STN2NE10L [STMICROELECTRONICS]
N-CHANNEL 100V - 0.33ohm - 2A SOT-223 STripFET POWER MOSFET; N沟道100V - 0.33ohm - 2A SOT- 223的STripFET功率MOSFET
| 型号： | STN2NE10L |
| 厂家： | 
ST |
| 描述： | N-CHANNEL 100V - 0.33ohm - 2A SOT-223 STripFET POWER MOSFET |
| 文件： | 总8页 (文件大小：87K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STN2NE10L
N-CHANNEL 100V - 0.33Ω - 2A SOT-223
STripFET POWER MOSFET
TYPE
VDSS
RDS(on)
ID
STN2NE10L
100 V
< 0.4 Ω
1.8 A
■
■
■
■
■
TYPICAL RDS(on) = 0.33 Ω
EXCEPTIONAL dv/dt CAPABILITY
AVALANCHERUGGED TECHNOLOGY
100 % AVALANCHE TESTED
LOW THRESHOLD DRIVE
2
3
DESCRIPTION
2
1
This Power Mosfet is the latest development of
STMicroelectronics unique ”Single Feature
Size ” stip-based process. The resulting transi-
stor shows extremely high packing density for low
on-resistance, rugged avalanche characteristics
and less critical alignment steps therefore a re-
markable manufacturingreproducibility.
SOT-223
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
■
■
■
DC MOTOR CONTROL (DISK DRIVES,etc.)
DC-DC & DC-AC CONVERTERS
SYNCHRONOUS RECTIFICATION
ABSOLUTE MAXIMUM RATINGS
Symbol
VDS
Parameter
Value
100
Unit
Drain-source Voltage (VGS = 0)
Drain- gate Voltage (RGS = 20 k
Gate-source Voltage
V
V
VDGR
VGS
)
100
Ω
± 20
1.8
V
o
ID
Drain Current (continuous) at Tc = 25 C
A
o
ID
Drain Current (continuous) at Tc = 100 C
1.3
A
IDM(• )
Ptot
Drain Current (pulsed)
7.2
A
o
Total Dissipation at Tc = 25 C
2.5
W
Derating Factor
0.02
6
W/oC
V/ns
oC
oC
dv/dt(1) Peak Diode Recovery voltage slope
Tstg
Storage Temperature
-65 to 150
150
Tj
Max. Operating Junction Temperature
(•) Pulse width limited by safe operating area
( ) ISD ≤ 7.2 A, di/dt ≤ 200 A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX
1
1/8
March 2000
STN2NE10L
THERMAL DATA
Rthj-pcb Thermal Resistance Junction-PC Board
Rthj-amb Thermal Resistance Junction-ambient
(Surface Mounted)
Max
Max
50
60
oC/W
oC/W
Tl
Maximum Lead Temperature For Soldering Purpose
260
oC
AVALANCHE CHARACTERISTICS
Symbol
Parameter
Max Value
Unit
IAR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by Tj max)
1.8
A
EAS
Single Pulse Avalanche Energy
(starting Tj = 25 C, ID = IAR, VDD = 25 V)
20
mJ
o
(Tcase = 25 oC unless otherwisespecified)
ELECTRICAL CHARACTERISTICS
OFF
Symbol
V(BR)DSS Drain-source
Breakdown Voltage
Zero Gate Voltage
Drain Current (VGS = 0) VDS = Max Rating
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
ID = 250
A
VGS = 0
100
V
µ
IDSS
IGSS
VDS = Max Rating
1
10
A
µ
µA
o
Tc = 125 C
Gate-body Leakage
Current (VDS = 0)
VGS
=
20 V
100
±
nA
±
ON ( )
Symbol
VGS(th)
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
Gate Threshold Voltage VDS = VGS ID = 250 µA
1
1.7
2.5
V
RDS(on)
Static Drain-source On VGS = 10 V ID = 1 A
0.33
0.38
0.4
0.45
Ω
Ω
Resistance
VGS = 5 V
ID = 1 A
ID(on)
On State Drain Current VDS > ID(on) x RDS(on)max
VGS = 10 V
1.8
A
DYNAMIC
Symbol
Parameter
Forward
Test Conditions
VDS > ID(on) x RDS(on)max ID = 1 A
Min.
