SP6120HV [SIPEX]

High Voltage, Synchronous ,Buck Controller Ideal for 2A to 20A, High Performance, DC-DC Power Converters; 高电压,同步,降压控制器非常适合2A至20A ,高性能, DC-DC电源转换器
SP6120HV
型号: SP6120HV
厂家: SIPEX CORPORATION    SIPEX CORPORATION
描述:

High Voltage, Synchronous ,Buck Controller Ideal for 2A to 20A, High Performance, DC-DC Power Converters
高电压,同步,降压控制器非常适合2A至20A ,高性能, DC-DC电源转换器

转换器 控制器
文件: 总22页 (文件大小:415K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
®
SP6120HV  
High Voltage, Synchronous ,Buck Controller  
Ideal for 2A to 20A, High Performance, DC-DC Power Converters  
Optimized for Single Supply, 3V - 12V Applications  
High Efficiency: Greater Than 95% Possible  
"AnyFETTM" Technology: Capable Of Switching Either  
N/C  
ENABLE  
ISP  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
BST  
GH  
SWN  
GND  
PGND  
GL  
SP6120HV  
PFET Or NFET High Side Switch  
ISN  
Selectable Discontinuous or Continuous Conduction  
16 Pin TSSOP  
VFB  
Mode  
COMP  
SS  
Fast Transient Response from Window Comparator  
16-Pin TSSOP, Small Size  
Accurate 1% Reference Over Line, Load and Temperature  
Accurate 10% Frequency  
Accurate, Rail to Rail, 43mV, Over-Current Sensing  
Resistor Programmable Frequency  
Resistor Programmable Output Voltage  
Low Quiescent Current: 950µA, 10µA in Shutdown  
Hiccup Over-Current Protection  
VCC  
PROG  
ROSC  
Now Available in Lead Free Packaging  
APPLICATIONS  
DSP  
Microprocessor Core  
I/O & Logic  
Industrial Control  
Distributed Power  
Low Voltage Power  
Capacitor Programmable Soft Start  
Guaranteed Boost Voltage to Enhance High Side NFET  
DESCRIPTION  
The SP6120HV is a fixed frequency, voltage mode, synchronous PWM controller designed  
to work from a single 12V, 5V or 3.3V input supply. Sipex's unique "AnyFETTM" Technology  
allows the SP6120HV to be used for resolving a multitude of price/performance trade-offs.  
It is separated from the PWM controller market by being the first controller to offer precision,  
speed, flexibility, protection and efficiency over a wide range of operating conditions.  
PMOS High Side Drive  
NMOS High Side Drive  
PROG = GND  
MBR0530  
3.3V  
3.3V  
PROG = V  
V
V
IN  
CC  
IN  
C
C
B
IN  
C
C
IN  
330µF x 2  
BST  
1µF  
NC  
®
®
330µF x 2  
BST  
GH  
1µF  
NC  
®®  
BST  
GH  
ENABLE  
QT  
ENABLE  
ISP  
CS  
RS  
ENABLE  
QT1  
ENABLE  
ISP  
CS  
RS  
22.1k  
SP6120BSWN  
1.9V  
39nF  
1A to 8A  
22.1k  
L1  
L1  
SWN  
GND  
39nF  
1.9V  
1A to 8A  
ISN  
GND  
V
SP6120B  
OUT  
2.5µH  
ISN  
V
OUT  
V
2.5µH  
PGND  
GL  
FB  
V
PGND  
GL  
FB  
QB  
COMP  
SS  
DS  
C
OUT  
470µF x 3  
RF  
5.23k  
RZ  
15k  
V
COMP  
SS  
DS  
V
QB  
C
OUT  
470µF x 3  
IN  
CC  
RF  
5.23k  
C
SS  
0.33µF  
CP  
100pF  
R
PROG  
OSC  
V
IN  
V
RZ  
15k  
CC  
CV  
CC  
2.2µF  
RI  
10k  
R
OSC  
CZ  
4.7nF  
R
CP  
100pF  
PROG  
OSC  
C
18.7k  
SS  
0.33µF  
CV  
CC  
2.2µF  
R
OSC  
RI  
10k  
CZ  
4.7nF  
18.7k  
QT, QB = FAIRCHILD FDS6690A  
QT1 = FAIRCHILD FDS6375 (PMOS only)  
L1 = PANASONIC ETQP6F2R5SFA  
DS = STMICROELECTRONICS STPS2L25U  
CIN = SANYO 6TPB330M  
COUT = SANYO 4TPB470M  
Date: 5/25/04  
SP6120HV Low Voltage, Synchronous Buck Controller  
© Copyright 2004 Sipex Corporation  
1
ABSOLUTE MAXIMUM RATINGS  
These are stress ratings only and functional operation  
of the device at these ratings or any other above those  
indicated in the operation sections of the specifications  
below is not implied. Exposure to absolute maximum  
rating conditions for extended periods of time may  
affect reliability.  
Peak Output Current < 10µs  
GH, GL ........................................................................ 2A  
Operating Temperature Range  
SP6120C ................................................ 0°C to +70°C  
SP6120E .............................................. -40°C to +85°C  
Junction Temperature, TJ ...................................... +125°C  
Storage Temperature Range .................. -65˚C to +150˚C  
Power Dissipation  
VCC .......................................................................... 13.2V  
BST ........................................................................... 19V  
BST-SWN ............................................................... 13.2V  
SWN ............................................................. -1V to 13.2V  
GH ..................................................... -0.3V to BST +0.3V  
GH-SWN ................................................................ 13.2V  
All Other Pins .......................................-0.3V to VCC +0.3V  
Lead Temperature (soldering 10 sec) ................... +300˚C  
ESD Rating ........................................................2kV HBM  
SPECIFICATIONS  
Unless otherwise specified: 3.0V < VCC <5.5V, 3.0V < BST < 13.2V, ROSC = 18.7k, CCOMP = 0.1µF, CSS = 0.1µF, ENABLE =  
3V, CGH = CGL = 3.3nF, VFB = 1.25V, ISP = ISN = 1.25V, SWN = GND = PGND = 0V, -40°C < TAMB <85°C (Note 1)  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX UNITS  
QUIESCENT CURRENT  
VCC Supply Current  
No Switching  
ENABLE = 0V  
-
-
0.95  
5
1.8  
20  
mA  
VCC Supply Current (Disabled)  
BST Supply Current  
µA  
No Switching, VBST = VCC  
No Switching, VCC = 5V, VBST = 10V  
-
-
1
100  
20  
150  
µA  
µA  
ERROR AMPLIFIER  
Error Amplifier Transconductance  
COMP Sink Current  
600  
35  
35  
3
µs  
µA  
µA  
M  
nA  
VFB = 1.35V, COMP = 0.5V, No Faults  
VFB = 1.15V, COMP = 1.6V  
15  
15  
65  
65  
COMP Source Current  
COMP Output Impedence  
VFB Input Bias Current  
REFERENCE  
-
60  
100  
Error Amplifier Reference  
VFB 3% Low Comparator  
VFB 3% High Comparator  
OSCILLATOR & DELAY PATH  
Oscillator Frequency  
Oscillator Frequency #2  
Duty Ratio  
Trimmed with Error Amp in Unity Gain 1.238  
1.250  
1.262  
V
3
3
%VREF  
%VREF  
270  
450  
300  
500  
95  
330  
550  
kHz  
kHz  
%
ROSC = 10.2kΩ  
Loop In Control -100% DC possible  
ROSC Voltage  
Information Only - Moves  
with Oscillator Trim  
0.65  
V
Minimum GH Pulse Width  
VCC > 4.5V, Ramp up COMP  
Voltage > 0.6V until GH starts  
Switching  
120  
250  
ns  
Date: 5/25/04  
