GM5ZR96270A [SHARP]
Single Color LED, Red, 2.4mm, ROHS COMPLIANT PACKAGE-2;
| 型号： | GM5ZR96270A |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Single Color LED, Red, 2.4mm, ROHS COMPLIANT PACKAGE-2 光电 |
| 文件： | 总13页 (文件大小：621K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
GM5ZR96270A
Light Emitting Diode
GM5ZR96270A
■ Features
■ Agency Approvals/Compliance
1. High brightness (600 mcd @ IF = 20 mA)
2. Red Color, from AlGaInP/GaP LED chip
1. RoHS compliant
■ Applications
1. General indication
2. Office automation/computers
3. Measuring equipment
4. Audio visual equipment
5. Home appliances
6. Telecommunications equipment
7. Tooling machines/Factory automation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: DG-072011
Date: February 20, 2007
©SHARP Corporation
GM5ZR96270A
■ External Dimensions
A
B
3.5
3.2
(2.4)
C
1
2
Polarity Mark
D
Equivalent Circuit
Tc
1
2
1
2
Cathode
Anode
Pin Arrangement
No.
1
Name
Anode
2
Cathode
(1.9)
NOTES:
1. Units: mm
2. Unspecified tolerence: 0.3 mm
3. ( ): Reference dimensions
4. Case temperature (Tc) measurement point
Sheet No.: DG-072011
2
GM5ZR96270A
■ Absolute Maximum Ratings
(Tc = 25°C)
Parameter
Power dissipation
Symbol
P
Rating
Unit
mW
mA
78
Forward current
IF
30
Peak pulsed forward current *1
IFM
100
mA
DC
0.6
2.0
mA/°C
mA/°C
V
Forward current derating factor
Pulse
VR
Reverse voltage
5
Operating temperature *2
Storage temperature
Tc
-40 to +100
-40 to +100
295
°C
Tstg
Tsol
°C
Soldering temperature *3
°C
1 Duty ratio = 1/10, Pulse width = 0.1 ms
2 Case temperature (See Outline Dimensions on page 2)
3 Each terminal must be soldered with a 30 W soldering iron within 3 seconds under 295°C. For Reflow Soldering information, see Fig. 13.
4 Operating current values here follow the derating curves shown in Fig. 1 through Fig. 3.
*
*
*
*
*
5 This device uses the leads for heat sinking, therefore the Operating Temperature range is prescribed by Tc.
■ Electro-optical Characteristics
(Tc = 25°C)
Unit
V
Parameter
Forward voltage
Symbol
Conditions
IF = 20 mA
VR = 5 V
MIN.
–
TYP.
2.2
600
624
–
MAX.
2.6
*3
VF
IV
Luminous intensity *1
Dominant wavelength *2
Reverse current
*3
*4
–
mcd
nm
λd
IR
*4
20
µA
1 Measured by EG&G Model 550 (Radiometer/Photometer) after 20 ms drive (Tolerance: 15%)
2 Measured by Ohtsuka Electronics Model MCPD-2000 after 20 ms drive (Tolerance: x, y: 0.02)
3 See Luminous Rank table on page 8.
*
*
*
*
4 See Dominant Wavelength table on page 8.
Sheet No.: DG-072011
3
GM5ZR96270A
■ Derating Curves
■ Characteristic Diagrams (TYP.*)
*Characteristics data are typical data and are not guaranteed data.
Fig. 1 Forward Current vs.
Fig. 4 Relative Luminous Intensity vs.
Forward Current
Case Temperature
70
(Tc = 25°C)
1000
60
50
40
30
20
10
0
100
10
1
-40
-20
0
20
40
60
80 100
0.1
1
10
100
Case Temperature Tc (°C)
Forward Current IF (mA)
Fig. 2 Peak Forward Current vs. Duty Ratio
Fig. 5 Forward Current vs. Forward Voltage
(Tc = 25°C)
120
100
100
80
10
60
40
20
0
1
1/100
1/10
1
Duty Ratio
0.1
1.4
1.6
1.8
2.0
2.2
2.4
Forward Voltage VF (V)
Fig. 3 Peak Forward Current vs.
Case Temperature
Fig. 6 Relative Luminous Intensity vs.
