LNBK20D2 [STMICROELECTRONICS]
LNB SUPPLY AND CONTROL VOLTAGE REGULATOR (PARALLEL INTERFACE); LNB电源和控制稳压器(并行接口)型号: | LNBK20D2 |
厂家: | ST |
描述: | LNB SUPPLY AND CONTROL VOLTAGE REGULATOR (PARALLEL INTERFACE) |
文件: | 总14页 (文件大小:469K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LNBK20D2
LNB SUPPLY AND CONTROL VOLTAGE
REGULATOR (PARALLEL INTERFACE)
■
COMPLETE INTERFACE FOR TWO LNBs
REMOTE SUPPLY AND CONTROL
■
■
GUARANTEED 400mA OUTPUT CURRENT
LNB SELECTION AND STAND-BY
FUNCTION
■
■
■
■
■
■
BUILT-IN TONE OSCILLATOR FACTORY
TRIMMED AT 22KHz
FAST OSCILLATOR START-UP FACILITATES
DiSEqC ENCODING
TWO SUPPLY INPUTS FOR LOWEST
DISSIPATION
BYPASS FUNCTION FOR SLAVE
OPERATION
LNB SHORT CIRCUIT PROTECTION AND
DIAGNOSTIC
AUXILIARY MODULATION INPUT EXTENDS
FLEXIBILITY
SO-20
(MI) and the LNBA pin, thus leaving all LNB
powering and control functions to the Master
Receiver. This electronic switch is closed when
the device is powered and EN pin is LOW.
The regulator outputs can be logic controlled to be
13 or 18 V (typ.) by mean of the VSEL pin for
remote controlling of LNBs. Additionally, it is
possible to increment by 1V (typ.) the selected
voltage value to compensate the excess voltage
drop along the coaxial cable (LLC pin HIGH).
In order to reduce the power dissipation of the
device when the lowest output voltage is selected,
■
■
CABLE LENGTH COMPENSATION
INTERNAL OVER TEMPERATURE
PROTECTION
BACKWARD CURRENT PROTECTION
COST-EFFECTIVE VERSION OF LNBP
SERIES
■
■
DESCRIPTION
the regulator has two Supply Input pins V
and
CC1
Intended for analog and digital satellite receivers,
the LNBK20D2 is a monolithic linear voltage
regulator, assembled in SO-20, specifically
designed to provide the powering voltages and the
interfacing signals to the LNB downconverter
situated in the antenna via the coaxial cable. It has
the same functionality of the LNBP1X and
LNBP20 series, at a reduced output current
capability. Since most satellite receivers have two
antenna ports, the output voltage of the regulator
is available at one of two logic-selectable output
pins (LNBA, LNBB). When the IC is powered and
put in Stand-by (EN pin LOW), both regulator
outputs are disabled to allow the antenna
downconverters to be supplied/controlled by
others satellite receivers sharing the same coaxial
lines. In this occurrence the device will limit at 3
mA (max) the backward current that could flow
from LNBA and LNBB output pins to GND.
V
. They must be powered respectively at 16V
CC2
(min) and 23V (min), and an internal switch
automatically will select the suitable supply pin
according to the selected output voltage. If
adequate heatsink is provided and higher power
losses are acceptable, both supply pins can be
powered by the same 23V source without
affecting any other circuit performance.
The ENT (Tone Enable) pin activates the internal
oscillator so that the DC output is modulated by a
±0.3 V, 22KHz (typ.) square wave. This internal
oscillator is factory trimmed within a tolerance of
±2KHz, thus no further adjustments neither
external components are required.
A burst coding of the 22KHz tone can be
accomplished thanks to the fast response of the
ENT input and the prompt oscillator start-up. This
helps designers who want to implement the
DiSEqC protocols (*).