SP6120HV Low Voltage, Synchronous Buck Controller  
© Copyright 2004 Sipex Corporation  
2
SPECIFICATIONS: continued  
Unless otherwise specified: 3.0V < VCC <5.5V, 3.0V < BST < 13.2V, ROSC = 18.7k, CCOMP = 0.1µF, CSS = 0.1µF, ENABLE =  
3V, CGH = CGL = 3.3nF, VFB = 1.25V, ISP = ISN = 1.25V, SWN = GND = PGND = 0V, -40°C < TAMB <85°C (Note 1)  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX UNITS  
SOFTSTART  
SS Charge Current  
SS Discharge Current  
COMP Discharge Current  
COMP Clamp Voltage  
SS Ok Threshold  
SS Fault Reset  
VSS = 1.5V  
25  
2
50  
5
70  
7
µA  
µA  
µA  
V
VSS = 1.5V  
VCOMP = 0.5V, Fault Initiated  
VFB < 1.0V, VSS = 2.5V  
200  
2.0  
1.7  
0.2  
2.0  
500  
2.4  
2.0  
0.25  
2.4  
-
2.8  
2.2  
0.3  
2.8  
V
V
SS Clamp Voltage  
V
OVER CURRENT & ZERO CURRENT COMPARATORS  
Over Current Comparator  
Threshold Voltage  
Rail to Rail Common Mode Input  
32  
-
43  
54  
mV  
ISN, ISP Input Bias Current  
60  
2
250  
nA  
Zero Current Comparator  
Threshold  
VISP - VISN  
mV  
UVLO  
VCC Start Threshold  
VCC Stop Threshold  
ENABLE  
2.75  
2.65  
2.85  
2.75  
2.95  
2.9  
V
V
Enable Threshold  
ON  
OFF  
1.45  
9
0.65  
0.6  
V
Enable Pin Source Current  
GATE DRIVER  
4
µA  
GH Rise Time  
VCC > 4.5V  
VCC > 4.5V  
VCC > 4.5V  
VCC > 4.5V  
VCC > 4.5V  
VCC > 4.5V  
-
-
40  
40  
40  
40  
60  
60  
110  
110  
110  
110  
140  
140  
ns  
ns  
ns  
ns  
ns  
ns  
GH Fall Time  
GL Rise Time  
-
GL Fall Time  
-
GH to GL Non-Overlap Time  
GL to GH Non-Overlap Time  
VBST OK Threshold  
0
0
VCC = 3.0V, FB=1.15V, Search GL High  
VCC = 5.5V, FB=1.15V, Search GL High  
4.0  
7.3  
4.8  
7.8  
5.0  
8.3  
V
V
Forced GL ON  
VBST < VBST OK Threshold, FB =1.15V  
200  
350  
650  
ns  
Note 1: Specifications to -40°C are guaranteed by design, characterization and correlation with statistical process control.  
Date: 5/25/04  
SP6120HV Low Voltage, Synchronous Buck Controller  
© Copyright 2004 Sipex Corporation  
3
PIN DESCRIPTION  
NAME  
FUNCTION  
PIN NUMBER  
1
2
N/C  
No Connection  
ENABLE  
TTL compatible input with internal 4uA pullup. Floating or Venable> 1.5V will  
enable the part, Venable < 0.65V disables part.  
3
ISP  
Current Sense Positive Input: Rail to Rail Input for Over-Current Detection,  
43mV threshold with 10µs (typ) response time.  
4
5
ISN  
VFB  
Current Sense Negative Input: Rail to Rail input for Over-Current Detection.  
Feedback Voltage Pin: Inverting input of the error amplifier and serves as the  
output voltage feedback point for the buck converter. The output voltage is  
sensed and can be adjusted through an external resistor divider.  
6
7
COMP  
SS  
Error Amplifier Compensation Pin: A lead lag network is typically connected  
to this pin to compensate the feedback loop. This pin is clamped by the SS  
voltage and is limited to 2.8V maximum.  
Soft Start Programming Pin: This pin sources 50µA on start-up. A 0.01µF to  
1µF capacitor on this pin is typically enough capacitance to soft start a power  
supply. In addition, hiccup mode timing is controlled by this pin through the  
5µA discharge current. The SS voltage is clamped to 2.7V maximum.  
8
9
ROSC  
Frequency Programming Pin: A resistor to ground is used to program  
frequency. Typical values - 18,700, 300kHz; 10,200, 500kHz.  
PROG  
Programming Pin:  
PROG = GND; MODE = NFET/CONTINOUS  
PROG = 68kto GND; MODE = NFET/DISCONTINOUS  
PROG = VCC; MODE = PFET/CONTINOUS  
PROG = 68kto VCC; MODE = PFET/DISCONTINOUS  
10  
VCC  
I.C. Supply Pin: ESD structures also hooked to this pin. Properly bypass this  
pin to PGND with a low ESL/ESR ceramic capacitor.  
11  
12  
GL  
Synchronous FET Driver: 1nF/20ns typical drive capability.  
PGND  
Power Ground Pin: Used for Power Stage. Connect Directly to GND at I.C.  
pins for optimal performance.  
13  
14  
GND  
SWN  
Ground Pin: Main ground pin for I.C.  
Switch Node Reference: High side MOSFET driver reference. Can also be  
tied to GND for low voltage applications.  
15  
16  
GH  
HIgh Side MOSFET Driver: Can be NFET or PFET depending on Program  
Mode. 1nF/20ns typical drive capability. Maximum voltage rating is  
referenced to SWN.  
BST  
High Side Driver Supply Pin. When VBST is less than VBST OK Threshold, GL  
is forced to turn on for at least 300ns. This is intended for enough time to  
charge the BST capacitor.  
Date: 5/25/04  
SP6120HV Low Voltage, Synchronous Buck Controller  
© Copyright 2004 Sipex Corporation  
4
BLOCK DIAGRAM  
SS  
+
V
FB 3% Low ENABLE  
2V  
-
VFB  
Continuous/  
Discontinuous  
-
3%  
ON 100%  
Program  
Logic  
+
-
+
Window  
Comparator  
Logic  
9
PROG  
NFET/PFET  
1.25V  
3%  
Reference  
2
ENABLE  
GND  
OFF 100%  
-
+
-
VFB  
+
BST  
GH  
16  
15  
13  
GM  
Error Amplifier  
RESET  
Dominant  
SS  
+
-
PWM Latch  
Driver  
Logic  
-
Synchronous  
Driver  
14 SWN  
11 GL  
VFB  
5
R
+
QPWM  
Q
S
12  
8
PGND  
ROSC  
COMP  
VCC  
6
10  
0.65V  
ICHARGE  
1V RAMP  
UVLO  
-
F (kHz) = 5.7E6/ROSC ()  
2.85 VON  
2.75 VOFF  
Set Dominant  
+
Fault Latch  
S
Soft Start  
& Hiccup Logic  
ISP  
ISN  
3
4
+
OVC  
FAULT  
Q
x 10  
+
TOFF  
10µs  
-
R
-
430mV  
-
7
SS  
+
-
250mV  
Zero crossing detect  
+
APPLICATION SCHEMATIC  
NMOS High Side Drive  
PROG = GND  
MBR0530  
3.3V  
V
IN  
C
C
B
IN  
C
BST  
1µF  
1µF  
®
®
330µF x 2  
NC  
BST  
GH  
ENABLE  
QT  
ENABLE  
ISP  
CS  
RS  
22.1k  
SP6120BSWN  
1.9V  
1A to 8A  
39nF  
L1  
ISN  
GND  
V
OUT  
2.5µH  
V
PGND  
GL  
FB  
QB  
COMP  
SS  
DS  
C
OUT  
470µF x 3  
RF  
5.23k  
RZ  
15k  
V
V
IN  
CC  
C
SS  
0.33µF  
CP  
100pF  
R
PROG  
OSC  
CV  
CC  
2.2µF  
RI  
10k  
R
18.7k  
OSC  
CZ  
4.7nF  
Figure 1. Schematic 3.3V to 1.9V Power Supply  
CIN = SANYO 6TPB330M  
COUT = SANYO 4TPB470M  
QT, QB = FAIRCHILD FDS6690A  
L1 = PANASONIC ETQP6F2R5SFA  
DS = STMICROELECTRONICS STPS2L25U  
Date: 5/25/04  
SP6120HV Low Voltage, Synchronous Buck Controller  
© Copyright 2004 Sipex Corporation  
5
Typical Performance Characteristics  
Refer to circuit in Figure 1 with VIN = 3.3V; VOUT = 1.9V, ROSC = 18.7k, and TAMB = +25°C unless otherwise noted.  
