STPS140-Y [STMICROELECTRONICS]

Automotive power Schottky rectifier; 汽车大功率肖特基整流


型号：	STPS140-Y
厂家：	ST
描述：	Automotive power Schottky rectifier 汽车大功率肖特基整流
文件：	总9页 (文件大小：103K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

STPS140-Y

Automotive power Schottky rectifier

Features

■ Very small conduction losses

■ Negligible switching losses

■ Low forward voltage drop

■ Surface mount miniature packages

■ Avalanche capability specified

■ AEC-Q101 qualified

SMA

SMB

(JEDEC DO-214AC)

STPS140AY

(JEDEC DO-214AA)

STPS140UY

■ ECOPACK 2 compliant component

Table 1.

Device summary

Description

Symbol

Value

Single chip Schottky rectifiers suited to Switched

Mode Power Supplies and high frequency DC to

DC converters.

I_F(AV)

V_RRM

T_{j (max)}

V_{F (max)}

1 A

40 V

Packaged in SMA and SMB, this device is

especially intended for surface mounting and

used in low voltage, high frequency inverters, free

wheeling and polarity protection for automotive

applications.

150 °C

0.5 V

December 2010

Doc ID 17973 Rev 1

1/9

www.st.com

Characteristics

STPS140-Y

Characteristics

Table 2.

Symbol

Absolute Ratings (limiting values)

Parameter

Value

Unit

V_RRMRepetitive peak reverse voltage

I_F(RMS)Forward rms voltage

SMA

SMB

T_L= 130 °C δ = 0.5

T_L= 135 °C δ = 0.5

Average forward

current

I_F(AV)

I_FSM

I_RRM

I_RSM

Surge non repetitive forward current t_p=10 ms sinusoidal

Repetitive peak reverse current

t_p= 2 µs F = 1 kHz square

t_p= 100 µs square

Non repetitive peak reverse current

P_ARMRepetitive peak avalanche power

t_p= 1 µs Tj = 25 °C

900

T_stg

T_j

Storage temperature range

- 65 to + 150

- 40 to + 150

10000

°C

Operating junction temperature range⁽¹⁾

dV/dt Critical rate of rise of reverse voltage

V/µs

dPtot

dTj

condition to avoid thermal runaway for a diode on its own heatsink

Rth(j-a)

Table 3.

Symbol

Thermal resistance

Parameter

Value

Unit

SMA

SMB

R_th(j-l)Junction to lead

°C/W

Table 4.

Symbol

Static electrical characteristics

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

T_j= 25 °C

T_j= 100 °C

T_j= 25 °C

T_j= 125 °C

T_j= 25 °C

T_j= 125 °C

µA

(1)

I_R

Reverse leakage current

V_R= V_RRM

0.25

0.43

0.53

0.55

0.5

0.65

0.6

I_F= 1 A

I_F= 2 A

(2)

V_F

Forward voltage drop

1. Pulse test: tp = 380 µs, δ < 2%

2. Pulse test: tp = 5 ms, δ < 2%

To evaluate the conduction losses use the following equation: P = 0.4 x I

+ 0.10 I

F(AV)

F (RMS)

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STPS140-Y

Figure 1.

Characteristics

Average forward power dissipation Figure 2.

versus average forward current

Average forward current versus

ambient temperature (δ = 0.5)

(A)

F(AV)

(W)

F(AV)

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

R_th(j-a)=R_th(j-I)

δ = 0.1

δ = 0.2

δ = 0.5

δ = 0.05

SMA

R_th(j-a)=100°C/W

S_(CU)=1.5cm²

δ = 1

SMB

R_th(j-a)=80°C/W

S_(CU)=1.5cm²

(A)

F(AV)

T (°C)

amb

=tp/T

1.0

=tp/T

0.0

0.2

0.4

0.6

0.8

1.2

100

125

150

Figure 3.

Normalized avalanche power

derating versus pulse duration

Figure 4.

Normalized avalanche power

derating versus junction

temperature

(t )

(1µs)

ARM

(t )

(25°C)

ARM

1.2

0.1

0.8

0.6

0.4

0.2

0.01

T (°C)

t (µs)

0.001

100

125

150

0.01

0.1

100

1000

Figure 5.

