STPS1545C [STMICROELECTRONICS]
Power Schottky rectifier; 功率肖特基整流器
| 型号： | STPS1545C |
| 厂家： | 
ST |
| 描述： | Power Schottky rectifier |
| 文件： | 总9页 (文件大小：145K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STPS1545C
Power Schottky rectifier
Main product characteristics
A1
K
A2
IF(AV)
VRRM
2 x 7.5 A
45 V
Tj (max)
VF(max)
175° C
0.57 V
A2
K
Features and Benefits
A1
■ Very small conduction losses
■ Negligible switching losses
■ Extremely fast switching
TO-220AB
STPS1545CT
■ Avalanche capability specified
K
Description
Dual center tap Schottky rectifier suited for
SwitchMode Power Supply and high frequency
DC to DC converters.
A2
A2
A1
K
A1
I2PAK
D2PAK
STPS1545CG
2
2
Packaged either in TO-220AB, D PAK or I PAK,
this device is especially intended for use in low
voltage, high frequency inverters, free wheeling
and polarity protection applications.
STPS1545CR
March 2007
Rev 6
1/9
www.st.com
9
Characteristics
STPS1545C
1
Characteristics
Table 1.
Symbol
Absolute Ratings (limiting values)
Parameter
Value
Unit
VRRM Repetitive peak reverse voltage
IF(RMS) RMS forward voltage
45
20
V
A
A
IF(AV) Average forward current δ = 0.5
Tc = 157° C Per diode
7.5
tp = 10 ms
Sinusoidal
IFSM
Surge non repetitive forward current
150
1
A
A
tp = 2 µs square
F = 1 kHz
IRRM Peak repetitive reverse current
IRSM
Non repetitive peak reverse current
tp = 100 µs square
tp = 1 µs Tj = 25°C
2
2700
A
W
PARM Repetitive peak avalanche power
Tstg
Tj
Storage temperature range
Maximum operating junction temperature (1)
-65 to + 175
175
°C
°C
dV/dt Critical rate of rise of reverse voltage
10000
V/µs
dPtot
---------------
1
-------------------------
1.
<
thermal runaway condition for a diode on its own heatsink
dTj
Rth(j – a)
Table 2.
Symbol
Thermal resistances
Parameter
Value
Unit
Per diode
Total
3.0
1.7
Rth(j-c) Junction to case
Rth(c)
°C/W
Coupling
0.35
When the diodes 1 and 2 are used simultaneously :
ΔTj(diode 1) = P(diode1) x R
(Per diode) + P(diode 2) x R
th(j-c)
th(c)
Table 3.
Symbol
Static electrical characteristics (per diode)
Parameter
Test Conditions
Min. Typ. Max. Unit
Tj = 25°C
100
15
µA
(1)
IR
Reverse leakage current
VR =VRRM
Tj = 125°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
5
mA
IF = 7.5A
IF = 15 A
IF = 15 A
0.5
0.57
0.84
0.72
(1)
VF
Forward voltage drop
V
0.65
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
2
P = 0.42 x I
+ 0.020 I
F(AV)
F (RMS)
2/9
STPS1545
Figure 1.
Characteristics
Average forward power dissipation Figure 2.
versus average forward current (per
diode)
Average forward current versus
ambient temperature (δ = 0.5, per
diode)
I
(A)
P
(W)
F(AV)
F(AV)
9
8
7
6
5
4
3
2
1
0
6
5
4
3
2
1
0
TO-220AB
2
δ = 0.1
δ = 0.2
δ = 0.5
Rth(j-a)=Rth(j-c)
D
PAK
δ = 0.05
Rth(j-a)=40°C/W
Rth(j-a)=15°C/W
δ = 1
T
T
tp
=tp/T
δ
I
(A)
F(AV)
tp
T (°C)
amb
=tp/T
25
δ
0
1
2
3
4
5
6
7
8
9
10
0
50
75
100
125
150
175
Figure 3.
Normalized avalanche power
derating versus pulse duration
Figure 4.
Normalized avalanche power
derating versus junction
temperature
P
(t )
p
(1µs)
ARM
P
ARM
(t )
p
(25°C)
ARM
P
ARM
P
1
1.2
1
0.1
0.8
0.6
0.4
0.2
0.01
T (°C)
j
t (µs)
p
0
0.001
25
50
75
100
125
150
0.01
0.1
1
10
100
1000
Figure 5.
Non repetitive surge peak forward Figure 6.
current versus overload duration
(maximum values, per diode)
Relative variation of thermal
impedance junction to case versus
pulse duration
Z
/R
I
(A)
th(j-c) th(j-c)
M
1.0
0.8
0.6
0.4
0.2
0.0
120
100
80
60
40
20
0
TC=50°C
δ = 0.5
δ = 0.2
TC=100°C
T
TC=150°C
IM
δ = 0.1
t
t (s)
p
t(s)
δ=0.5
Single pulse
tp
=tp/T
δ
1E-3
1E-2
1E-1
1E+0
1E-4
1E-3
1E-2
1E-1
1E+0
3/9
Characteristics
STPS1545C
Figure 7.
Reverse leakage current versus
Figure 8.