100  
90  
80  
70  
60  
50  
1.925  
1.920  
1.915  
1.910  
1.905  
1.900  
1.895  
1.890  
1.885  
1.880  
1.875  
0
2
4
6
8
10  
0
1
2
3
4
5
Load Current (A)  
Output Current (A)  
Figure 2. Efficiency vs. Output Current  
Figure 3. Load Regulation  
VOUT  
VOUT  
Gate High  
Gate High  
IOUT(1A/div)  
IOUT(5A/div)  
Figure 5. Load Step Response: 0.4A to 7A  
Figure 4. Load Step Response: 0.4A to 2A  
V
OUT  
V
OUT  
V
IN  
V
IN  
Soft Start  
Soft Start  
I
(1A/div)  
IN  
I
(5A/div)  
OUT  
Figure 6. Start-Up Response: 5A Load  
Figure 7. Overcurrent: 9A Load  
Date: 5/25/04  
SP6120HV Low Voltage, Synchronous Buck Controller  
© Copyright 2004 Sipex Corporation  
6
Typical Performance Characteristics  
Unless otherwise specified: VCC = BST = ENABLE = 3.3V, ROSC = 18.7k, CCOMP = 0.1µF, CSS = 0.1µF, CGH = CGL = 3.3nF, VFB = 1.25V,  
ISP = ISN = 1.25V, SWN = GND = PGND = 0V, TAMB = 25°C.  
0.30  
48  
46  
0.20  
0.10  
0.00  
44  
42  
40  
-0.10  
-0.20  
38  
-40  
-15  
10  
35  
60  
85  
-40  
-15  
10  
35  
60  
85  
Temperature (°C)  
Temperature (°C)  
Figure 8. Error Amplifier Reference vs. Temperature  
Figure 9. Overcurrent Comparator Threshold Voltage  
vs. Temperature  
-44  
-45  
-46  
-47  
5.25  
5.20  
5.15  
5.10  
5.05  
5.00  
-40  
-15  
10  
35  
60  
85  
-40  
-15  
10  
35  
60  
85  
Temperature (°C)  
Temperature (°C)  
Figure 11. SS Discharge Current vs. Temperature with  
VSS = 1.5V  
Figure 10. SS Charge Current vs. Temperature with  
VSS = 1.5V  
3.6  
3.4  
3.2  
3.0  
2.8  
2.6  
-2.2  
-2.4  
-2.6  
-2.8  
-3.0  
-3.2  
-40  
-15  
10  
35  
60  
85  
-40  
-15  
10  
35  
60  
85  
Temperature (°C)  
Temperature (°C)  
Figure 12. VFB 3% High Comparator vs. Temperature  
Figure 13. VFB 3% Low Comparator vs. Temperature  
Date: 5/25/04  
SP6120HV Low Voltage, Synchronous Buck Controller  
© Copyright 2004 Sipex Corporation  
7
Typical Performance Characteristics  
Unless otherwise specified: VCC = BST = ENABLE = 3.3V, ROSC = 18.7k, CCOMP = 0.1µF, CSS = 0.1µF, CGH = CGL = 3.3nF, VFB = 1.25V,  
ISP = ISN = 1.25V, SWN = GND = PGND = 0V, TAMB = 25°C.  
2.900  
2.875  
2.850  
2.825  
2.850  
2.825  
2.800  
2.775  
2.750  
2.800  
-40  
-15  
10  
35  
60  
85  
-40  
-15  
10  
35  
60  
85  
Temperature (°C)  
Temperature (°C)  
Figure 14. VCC Start Threshold vs. Temperature  
Figure 15. VCC Stop Threshold vs. Temperature  
800  
700  
600  
500  
400  
300  
200  
302  
301  
300  
299  
298  
-40  
-15  
10  
35  
60  
85  
5
10  
15  
20  
25  
30  
Temperature (°C)  
R
(k)  
OSC  
Figure 17. Oscillator Frequency vs. ROSC with VCC = 5V  
and CGH = CGL = Open.  
Figure 16. Oscillator Frequency vs. Temperature  
THEORY OF OPERATION  
General Overview  
The SP6120HV is a constant frequency, voltage  
mode PWM controller for low voltage, DC/DC  
step down converters. It has a main loop where  
anexternalresistor(ROSC)setsthefrequencyand  
the driver is controlled by the comparison of an  
error amp output (COMP) and a 1V ramp signal.  
Theerroramphasatransconductanceof 600µS,  
anoutputimpedanceof3M, aninternalpoleat  
2 MHz and a 1.25V reference input. Although  
the main control loop is capable of 0% and 100%  
duty cycle, its response time is limited by the  
external component selection. Therefore, a sec-  
ondary loop, including a window comparator  
positioned 3% above and below the reference,  
has been added to insure fast response to line and  
load transients. A unique “Ripple & Frequency  
Independent” algorithm, added to the secondary  
loop, insures that the window comparator does  
not interfere with the main loop during normal  
operation. In addition to receiving driver com-  
mands from the main and secondary loops, the  
Driver Logic is also controlled by the Program-  
ming Logic, Fault Logic and Zero Crossing  
Comparator. The Programming Logic tells the  
Driver Logic whether the controller is using a  
PFETorNFEThighsidedriveraswellaswhether  
the controller is operating in continuous or dis-  
continuousmode.TheFaultLogicholdsthehigh  
andlowsidedriversoffifVCC dipsbelow2.75V,  
if an over current condition exists, or if the part  
is disabled through the ENABLE pin. The Zero  
Crossing Comparator turns the lower driver off  
Date: 5/25/04  
SP6120HV Low Voltage, Synchronous Buck Controller  
© Copyright 2004 Sipex Corporation  
8
General Overview: continued  
on, the BST pin may not be high enough to fully  
enhance the switch. To prevent this operation,  
SP6120HV monitors the BST pin voltage in  
reference to the VCC voltage. When the BST pin  
voltage is less than VBST OK threshold, the  
controller forces the GL to turn on for MINI-  
MUM GL ON at the end of the switching cycle.  
This provides enough time to recharge the CBST  
and ensures the proper operation of the boot-  
strap circuit.  
if the conduction current reaches zero and the  
Driver Logic has made an attempt to turn the  
lower driver on and the Programming Logic is  
set for discontinuous mode. Lastly, the 4driv-  
ers have internal gate non-overlap circuitry and  
are designed to drive MOSFETs associated with  
converter designs in the 5A to 10A range. Typi-  
cally the high side driver is referenced to the  
SWN pin; further improving the efficiency and  
performance of the converter.  
