STF3HNK90Z [STMICROELECTRONICS]

N-CHANNEL 900V - 3.5W - 3A TO-220 - TO-220FP Zener-Protected SuperMESHTM Power MOSFET; N沟道900V - 3.5W - 3A TO- 220 - TO- 220FP齐纳保护SuperMESHTM功率MOSFET
STF3HNK90Z
型号: STF3HNK90Z
厂家: ST    ST
描述:

N-CHANNEL 900V - 3.5W - 3A TO-220 - TO-220FP Zener-Protected SuperMESHTM Power MOSFET
N沟道900V - 3.5W - 3A TO- 220 - TO- 220FP齐纳保护SuperMESHTM功率MOSFET

文件: 总10页 (文件大小:403K)
中文:  中文翻译
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STP3HNK90Z - STF3HNK90Z  
N-CHANNEL 900V - 3.5- 3A TO-220 - TO-220FP  
Zener-Protected SuperMESH™Power MOSFET  
TYPE  
V
R
I
D
Pw  
DSS  
DS(on)  
STP3HNK90Z  
STF3HNK90Z  
900 V  
900 V  
< 4.2 Ω  
< 4.2 Ω  
3 A  
3 A  
90 W  
25 W  
TYPICAL R (on) = 3.5 Ω  
DS  
EXTREMELY HIGH dv/dt CAPABILITY  
100% AVALANCHE TESTED  
GATE CHARGE MINIMIZED  
VERY LOW INTRINSIC CAPACITANCES  
VERY GOOD MANUFACTURING  
REPEATIBILITY  
3
2
1
TO-220  
TO-220FP  
DESCRIPTION  
The SuperMESH™ series is obtained through an  
extreme optimization of ST’s well established strip-  
based PowerMESH™ layout. In addition to pushing  
on-resistance significantly down, special care is tak-  
en to ensure a very good dv/dt capability for the  
most demanding applications. Such series comple-  
ments ST full range of high voltage MOSFETs in-  
cluding revolutionary MDmesh™ products.  
INTERNAL SCHEMATIC DIAGRAM  
APPLICATIONS  
HIGH CURRENT, HIGH SPEED SWITCHING  
IDEAL FOR OFF-LINE POWER SUPPLIES,  
ADAPTORS AND PFC  
LIGHTING  
ORDERING INFORMATION  
SALES TYPE  
STP3HNK90Z  
STF3HNK90Z  
MARKING  
P3HNK90Z  
F3HNK90Z  
PACKAGE  
PACKAGING  
TUBE  
TO-220  
TO-220FP  
TUBE  
August 2003  
1/10  
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.  
STP3HNK90Z - STF3HNK90Z  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
Unit  
STP3HNK90Z  
STF3HNK90Z  
V
Drain-source Voltage (V = 0)  
900  
900  
± 30  
V
V
DS  
GS  
V
Drain-gate Voltage (R = 20 k)  
DGR  
GS  
V
Gate- source Voltage  
V
GS  
I
Drain Current (continuous) at T = 25°C  
3
3 (*)  
1.89 (*)  
12 (*)  
25  
A
D
C
I
Drain Current (continuous) at T = 100°C  
1.89  
12  
A
D
C
I
( )  
Drain Current (pulsed)  
A
DM  
P
Total Dissipation at T = 25°C  
90  
W
TOT  
C
Derating Factor  
0.72  
0.2  
W/°C  
V
V
Gate source ESD(HBM-C=100pF, R=1.5KΩ)  
Peak Diode Recovery voltage slope  
Insulation Withstand Voltage (DC)  
3000  
4.5  
ESD(G-S)  
dv/dt (1)  
V/ns  
V
V
ISO  
-
2500  
T
T
stg  
Operating Junction Temperature  
Storage Temperature  
j
-55 to 150  
°C  
( ) Pulse width limited by safe operating area  
(1) I 3A, di/dt 200A/µs, V V , T T  
JMAX.  