Typ.
Max.
Unit
gfs ( )
1
3
S
Transconductance
Ciss
Coss
Crss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
VDS = 25 V f = 1 MHz VGS = 0 V
345
45
20
pF
pF
pF
2/8
STN2NE10L
ELECTRICAL CHARACTERISTICS
(continued)
SWITCHING ON
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
td(on)
tr
Turn-on Delay Time
Rise Time
VDD = 50 V
RG = 4.7
ID = 3.5 A
VGS = 5 V
7
17
ns
ns
Ω
(Resistive Load, see fig. 3)
Qg
Qgs
Qgd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
VDD = 80 V ID = 7 A VGS = 5 V
10
5
4
14
nC
nC
nC
SWITCHING OFF
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
td(off)
tf
Turn-off Delay Time
Fall Time
VDD = 80 V
RG =4.7
ID = 3.5 A
VGS = 5 V
22
8
ns
ns
Ω
(Resistive Load, see fig. 3)
VDD = 80 V ID = 7 A
RG = 4.7 VGS = 5 V
tr(Voff)
tf
tc
Off-voltage Rise Time
Fall Time
Cross-over Time
8
9
19
ns
ns
ns
Ω
(Inductive Load, see fig. 5)
SOURCE DRAIN DIODE
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
ISD
ISDM ( )
Source-drain Current
Source-drain Current
(pulsed)
2
8
A
A
•
VSD ( ) Forward On Voltage
ISD = 2 A VGS = 0
1.5
V
trr
Reverse Recovery
Time
Reverse Recovery
Charge
Reverse Recovery
Current
ISD = 7 A
VDD = 30 V
(see test circuit, fig. 5)
di/dt = 100 A/ s
75
190
5
ns
µ
TJ = 150 oC
Qrr
C
µ
IRRM
A
( ) Pulsed: Pulse duration = 300 s, duty cycle 1.5 %
µ
(•) Pulse width limited by safe operating area
Safe Operating Area
Thermal Impedance
3/8
STN2NE10L
Output Characteristics
Transfer Characteristics
Transconductance
Static Drain-source On Resistance
Gate Charge vs Gate-sourceVoltage
CapacitanceVariations
4/8
STN2NE10L
Normalized Gate ThresholdVoltage vs
Temperature
Normalized On Resistance vs Temperature
Source-drainDiode Forward Characteristics
5/8
STN2NE10L
Fig. 1:
Fig. 2:
UnclampedInductive Waveform
Unclamped Inductive Load Test Circuit
Fig. 3: Switching Times Test Circuits For
Fig. 4: Gate Charge test Circuit
Resistive Load
Fig. 5:
Test Circuit For InductiveLoad Switching
And Diode Recovery Times
6/8
STN2NE10L
SOT-223 MECHANICAL DATA
mm
mils
TYP.
90.6
181.1
15.7
25.6
63
DIM.
MIN.
2.27
4.57
0.2
TYP.
2.3
MAX.
2.33
4.63
0.6
MIN.
89.4
179.9
7.9
MAX.
91.7
a
b
4.6
182.3
23.6
c
0.4
d
0.63
1.5
0.65
1.6
0.67
1.7
24.8
59.1
26.4
e1
e4
f
66.9
0.32
3.1
12.6
2.9
0.67
6.7
3
114.2
26.4
118.1
27.6
122.1
28.7
g
0.7
7
0.73
7.3
l1
l2
L
263.8
137.8
248
275.6
137.8
255.9
287.4
145.7
263.8
3.5
3.5
6.5
3.7
6.3
6.7
L
l2
d
a
e4
c
b
f
C
C
B
E
g
P008B
7/8
STN2NE10L
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of use of such information nor for any infringement of patents or other rights of third parites which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specificationmentioned in this publication are
subject tochange without notice. This publication supersedes and replaces all informaiton previouslysupplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systemswithout express written approval of STMicroelectronics.
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