Junction capacitance versus
reverse voltage applied (typical
values, per diode)
reverse voltage applied (typical
values, per diode)
C(pF)
I (µA)
R
1000
5E+4
1E+4
F=1MHz
VOSC=30mVRMS
Tj=25°C
Tj=150°C
Tj=125°C
Tj=100°C
500
200
1E+3
1E+2
1E+1
1E+0
1E-1
Tj=75°C
Tj=50°C
Tj=25°C
V (V)
R
V (V)
R
100
1
0
5
10
15
20
25
30
35
40
45
2
5
10
20
50
Figure 9.
Forward voltage drop versus
forward current (maximum values,
per diode)
Figure 10. Thermal resistance junction to
ambient versus copper surface
under tab (Epoxy printed circuit
board, copper thickness: 35 µm)
I
(A)
FM
R
(°C/W)
th(j-a)
100.0
10.0
1.0
80
70
60
50
40
30
20
10
0
Tj=125°C
(typical values)
Tj=25°C
Tj=125°C
S(Cu)(cm²)
V (V)
FM
0.1
0
2
4
6
8
10
12
14
16
18
20
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
4/9
STPS1545
Package Information
2
Package Information
●
●
●
●
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.55 Nm
Maximum torque value: 0.70 Nm
2
Figure 11. D PAK dimensions
Dimensions
Millimeters
Ref
Inches
Min.
Max.
Min.
Max.
A
A1
A2
B
4.40
2.49
0.03
0.70
1.14
0.45
1.23
8.95
10.00
4.88
15.00
1.27
1.40
2.40
4.60
2.69
0.23
0.93
1.70
0.60
1.36
9.35
10.40
5.28
15.85
1.40
1.75
3.20
0.173
0.098
0.001
0.027
0.045
0.017
0.048
0.352
0.393
0.192
0.590
0.050
0.055
0.094
0.181
0.106
0.009
0.037
0.067
0.024
0.054
0.368
0.409
0.208
0.624
0.055
0.069
0.126
A
E
C2
L2
D
B2
C
L
L3
A1
C2
D
B2
B
R
C
G
E
A2
G
L
M
*
V2
L2
L3
M
* FLAT ZONE NO LESS THAN 2mm
R
0.40 typ.
0.016 typ.
V2
0°
8°
0°
8°
Figure 12. Footprint (dimensions in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
5/9
Package Information
STPS1545C
Inches
Figure 13. TO-220AB dimensions
Dimensions
Millimeters
Min. Max.
Ref
Min.
Max.
A
C
4.40
1.23
2.40
0.49
0.61
1.14
1.14
4.95
2.40
10
4.60
1.32
2.72
0.70
0.88
1.70
1.70
5.15
2.70
10.40
0.173
0.048
0.094
0.019
0.024
0.044
0.044
0.194
0.094
0.393
0.181
0.051
0.107
0.027
0.034
0.066
0.066
0.202
0.106
0.409
A
H2
D
Dia
C
E
L5
L7
F
F1
F2
G
L6
L4
L2
F2
F1
D
L9
G1
H2
L2
L4
L5
L6
L7
L9
M
F
16.4 typ.
0.645 typ.
M
13
14
0.511
0.104
0.600
0.244
0.137
0.551
0.116
0.620
0.259
0.154
G1
E
2.65
15.25
6.20
3.50
2.95
15.75
6.60
3.93
G
2.6 typ.
0.102 typ.
Diam.
3.75
3.85
0.147
0.151
6/9
STPS1545
Package Information
2
Figure 14. I PAK dimensions
Dimensions
Ref
Millimeters
Typ.
Inches
Typ.
Min.
Max.
Min.
Max.
A
A
A1
b
4.40
2.49
0.70
1.14
1.14
0.45
1.23
8.95
2.40
10.0
13.1
3.48
1.27
4.60
2.69
0.93
1.17
1.17
0.60
1.36
9.35
2.70
10.4
13.6
3.78
1.40
0.173 0.181
0.098 0.106
0.028 0.037
0.044 0.046
0.044 0.046
0.018 0.024
0.048 0.054
0.352 0.368
0.094 0.106
0.394 0.409
0.516 0.535
0.137 0.149
0.050 0.055
A
A1
b
4.40
2.49
0.70
1.14
1.14
0.45
1.23
8.95
2.40
10.0
13.1
3.48
1.27
E
c2
L2
b1
b2
c
b1
b2
c
D
L1
A1
c2
D
c2
D
b1
b
L
e
e
E
E
c
L
L
e
e1
L1
L2
L1
L2
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
7/9
Ordering Information
STPS1545C
3
Ordering Information
Delivery
mode
Ordering type
Marking
Package
Weight Base qty
STPS1545CT
STPS1545CG
STPS1545CG-TR
STPS1545CR
STPS1545CT
STPS1545CG
STPS1545CG
STPS1545CR
TO-220AB
D2PAK
D2PAK
I2PAK
2.23 g
1.48 g
1.48 g
1.49 g
50
50
Tube
Tube
1000
50
Tape & reel
Tube
4
Revision history
Date
Revision
Description of Changes
Jul-2003
5F
6
Last release.
21-Mar-2007
Removed ISOWATT and TO-220FPAB packages.
8/9
STPS1545
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9/9
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