SD  
DD  
(BR)DSS  
j
(*) Limited only by maximum temperature allowed  
THERMAL DATA  
TO-220  
TO-220FP  
Rthj-case  
Rthj-amb  
Thermal Resistance Junction-case Max  
1.38  
5
°C/W  
°C/W  
°C  
Thermal Resistance Junction-ambient Max  
Maximum Lead Temperature For Soldering Purpose  
62.5  
300  
T
l
AVALANCHE CHARACTERISTICS  
Symbol  
Parameter  
Max Value  
Unit  
I
AR  
Avalanche Current, Repetitive or Not-Repetitive  
3
A
(pulse width limited by T max)  
j
E
Single Pulse Avalanche Energy  
200  
mJ  
AS  
(starting T = 25 °C, I = I , V = 50 V)  
j
D
AR  
DD  
GATE-SOURCE ZENER DIODE  
Symbol  
BV  
Parameter  
Test Conditions  
Igs=± 1mA (Open Drain)  
Min.  
Typ.  
Max.  
Unit  
Gate-Source Breakdown  
Voltage  
30  
V
GSO  
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES  
The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s  
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be  
applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and  
cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the  
usage of external components.  
2/10  
STP3HNK90Z - STF3HNK90Z  
ELECTRICAL CHARACTERISTICS (T  
=25°C UNLESS OTHERWISE SPECIFIED)  
CASE  
ON/OFF  
Symbol  
Parameter  
Drain-source  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
V
I
= 1 mA, V = 0  
900  
V
(BR)DSS  
D
GS  
Breakdown Voltage  
I
Zero Gate Voltage  
V
V
= Max Rating  
= Max Rating, T = 125 °C  
1
50  
µA  
µA  
DSS  
DS  
DS  
Drain Current (V = 0)  
GS  
C
I
Gate-body Leakage  
V
= ± 30 V  
±10  
µA  
GSS  
GS  
Current (V = 0)  
DS  
V
V
V
= V , I = 50 µA  
Gate Threshold Voltage  
3
3.75  
3.5  
4.5  
4.2  
V
GS(th)  
DS  
GS  
GS  
D
R
Static Drain-source On  
Resistance  
= 10 V, I = 1.5 A  
DS(on)  
D
DYNAMIC  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
g
(1)  
Forward Transconductance  
V
V
= 15 V I = 1.5 A  
1.9  
S
fs  
DS  
, D  
C
C
C
Input Capacitance  
Output Capacitance  
Reverse Transfer  
Capacitance  
V
= 25V, f = 1 MHz, V = 0  
690  
71  
14.4  
pF  
pF  
pF  
iss  
DS  
GS  
oss  
rss  
C
(3) Equivalent Output  
Capacitance  
= 0V, V = 0V to 720V  
88  
pF  
oss eq.  
GS  
DD  
DS  
t
Turn-on Delay Time  
Rise Time  
Turn-off Delay Time  
Fall Time  
V
R
= 450 V, I = 1.5 A  
23  
28  
42  
27  
ns  
ns  
ns  
ns  
d(on)  
D
t
= 4.7V = 10 V  
GS  
r
G
t
(Resistive Load see, Figure 3)  
d(off)  
t
f
Q
Q
Q
V
V
= 720V, I = 3 A,  
= 10V  
35  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
26  
5.7  
13.9  
nC  
nC  
nC  
g
DD  
GS  
D
gs  
gd  
SOURCE DRAIN DIODE  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
I
3
12  
A
A
Source-drain Current  
Source-drain Current (pulsed)  
SD  
(2)  
I
SDM  
V
(1)  
I
= 3 A, V = 0  
Forward On Voltage  
1.6  
V
SD  
SD  
GS  
t
Q
I
= 3 A, di/dt = 100A/µs  
= 50 V, T = 25°C  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
494  
2.4  
9.8  
ns  
µC  
A
rr  
SD  
V
DD  
rr  
j
I
(see test circuit, Figure 5)  
RRM  
t
Q
I
= 3 A, di/dt = 100A/µs  
= 50 V, T = 150°C  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
628  
3.2  
10.2  
ns  
µC  
A
rr  
SD  
V
DD  
rr  
j
I
(see test circuit, Figure 5)  
RRM  
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.  
