L8219P [STMICROELECTRONICS]

STEPPER MOTOR CONTROLLER, 2.5A, PDSO36, POWER, SO-36;
L8219P
型号: L8219P
厂家: ST    ST
描述:

STEPPER MOTOR CONTROLLER, 2.5A, PDSO36, POWER, SO-36

电动机控制 光电二极管
文件: 总13页 (文件大小:159K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
L8219  
HIGH CURRENT STEPPER MOTOR DRIVER  
PRODUCT PREVIEW  
IMPROVED STEP ANGLE SPLITTING &  
TORQUE  
ABLE TO DRIVE BOTH WINDINGS OF  
BIPOLAR STEPPER MOTOR  
OUTPUT CURRENT UP TO 1.5A EACH  
WINDING  
WIDE VOLTAGE RANGE 10V TO 46V  
HALF-STEP, FULL-STEP AND MICROSTEPP-  
ING MODE  
SO28EP  
ORDERING NUMBERS:  
L8219LP  
PowerSO36  
L8219P  
tors.The L8219 with a few external components form  
a complete control and drive circuit for LS-TTL or mi-  
croprocessor controlled stepper motor system.The  
power stage is a dual full bridge capable of sustaining  
46V and including four diodes for current recircula-  
tion.A cross conduction protection is provided to  
avoid simultaneous cross conduction during switch-  
ing current direction.An internal pulse-width-modula-  
tion (PWM) controls the output current to 1.5A with  
peak start-up current up to 1.75A.Wide range of cur-  
rent control from 1.5A (each bridge) is permitted by  
means of two logic inputs and an external voltage ref-  
erence. A phase input to each bridge determines the  
load current direction.A thermal protection circuitry  
disables the outputs if the chip temperature exceeds  
safe operating limits.  
BUILT-IN PROTECTION DIODES  
INTERNAL PWM CURRENT CONTROL  
LOW OUTPUT SATURATION VOLTAGE  
DESIGNED FOR UNSTABILIZED MOTOR  
SUPPLY VOLTAGE  
INTERNAL THERMAL SHUTDOWN  
TWO POWER PACKAGES ARE AVAILABLE:  
- SO28EP Exposed Pad  
- PowerSO36  
DESCRIPTION  
The L8219 is a bipolar monolithic integrated circuits  
intended to control and drive both winding of a bipolar  
stepper motor or bidirectionally control two DC mo-  
BLOCK DIAGRAM  
COMPINP1  
R C  
1
PH1  
EN1  
V
V
S1  
1
SS  
OUT1A  
OUT1B  
I
I
01  
11  
+
2bit  
DAC  
WINDING  
1
LOGIC  
-
V
REF1  
R
C
R
V
S1  
C
C
THERMAL  
S2  
SHUTDOWN  
OUT2A  
I
I
02  
12  
-
2bit  
DAC  
WINDING  
2
LOGIC  
+
V
REF2  
OUT2B  
C
C
R
C
D99IN1075A  
COMPINP2  
R C  
2
PH2  
EN2  
R
S2  
2
August 2002  
1/13  
This is preliminary information on a new product now in development. Details are subject to change without notice.  
L8219  
PINS CONNECTIONS (Top views)  
OUT2B  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
OUT1B  
R
2
R
S1  
S2  
GND  
OUT2A  
COMPINP2  
VS2  
3
GND  
OUT1A  
N.C.  
4
5
6
COMPINP1  
VS1  
GND  
7
SO28EP  
EN2  
8
GND  
EN1  
I02  
9
I12  
10  
11  
12  
13  
14  
I01  
PH2  
I11  
VREF2  
PH1  
R C  
VREF1  
2
2
VSS  
R C  
1
1
D99IN1074A  
1
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
VS1  
COMPINP1  
N.C.  
GND  
EN1  
N.C.  
N.C.  
I01  
2
3
4
N.C.  
5
N.C.  
6
OUT1A  
GND  
I11  
7
PH1  
VREF1  
8
R
S1  
9
OUT1B  
OUT2B  
R C  
1 1  
PowerSO36  
10  
11  
12  
13  
14  
15  
16  
17  
18  
VSS  
R C  
R
S2  
2
2
GND  
OUT2A  
N.C.  
VREF2  
PH2  
I12  
N.C.  
I02  
N.C.  
N.C.  
EN2  
GND  
COMPINP2  
VS2  
D99IN1073A  
2/13  
L8219  
PIN FUNCTION  
SO28  
PowerSO36  
Name  
Description  
EP  
1
10  
OUT2B Bridge-2  
Ouput connection. The output stage is a "H" bridge formed by four transistors and  
four diodes connected to ground suitable for switching applications.  