UVLO  
Assuming that the ENABLE pin is either pulled  
high or floating, the voltage on the VCC pin then  
determines operation of the SP6120HV. As VCC  
rises, the UVLO block monitors VCC and keeps  
the high side and low side MOSFETs off and the  
COMPandSSpinslowuntilVCC reaches2.85V.  
If no faults are present, the SP6120HV will  
initiate a soft start when VCC exceeds 2.85V.  
Hysteresis (about 100mV) in the UVLO com-  
parator provides noise immunity at start-up.  
ENABLE  
Low quiescent mode or “Sleep Mode” is initi-  
ated by pulling the ENABLE pin below 650mV.  
The ENABLE pin has an internal 4µA pull-up  
current and does not require any external inter-  
face for normal operation. If the ENABLE pin is  
driven from a voltage source, the voltage must  
be above 1.45V in order to guarantee proper  
“awake” operation. Assuming that VCC is above  
2.85V, the SP6120HV transitions from “Sleep  
Mode” to “Awake Mode” in about 20µs to 30µs  
and from “Awake Mode” to “Sleep Mode” in a  
few microseconds. SP6120HV quiescent cur-  
rent in sleep mode is 20µA maximum. During  
SleepMode,thehighsideandlowsideMOSFETs  
are turned off and the COMP and SS pins are  
held low.  
Soft Start  
(see figures on next page)  
Soft start is required on step-down controllers to  
prevent excess inrush current through the power  
train during start-up. Typically this is managed  
by sourcing a controlled current into a program-  
mingcapacitor(ontheSSpin)andthenusingthe  
voltage across this capacitor to slowly ramp up  
either the error amp reference or the error amp  
output (COMP). The control loop creates nar-  
row width driver pulses while the output voltage  
is low and allows these pulses to increase to their  
steady-state duty cycle as the output voltage  
increases to its regulated value. As a result of  
controlling the inductor volt*second product  
during start-up, inrush current is also controlled.  
Bootstrap Circuit  
When SP6120HV is programmed to drive a  
high side N channel MOSFET, a bootstrap cir-  
cuit is required to generate a voltage higher than  
VIN tofullyenhancethetopMOSFET. Atypical  
bootstrap only requires a capacitor and diode  
shown as CBST and DBST in the application  
circuit on the front page. When the bottom  
MOSFET QB is turned on, DBST is forward  
biased and charges the CBST close to VIN. When  
thetopMOSFETturnon,theswitchnodeswings  
to the VIN voltage. Now the voltage at the BST  
pin is 2*VIN and DBST is reverse biased. The  
BST pin voltage powers the high side MOSFET  
driver, and thus the GH output goes up to 2*VIN  
to provide a VDS equal to VIN.  
The presence of the output capacitor creates  
extracurrentdrawduringstart-up. Simplystated,  
dVOUT/dt requires an average sustained current  
in the output capacitor and this current must be  
consideredwhilecalculatingpeakinrushcurrent  
andovercurrentthresholds. SincetheSP6120HV  
ramps up the error amp reference voltage, an  
expression for the output capacitor current can  
be written as:  
Under certain conditions, the bottom MOSFET  
may not turn on long enough to replenish CBST  
voltage.Therefore,whenthetopMOSFETturns  
ICOUT = (COUT/CSS) * (VOUT/1.25) * 50µA  
Date: 5/25/04  
SP6120HV Low Voltage, Synchronous Buck Controller  
© Copyright 2004 Sipex Corporation  
9
As the figure shows, the SS voltage controls a  
variety of signals. First, provided all the external  
faultconditionsareremoved,thefaultlatchisreset  
and the SS cap begins to charge. When the SS  
voltage reaches around 0.3V, the error amp refer-  
encebeginstotracktheSSvoltagewhilemaintain-  
ingthe0.3Vdifferential.AstheSSvoltagereaches  
0.7V, the driver begins to switch the high side and  
low side MOSFETs with narrow pulses in an  
efforttokeeptheconverteroutputregulated. As  
theerrorampreferencerampsupward,thedriver  
pulseswidenuntilasteadystatevalueisreached.  
The “bump” in the inductor current transfer curve  
is indicative of excess charge current incurred due  
to the finite propagation delay of the controller.  
When the SS voltage reaches 2.0V, the second-  
ary loop including the 3% window comparator  
is enabled. Lastly, the SS voltage is clamped at  
2.4V, ending the soft start charge cycle.  
Hiccup Mode  
When the converter enters a fault mode, the  
driverholdsthehighsideandlowsideMOSFETs  
off for a finite period of time. Provided the part  
is enabled, this time is set by the discharge of the  
SS capacitor. The discharge time is roughly 10  
times the charge interval thereby giving the  
power supply plenty of time to cool during an  
over current fault. The driver off-time is pre-  
dominantly determined by the discharge time.  
Restart will occur just like a normal soft start  
cycle.  
However, if a fault occurs during the soft start  
charge cycle, the FAULT latch is immediately  
set, turning off the high side and low side  
MOSFETs. The MOSFETs remain off during  
the remainder of the charge cycle and subse-  
quentdischargecycleoftheSScapacitor. Again,  
provided there are no external fault conditions,  
the FAULT latch will be reset when the SS  
voltage reaches 250 mV.  
2.4V  
2.0V  
SS Voltage  
Over Current Protection  
0.7V  
0.25V  
0V  
dVSS/dt = 50µA/CSS  
The SP6120HV over current protection scheme  
is designed to take advantage of three popular  
detection schemes: Sense Resistor, Trace Resis-  
tor or Inductor Sense. Because the detection  
threshold is only 43mV, both trace resistor and  
inductor sense become attractive protection  
schemes. The inductor sense scheme adds no  
additional dc loss to the converter and is an  
excellent alternative to Rdson based schemes;  
Error Amplifier  
VOUT = V(Eamp REF)* (1+RF/RI)  
Reference  
Voltage  
1.25V  
0V  
ILOAD  
Inductor Current  
0V  
43mV  
V(VCC  
)
V(ISP) - V(ISN)  
FAULT  
Reset Voltage  
0V  
0V  
2.4V  
2.0V  
V(VCC  
)
SS Voltage  
SWN  
Voltage  
250mV  
0V  
V(VCC  
)
0V  
V(VCC  
)
FAULT Voltage  
3% Low  
Enable Voltage  
0V  
0V  
TIME  
Date: 5/25/04  
SP6120HV Low Voltage, Synchronous Buck Controller  
© Copyright 2004 Sipex Corporation  
10  
Over Current Protection: continued  
providing continuous current sensing and flex-  
ible MOSFET selection. An internal, 10µs filter  
conditions the over current signal from tran-  
sients generated during load steps. In addition,  
becausetheovercurrentinputs, ISPandISN, are  
capable of rail to rail operation, the SP6120HV  
provides excellent over current protection dur-  
Continuous  
Load  
Current  
0A  
ing conditions where VIN approaches VOUT  
.
GH, GL  
Voltage  
Zero Crossing Detection  
In some applications, it may be undesirable to  
have negative conduction current in the induc-  
tor. This situation happens when the ripple cur-  
rent in the inductor is higher than the load cur-  
rent. Therefore, the SP6120HV provides an  
option for “discontinuous” operation. If the  
Program Logic (see next section) is set for dis-  
continuous mode, then the Driver Logic looks at  
the Zero Crossing Comparator and the state of  
the lower gate driver. If the low side MOSFET  
was “on” and V(ISP)-V(ISN) < 0 then the low  
side MOSFET is immediately turned off and  
held off until the high side MOSFET is turned  
“on”. When the high side MOSFET turns “on”  
, the Driver Logic is reset. The following figures  
show continuous and discontinuous operation  
foraconverterwithanNFEThighsideMOSFET.  
