GP1A044RCKLF [SHARP]
Optoelectronic Device,;
| 型号： | GP1A044RCKLF |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Optoelectronic Device, |
| 文件： | 总10页 (文件大小：137K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
GP1A044RxKLF Series
*
OPIC Output,
GP1A044RxKLF
Series
Transmissive Photointerrupter
with Encoder function
Description
Agency approvals/Compliance
■
■
GP1A044RBKLF Series are transmissive photointer-
1. Compliant with RoHS directive
rupter, with optical encoder function used for determining
rotational/linear direction and speed. Must be used in
conjunction with a linear scale or code wheel. The en-
coder is designed to output 2 pulses whose phase differs
by 90˚.
Applications
■
1. General purpose detection of motion either linear or
rotary
2. Example : Printer paper feed roller or Printer head
Mist proof function with new design lens.
Features
■
1. Transmissive with encoder function
2. Highlights :
• High resolution available
• Rotary or Linear functionality
3. Key Parameters :
• Resolution : 150LPI (GP1A044RBKLF),
180LPI (GP1A044RCKLF)
• Type : Digital output
• Frequency : 20 kHz (MAX.)
• Gap Width : 0.5mm
• Package : 17.9 12.2 7.5mm
×
×
4. Lead free and RoHS directive compliant
* "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-
processing
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D3-A05801EN
Date Oct. 3. 2005
© SHARP Corporation
1
GP1A044RxKLF Series
Internal Connection Diagram
■
1
2
Anode
Cathode
6
5
10kΩ
PD4
PD2
PD3
PD1
3 GND
4 VOB
−
+
1
2
VOA
VCC
5
6
4
10kΩ
+
−
3
VCC=2.7 to 5.5V
(Unit : mm)
Outline Dimensions
■
6.4
1.4±0.2
Sensor center
4.3
R2.1
R1.1
(2.4)
11.1±0.2
1.1
8.1±0.2
6.5
0.75±0.15 3.9
R1
041
2-φ2±0.05
(0.55)
5.4
Date code
1
6
5
4
3
2
• Unspecified tolerance : ±0.2mm.
( ) : Reference dimensions.
•
• The dimensions indicated by refer
to those measured from the lead
base.
◆
0.5±0.2
5.4
±0.3
◆
8.25
±0.3
◆
10.25
Product mass : approx. 0.77g
Solder material : SnAgCu dipping
Sheet No.: D3-A05801EN
2
GP1A044RxKLF Series
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D.
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
:
Mark
Month
Mark
0
1
2
3
4
5
6
7
8
9
0
:
1
2
1
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
10
11
12
X
Y
Z
repeats in a 10 year cycle
Country of origin
China
Sheet No.: D3-A05801EN
3
GP1A044RxKLF Series
Absolute Maximum Ratings
■
(T 25˚C)
=
a
Parameter
1Forward current
Reverse voltage
Supply voltage
Symbol
Rating
Unit
mA
V
∗
IF
30
4
Input
VR
VCC
IOL
PO
7
V
Output Low level output current
8
mA
mW
˚C
∗
1Power dissipation
150
Operating temperature
Storage temperature
2Soldering temperature
Topr
Tstg
Tsol
0 to 60
+
25 to 70
˚C
−
+
∗
260
˚C
∗1 Refer to Fig.2, Fig.3
∗2 For MAX. 5s
Electro-optical Characteristics
■
(T 25˚C)
=
a
Parameter
Symbol
VF
Condition
15mA
MIN.
−
TYP. MAX.
Unit
V
Forward voltage
Input
I
1.35
−
1.5
100
5.5
0.4
−
=
F
Reverse current
IR
VR 1V
A
μ
=
−
Operating supply voltage range
Low level output voltage
VCC
VOL
VOH
2.7
−
5
V
−
VCC 3.3V, I 15mA, I 8mA
0.1
3.2
V
V
=
=
=
OL
F
Output
High level output voltage
Supply current
Duty
VCC 3.3V, I 15mA
2.4
=
=
F
VCC 5V, I 15mA
=
=
F
ICC
2
5
mA
−
Phase A and B both at low level
DA/DB
θAB1 to 4
tr
35
45
−
50
90
1
65
135
2
%
∗
3
Transfer Phase difference
˚
VCC 3.3V, I 15mA, f 10kHz
=
=
F
=
charac-
Rise time
Fall time
Response time
teristics
s
μ
tf
1
2
−
Response frequency
fmax
VCC 3.3V, I 15mA
20
kHz
=
=
−
−
F
∗3 The test condition is according to Fig.4. Transfer characteristics value does not include any error of linear scale.