Non repetitive surge peak forward Figure 6.

current versus overload duration

(maximum values) (SMA)

Non repetitive surge peak forward

current versus overload duration

(maximum values) (SMB)

(A)

T_a=25°C

T_a=50°C

T_a=100°C

T_a=25°C

T_a=50°C

T_a=100°C

δ=0.5

t(s)

1E-3

1E-2

1E-1

1E+0

1E-3

1E-2

1E-1

1E+0

Doc ID 17973 Rev 1

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Characteristics

STPS140-Y

Figure 7.

Relative variation of thermal

Figure 8.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (SMA)

impedance junction to ambient

versus pulse duration (SMB)

th(j-c) th(j-c)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

Epoxy printed circuit board, copper thickness: 35 µm

reccomended pad layout

Epoxy printed circuit board, copper thickness: 35 µm

reccomended pad layout

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

t (s)

=tp/T

1E+2

1E-2

1E-1

1E+0

1E+1

1E+2

1E+0

1E+3

1E-2

1E-1

1E+1

Figure 9.

Reverse leakage current versus

reverse voltage applied

(typical values)

Figure 10. Junction capacitance versus

reverse voltage applied

(typical values)

I (µA)

C(pF)

1E+3

1E+2

1E+1

1E+0

1E-1

1E-2

200

T_j=125°C

F=1MHz

T_j=25°C

100

T_j=75°C

T_j=25°C

V (V)

Figure 11. Forward voltage drop versus

forward current (maximum values)

Figure 12. Thermal resistance junction to

ambient versus copper surface

under each lead (SMA)

(A)

(°C/W)

th(j-a)

140

120

100

1E+1

1E+0

1E-1

1E-2

Epoxy printed circuit board FR4, copper thickness: 35 µm

T_j=125°C

reccomended pad layout

P=1.5W

S(Cu)(cm²)

(V)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

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Doc ID 17973 Rev 1

STPS140-Y

Characteristics

Figure 13. Thermal resistance junction to ambient versus copper surface under each lead

(Epoxy printed circuit board FR4, copper thickness: 35 µm) (SMB)

(°C/W)

th(j-a)

120

100

P=1.5W

S(Cu)(cm²)

Doc ID 17973 Rev 1

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Package information

STPS140-Y

Package information

●

Band indicates cathode

Epoxy meets UL94, V0

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK packages, depending on their level of environmental compliance. ECOPACK

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK is an ST trademark.

Figure 14. SMA package mechanical data

Dimensions

Ref

Millimeters

Inches

Min. Max.

Min.

Max.

1.90

0.05

1.25

0.15

4.80

3.95

2.25

0.75

2.03

0.20

1.65

0.41

5.60

4.60

2.95

1.60

0.075

0.002

0.049

0.006

0.189

0.156

0.089

0.030

0.080

0.008

0.065

0.016

0.220

0.181

0.116

0.063

Figure 15. SMA footprint dimensions (in millimeters)

1.65

1.45

2.40

1.45

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Doc ID 17973 Rev 1

STPS140-Y

Package information

Dimensions

Figure 16. SMB package mechanical data

Ref

Millimeters

Inches

Min.

Max.

Min.

Max.

1.90

0.05

1.95

0.15

5.10

4.05

3.30

0.75

2.45

0.20

2.20

0.41

5.60

4.60

3.95

1.60

0.075

0.002

0.077

0.006

0.201

0.159

0.130

0.030

0.096

0.008

0.087

0.016

0.220

0.181

0.156

0.063

Figure 17. SMB footprint dimensions (in millimeters)

2.3

1.52

2.75

1.52

Doc ID 17973 Rev 1

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Ordering information

STPS140-Y

Ordering information

Table 5.

Order code

STPS140A

STPS140U

Ordering information

Marking

Package

Weight

Base qty

Delivery mode

S140Y

G14Y

SMA

SMB

0.068 g

0.107 g

5000

2500

Tape and reel

Revision history

Table 6.

Date

10-Dec-2010

Document revision history

Revision

Changes

First issue.

8/9

Doc ID 17973 Rev 1

STPS140-Y

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Doc ID 17973 Rev 1

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STPS140-Y [STMICROELECTRONICS]

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