2. Pulse width limited by safe operating area.  
3. C  
V
is defined as a constant equivalent capacitance giving the same charging time as C  
when V increases from 0 to 80%  
oss DS  
oss eq.  
.
DSS  
3/10  
STP3HNK90Z - STF3HNK90Z  
Safe Operating Area For TO-220  
Thermal Impedance For TO-220  
Safe Operating Area For TO-220FP  
Thermal Impedance For TO-220FP  
Output Characteristics  
Transfer Characteristics  
4/10  
STP3HNK90Z - STF3HNK90Z  
Transconductance  
Static Drain-source On Resistance  
Gate Charge vs Gate-source Voltage  
Capacitance Variations  
Normalized Gate Threshold Voltage vs Temp.  
Normalized On Resistance vs Temperature  
5/10  
STP3HNK90Z - STF3HNK90Z  
Source-drain Diode Forward Characteristics  
Normalized BVDSS vs Temperature  
Maximum Avalanche Energy vs Temperature  
6/10  
STP3HNK90Z - STF3HNK90Z  
Fig. 1: Unclamped Inductive Load Test Circuit  
Fig. 2: Unclamped Inductive Waveform  
Fig. 3: Switching Times Test Circuit For  
Fig. 4: Gate Charge test Circuit  
Resistive Load  
Fig. 5: Test Circuit For Inductive Load Switching  
And Diode Recovery Times  
7/10  
STP3HNK90Z - STF3HNK90Z  
TO-220 MECHANICAL DATA  
mm.  
inch  
TYP.  
DIM.  
MIN.  
TYP  
MAX.  
4.60  
0.88  
1.70  
0.70  
15.75  
10.40  
2.70  
5.15  
1.32  
6.60  
2.72  
14  
MIN.  
0.173  
0.024  
0.045  
0.019  
0.60  
MAX.  
0.181  
0.034  
0.066  
0.027  
0.620  
0.409  
0.106  
0.202  
0.052  
0.256  
0.107  
0.551  
0.154  
A
b
4.40  
0.61  
1.15  
0.49  
15.25  
10  
b1  
c
D
E
0.393  
0.094  
0.194  
0.048  
0.244  
0.094  
0.511  
0.137  
e
2.40  
4.95  
1.23  
6.20  
2.40  
13  
e1  
F
H1  
J1  
L
L1  
L20  
L30  
øP  
Q
3.50  
3.93  
16.40  
28.90  
0.645  
1.137  
3.75  
2.65  
3.85  
2.95  
0.147  
0.104  
0.151  
0.116  
8/10  
STP3HNK90Z - STF3HNK90Z  
TO-220FP MECHANICAL DATA  
mm.  
TYP  
inch  
TYP.  
DIM.  
MIN.  
4.4  
MAX.  
4.6  
2.7  
2.75  
0.7  
1
MIN.  
0.173  
0.098  
0.098  
0.017  
0.030  
0.045  
0.045  
0.195  
0.094  
0.393  
MAX.  
0.181  
0.106  
0.108  
0.027  
0.039  
0.067  
0.067  
0.204  
0.106  
0.409  
A
B
2.5  
D
2.5  
E
0.45  
0.75  
1.15  
1.15  
4.95  
2.4  
F
F1  
F2  
G
1.7  
1.7  
5.2  
2.7  
10.4  
G1  
H
10  
L2  
L3  
L4  
L5  
L6  
L7  
Ø
16  
0.630  
28.6  
9.8  
2.9  
15.9  
9
30.6  
10.6  
3.6  
1.126  
.0385  
0.114  
0.626  
0.354  
0.118  
1.204  
0.417  
0.141  
0.645  
0.366  
0.126  
16.4  
9.3  
3
3.2  
L3  
L6  
L7  
1 2  
L4  
3
L5  
L2  
9/10  
STP3HNK90Z - STF3HNK90Z  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the  
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from  
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications  
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information  
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or  
systems without express written approval of STMicroelectronics.  
© The ST logo is a registered trademark of STMicroelectronics  
© 2003 STMicroelectronics - Printed in Italy - All Rights Reserved  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco  
Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.  
© http://www.st.com  
10/10  

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