0V  
0V  
Discontinuous  
Load  
Current  
0A  
GH, GL  
Voltage  
0V  
0V  
Discontinuous vs. Continuous Mode  
TIME  
The discontinuous mode is used when better  
light load efficiency is desired, for example in  
portable applications. Additionally, for power  
supplysequencinginsomeapplicationstheDC-  
DC converter output is pre-charged to a voltage  
through a switch at start-up, and discontinuous  
operation would be required to prevent reverse  
inductorcurrentfromdischargingthepre-charge  
voltage. The continuous mode is preferable for  
lower noise and EMI applications since the  
discontinuous mode can cause ringing of the  
switch node voltage when it turns both switches  
off. Another example where continuous mode  
could be required is one where the inductor has  
anextrawindingusedforanover-windingregu-  
lator and thus continuous conduction is neces-  
sary to produce this second output voltage.  
Program Logic  
The Program pin (PROG) of the SP6120HV  
adds a new level of flexibility to the design of  
DC/DCconverters. A10µAcurrentflowseither  
into or out of the Program pin depending on the  
initialpotentialpresentedtothepin.Ifnoresistor  
is present, the Program Logic simply looks at the  
potential on the pin, sets the mode to “continu-  
ous” and programs NFET or PFET high side  
driveaccordingly.Ifthe68kresistorispresent,  
the voltage drop across the resistor signals the  
SP6120HV to put the Driver Logic in “discon-  
tinuous” mode. With one pin and a 68kresis-  
tor, the SP6120HV can be configured for a  
variety of operating modes:  
Date: 5/25/04  
SP6120HV Low Voltage, Synchronous Buck Controller  
© Copyright 2004 Sipex Corporation  
11  
Program Logic: continued  
tor detects whether the output voltage is above  
or below the regulated value by 3%. Then, a  
proprietary “Ripple & Frequency Independent”  
algorithm synchronizes the output of the win-  
dow comparator with the peak and valley of the  
inductor current waveform. 3% low detection is  
synchronized with inductor current peak; 3%  
high detection is synchronized with the inductor  
current valley. However, in order to eliminate  
anyadditionalloops, thecurrentpeakandvalley  
are determined by the edges associated with the  
on-time in the main loop. The set pulse corre-  
sponding to the start of an on-time indicates a  
PROGRAM LOGIC TRUTH TABLE  
PROGRAM PIN  
Short to GND  
68 kto GND  
Short to VCC  
NFET OR PFET  
NFET  
MODE  
Continuous  
Discontinuous  
Continuous  
Discontinous  
NFET  
PFET  
68 kto VCC  
PFET  
The NFET/PFET programmability is for the  
high side MOSFET. When designing DC/DC  
converters, it is not always obvious when to use  
an NFET with a charge pump or a simple PFET  
for the high side MOSFET. Often, the controller  
has to be changed, making performance evalua-  
tions difficult. This difficulty is worsened by the  
limited availability of true low voltage control-  
lers. Inaddition,byalsoprogrammingthemode,  
continuousordiscontinuous,switchmodepower  
designs that are successful in bus applications  
can now find homes in portable applications.  
MAX  
DC Load  
Current  
MIN  
0A  
Output  
Voltage  
VOUT  
Secondary Loop (3% Window Comparator)  
DSP, microcontroller and microprocessor appli-  
cations have very strict supply voltage require-  
ments. In addition, the current requirements to  
these devices can change drastically. Linear  
regulators, typically the workhorse for DC/DC  
step-down, do a great job managing accuracy  
and transient response at the expense of effi-  
ciency. On the other hand, PWM switching  
regulators typically do a great job managing  
efficiency at the expense of output ripple and  
line/load step response. The trick in PWM  
controller design is to emulate the transient re-  
sponse of the linear regulator.  
.
Reset  
Main Loop  
Set  
V(VCC  
)
3% High  
Latch On  
Of course improving transient response should  
be transparent to the power supply designer.  
Very often this is not the case. Usually the very  
circuitry that improves the controllers transient  
responseadverselyinterfereswiththemainPWM  
loop or complicates the board level design of the  
power converter.  
0V  
V(VCC  
)
3% Low  
Latch On  
0V  
The SP6120HV handles line/load transient re-  
sponse in a new way. First, a window compara-  
TIME  
Date: 5/25/04  
SP6120HV Low Voltage, Synchronous Buck Controller  
© Copyright 2004 Sipex Corporation  
12  
Output Drivers  
Secondary Loop (3% Window Comparator):  
continued  
The driver stage consists of one high side, 4Ω  
driver, GH and one low side, 4, NFET driver,  
GL. As previously stated, the high side driver can  
be configured to drive a PFET or an NFET high  
side switch. The high side driver can also be  
configured as a switch node referenced driver.  
Duetovoltageconstraints,thismodeismandatory  
for 5V, single supply, high side NFET applica-  
tions. The following figure shows typical driver  
waveforms for the 5V, high side NFET design.  
current valley and the reset pulse corresponding  
to the end of an on-time indicates a current peak.  
In effect, the main loop determines the status of  
the secondary loop.  
Notice that the output voltage appears to coast  
toward the regulated value during periods where  
the main loop would be telling the drivers to  
switch. It is during this interval that the 3%  
windowcomparatorhastakencontrolawayfrom  
the main loop. The main loop regains control  
only if the output voltage crosses through its  
regulated value. Also notice where the 3% com-  
parator takes over. The output voltage is consid-  
ered “high” only if the trough of the ripple is  
above 3%. The output voltage is considered  
“low” only if the peak of the ripple is below 3%.  
By managing the secondary loop in this fashion,  
the SP6120HV can improve the transient re-  
sponse of high performance power converters  
without causing strange disturbances in low to  
moderate performance systems.  
As with all synchronous designs, care must be  
taken to ensure that the MOSFETs are properly  
chosen for non-overlap time, peak current capa-  
bility and efficiency.  
GATE DRIVER TEST CONDITONS  
5V  
90%  
GH (GL)  
FALL TIME  
2V  
10%  
5V  
90%  
RISE TIME  
2V  
GH (GL)  
10%  
Driver Logic  
Signals from the PWM latch (QPWM), Fault  
latch (FAULT), Program Logic, Zero Crossing  
Comparator, and 3% Window Comparators all  
flow into the Driver Logic. The following is a  
truthtablefordeterminingthestateoftheGHand  
GL voltages for given inputs:  
NON-OVERLAP  
V(BST)  
GH  
Voltage  
0V  
DRIVER LOGIC TRUTH TABLE  
V(VCC  
)
FAULT  
1
1
0
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
QPWM or  
3% COMP  
GL  
Voltage  
X
X
NFET/PFET  
CONT/DISC  
ZERO CROSS  
GH  
N
X
X
0
P
X
X
1
N
X
X
1
P
X
X
0
N
C
X
0
P
C
X
1
N
D
0
P
D
0
N
D
1
P
D
1
0V  
V(VCC = VIN  
)
0
1
0
1
SWN  
Voltage  
GL  
0
0
0
0
1
1
1
1
0
0
~0V  
~V(Diode) V  
The QPWM and 3% Comparators are grouped  
together because 3% Low is the same as QPWM  
= 1 and 3% High is the same as QPWM = 0.  
~2V(VIN  
)
BST  
Voltage  
~V(VIN  
)
TIME  
Date: 5/25/04  
SP6120HV Low Voltage, Synchronous Buck Controller  
© Copyright 2004 Sipex Corporation  
13  
APPLICATIONS INFORMATION  
Inductor Selection  
duce considerable ac core loss, especially when  
the inductor value is relatively low and the  
ripple current is high. Ferrite materials, on the  
other hand, are more expensive and have an  
abrupt saturation characteristic with the induc-  
tance dropping sharply when the peak design  
current is exceeded. Nevertheless, they are pre-  
ferred at high switching frequencies because  
they present very low core loss and the design  
only needs to prevent saturation. In general,  
ferrite or molypermalloy materials are better  
choice for all but the most cost sensitive appli-  
cations.  