2
11  
Rs2  
Bridge-2  
Power stage sink transistors emitter connection.Sensing resistor is connected from  
this pin and ground.  
3
4
5
12  
13  
17  
GND2 Ground  
OUT2A same as OUT2B  
COMPI Bridge-2  
MP2  
An internal low pass filter RcCc is integrated.  
6
7, 21  
8
18  
19,36  
20  
Vs2  
Bridge-2 Power supply voltage.  
Ground  
GND  
EN2  
Bridge2  
When the enable input is set high the bridge is immediately switched-off skipping the  
delay time of the current control loop turning-off (I0=I1=H)  
9
22  
I02  
Bridge-2  
Logic input to set up the output current level, which is also determined by the  
sensing resistor and reference voltage(see also Functional description and table 1).  
10  
11  
23  
24  
I12  
same as I02 (see table 1)  
PH2  
Bridge-2  
This TTL-compatible logic inputs sets the direction of current flow through the load. A  
high level causes current to flow from OUTPUT A (source) to OUTPUT B (sink). A  
schmitt trigger on this input provides good noise immunity and a delay circuit  
prevents output stage short circuits during switching.  
12  
13  
25  
26  
Vref2  
R2C2  
Bridge-2  
A voltage applied to this pin sets the reference voltage of the comparators, this  
determinig the output current (also depending on Rs and the the two inputs INPUT 0  
and INPUT 1).  
Bridge-2  
An external RC network connected to this pin sets the toff time of the higher power  
transistors.The pulse generator is a monostable triggerd by the output of the  
comparators (toff = 1.1 RTCT)  
14  
15  
16  
17  
18  
19  
20  
22  
23  
27  
28  
29  
30  
31  
32  
35  
1
Vss  
R1C1  
Vref1  
PH1  
I11  
Supply voltage input for the logic circuitry.  
Bridge-1 same as R2C2.  
Bridge-1 same as Vref2  
Bridge-1 same as PH2  
Bridge-1 same as I12  
I01  
Bridge-1 same as I02  
EN1  
Vs1  
Bridge-1 same as EN2  
Bridge-1 Power supply voltage.  
2
COMPINP1 Bridge-1  
An internal low pass filter RcCc is integrated. Another RC external network will  
modify the blanking time (ss Functional Description)  
24  
25  
3,4,5,14,15,  
16,21,33,34  
N.C.  
Not connected  
6
OUT1A Bridge-1  
Output connection. The output stage is a "H" bridge formed by four transistors and  
four diodes connected to ground suitable for switching applications  
26  
27  
7
8
GND  
RS1  
Ground.  
Bridge-1  
Power stage sink transistors emitter connection.Sensing resistor is connected from  
this pin and ground.  
28  
9
OUT1B same as OUT1A  
3/13  
L8219  
THERMAL CHARACTERISTICS - SO28EP  
Power Dissipated T Ambient Thermal J-A resistance  
Conditions  
(W)  
(˚C)  
(˚C/W)  
4.4  
70  
18  
pad layout + ground layers + 16 via hol  
PCB ref.: 4 LAYER cm 12 x 12  
3.5  
2.1  
70  
70  
23  
38  
pad layout + ground layers  
PCB ref.: 4 LAYER cm 12 x 12  
pad layout + 6cm2 on board heat sink  
PCB ref.: 2 LAYER cm 12 x 12  
D02IN1372  
10  
8
6
4
2
0
18˚C/W  
23˚C/W  
38˚C/W  
0
20  
40  
60  
80  
100  
120  
140  
160  
D02IN1373  
Ambient Temperature (˚C)  
4/13  
L8219  
THERMAL CHARACTERISTICS - PowerSO36  
Power Dissipated T Ambient Thermal J-A resistance  
Conditions  
(W)  
(˚C)  
(˚C/W)  
5.3  
70  
15  
pad layout + ground layers + 16 via hol  
PCB ref.: 4 LAYER cm 12 x 12  
4.0  
2.3  
70  
70  
20  
35  
pad layout + ground layers  
PCB ref.: 4 LAYER cm 12 x 12  
pad layout + 6cm2 on board heat sink  
PCB ref.: 2 LAYER cm 12 x 12  
D02IN1370  
12  
10  
8
15˚C/W  
20˚C/W  
6
35˚C/W  
4
2
0
0
20  
40  
60  
80  
100  
120  
140  
160  
D02IN1371  
Ambient Temperature (˚C)  
5/13  
L8219  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
50  
Unit  
V
V
S
Supply Voltage  
I
I
Output Current (peak) non repetitive ton < 2µs  
Output Current repetitive ton < 10µs  
Logic Supply Voltage  
2.5  
A
o
1.75  
A
o
V
SS  
7
V
V
Logic Input Voltage Range  
Sense Output Voltage  
-0.3 to +7  
1.5  
V
IN  
V
V
sense  
T
Junction Temperature  
+150  
°C  
°C  
°C  
J
T
op  
Operating Temperature Range  
Storage Temperature Range  
0 to 70  
-55 to +150  
T
stg  
ELECTRICAL CHARACTERISTICS (T = 25°C, V = 46V, V = 4.75V to 5.25V, V = 5V; unless otherwise  
REF  
j
S
SS  
specified) See fig. 3.  