For slave operation in single dish, dual receiver
systems, the bypass function is implemented by
an electronic switch between the Master Input pin
In order to improve design flexibility and to allow
implementation of newcoming LNB remote control
standards, an analogic modulation input pin is
July 2003
1/14
LNBK20D2
available (EXTM). An appropriate DC blocking
capacitor must be used to couple the modulating
signal source to the EXTM pin. When external
modulation is not used, the relevant pin can be left
open.
IMPEDANCE. If the overload is still present, the
protection circuit will cycle again through t and
off
ton until the overload is removed. Typical t +t
on off
value is 1200ms when a 4.7µF external capacitor
is used.
Two pins are dedicated to the overcurrent
protection/monitoring: CEXT and OLF. The
overcurrent protection circuit works dynamically:
as soon as an overload is detected in either LNB
output, the output is shut-down for a time Toff
determined by the capacitor connected between
CEXT and GND. Simultaneously the OLF pin, that
is an open collector diagnostic output flag, from
HIGH IMPEDANCE state goes LOW.
This dynamic operation can greatly reduce the
power dissipation in short circuit condition, still
ensuring excellent power-on start up even with
highly capacitive loads on LNB outputs.
The device is packaged in Multiwatt15 for
thru-holes mounting and in PowerSO-20 for
surface mounting. When a limited functionality in a
smaller package matches design needs, a range
of cost-effective PowerSO-10 solutions is also
offered. All versions have built-in thermal
protection against overheating damage.
After the time has elapsed, the output is resumed
for a time t =1/15t (typ.) and OLF goes in HIGH
on
off
(*): External components are needed to comply to level 2.x and above (bidirectiona) DiSEqC bus hardware requirements. DiSEqC is a
trademark or EUTELSAT.
PIN CONFIGURATION (top view)
2/14
LNBK20D2
TABLE A: PIN CONFIGURATIONS
PIN N°
SYMBOL
NAME
FUNCTION
1
LLC
Line Length Compens.
(1V typ)
Logic control input: see truth table
2
OLF
MI
Over Load Flag
Logic output (open collector). Normally in HIGH
IMPEDANCE, goes LOW when current or thermal overload
occurs
3
4
Master Input
In stand-by mode, the voltage on MI is routed to LNBA pin.
Can be left open if bypass function is not needed
LNBB
GND
Output Port
Ground
See truth tables for voltage and port selection
5, 6, 15,
16
Circuit Ground. It is internally connected to the die frame
7, 13
8
N.C.
Not Connected
Supply Input 1
V
15V to 27V supply. It is automatically selected when
CC1
V
= 13 or 14V
OUT
9
V
Supply Input 2
Output Port
22V to 27V supply. It is automatically selected when
= 18 or 19V
CC2
V
OUT
10
LNBA
See truth table voltage and port selection. In stand-by mode
this port is powered by the MI pin via the internal Bypass
Switch
11
V
Output Voltage Selection: Logic control input: see truth table
13 or 18V (typ)
SEL
12
14
18
19
EN
Port Enable
Port Selection
Logic control input: see truth table
Logic control input: see truth table
Logic control input: see truth table
OSEL
ENT
22KHz Tone Enable
External Capacitor
CEXT
Timing Capacitor used by the Dynamic Overload protection.
Typical application is 4.7µF for a 1200ms cycle
20
EXTM
External Modulator
External Modulation Input. Needs DC decoupling to the AC
source. if not used, can be left open.
NOTE: the limited pin availability of the PowerSO-10 package leads to drop some functions.
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter²
Value
Unit
V
DC Input Voltage (V
, V
, MI)
28
Internally Limited
-0.5 to 7
900
V
mA
V
I
CC1
CC2
I
Output Current (LNBA, LNBB)
O
V
Logic Input Voltage (ENT, EN OSEL, VSEL, LLC)
Bypass Switch Current
I
I
mA
W
SW
P
Power Dissipation at T
< 85°C
3
D
case
T
Storage Temperature Range
-40 to +150
-40 to +125
°C
°C
stg
T
Operating Junction Temperature Range
op
Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these condition is
not implied.