Case Temperature
120
100
80
60
40
20
0
(IF = 20 mA)
1000
100
-40
-20
0
20
40
60
80
100
Case Temperature Tc (°C)
10
-40
-20
0
20
40
60
80
100
Case Temperature Tc (°C)
Sheet No.: DG-072011
4
GM5ZR96270A
■ Tape Specifications
Fig. 7 Tape Shape and Dimensions
P0
A
t1
D0
Cathode
P2
t3
Anode
t2
P1
■ Tape Dimension Specifications
Dimension
(mm)
Parameter
Symbol
Remarks
Vertical
Horizontal
Pitch
A
B
3.0
3.7
4.0
1.5
4.0
1.75
2.0
3.5
5.4
0.1
8.0
0.3
2.6
Dimension excludes corner R at the bottom inside
Concave square hole for
parts insertion
P1
D0
P0
E
Diameter
Pitch
Round sprocket hole
Accumulated error 0.5 mm/10 pitch
Position
Vertical
Horizontal
Width
Distance between the edge of the tape and center of the hole
P2
F
Distance between center line of the concave square hole and
round sprocket hole
Center to center distance
Cover tape
W1
t3
Thickness
Width
W0
t1
Carrier tape
Thickness
Thickness of entire unit
t2
With cover tape and carrier tape combined
Sheet No.: DG-072011
5
GM5ZR96270A
■ Reel Specifications
Fig. 8 Reel Shape and Dimensions
0.8
0.6
0.4
0.2
E
U
C
SHARP CORPORATION
PART No.
QUANTITY
.16ꢀ0Qꢁ
ޓޓޓ
ꢀꢀ4#0-ꢀޓ
ޓ
ޛޓޓ
'+#,ꢀ%ꢂꢃޜ
/#&'ꢀ+0ޓ
2*+.+22+0'5 Label
t
W
■ Reel Dimension Specifications
Parameter
Diameter
Symbol Dimension (mm)
Remarks
A
t
φ180
1.3
9.5
φ60
φ13
2.0
4
Flange Thickness
Inner space direction
W
B
C
E
U
Dimension of shaft core
External diameter
Spindle hole diameter
Key slit width
Hub
Key slit depth
*1 Label on side of flange: part name, quantity, lot number.
*2 Material: described on flange.
Sheet No.: DG-072011
6
GM5ZR96270A
■ Taping Specifications
1. Leader tape standard: JIS C0806
Fig. 9 Leader Tape
Pull out
Beginning
End
Empty
Stuffed
Leading
10 pitch or more
100 pitch or more
2. Cover tape peel resistance: F = 0.1 to 1.0 N (θ = 10° or less). See Fig. 10.
Fig. 10 Tape Separation
F
Cover tape
θ = 0 ~ 10°
Tape speed: 5 mm/s
Forward
Carrier tape
3. Tape bending resistance: Cover tape will remain in place on radii of 30 mm or more. Under 30 mm radii,
the cover may separate.
4. Joints are not allowed in the cover tape.
5. Parts are packed with an average quantity of 2000 pieces per reel.
6. Product mass: 30 mg (approximately)
7. Sharp guarantees the following:
a. No contiguous empty spaces in the tape
b. Missing parts will not make up more than 0.1% of the total quantity.
c. Parts will be easily removed from the packing.
8. Parts will not stick to the cover tape as it is peeled.
Sheet No.: DG-072011
7
GM5ZR96270A
■ Label and Marking Information
Fig. 11 Label Contents
SHARP CORPORATION
PART No.
GM5ZR96270A
φ Part number
Quantity
φ
QUANTITY
2000
φ EIAJ C-3 Bar code
EIAJ C-3 Bar code
φ
LOT No. MI07A01 RANK
ޓ
ޛޓޓ
EIAJ C-3ޜ
MADE INޓ
PHILIPPINES Indication (example) of lot number and rank
Indication (example) of production country
φ
φ
LOT Number
0 7
0 1
5
I
A
4
M
1
2
3
Production plant code (alphabetically)
1
2 Production lot (single or double digits)
3 Production year (the last two digits of the year)
4 Production month
(to be indicated alphabetically with January corresponding to A)
5
Production date (01 ~ 31)
Rank
:
: Luminous intensity rank
: Dominant Wavelength rank
■ Luminous Intensity Rank Table (Tc = 25°C)
Rank Luminous Intensity Unit
Condition
K
L
383 ~ 746
552 ~ 1075
795 ~ 1548
mcd
IF = 20 mA
M
1 Parts are marked to the highest rank of their tested luminosity level.
2 Quantity of each rank is decided by Sharp.
*
*
■ Dominant Wavelength Rank Table (Tc = 25°C)
Rank Luminous Intensity Unit
Condition
a
b
c
d
616.5 ~ 621.0
620.0 ~ 624.5
623.5 ~ 628.0
627.0 ~ 631.5
nm
IF = 20 mA
1 Ranks in this table are derived using a typical device, driven as noted here; and therefore are not guaranteed data.
2 Quantity of each rank is decided by Sharp.
*
*
Sheet No.: DG-072011
8
GM5ZR96270A
■ Design Notes
1. This product is not designed to resist electromagnetic and ionized-particle radiation. Moreover, it is not designed
to directly resist excessive moisture, such as dew or condensation; or corrosive (salt) air or corrosive gases,
such as Cl, H2S, NH3, SO2, NOX.
2. Do not allow the circuit design to apply any reverse voltage to the LEDs.
3. This part can be easily damaged by external stress. Make sure they are not mechanically stressed during or
after assembly.