Symbol  
Parameter  
Test Condition  
Min.  
Typ.  
Max.  
Unit  
OUTPUT DRIVERS (OUT or OUTB)  
A
V
S
Motor Supply Range  
10  
46  
V
I
Output Leakage Current  
V
V
= V  
= 0  
-
-
<1  
<-1  
100  
-100  
µA  
µA  
CEX  
OUT  
OUT  
s
V
Output Saturation Voltage  
Sink Driver, I  
Sink Driver, I  
Source Driver, I  
Source Driver, I  
= +1A  
-
-
-
-
0.5  
0.8  
1.8  
1.9  
0.7  
1
1.9  
2.1  
V
V
V
V
CE(sat)  
OUT  
= +1.5A  
OUT  
= -1A  
= -1.5A  
OUT  
OUT  
I
Clamp Diode Leakage Current  
Clamp Diode Forward Voltage  
V
= 50V  
R
-
<1  
50  
µA  
R
V
Sink Diode  
Source Diode I =1.5A  
1.6  
1.6  
2
2
V
V
F
F
I
Driver Supply Current  
Driver Supply Current  
Both Bridges ON, No Load  
Both Bridges OFF  
-
-
8
6
20  
15  
mA  
mA  
S(on)  
S(off)  
I
CONTROL LOGIC  
V
Input Voltage  
All Inputs  
All Inputs  
2.4  
-
-
-
V
IN(H)  
V
Input Voltage  
-
0.8  
20  
V
IN(L)  
IN(H)  
I
Input Current  
V
V
= 2.4V  
-
<1  
-3  
-
mA  
mA  
V
IN  
IN  
I
Input Current  
= 0.84V  
-
1.5  
-
-200  
7.5  
120  
20  
IN(L)  
V
Reference Voltage  
Total Logic Supply Current  
Total Logic Supply Current  
Operating  
I = I = 0.8V, No Load  
REF  
I
90  
14  
mA  
mA  
SS(ON)  
o
1
I
I = I = 2.4V, No Load  
-
SS(OFF)  
o
1
COMPARATORS  
Current Limit Threshold (at trip  
V
/
I = I = 0.8V  
9.5  
12.7  
20.7  
-
10  
14.1  
24.4  
50  
10.5  
15.6  
28.1  
-
-
REF  
o
1
point  
V
sense  
I = 2.4V, I = 0.8V  
o
1
I = 0.8V, I = 2.4V  
-
o
1
t
Cutoff Time  
R = 56KC = 820pF  
µs  
µs  
off  
t
t
t
Turn Off Delay  
Fig. 1  
-
1
d
PROTECTION  
Thermal Shutdown Temperature  
T
-
170  
-
°C  
J
6/13  
L8219  
FUNCTIONAL DESCRIPTION  
One L8219 is able to drive both windings of a bipolar stepper motor. Internal PWM control circuit sets the current  
in each motor's winding. The peak current in each winding is sensed and then controlled by an external sensing  
resistor (Rs), a reference voltage (Vref), and the 2 bit DAC. In addition, varying the Vref voltage can be provided  
a continous control of the peak load current fitting micro-stepping application needs.  
Logic (I and I )  
0
1
The current level in each motor winding is selected with two digital inputs. (See tab.1) producing four current  
Imax, 70.7%Imax, 41%Imax and zero current.  
Eight step position can be produced at constant torque setting an Half-step mode and selecting 100% current  
when only one phase is ON and 70.7% when two phases are ON.  
When the "Phase" signal change or when I =I =H the power bridge is turned off resulting in a fast current decay  
0
1
(see fig.1) through the internal output clamp and flyback diodes. The fast current decay is usefull for half-step  
and high speed application. If any of the logic inputs is left open, the circuit will treat it as a high level input. Due  
to the internal current control loop (sensing resistor, comparator, monostable) a delay time of ~2  
tween the input of the digital comand and the real current implementation in the motor's winding. When the dig-  
ital inputs are set to zero (I =I =L) the average current will be higher then zero for a time period of ~2 sec; to  
µsec exsist be-  
µ
0
1
skip this problem there is the pin "Enable" which immediately turn off the bridge.  