THERMAL DATA
Symbol
Parameter
Thermal Resistance Junction-case
Value
Unit
R
15
°C/W
thj-case
3/14
LNBK20D2
LOGIC CONTROLS TRUTH TABLE
CONTROL I/O
PIN NAME
L
H
OUT
OLF
I
> I
or T > 150°C
I
< I
OMAX
OUT
OMAX
j
OUT
IN
IN
IN
IN
IN
ENT
EN
22KHz tone OFF
See Table Below
See Table Below
See Table Below
See Table Below
22KHz tone ON
See Table Below
See Table Below
See Table Below
See Table Below
OSEL
VSEL
LLC
V
V
EN
OSEL
VSEL
LLCO
LNBA
LNBB
L
X
X
X
V
- 0.4V (typ.)
Disabled
MI
H
H
H
H
H
H
H
H
L
L
L
H
L
L
L
13V (typ.)
18V (typ.)
14V (typ.)
19V (typ.)
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
13V (typ.)
18V (typ.)
14V (typ.)
19V (typ.)
L
H
H
L
L
H
L
H
H
H
H
H
L
L
H
H
H
NOTE: All logic input pins have internal pull-down resistor (typ. = 250KΩ)
BLOCK DIAGRAM
4/14
LNBK20D2
ELECTRICAL CHARACTERISTICS FOR LNBK SERIES (T = 0 to 85°C, C = 0.22µF, C =0.1µF,
J
I
O
EN=H, ENT=L, LLC=L, V =16V, V =23V I
=50mA, unless otherwise specified.)
IN1
IN2
OUT
Symbol
Parameter
Test Conditions
Min.
15
Typ.
Max.
Unit
V
V
V
V
Supply Voltage
Supply Voltage
I
I
I
I
I
I
I
I
= 400 mA ENT=H, VSEL=L, LLC=L
= 400 mA ENT=H, VSEL=L, LLC=H
= 400 mA ENT=H, VSEL=L, LLC=L
= 400 mA VSEL=L, LLC=H
27
27
IN1
IN2
CC1
CC2
O
O
O
O
O
O
O
O
16
V
V
22
27
V
23
27
V
V
V
Output Voltage
Output Voltage
Line Regulation
Load Regulation
= 400 mA VSEL=L, LLC=L
17.3
18
19
13
14
5
18.7
V
O1
O2
= 400 mA ENT=H, VSEL=L, LLC=H
= 400 mA VSEL=L, LLC=L
V
12.5
13.5
V
= 400 mA ENT=H, VSEL=L, LLC=H
V
∆V
∆V
V
V
V
=15 to 18V
=22 to 25V
V
V
V
=13V
50
50
mV
mV
mV
O
O
IN1
IN2
IN1
OUT
OUT
OUT
=18V
5
=V =22V
=13 or 18V
65
150
IN2
I
= 0 to 3A
O
SVR Supply Voltage Rejection
V
= V
= 23 ± 0.5V f = 120 Hz,
ac ac
45
dB
mA
ms
IN1
IN2
I
Output Current Limiting
500
650
1100
800
MAX
t
Dynamic Overload
Output Shorted
Output Shorted
C
C
=4.7µF
OFF
EXT
protection OFF Time
t
Dynamic Overload
protection ON Time
=4.7µF
t
/15
ms
ON
EXT
OFF
f
Tone Frequency
ENT=H
ENT=H
ENT=H
ENT=H
20
0.55
40
22
24
0.9
60
15
KHz
Vpp
%
TONE
A
Tone Amplitude
0.72
50
10
5
TONE
D
Tone Duty Cycle
TONE
t , t
Tone Rise and Fall Time
External Modulation Gain
5
µs
r
f
G
V
∆V
/∆V ,
EXTM
f = 10Hz to 40KHz
EXTM
EXTM
OUT
External Modulation Input
Voltage
AC Coupling
f = 10Hz to 40KHz
EN=L, =300mA,
=8mA
400
mVpp
Ω
Z
External Modulation
Impedance
400
0.35
0.28
EXTM
V
Bypass Switch Voltage
Drop (MI to LNBA)
I
V
-V =4V
0.6
0.5
10
V
SW
SW
CC2 MI
V
Overload Flag Pin Logic
LOW
I
V
OL
OZ
OL
I
Overload Flag Pin OFF
State Leakage Current
V
= 6V
µA
V
OH
V
Control Input Pin Logic
LOW
0.8
IL
IH
IH
V
Control Input Pin Logic
HIGH
2.5
V
I
Control Pins Input Current
Supply Current
V
= 5V
20