There are many factors to consider in selecting  
the inductor including cost, efficiency, size and  
EMI. In a typical SP6120HV circuit, the induc-  
tor is chosen primarily for value, saturation  
current and DC resistance. Increasing the in-  
ductorvaluewilldecreaseoutputvoltageripple,  
but degrade transient response. Low inductor  
values provide the smallest size, but cause large  
ripplecurrents, poorefficiencyandmoreoutput  
capacitance to smooth out the larger ripple  
current.Theinductormustalsobeabletohandle  
the peak current at the switching frequency  
without saturating, and the copper resistance in  
the winding should be kept as low as possible to  
minimize resistive power loss. A good compro-  
mise between size, loss and cost is to set the  
inductor ripple current to be within 20% to 40%  
of the maximum output current.  
The power dissipated in the inductor is equal to  
the sum of the core and copper losses. To mini-  
mizecopperlosses,thewindingresistanceneeds  
to be minimized, but this usually comes at the  
expense of a larger inductor. Core losses have a  
more significant contribution at low output cur-  
rent where the copper losses are at a minimum,  
and can typically be neglected at higher output  
currentswherethecopperlossesdominate.Core  
loss information is usually available from the  
magnetic vendor.  
The switching frequency and the inductor oper-  
ating point determine the inductor value as  
follows:  
VOUT (VIN (max) VOUT  
)
L =  
VIN (max) FS Kr IOUT (max)  
Thecopperlossintheinductorcanbecalculated  
using the following equation:  
where:  
PL(Cu) = IL2(RMS) RWINDING  
FS = switching frequency  
Kr = ratio of the ac inductor ripple current to  
the maximum output current  
where IL(RMS) is the RMS inductor current that  
can be calculated as follows:  
2
The peak to peak inductor ripple current is:  
1
3
IPP  
IOUT(max)  
I
L(RMS) = IOUT(max) 1 +  
(
)
VOUT (VIN (max) VOUT  
)
IPP  
=
VIN(max) FS L  
Output Capacitor Selection  
Oncetherequiredinductorvalueisselected, the  
proper selection of core material is based on  
peak inductor current and efficiency require-  
ments.  
The core material must be large enough not to  
saturate at the peak inductor current  
The required ESR (Equivalent Series Resis-  
tance) and capacitance drive the selection of the  
type and quantity of the output capacitors. The  
ESR must be small enough that both the resis-  
tive voltage deviation due to a step change in the  
load current and the output ripple voltage do not  
exceed the tolerance limits expected on the  
output voltage. During an output load transient,  
the output capacitor must supply all the addi-  
tional current demanded by the load until the  
SP6120HV adjusts the inductor current to the  
new value. Therefore the capacitance must be  
IPP  
IPEAK = IOUT (max)  
+
2
and provide low core loss at the high switching  
frequency. Low cost powdered iron cores have  
a gradual saturation characteristic but can intro-  
Date: 5/25/04  
SP6120HV Low Voltage, Synchronous Buck Controller  
© Copyright 2004 Sipex Corporation  
14  
largeenoughsothattheoutputvoltageisheldup  
while the inductor current ramps up or down to  
the value corresponding to the new load current.  
Additionally, the ESR in the output capacitor  
causes a step in the output voltage equal to the  
ESR value multiplied by the change in load  
current. Because of the fast transient response  
and inherent 100% and 0% duty cycle capabil-  
ity provided by the SP6120HV when exposed to  
output load transient, the output capacitor is  
typically chosen for ESR, not for capacitance  
value.  
is a solid electrolytic chip capacitor that has low  
ESR and high capacitance. For the same ESR  
value, POSCAP has lower profile compared  
with tantalum capacitor.  
Input Capacitor Selection  
The input capacitor should be selected for ripple  
current rating, capacitance and voltage rating.  
The input capacitor must meet the ripple current  
requirement imposed by the switching current.  
In continuous conduction mode, the source cur-  
rent of the high-side MOSFET is approximately  
a square wave of duty cycle VOUT/VIN. Most of  
this current is supplied by the input bypass  
capacitors. The RMS value of input capacitor  
current is determined at the maximum output  
current and under the assumption that the peak  
to peak inductor ripple current is low, it is given  
by:  
The output capacitor’s ESR, combined with the  
inductor ripple current, is typically the main  
contributor to output voltage ripple. The maxi-  
mum allowable ESR required to maintain a  
specifiedoutputvoltageripplecanbecalculated  
by:  
ICIN(rms) = I  
OUT(max) D(1 - D)  
VOUT  
RESR  
IPP  
The worse case occurs when the duty cycle D is  
50% and gives an RMS current value equal to  
IOUT /2. Select input capacitors with adequate  
ripple current rating to ensure reliable opera-  
tion.  
where:  
VOUT = peak to peak output voltage ripple  
IPP = peak to peak inductor ripple current  
The power dissipated in the input capacitor is:  
The total output ripple is a combination of the  
ESR and the output capacitance value and can  
be calculated as follows:  
P
= IC2IN (rms) RESR(CIN)  
CIN  
This can become a significant part of power  
losses in a converter and hurt the overall energy  
transfer efficiency.  
2 + (IPPRESR  
)
IPP (1 – D)  
2
VOUT  
=
COUTFS  
(
)
where:  
The input voltage ripple primarily depends on  
the input capacitor ESR and capacitance. Ignor-  
ing the inductor ripple current, the input voltage  
ripple can be determined by:  
FS = switching frequency  
D = duty cycle  
COUT = output capacitance value  
I
OUT (MAX )VOUT (VIN VOUT )  
VIN = Iout(max) RESR(CIN )  
+
2
Recommended capacitors that can be used ef-  
fectively in SP6120HV applications are: low-  
ESRaluminumelectrolyticcapacitors,OS-CON  
capacitorsthatprovideaveryhighperformance/  
size ratio for electrolytic capacitors and low-  
ESR tantalum capacitors. AVX TPS series and  
KemetT510surfacemountcapacitorsarepopu-  
lar tantalum capacitors that work well in  
SP6120HV applications. POSCAP from Sanyo  
FSCINVIN  
The capacitor type suitable for the output ca-  
pacitors can also be used for the input capaci-  
tors. However, exercise extra caution when tan-  
talum capacitors are considered. Tantalum ca-  
pacitorsareknownforcatastrophicfailurewhen  
exposed to surge current, and input capacitors  
Date: 5/25/04  
SP6120HV Low Voltage, Synchronous Buck Controller  
© Copyright 2004 Sipex Corporation  
15  
are prone to such surge current when power  
supplies are connected ‘live’ to low impedance  
powersources.Certaintantalumcapacitors,such  
as AVX TPS series, are surge tested. For ge-  
neric tantalum capacitors, use 2:1 voltage derat-  
ing to protect the input capacitors from surge  
fall-out.  
synchronous buck converters of efficiency over  
90%, allow no more than 4% power losses for  
high or low side MOSFETs. For input voltages  
of 3.3V and 5V, conduction losses often domi-  
nate switching losses. Therefore, lowering the  
RDS(ON) of the MOSFETs always improves  
efficiency even though it gives rise to higher  
switching losses due to increased Crss.  
MOSFET Selection  
Top and bottom MOSFETs experience unequal  
conductionlossesiftheirontimeisunequal. For  
applicationsrunningatlargeorsmalldutycycle,  
it makes sense to use different top and bottom  
MOSFETs. Alternatively, parallel multiple  
MOSFETs to conduct large duty factor.  
