S71WS256NC0BAWYJ3 [SPANSION]

Stacked Multi-Chip Product (MCP); 堆叠式多芯片产品( MCP )
S71WS256NC0BAWYJ3
元器件型号: S71WS256NC0BAWYJ3
生产厂家: SPANSION    SPANSION
描述和应用:

Stacked Multi-Chip Product (MCP)
堆叠式多芯片产品( MCP )

PDF文件: 总13页 (文件大小:334K)
下载文档:  下载PDF数据表文档文件
型号参数:S71WS256NC0BAWYJ3参数

S71WS256NC0BAWYK0

Stacked Multi-Chip Product (MCP)

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9 SPANSION

S71WS256NC0BAWYK2

Stacked Multi-Chip Product (MCP)

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22 SPANSION

S71WS256NC0BAWYK3

Stacked Multi-Chip Product (MCP)

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14 SPANSION

S71WS256NC0BAWYN0

Stacked Multi-Chip Product (MCP)

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7 SPANSION

S71WS256NC0BAWYN2

Stacked Multi-Chip Product (MCP)

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9 SPANSION

S71WS256NC0BAWYN3

Stacked Multi-Chip Product (MCP)

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7 SPANSION

S71WS256NC0BAWYP0

Stacked Multi-Chip Product (MCP)

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19 SPANSION

S71WS256NC0BAWYP2

Stacked Multi-Chip Product (MCP)

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14 SPANSION

S71WS256NC0BAWYP3

Stacked Multi-Chip Product (MCP)

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20 SPANSION

S71WS256NC0BFIAB2

Memory Circuit, 16MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

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0 SPANSION

S71WS256NC0BFWA20

Stacked Multi-Chip Product (MCP)

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21 SPANSION

S71WS256NC0BFWA20

Memory Circuit, 16MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

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0 SPANSION

S71WS256NC0BFWA22

Stacked Multi-Chip Product (MCP)

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19 SPANSION

S71WS256NC0BFWA22

Memory Circuit, 16MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

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0 SPANSION

S71WS256NC0BFWA23

Stacked Multi-Chip Product (MCP)

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10 SPANSION