STPS15LB-TR [STMICROELECTRONICS]

LOW DROP POWER SCHOTTKY RECTIFIER; 电力低压降肖特基整流器


型号：	STPS15LB-TR
厂家：	ST
描述：	LOW DROP POWER SCHOTTKY RECTIFIER 电力低压降肖特基整流器整流二极管功效局域网
文件：	总5页 (文件大小：70K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

STPS5L25B/B-1

LOW DROP POWER SCHOTTKY RECTIFIER

MAIN PRODUCT CHARACTERISTICS

I_F(AV)

V_RRM

5 A

4 (TAB)

25 V

Tj (max)

V_F(max)

150°C

0.35 V

FEATURES AND BENEFITS

VERY LOW FORWARD VOLTAGE DROP FOR

LESS POWER DISSIPATION AND REDUCED

HEATSINK

OPTIMIZED CONDUCTION/REVERSE LOSSES

TRADE-OFF WHICH MEANS THE HIGHEST

EFFICIENCY IN THE APPLICATIONS

HIGH POWER SURFACE MOUNT MINIATURE

PACKAGE

IPAK

STPS5L25B-1

DPAK

STPS5L25B

AVALANCHE RATED

DESCRIPTION

Single Schottky rectifier suited to Switched Mode

Power Supplies and high frequency DC to DC con-

verters.

This device is especially intended for use as a Rec-

tifier at the secondary of 3.3V SMPS units.

ABSOLUTE RATINGS

(limiting values)

Symbol

Parameter

Value

Unit

V_RRM

Repetitive peak reverse voltage

I_F(RMS)RMS forward current

I_F(AV)

I_FSM

I_RRM

I_RSM

T_stg

Average forward current

Tc = 145°C δ = 0.5

Surge non repetitive forward current

Repetitive peak reverse current

Non repetitive peak reverse current

Storage temperature range

tp = 10 ms Sinusoidal

tp=2 µs square F=1kHz

tp = 100 µs square

°C

- 65 to + 150

150

Maximum operating junction temperature *

Critical rate of rise of reverse voltage

V/ s

dV/dt

10000

dPtot

dTj

* :

thermal runaway condition for a diode on its own heatsink

Rth(j−a)

August 1999 - Ed: 3A

1/5

STPS5L25B/B-1

THERMAL RESISTANCES

Symbol

Parameter

Value

Unit

R_th(j-c)

Junction to case

2.5

C/W

STATIC ELECTRICAL CHARACTERISTICS

Symbol

Tests Conditions

Min. Typ. Max.

Unit

I_R*

Reverse leakage current

Tj = 25 C

V_R= V_RRM

350

Tj = 125 C

115

0.47

0.35

0.59

0.50

Tj = 25 C

V_F*

Forward voltage drop

I_F= 5 A

= 5 A

0.31

0.41

Tj = 125 C

I_F

= 10 A

Tj = 25 C

Tj = 125 C

Pulse test : * tp = 380 µs, δ < 2%

To evaluate the maximum conduction losses use the following equation :

P = 0.2 x I_F(AV)+ 0.030 I_{F (RMS)}

Fig. 1:

average forward current.

Fig. 2:

Average forward current versus ambient

Average forward power dissipation versus

temperature ( =0.5).

PF(av)(W)

IF(av)(A)

2.5

δ = 0.2

δ = 0.1

δ = 0.5

Rth(j-a)=Rth(j-c)

2.0

1.5

1.0

0.5

0.0

δ = 0.05

δ = 1

Rth(j-a)=70°C/W

Tamb(°C)

=tp/T

IF(av) (A)

100

125

150

2/5

STPS5L25B/B-1

Fig. 3:

Fig. 4:

Relative variation of thermal impedance

junction to case versus pulse duration.

Non repetitive surge peak forward current

versus overload duration (maximum values).

IM(A)

Zth(j-c)/Rth(j-c)

100

1.0

0.8

Tc=25°C

δ = 0.5

0.6

Tc=75°C

0.4

δ = 0.2

Tc=100°C

Single pulse

0.2

δ = 0.1

t(s)

=tp/T

=0.5

tp(s)

0.0

1E-3

1E-2

1E-1

1E+0

1.0E-4

1.0E-3

1.0E-2

1.0E-1

1.0E+0

Fig. 5:

Fig. 6:

Reverse leakage current versus reverse

Junction capacitance versus reverse

voltage applied (typical values).

IR(mA)

C(pF)

3E+2

Tj=150°C

1E+2

2000

F=1MHz

Tj=25°C

Tj=125°C

1E+1

1000

500

1E+0

1E-1

Tj=25°C

200

1E-2

VR(V)

100

1E-3

Fig. 7:

rent (maximum values).

Forward voltage drop versus forward cur-

Fig. 8:

Thermal resistance junction to ambient ver-

sus copper surface under tab (Epoxy printed circuit

board FR4, copper thickness: 35 m).

Rth(j-a) (°C/W)

IFM(A)

100.0

100

Typical values

Tj=150°C

10.0

Tj=125°C

Tj=25°C

1.0

0.1

VFM(V)

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0

S(Cu) (cm²)

3/5

STPS5L25B/B-1

PACKAGE MECHANICAL DATA

DPAK

DIMENSIONS

Millimeters Inches

Min. Min.

REF.

Max

2.40

1.10

0.23

0.90

5.40

0.60

6.20

6.60

4.60

10.10

Max.

0.094

0.043

0.009

0.035

0.212

0.023

0.244

0.259

0.181

0.397

2.20

0.90

0.03

0.64

5.20

0.45

0.48

6.00

6.40

4.40

9.35

0.086

0.035

0.001

0.025

0.204

0.017

0.018

0.236

0.251

0.173

0.368

0.80 typ.

0.031 typ.

0.60

0°

1.00

8°

0.023

0°

0.039

8°

FOOT PRINT DIMENSIONS

(in millimeters)

6.7

1.6

2.3 2.3

4/5

STPS5L25B/B-1

PACKAGE MECHANICAL DATA

IPAK

DIMENSIONS

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

REF.

2.2

0.9

2.4 0.086

1.1 0.035

1.3 0.027

0.9 0.025

5.4 0.204

0.85

0.094

0.043

0.051

0.035

0.212

0.033

0.7

0.64

5.2

0.3

0.035

0.95

0.037

0.023

0.244

0.260

0.181

0.641

0.370

0.047

0.45

0.6 0.017

0.6 0.019

6.2 0.236

6.6 0.252

4.6 0.173

16.3 0.626

9.4 0.354

1.2 0.031

C2 0.48

6.4

4.4

15.9

0.8

10°

0.031 0.039

10°

Ordering type

STPS5L25B

Marking

Package

DPAK

IPAK

Weight

Base qty

Delivery mode

Tube

STPS5L25B

0.30g

0.35g

2500

STPS15LB-TR

STPS5L25B-1

Tape & reel

Tube

Epoxy meets UL94,V0

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of

use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by

implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to

change without notice. This publication supersedes and replaces all information previously supplied.

STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-

proval of STMicroelectronics.

The ST logo is a registered trademark of STMicroelectronics

STMicroelectronics GROUP OF COMPANIES

Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia

Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.

http://www.st.com

5/5

STPS15LB-TR [STMICROELECTRONICS]

相关型号：

STPS15LCD80CR

STPS15M80CFP

STPS15M80CG-TR

STPS15M80CR

STPS15M80CT

STPS15SM80C

STPS160

STPS160-Y

STPS16035T

STPS16035TV

STPS16045

STPS16045T