Sheet No.: D3-A05801EN
4
GP1A044RxKLF Series
Fig.1 Output Waveform
tAP
tAH
tAH
___
DA=
DB=
×100
×100
A Output
θAB1
θAB4
tAP
θAB2
θAB3
tBH
___
B Output
tBH
tBP
tBP
Scale moving direction is shown in the measuring condition (Refer to Fig.4).
90% 90%
10% 10%
tr
A, B Output
tf
Fig.2 Forward Current vs.
Ambient Temperature
100
Fig.3 Output Power Dissipation vs.
Ambient Temperature
150
80
60
50
40
30
100
80
50
20
15
0
0
−10
0
2025
40
60 70 80
100
−10
0
2025
40
60 70 80
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (C)
Sheet No.: D3-A05801EN
5
GP1A044RxKLF Series
Fig.4 Measuring Condition
(Unit : mm)
Slit pattern surface face to detector side
(3)
Optical axis
(2.4)
1.4MAX. Slit pattern end
3.4MIN. Slit pattern end
*1 Scale position tolerance in Z direction is less than 0.5mm
*2 Scale moving direction
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D3-A05801EN
6
GP1A044RxKLF Series
Design Considerations
■
●
Design guide
1) It is recommended that this product be used under the condition of typical IF 15mA for which it is
=
designed.
2) In order to stabilize power supply line, connect a by-pass capacitor of more than 0.01 F between VCC and
μ
GND near the device.
3) When using this product in combination with linear scale, please set them up so that the scale face should
not touch this product.
4) OPIC chip due to micro design is easily affected by the Electro static discharge. At operating, in order to
protect the destruction and the defect of characteristics by Electro static discharge, please take a general
countermeasure of the Electro static discharge.
This product is not designed against irradiation and incorporates non-coherent IRED.
●
Parts
This product is assembled using the below parts.
[Using a silicon photodiode as light detecting portion, and a bipolar IC as signal processing circuit]
• Photodetector (qty. : 1)
Maximum Sensitivity
wavelength (nm)
Sensitivity
wavelength (nm)
Category
Response time (μs)
Photodiode
780
400 to 1 200
50
• Photo emitter (qty. : 1)
Maximum light emitting
Category
Material
GaAlAs
wavelength (nm)
Infrared emitting diode
(non-coherent)
850
• Material
Holder
Bottom cover
Lens holder
Lead frame plating
SnAgCu dipping
Black polycarbonate resin
Black polycarbonate resin
Transparent polycarbonate resin
• Others
Laser generator is not used.
Sheet No.: D3-A05801EN
7
GP1A044RxKLF Series
Manufacturing Guidelines
■
●
Soldering Method
Flow Soldering:
Soldering should be completed below 260˚C and within 5 s.
Please solder within one time.
Soldering area is 1mm or more away from the bottom of housing.
Please take care not to let any extcrhal force exert on lead pins.
Please don't do soldering with preheating, and please don't do soldering by reflow.
Lead pin
Lead terminals of this product are tin copper alloy plated. Before usage, please evaluate solderability with
actual conditions and confirm. And the uniformity in color for the lead terminals are not specified.
Other notice
Please test the soldering method in actual condition and make sure the soldering works fine, since
the impact on the junction between the device and PCB varies depending on the tooling and soldering
conditions.
●
●
Cleaning instructions
The lens part of this product is an optical component built with the resin.
Therefore, please never cleanse this product by the cleaning agent.
When necessary, dust and stain shall clean by air-blow.
Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Sheet No.: D3-A05801EN
8
GP1A044RxKLF Series
Package specification
■
Package materials
Tray : Polystyrene
Pad : Polyethylene
Wrapping pad : Corrugated fiberboard
Packing case : Corrugated fiberboard
Package method
200 pcs of products shall be packaged in a tray. (The storage method is shown in below figure.) The pad is
put on top of tray, and These 10 tray are heaped up.
After these trays are wrapped into one by wrapping pad, they shall be put in the packing case. (1 packing
contains 2 000 pcs).
Packing composition
Tray with product
(10 trays in case)
Wrapping
pad
Pad
(10 pads
in case)
Packing case
Product
Tray
Sheet No.: D3-A05801EN
9
GP1A044RxKLF Series
Important Notices
■
· The circuit application examples in this publication
are provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related
to any intellectual property right of a third party resulting
from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials, structure,
and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· Contact and consult with a SHARP representative
if there are any questions about the contents of this
publication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
Sheet No.: D3-A05801EN
[H183]
10
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