7 Ω  
ID = 5 A  
VGS = 4.5 V  
40  
60  
ns  
ns  
(Resistive Load, see fig. 3)  
SOURCE DRAIN DIODE  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
ISD  
ISDM ( )  
Source-drain Current  
Source-drain Current  
(pulsed)  
10  
40  
A
A
VSD ( ) Forward On Voltage  
ISD = 10 A VGS = 0  
1.2  
V
trr  
Reverse Recovery  
Time  
Reverse Recovery  
Charge  
Reverse Recovery  
Current  
ISD = 10 A  
VDD = 15 V  
(see test circuit, fig. 5)  
di/dt = 100 A/µs  
Tj = 150 oC  
45  
52  
ns  
Qrr  
nC  
A
IRRM  
2.3  
( ) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %  
( ) Pulse width limited by safe operating area  
3/6  
STS10NF30L  
Fig. 1:  
Fig. 2:  
UnclampedInductive Waveform  
Unclamped Inductive Load Test Circuit  
Fig. 3: Switching Times Test Circuits For  
Fig. 4: Gate Charge test Circuit  
Resistive Load  
Fig. 5:  
Test Circuit For InductiveLoad Switching  
And Diode Recovery Times  
4/6  
STS10NF30L  
SO-8 MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
TYP.  
MAX.  
1.75  
0.25  
1.65  
0.85  
0.48  
0.25  
0.5  
MIN.  
MAX.  
0.068  
0.009  
0.064  
0.033  
0.018  
0.010  
0.019  
A
a1  
a2  
a3  
b
0.1  
0.003  
0.65  
0.35  
0.19  
0.25  
0.025  
0.013  
0.007  
0.010  
b1  
C
c1  
D
45 (typ.)  
4.8  
5.8  
5.0  
6.2  
0.188  
0.228  
0.196  
0.244  
E
e
1.27  
3.81  
0.050  
0.150  
e3  
F
3.8  
0.4  
4.0  
1.27  
0.6  
0.14  
0.157  
0.050  
0.023  
L
0.015  
M
S
8 (max.)  
0016023  
5/6  
STS10NF30L  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences  
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is  
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are  
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products  
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
The ST logo is a trademark of STMicroelectronics  
2000 STMicroelectronics – Printed in Italy – All Rights Reserved  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil -China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco -  
Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.  
http://www.st.com  
6/6  

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