The losses associated with MOSFETs can be  
divided into conduction and switching losses.  
Conduction losses are related to the on resis-  
tance of MOSFETs, and increase with the load  
current. Switching losses occur on each on/off  
transition when the MOSFETs experience both  
high current and voltage. Since the bottom  
MOSFET switches current from/to a paralleled  
diode (either its own body diode or a Schottky  
diode), the voltage across the MOSFET is no  
more than 1V during switching transition. As a  
result, its switching losses are negligible. The  
switching losses are difficult to quantify due to  
allthevariablesaffectingturnon/offtime.How-  
ever, the following equation provides an ap-  
proximation on the switching losses associated  
with the top MOSFET driven by SP6120HV.  
R
DS(ON) varies greatly with the gate driver volt-  
age.TheMOSFETvendorsoftenspecifyRDS(ON)  
on multiple gate to source voltages (VGS), as  
well as provide typical curve of RDS(ON) versus  
VGS. For 5V input, use the RDS(ON) specified at  
4.5V VGS. At the time of this publication, ven-  
dors, such as Fairchild, Siliconix and Interna-  
tional Rectifier, have started to specify RDS(ON)  
atVGS lessthan3V. Thishasprovidednecessary  
data for designs in which these MOSFETs are  
driven with 3.3V and made it possible to use  
SP6120HV in 3.3V only applications.  
PSH (max) =12CrssVIN (max)IOUT (max)FS  
where  
Thermal calculation must be conducted to en-  
sure the MOSFET can handle the maximum  
load current. The junction temperature of the  
MOSFET, determined as follows, must stay  
below the maximum rating.  
Crss = reverse transfer capacitance of the top  
MOSFET  
Switching losses need to be taken into account  
for high switching frequency, since they are  
directly proportional to switching frequency.  
The conduction losses associated with top and  
bottom MOSFETs are determined by:  
PMOSFET (max)  
TJ(max) =TA(max)  
+
Rθ  
JA  
P
CH (max) = RDS (ON )IOUT (max)2 D  
where  
= RDS(ON )IOUT (max)2(1D)  
TA(max) = maximum ambient temperature  
PMOSFET(max) = maximum power dissipa-  
tion of the MOSFET  
P
CL(max)  
where  
RΘJA = junction to ambient thermal resistance.  
PCH(max) = conduction losses of the high side  
MOSFET  
RΘJA of the device depends greatly on the board  
layout, as well as device package. Significant  
thermal improvement can be achieved in the  
maximum power dissipation through the proper  
design of copper mounting pads on the circuit  
board. For example, in a SO-8 package, placing  
PCL(max) = conduction losses of the low side  
MOSFET  
RDS(ON) = drain to source on resistance.  
The total power losses of the top MOSFET are  
the sum of switching and conduction losses. For  
Date: 5/25/04  
SP6120HV Low Voltage, Synchronous Buck Controller  
© Copyright 2004 Sipex Corporation  
16  
Loop Compensation Design  
two 0.04 square inches copper pad directly  
under the package, without occupying addi-  
tional board space, can increase the maximum  
power from approximately 1 to 1.2W. For DPAK  
package, enlarging the tap mounting pad to 1 square  
inches reduces the RΘJA from 96°C/W to 40°C/W.  
The goal of loop compensation is to manipulate  
loopfrequencyresponsesuchthatitsgaincrosses  
over0dbataslopeof20db/dec.TheSP6120HV  
has a transconductance error amplifier and re-  
quires the compensation network to be con-  
nected between the COMP pin and ground, as  
shown in Figure 18.  
Schottky Diode Selection  
When paralleled with the bottom MOSFET, an  
optional Schottky diode can improve efficiency  
and reduce noises. Without this Schottky diode,  
the body diode of the bottom MOSFET con-  
ducts the current during the non-overlap time  
when both MOSFETs are turned off. Unfortu-  
nately, the body diode has high forward voltage  
and reverse recovery problem. The reverse re-  
covery of the body diode causes additional  
switching noises when the diode turns off. The  
Schottky diode alleviates these noises and addi-  
tionally improves efficiency thanks to its low  
forward voltage. The reverse voltage across the  
diode is equal to input voltage, and the diode  
must be able to handle the peak current equal to  
the maximum load current.  
The first step of compensation design is to pick  
the loop crossover frequency. High crossover  
frequencyisdesirableforfasttransientresponse,  
but often jeopardize the system stability. Since  
the SP6120HV is equipped with 3% window  
comparator that takes over the control loop on  
transient, the crossover frequency can be se-  
lected primarily to the satisfaction of system  
stability. Crossover frequency should be higher  
than the ESR zero but less than 1/5 of the  
switching frequency. The ESR zero is contrib-  
uted by the ESR associated with the output  
capacitors and can be determined by:  
1
fZ(ESR)  
=
2πCOUTRESR  
Crossover frequency of 20kHz is a sound first  
try if low ESR tantalum capacitors or poscaps  
are used at the output. The next step is to calcu-  
late the complex conjugate poles contributed by  
the LC output filter,  
The power dissipation of the Schottky diode is  
determined by  
P
DIODE = 2VFIOUTTNOLFS  
where  
1
fP(LC)  
=
TNOL = non-overlap time between GH and GL.  
2π√ LCOUT  
VF = forward voltage of the Schottky diode.  
The open loop gain of the whole system can be  
divided into the gain of the error amplifier,  
PWM modulator, buck converter, and feedback  
resistor divider. In order to crossover at the  
selected frequency fco, the gain of the error  
amplifier has to compensate for the attenuation  
caused by the rest of the loop at this frequency.  
In the RC network shown in Figure 18, the  
product of R1 and the error amplifier  
transconductance determines this gain. There-  
fore, R1 can be determined from the following  
equation that takes into account the typical error  
amplifier transconductance, reference voltage  
and PWM ramp built into the SP6120HV.  
®®  
COMP  
R1  
C2  
SP6120B  
C1  
Figure 18. The RC network connected to the COMP pin  
provides a pole and a zero to control loop.  
1300VOUT fCO fZ(ESR)  
R1 =  
2
VIN fP(LC)  
Date: 5/25/04  
SP6120HV Low Voltage, Synchronous Buck Controller  
© Copyright 2004 Sipex Corporation  
17  
In Figure 18, R1 and C1 provides a zero fZ1  
whichneedstobeplacedatorbelowfP(LC). If fZ1  
is made equal to fP(LC) for convenience, the  
value of C1 can be calculated as  
Current Sense  
The SP6120HV allows sensing current using  
the inductor, PCB trace or current-sense resis-  
tor. Inductor-sense utilizes the voltage drop  
across the ESR of the inductor, while PCB trace  
and  
current-sense resistor introduce additional re-  
sistance in series with the inductor. The resis-  
tance of the sense element determines the  
overcurrent protection threshold as follows,  
1
C1 =  
2πfP(LC)R1  
The optional C2 generates a pole fP1 with R1 to  
cut down high frequency noise for reliable op-  
eration. This pole should be placed one decade  
higher than the crossover frequency to avoid  
erosion of phase margin. Therefore, the value of  
the C2 can be derived from  
43mV  
RSEN  
ILIM  
=
1
RSEN = current-sense resistance which can be  
implemented as ESR of the inductor, trace or  
discrete resistor.  
C2 =  
20πfCOR1  
Figure 19 illustrates the overall loop frequency  
response and frequency of each pole and zero.  
Tofine-tunethecompensation, itisnecessaryto  
physically measure the frequency response us-  
ing a network analyzer.  