µA
IH
I
Output Disabled (EN=L)
0.3
3.1
1
6
mA
mA
CC
ENT=H,
I
=500mA
OUT
I
Output Backward Current
EN=L
V
= V
= 18V
0.2
3
mA
OBK
LNBA
LNBB
V
= V
= 22V or floating
IN1
IN2
T
Temperature Shutdown
Threshold
150
°C
SHDN
5/14
LNBK20D2
TYPICAL CHARACTERISTICS (unless otherwise specified T = 25°C)
j
Figure 1 : Output Voltage vs Output Current
Figure 2 : Tone Duty Cycle vs Temperature
Figure 3 : Tone Fall Time vs Temperature
Figure 4 : Tone Frequency vs Temperature
Figure 5 : Tone Rise Time vs Temperature
Figure 6 : Tone Amplitude vs Temperature
6/14
LNBK20D2
Figure 7 : S.V.R. vs Frequency
Figure 10 : LNBA External Modulation gain vs
Frequency
Figure 8 : External Modulation vs Temperature
Figure 11 : Bypass switch Drop vs Output
Current
Figure 9 : Bypass Switch Drop vs Output Current
Figure 12 : overload Flag pin Logic LOW vs Flag
Current
7/14
LNBK20D2
Figure 13 : Supply Voltage vs Temperature
Figure 16 : Tone Enable
Figure 17 : Tone Disable
Figure 18 : 22KHz Tone
Figure 14 : Supply Current vs Temperature
Figure 15 : Dynamic Overload protection (I vs
SC
Time)
8/14
LNBK20D2
Figure 19 : Enable Time
Figure 21 : 18V to 13V Change
Figure 20 : Disable Time
Figure 22 : 18V to 13V Change
TYPICAL APPLICATION SCHEMATICS
TWO ANTENNA PORTS RECEIVER
MCU+V
10uF
17V
24V
ANT CONNECTORS
C2
11
1
2
AUX DATA
EXTM
OLF
VCC1
VCC2
R1
JA
JB
3
15
14
LNBA
LNBB
MI
47K
13
TUNER
4
9
5
7
12
10
VSEL
ENT
EN
OSEL
LLC
CEXT
C1
4.7µF
C3 C4 C5 C6
+
8
GND
2x 47nF
2x 0.1µF
LNBK20
Vcc
I/Os
I/Os
MCU
9/14
LNBK20D2
SINGLE ANTENNA RECEIVER WITH MASTER RECEIVER PORT
17V
24V
MCU+V
10uF
C2
1
2
11
13
AUX DATA
EXTM
OLF
VCC1
VCC2
R1
ANT
3
15
14
LNBA
LNBB
MI
47K
MASTER
10
4
9
5
7
12
TUNER
VSEL
ENT
EN
OSEL
LLC
CEXT
4.7µF
C1
C3 C4 C5
+
47nF
8
GND
2x 0.1µF
LNBK20
Vcc
I/Os
I/Os
MCU
USING SERIAL BUS TO SAVE MPU I/Os
17V
24V
MCU+V
ANT
CONNECTORS
C2
R1
11
13
1
2
AUX DATA
EXTM
VCC1
VCC2
47K
JA
10uF
3
15
14
LNBA
LNBB
MI
OLF
JB
TUNER
1
2
3
15
4
5
6
4
9
5
7
12
10
VSEL
STR
D
CLK
OE
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
CEXT
ENT
EN
OSEL
LLC
4.7µF
C1
C3 C4 C5 C6
2x 0.1µF 2x 47nF
+
7
14
13
12
11
8
GND
LNBK20
9
10
QS
QS
4094
SERIAL
BUS
MCU+V
I/Os
Vcc
MCU
10/14
LNBK20D2
THERMAL DESIGN NOTE
During normal operation, this device dissipates some power. At maximum rated output current (400mA),
the voltage drop on the linear regulator lead to a total dissipated power that is of about 2W. The heat
generated requires a suitable heatsink to keep the junction temperature below the over temperature
protection threshold. Assuming a 40°C temperature inside the Set-Top-Box case, the total Rthj-amb has
to be less than 43°C/W.