With the I and I digital input signals is also possible to implement the "holding torque" (reduced power dissi-  
0
1
pation), or the best "start-up" condition (maximum output current).  
Io  
I1  
Current Leve  
H
L
H
L
H
H
L
0% Current  
41% Current  
70.7% Current  
100% Current  
L
Figure 1.  
VBB  
DRIVE CURRENT  
RECIRCULATION  
(SLOW-DECAY MODE)  
RECIRCULATION  
(FAST-DECAY MODE)  
RS  
D99IN1004  
Internal PWM Current Control  
Once an output current level has been set by the digital input the current in the motor winding begins to flow in  
the bridge (see fig.1) and the max peak current Imax can be defined by: Imax = Vref10 Rs. At the same time  
the voltage on sensing resistor increase and the bridge will be turned off again as soon as the voltage on the  
sensing resistor is equal to the value set by the DAC; at this stage the current recirculates through the ground-  
clamp diodes and sink transistor implementing the slow current decay.  
Once the "toff" time has expired the source driver is turned on again and the cycle repeat itself keeping the de-  
sidered average current level.  
7/13  
L8219  
Figure 2.  
VOUTA-VOUTB or VOUTB-VOUTA  
(EACH WINDING)  
toff =1·1 RtCt  
1
fs =  
normalized  
1
ton + toff  
ton  
1/2  
toff  
td  
Vsense  
Vref  
ton  
toff  
D99IN1019  
Figure 3. Principle Operating Sequence  
STAND BY WITH  
HALFSTEP MOTOR DRIVE  
FULL STEP  
HOLDING TORQUE  
MOTOR DRIVE  
Im=41%  
Im=70.7%  
Im=100%  
1
2 3 4 5 6 7 8  
I01  
I11  
Ph1  
Ph2  
I02  
I12  
MOTOR CURRENT PHASE 1  
Imax  
-Imax  
Imax  
MOTOR CURRENT PHASE 2  
-Imax  
D99IN1020A  
8/13  
L8219  
Phase  
This input determines the direction of current flow in the windings, depending on the motor connections. The  
signal is fed through a Schmidt-trigge for noise immunity, and through a time delay in order to guarantee that  
no short-circuit occurs in the output stage during phase-shift. High level on the PHASE input causes the motor  
current flow from Out A through the winding to Out B.  
Current Sensor  
This part contains a current sensing resistor (R ), a low pass filter (R , C ) and three comparators.Only one  
S
C
C
comparator is active at a time. It is activated by the input logic according to the current level chosen with signals  
I and I .  
0
1
The motor current flows through the sensing resistor R . When the current has increased so that the voltage  
S
across R becomes higher than the reference voltage on the other comparator input, the comparator goes high,  
S
which triggers the pulse generator.  
The max peak current Imax can be defined by:  
V
ref  
I
= ----------------  
max  
10 R  
S
Single-pulse Generator  
The pulse generator is a monostable triggered on the positive going edge of the comparator output.  
The monostable output is high during the pulse time, t , which is determined by the time components R and C .  
off  
t
t
t
= 1.1 · R C  
t t  
off  
The single pulse switches off the power feed to the motor winding, causing the winding current to decrease dur-  
ing t  
.
off  
If a new trigger signal should occur during t , it is ignored.  
off  
Output Stage  
The output stage contains four Darlington transistors (source drivers) four saturated transistors (sink drivers)  
and eight diodes, connected in two H bridge. The source transistors are used to switch the power supplied to  
the motor winding, thus driving a constant current through the winding.  
V , V , V  
S
SS Ref  
The circuit will stand any order of turn-on or turn-off the supply voltages V and V . Normal dV/dt values are  
S
SS  
then assumed. Preferably, V  
should be tracking V during power-on and power-off if V is established.  
SS S  
Ref  
Thermal Shutdown  
When the die temperature reach 170°C the thermal shutdown internal circuitry turns off the power stage  
(tristate), once the cause of the die increased temperature will be removed the L8219 re-turns on itself as soon  
as the die temperature reach 150°C.  
