ESDA6V1-4BP6 [STMICROELECTRONICS]

Transil array for ESD protection; TRANSIL阵列的ESD保护
ESDA6V1-4BP6
型号: ESDA6V1-4BP6
厂家: ST    ST
描述:

Transil array for ESD protection
TRANSIL阵列的ESD保护

文件: 总8页 (文件大小:116K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ESDAxxxP6  
ASD  
Transil™ array for ESD protection  
Main applications  
Where transient overvoltage protection in ESD  
sensitive equipment is required, such as:  
Computers  
SOT-666  
ESDA14V2BP6  
ESDA25-4BP6  
SOT-666IP  
(Internal pad)  
ESDA6V1P6  
ESDA6V1-5P6  
Servers  
Printers  
Communication systems and cellular phones  
Video equipment  
Order codes  
These devices are particularly adapted to the  
protection of symmetrical signals.  
Part Number  
Marking  
Features  
ESDA6V1P6  
ESDA6V1-5P6  
ESDA14V2BP6  
ESDA25-4BP6  
B
C
A
V
4 / 5 Unidirectional  
(ESDA6V1P6 and ESDA6V1-5P6) and  
Bidirectional (ESDA14V2BP6 and  
ESDA25-4BP6) Transil functions  
Breakdown voltage:  
Figure 1.  
ESDA6V1P6 functional diagram  
V
BR = 6.1 V min., 14.2 V min. and 25 V min.  
Low leakage current:  
I/O1  
GND  
I/O2  
I/O4  
GND  
I/O3  
< 500 nA (ESDA6V1P6 / ESDA6V1-5P6)  
< 1 µA (ESDA14V2BP6 and ESDA25-4BP6)  
2
Very small PCB area < 2.6 mm  
Description  
Figure 2.  
ESDA6V1-5P6 functional diagram  
The ESDAxxxP6 are monolithic arrays designed  
to protect up to 5 lines against ESD transients.  
I/O1  
GND  
I/O2  
I/O5  
I/O4  
I/O3  
These devices are ideal where board space  
saving and reduced line capacitance are required.  
Benefits  
High ESD protection level  
High integration  
Figure 3.  
ESDA14V2BP6 and ESDA25-4BP6  
functional diagram  
Suitable for high density boards  
I/O1  
GND  
I/O2  
I/O4  
GND  
I/O3  
Complies with the following standards:  
IEC61000-4-2 level 4:  
15 kV (air discharge)  
8 kV (contact discharge)  
TM: Transil is a trademark of STMicroelectronics  
MIL STD 883E-Method 3015-7: class3  
25 kV (Human Body Model)  
May 2007  
Rev 3  
1/8  
www.st.com  
8
Characteristics  
ESDAxxxP6  
1
Characteristics  
Table 1.  
Symbol  
Absolute Maximum Ratings (Tamb = 25° C)  
Parameter  
Value  
Unit  
air discharge  
IEC 61000-4-2 level 4 standard  
contact discharge  
15  
8
VPP  
kV  
Peak pulse power (8/20 µs) (1)  
Tj initial = Tamb  
ESDA6V1P6 / ESDA6V1-5P6  
ESDA14V2BP6 / ESDA25-4BP6  
150  
50  
PPP  
W
Tj  
Tstg  
TL  
Junction temperature  
150  
°C  
Storage temperature range  
-55 to +150 °C  
260 °C  
-40 to +150 °C  
Maximum lead temperature for soldering during 10 s at 5 mm for case  
Operating temperature range  
Top  
1. for a surge greater than the maximum values, the diode will fail in short-circuit.  
Table 2.  
Symbol  
Electrical Characteristics (Tamb = 25° C)  
Parameter  
Unidirectional  
I
IF  
VRM  
VBR  
VCL  
IRM  
IPP  
αT  
Stand-off voltage  
Breakdown voltage  
VF  
V
CLVBR VRM  
V
Clamping voltage  
IRM  
Bidirectional  
Leakage current  
I
Slope: 1/Rd  
Peak pulse current  
Voltage temperature coefficient  
Forward voltage drop  
Capacitance  
IPP  
VCLVBR VRM  
V
IRM  
VF  
C
Slope: 1/Rd  
IPP  
Rd  
Dynamic resistance  
VBR  
IRM  
@
VRM  
Rd  
αT  
C
@ IR  
max.  
typ.  
typ.  
Part Numbers  
min.  
max.  
max.  
@ 0V  
pF  
V
V
mA  
µA  
V
Ω
10-4/°C  
ESDA6V1P6  
6.1  
7.2  
1
0.5  
3
1.5  
4
70  
ESDA6V1-5P6  
1
0.1  
1
12  
3
ESDA14V2BP6  
ESDA25-4BP6  
14.2  
25  
18  
30  
1
1
1.5  
1.7  
5.8  
7.3  
25  
22  
24  
2/8  
ESDAxxxP6  
Figure 4.  
Characteristics  
Peak power dissipation versus  
initial junction temperature  
Figure 5.  
Peak pulse power versus  
exponential pulse duration  
(Tj initial = 25° C)  
P
PP  
[T initial] / P [T initial=25°C]  
P (W)  
PP  
j
PP  
j
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
1000  
100  
10  
Tj initial = 25°C  
ESDA6V1P6 & ESDA6V1-5P6  
ESDA14V2BP6 & ESDA25-4BP6  
T initial (°C)  
j
t (µs)  
p
0
25  
50  
75  
100  
125  
150  
175  
1
10  
100  
Figure 6.  
Clamping voltage versus peak  
Figure 7.  
Junction capacitance versus  
pulse current (Tj initial = 25° C,  