While this can be easily achieved using a through-hole power package that can be attached to a small
heatsink or to the metallic frame of the receiver, a surface mount power package must rely on PCB
solutions whose thermal efficiency is often limited. The simplest solution is to use a large, continuous
copper area of the GND layer to dissipate the heat coming from the IC body.
The SO-20 package of this IC has 4 GND pins that are not just intended for electrical GND connection, but
also to provide a low thermal resistance path between the silicon chip and the PCB heatsink. Given an
Rthj-c equal to 15°C/W, a maximum of 28°C/W are left to the PCB heatsink. This figure is achieved if a
2
minimum of 25cm copper area is placed just below the IC body. This area can be the inner GND layer of
a multi-layer PCB, or, in a dual layer PCB, an unbroken GND area even on the opposite side where the
IC is placed. In both cases, the thermal path between the IC GND pins and the dissipating copper area
must exhibit a low thermal resistance.
In figure 4, it is shown a suggested layout for the SO-20 package with a dual layer PCB, where the IC
Ground pins and the square dissipating area are thermally connected through 32 vias holes, filled by
solder. This arrangement, when L=50mm, achieves an Rthc-a of about 28°C/W.
Different layouts are possible, too. Basic principles, however, suggest to keep the IC and its ground pins
approximately in the middle of the dissipating area; to provide as many vias as possible; to design a
dissipating area having a shape as square as possible and not interrupted by other copper traces.
SO-20 SUGGESTED PCB HEATSINK LAYOUT
11/14
LNBK20D2
SO-20 MECHANICAL DATA
mm.
inch
TYP.
DIM.
MIN.
TYP
MAX.
2.65
0.2
MIN.
MAX.
0.104
0.008
0.096
0.019
0.012
A
a1
a2
b
0.1
0.004
2.45
0.49
0.32
0.35
0.23
0.014
0.009
b1
C
0.5
0.020
c1
D
45˚ (typ.)
12.60
10.00
13.00
10.65
0.496
0.393
0.512
0.419
E
e
1.27
0.050
0.450
e3
F
11.43
7.40
0.50
7.60
1.27
0.75
0.291
0.020
0.300
0.050
0.029
L
M
S
˚ (max.)
8
PO13L
12/14
LNBK20D2
Tape & Reel SO-20 MECHANICAL DATA
mm.
TYP
inch
TYP.
DIM.
MIN.
MAX.
330
MIN.
MAX.
12.992
0.519
A
C
12.8
20.2
60
13.2
0.504
0.795
2.362
D
N
T
30.4
11
1.197
0.433
0.528
0.130
0.161
0.476
Ao
Bo
Ko
Po
P
10.8
13.2
3.1
0.425
0.520
0.122
0.153
0.468
13.4
3.3
3.9
4.1
11.9
12.1
13/14
LNBK20D2
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or
systems without express written approval of STMicroelectronics.
© The ST logo is a registered trademark of STMicroelectronics
© 2003 STMicroelectronics - Printed in Italy - All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
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14/14
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