S71WS256NC0BAWYP2 [SPANSION]

Stacked Multi-Chip Product (MCP); 堆叠式多芯片产品( MCP )
S71WS256NC0BAWYP2
型号: S71WS256NC0BAWYP2
厂家: SPANSION    SPANSION
描述:

Stacked Multi-Chip Product (MCP)
堆叠式多芯片产品( MCP )

文件: 总13页 (文件大小:334K)
下载:  下载PDF数据表文档文件

S71WS256NC0BAWYP3

Stacked Multi-Chip Product (MCP)

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20 SPANSION

S71WS256NC0BFIAB2

Memory Circuit, 16MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

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0 SPANSION

S71WS256NC0BFWA20

Stacked Multi-Chip Product (MCP)

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21 SPANSION

S71WS256NC0BFWA20

Memory Circuit, 16MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

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0 SPANSION

S71WS256NC0BFWA22

Stacked Multi-Chip Product (MCP)

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19 SPANSION

S71WS256NC0BFWA22

Memory Circuit, 16MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

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0 SPANSION

S71WS256NC0BFWA23

Stacked Multi-Chip Product (MCP)

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10 SPANSION

S71WS256NC0BFWA30

Stacked Multi-Chip Product (MCP)

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10 SPANSION

S71WS256NC0BFWA30

Memory Circuit, 16MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

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0 SPANSION

S71WS256NC0BFWA32

Stacked Multi-Chip Product (MCP)

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14 SPANSION

S71WS256NC0BFWA32

Memory Circuit, 16MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

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0 SPANSION

S71WS256NC0BFWA33

Stacked Multi-Chip Product (MCP)

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16 SPANSION

S71WS256NC0BFWA60

Stacked Multi-Chip Product (MCP)

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8 SPANSION

S71WS256NC0BFWA62

Stacked Multi-Chip Product (MCP)

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23 SPANSION

S71WS256NC0BFWA63

Stacked Multi-Chip Product (MCP)

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28 SPANSION