rectangular waveform, tp = 2.5 µs)  
reverse applied voltage (typical  
values)  
I
(A)  
PP  
C(pF)  
100.0  
10.0  
1.0  
80  
F=1MHz  
VOSC=30mVRMS  
Tj=25°C  
ESDA14V2BP6  
70  
60  
50  
40  
30  
20  
10  
0
ESDA6V1P6 & ESDA6V1-5P6  
ESDA6V1P6 & ESDA6V1-5P6  
ESDA25-4BP6  
ESDA14V2BP6  
tP=2.5µs  
Tj initial =25°C  
V
(V)  
CL  
V (V)  
R
ESDA25-4BP6  
10 11 12 13 14  
0.1  
0
10  
20  
30  
40  
50  
60  
70  
0
1
2
3
4
5
6
7
8
9
Figure 8.  
Relative variation of leakage  
current versus junction  
temperature (typical values)  
Figure 9.  
Peak forward voltage drop versus  
peak forward current (typical  
values)  
I (A)  
FM  
I [T ] / I [T =25°C]  
R
j
R
j
1.E+00  
1.E-01  
1.E-02  
1.E-03  
1.E+04  
1.E+03  
1.E+02  
1.E+01  
1.E+00  
ESDA6V1P6 & ESDA6V1-5P6  
ESDA14V2BP6  
VRM =12 V  
Tj =125°C  
Tj =25°C  
ESDA25-4BP6  
VRM = 24 V  
ESDA6V1P6 & ESDA6V1-5P6  
VRM =3 V  
T (°C)  
j
V
(V)  
FM  
25  
50  
75  
100  
125  
150  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
3/8  
Ordering information scheme  
ESDAxxxP6  
Figure 10. ESD response @ V = 15 kV air  
Figure 11. ESD response @ V = 15 kV air  
PP  
PP  
discharge (ESDA6V1-5P6)  
discharge (ESDA25-4BP6)  
20 V per div  
0.2 µs per div  
2
Ordering information scheme  
ESDA 6V1 - x B Px  
ESD Array  
Breakdown Voltage  
6V1 = 6.1 Volts min.  
14V2 = 14.2 Volts min.  
25 = 25 Volts min.  
Number of lines protected (optional)  
5 = 5 lines  
4 = 4 lines  
Type  
Blank = Unidirectional  
B = Bidirectional  
Packages  
P6 = SOT-666 for ESDA14V2BP6 and ESDA25-4BP6  
SOT-666IP for ESDA6V1P6 and ESDA6V1-5P6  
4/8  
ESDAxxxP6  
Package information  
3
Package information  
Epoxy meets UL94, V0  
Table 3.  
SOT-666 Dimensions  
Dimensions  
Millimeters  
Min. Typ. Max. Min. Typ. Max.  
b1  
Ref.  
Inches  
L1  
A
0.45  
0.60 0.018  
0.18 0.003  
0.34 0.007  
0.024  
0.007  
0.013  
L3  
b
A3 0.08  
0.17  
b
D
E1  
E
b1 0.19 0.27 0.34 0.007 0.011 0.013  
D
E
1.50  
1.50  
1.70 0.059  
1.70 0.059  
1.30 0.043  
0.067  
0.067  
0.051  
A
L2  
A3  
E1 1.10  
e
0.50  
0.19  
0.020  
0.007  
L1  
L2 0.10  
L3  
0.30 0.004  
0.012  
e
0.10  
0.004  
Figure 12. SOT-666 Footprint (dimensions in mm)  
0.50  
0.62  
2.60  
0.99  
0.30  
5/8  
Package information  
Table 4.  
ESDAxxxP6  
Inches  
SOT-666IP Dimensions  
Dimensions  
Millimeters  
Ref.  
b1  
L1  
Min. Typ. Max. Min. Typ. Max.  
L4  
A
0.45  
0.60 0.018  
0.18 0.003  
0.34 0.007  
0.024  
0.007  
0.013  
L3  
b
A3 0.08  
0.17  
b
D
E1  
E
b1 0.19 0.27 0.34 0.007 0.011 0.013  
D
E
1.50  
1.50  
1.70 0.059  
1.70 0.059  
1.30 0.043  
0.067  
0.067  
0.051  
A
L2  
E1 1.10  
A3  
e
0.50  
0.19  
0.020  
0.007  
L1  
L2 0.10  
0.30 0.004  
0.012  
e
L3  
L4  
0.10  
0.60  
0.004  
0.024  
Figure 13. SOT-666IP Footprint (dimensions in mm)  
0.50  
0.30  
0.99  
0.21  
0.62 2.60  
1.40  
0.20  
In order to meet environmental requirements, ST offers these devices in ECOPACK®  
packages. These packages have a lead-free second level interconnect. The category of  
second level interconnect is marked on the package and on the inner box label, in  
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering  
conditions are also marked on the inner box label. ECOPACK is an ST trademark.  
ECOPACK specifications are available at: www.st.com.  
6/8  
ESDAxxxP6  
Ordering information  
4
Ordering information  
Part Number  
Marking  
Package  
Weight  
Base qty  
Delivery mode  
ESDA6V1P6  
ESDA6V1-5P6  
ESDA14V2BP6  
ESDA25-4BP6  
B
C
A
V
SOT-666IP  
SOT-666  
2.9 mg  
3000  
Tape and reel  
5
Revision history  
Date  
Revision  
Changes  
ESDA6V1P6, ESDA6V1-5P6 and ESDA14V2BP6: datasheets  
merged. ECOPACK statement added. Some curves combined.  
07-Feb-2006  
1
Reformatted to current standards. Modified package information to  
show both SOT-666 and SOT-666IP.  
26-Jun-2006  
22-May-2007  
2
3
Added product ESDA25-4BP6  
7/8  
ESDAxxxP6  
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8/8  

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