APPLICATION INFORMATIONS  
Some stepper motors are not designed for continuous operation at maximum current. As the circuit drives a con-  
stant current through the motor, its temperature might increase exceedingly both at low and high speed opera-  
tion. Also, some stepper motors have such high core losses that they are not suited for switch mode current  
regulation. Unused inputs should be connected to proper voltage levels in order to get the highest noise immu-  
nity. As the circuit operates with switch mode current regulation, interference generation problems might arise  
in some applications. A good measure might then be to decouple the circuit with a 100nF capacitor, located near  
the package between power line and ground. The ground lead between Rs, and circuit GND should be kept as  
short as possible. A typical Application Circuit is shown in Fig. 4. Note that Ct must be NPO type or similar else.  
To sense the winding current, paralleled metal film resistors are recommended.  
9/13  
L8219  
Figure 4. Typical Application Circuit.  
V
=5V  
V
S
SS  
100nF  
100nF  
100µF  
OUT1  
OUT2  
I01  
I11  
Ph1  
Ph2  
I12  
M
I02  
RS 0.5Ω  
R
S1  
R C  
1
1
820pF  
Ct  
56K  
Rt  
toff  
56K  
Rt  
C
R
I
OMP NP1  
820pF  
Ct  
R C  
2
2
RS 0.5Ω  
S2  
C
I
OMP NP2  
D99IN1021A  
10/13  
L8219  
mm  
inch  
DIM.  
OUTLINE AND  
MECHANICAL DATA  
MIN.  
2.350  
0.100  
2.050  
0.330  
0.230  
17.70  
TYP. MAX. MIN.  
2.650 0.092  
0.300 0.004  
2.550 0.080  
0.510 0.013  
0.320 0.009  
18.10 0.696  
TYP. MAX.  
0.104  
A
A1  
A2  
b
0.012  
0.100  
0.020  
c
00.12  
(1)  
0.712  
D
D1  
ACCORDING TO PAD SIZE  
7.600 0.291  
(2)  
7.400  
0.299  
E
E1  
e
ACCORDING TO PAD SIZE  
1.270  
0.05  
H
10.00  
0.250  
0.400  
10.65 0.394  
0.750 0.010  
1.270 0.016  
0˚ (min), 8˚ (max)  
0.100  
0.419  
0.029  
0.05  
h
L
k
ddd  
0.004  
(1) Dimensions “D” does not include mold flash, protusions or gate burrs.  
Mold flash, protusions and gate shall not exeed 0.15mm per side  
(2) Dimensions “E” does not include inter-lead flash or protusions or  
gate burrs. Inter-lead flash or protusions shall not exeed 0.25mm  
SO28EP  
(HSOP28 - Exposed Pad)  
.
per side  
.
7165357  
11/13  
L8219  
mm  
inch  
DIM.  
MIN. TYP. MAX. MIN. TYP. MAX.  
OUTLINE AND  
MECHANICAL DATA  
A
a1  
a2  
a3  
b
3.60  
0.141  
0.012  
0.130  
0.004  
0.015  
0.012  
0.630  
0.385  
0.570  
0.10  
0.30 0.004  
3.30  
0
0.10  
0
0.22  
0.23  
0.38 0.008  
0.32 0.009  
16.00 0.622  
9.80 0.370  
14.50 0.547  
c
D (1) 15.80  
D1  
E
9.40  
13.90  
e
0.65  
0.0256  
0.435  
e3  
11.05  
E1 (1) 10.90  
E2  
11.10 0.429  
2.90  
0.437  
0.114  
0.244  
0.126  
0.004  
0.626  
0.043  
0.043  
E3  
E4  
G
H
5.80  
2.90  
0
6.20 0.228  
3.20 0.114  
0.10  
0
15.50  
15.90 0.610  
1.10  
h
L
0.80  
1.10 0.031  
10°(max.)  
8 °(max.)  
N
S
PowerSO36  
(1): "D" and "E1" do not include mold flash or protrusions  
- Mold flash or protrusions shall not exceed 0.15mm (0.006 inch)  
- Critical dimensions are "a3", "E" and "G".  
N
N
a2  
A
c
a1  
e
A
DETAIL B  
lead  
E
DETAIL A  
e3  
H
DETAIL A  
D
slug  
a3  
BOTTOM VIEW  
36  
19  
E3  
B
E1  
E2  
D1  
DETAIL B  
0.35  
Gage Plane  
- C -  
SEATING PLANE  
1
1
8
S
L
G
C
M
b
0.12  
A B  
PSO36MEC  
h x 45˚  
(COPLANARITY)  
12/13  
L8219  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences  
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted  
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject  
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not  
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
The ST logo is a registered trademark of STMicroelectronics  
2002 STMicroelectronics - All Rights Reserved  
STMicroelectronics GROUP OF COMPANIES  
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13/13  

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