Themaximumpowerdissipationonthecurrent-  
sense element is:  
2
P
= IOUT(max) RSEN  
SEN  
For the inductor-sense scheme shown in the  
application circuit, RS and CS are used to repli-  
catethesignalacrosstheESRoftheinductor.RS  
and CS can be looked at as a low pass filter  
whose output represents the DC differential  
voltage between the switch node and the output.  
At steady state, this voltage happens to be the  
output current times the ESR of the inductor. In  
addition, if the following relationship is satisfied,  
Gain  
-20db/dec  
-40db/dec  
Loop  
L
-20db/dec  
= RSCS  
f
ESR  
the output of the RsCs filter represents the exact  
voltage across the ESR, including the ripple.  
Since the SP6120HV’s hiccup overcurrent pro-  
tection scheme is intended to safeguard sus-  
tained overload conditions, the DC portion of  
the current signal is more of interest. Therefore,  
designing the RSCS time constant higher than L/  
ESR provides reliable current sense against any  
premature triggering due to noise or any tran-  
sientconditions. PickRsbetween10kand100k,  
and Cs can be determined by:  
-20db/dec  
-20db/dec  
Error Amplifier  
f
f
f
f
f
CO  
f
P1  
Z1 P(LC)  
Z(ESR)  
Figure 19. Frequency response of a stable system and its  
error amplifier.  
L
1
CS = 2  
ESR RS  
HerethetimeconstantofRSCS istwicethevalue  
of L/ESR.  
In some applications, it may be desirable to  
extend the current sense capability of a given  
Date: 5/25/04  
SP6120HV Low Voltage, Synchronous Buck Controller  
© Copyright 2004 Sipex Corporation  
18  
RSEN element (usually the inductor ESR) be-  
yond the limit set by the 43mV threshold.  
ISP  
ISN  
R
S2  
A straight forward way to do this would be to  
add a resistor RS2 in parallel with CS, creating a  
voltage divider with RS. This changes the rela-  
tionship with RS and CS to be  
R
S
C
S
L
SWN  
V
OUT  
ESR  
L
1
CS = 2  
ESR RS //RS2  
Figure 20: Current Sensing  
Using a voltage divider across the inductor, the  
new relationship becomes:  
Output Voltage Programming  
As shown in Figure 21(A), the voltage divider  
connecting to the VFB pin programs the output  
voltage according to  
43mV RS + RS2  
ILIM  
=
ESR  
RS2  
To calculate RS2, the formula becomes  
R1  
R2  
VOUT = 1.25( 1 +  
)
ILIMESR  
RS2 = RS  
– 1  
(
/
)
43mV  
where 1.25V is the internal reference voltage.  
SelectR2intherangeof10kto100k, andR1can  
be calculated using  
R2(VOUT – 1.25)  
R1 =  
1.25  
For output voltage less than 1.25V, a simple  
circuit shown in Figure 21(B) can be used in  
which VREF is an external voltage reference  
VOUT > 1.25V  
V
OUT  
< 1.25V  
greater than 1.25V. For sVimplicity, use the same  
REF  
resistor value for R1 and R2, then R3 is deter-  
mined as follows,  
R3  
®®  
®®  
R1  
R1  
(VREF – 1.25)R1  
2.5 – VOUT  
R3 =  
VFB  
VFB  
SP6120B  
SP6120B  
R2  
R2  
A
B
Figures 21(A), a voltage divider connected to the VFB pin programs the output voltageand 21(B), a simple circuit using  
one external voltage reference programs the output voltages to less than 1.25V.  
Date: 5/25/04  
SP6120HV Low Voltage, Synchronous Buck Controller  
© Copyright 2004 Sipex Corporation  
19  
Layout Guideline  
5. Connect the PGND pin close to the source of  
the bottom MOSFET, and the SWN pin to the  
source of the top MOSFET. Minimize the  
trace between GH/GL and the gates of the  
MOSFETs. All of these requirements reduce  
the impedance driving the MOSFETs. This is  
especiallyimportantforthebottomMOSFET  
that tends to turn on through its miller capaci-  
tor when the switch node swings high.  
PCB layout plays a critical role in proper func-  
tionoftheconvertersandEMIcontrol. Inswitch  
mode power supplies, loops carrying high di/dt  
give rise to EMI and ground bounces. The goal  
of layout optimization is to identify these loops  
and minimize them. It is also crucial on how to  
connect the controller ground such that its op-  
eration is not affected by noise. The following  
guideline should be followed to ensure proper  
operation.  
6. Minimize the loop composed of input capaci-  
tors, top/bottom MOSFETs and Schottky di-  
ode, This loop carries high di/dt current. Also  
increase the trace width to reduce copper  
losses.  
1. A ground plane is recommended for mini-  
mizing noises, copper losses and maximizing  
heat dissipation.  
2. Connectthegroundoffeedbackdivider,com-  
pensationcomponents, oscillatorresistorand  
soft-start capacitor to the GND pin of the IC.  
Then connect this pin as close as possible to  
the ground of the output capacitor.  
7. Maximize the trace width of the loop con-  
necting the inductor, output capacitors,  
Schottky diode and bottom MOSFET.  
3. The VCC bypass capacitor should be right  
next to the Vcc and GND pin.  
4. The traces connecting to feedback resistor  
andcurrentsensecomponentsshouldbeshort  
andfarawayfromtheswitchnode,andswitch-  
ing components.  
Date: 5/25/04  
SP6120HV Low Voltage, Synchronous Buck Controller  
© Copyright 2004 Sipex Corporation  
20  
PACKAGE: PLASTIC THIN SMALL  
OUTLINE  
(TSSOP)  
E2  
E1  
D
A
Ø
A1  
L
e
B
DIMENSIONS  
in inches (mm)  
16–PIN  
Minimum/Maximum  
- /0.043  
(- /1.10)  
A
0.002/0.006  
(0.05/0.15)  
A1  
B
0.007/0.012  
(0.19/0.30)  
0.193/0.201  
(4.90/5.10)  
D
0.169/0.177  
(4.30/4.50)  
E1  
e
0.026 BSC  
(0.65 BSC)  
0.126 BSC  
(3.20 BSC)  
E2  
L
0.020/0.030  
(0.50/0.75)  
0°/8°  
Ø
Date: 5/25/04  
SP6120HV Low Voltage, Synchronous Buck Controller  
© Copyright 2004 Sipex Corporation  
21  
ORDERING INFORMATION  
Operating Temperature Range  
Model  
Package Type  
SP6120HVCY .......................................... 0˚C to +70˚C ........................................ 16-Pin TSSOP  
SP6120HVCY/TR .................................... 0˚C to +70˚C ........................................ 16-Pin TSSOP  
SP6120HVEY ......................................... -40˚C to +85˚C ...................................... 16-Pin TSSOP  
SP6120HVEY/TR.................................... -40˚C to +85˚C ...................................... 16-Pin TSSOP  
Available in lead free packaging. To order add "-L" suffix to part number.  
Example: SP6120HVEY/TR = standard; SP6120HVEY-L/TR = lead free  
/TR = Tape and Reel  
Pack quantity is 1,500 for tsSOP.  
Corporation  
SIGNALPROCESSINGEXCELLENCE  
Sipex Corporation  
Headquarters and  
Sales Office  
22 Linnell Circle  
Billerica, MA 01821  
TEL: (978) 667-8700  
FAX: (978) 670-9001  
e-mail: sales@sipex.com  
Sales Office  
233 South Hillview Drive  
Milpitas, CA 95035  
TEL: (408) 934-7500  
FAX: (408) 935-7600  
Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the  
application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others.  
Date: 5/25/04  
SP6120HV Low Voltage, Synchronous Buck Controller  
© Copyright 2004 Sipex Corporation  
22  

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