4. This part has a very high light output. Looking directly at it during full power output can cause injury.
5. Sharp recommends taking proper personal and environmental static control precautions when handling this part.
6. Materials of high thermal conductivity are incorporated in this device to allow generated heat to be effectively
transferred from it to the circuit board. For best reliability, Sharp recommends against locating other sources of
heat near the LED, and to design the circuit board in such a way that heat can easily escape from the circuit
board. Sharp also recommends designing the circuit board so that the part’s case temperature is always kept
under 100°C (when the LED is turned on) including self-heating.
7. Sharp recommends handling these parts in a clean, non-dusty environment since surface dust may be difficult
to remove and can affect the optical performance of the part.
8. Sharp recommends confirming the part’s performance, reliability, and resistance to any of these conditions, if it
is to be used in any of these environments:
• Direct sunlight, outdoor exposure, dusty conditions
• In water, oil, medical fluids, and organic solvents
• Excessive moisture, such as dew or condensation
• Corrosive (salt) air or corrosive gases, such as Cl, H2S, NH3, SO2, NOX
Sheet No.: DG-072011
9
GM5ZR96270A
■ Manufacturing Guidelines
● Storage and Handling
1. Moisture-proofing: These parts are shipped in vacuum-sealed packaging to keep them dry and ready for use.
See Fig. 12.
Fig. 12 Factory Moisture-proof Packaging
Label
Aluminum
package
Silica gel
Reel
Label
2. Store these parts between 5°C and 30°C, at a relative humidity of less than 60%.
3. After breaking the package seal, maintain the environment within 5°C to 30°C, at a relative humidity of less than
60%. Solder the parts within 3 days.
4. If the parts will not be used immediately, repack them in a dry box, or re-vacuum-seal them with a desiccant.
5. If the parts are exposed to air for more than 3 days, or if the silica gel telltale indicates moisture contamination,
bake the parts:
• When in the tape carrier, bake them at a temperature of 95°C to 100°C, for 16 to 24 hours.
• When loose (in a metal tray) or on a PCB, bake them at a temperature of 110°C to 120°C, for 8 to 12 hours.
• Note that the reels may become distorted if they are in a stack when baking. Confirm that the parts have cooled
to room temperature after baking.
● Cleaning Instructions
1. Sharp does not recommend cleaning printed circuit boards containing this device. Process chemicals will affect
the structural and optical characteristics of this device.
2. Sharp recommends the use of solder paste that does not require cleaning.
3. Avoid cleaning this part ultrasonically. If ultrasonic cleaning is unavoidable, verify the process before use, as the
size of the bath, its duration, ultrasonic intensity, and PCB size and shape can affect the process. Recom-
mended solvents are water or isopropyl alcohol.
Sheet No.: DG-072011
10
GM5ZR96270A
● Soldering Instructions
1. When soldering with reflow methods, Sharp recommends following the soldering profile in Fig. 13.
2. Electrodes on this part are silver-plated. If the part is exposed to a corrosive environment, the plating may be
damaged, thereby affecting solderability.
3. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-
age due to the PCB flexing during the soldering process.
4. Both PCB design and solder reflow machine specifications will affect the amount of heat conducted into this part
during the production process. Sharp recommends verifying the process before production begins.
5. When using backside dip methods, Sharp recommends giving careful consideration to the process, as board
warping from heat may occur and the heat itself may be conducted into the package. Reflow after dip is recom-
mended, but they can be performed in the opposite order; keep the interval between the two processes as short
as possible.
6. When using a second reflow, the second process should be carried out as soon as possible after the first, unless
there is a water-wash or solvent-wash process. Then the parts must be baked as specified in Storage and Han-
dling before performing the second reflow.
7. The Reflow Profile shown in Fig. 13 should be considered as a set of maximum parameters. Since this part uses
the leads for heatsinking, the peak temperature should be kept as cool as possible and the cooldown period
lengthened as much as possible. Thermal conduction into the LED will be affected by the performance of the
reflow process, so verification of the reflow process is recommended. These parts may be used in a nitrogen
reflow process.
Fig. 13 Temperature Profile
260 (MAX)
1 ~ 2.5°C/s
1 ~ 4°C/s
220
200
60s (MAX)
5s (MAX)
150
60 ~ 120s
1 ~ 4°C/s
25
Time (s)
Sheet No.: DG-072011
11
GM5ZR96270A
● Recommended Solder Pad Design
1. Solderability depends on reflow conditions, solder paste, and circuit board materials. Check the entire process
before production commences.
2. Fig. 14 shows the recommended solder pattern for this part.
3. When using back side dip methods, Sharp recommends checking the process carefully: board warping from
heat can cause mechanical failure in these parts, in addition to the high heat conducted into the part through
the leads. Performing reflow after dip is recommended, with the interval between the two as short as possible.
Fig. 14 Recommended Solder Pad Design
Product center
1.5
1.5
4.5
NOTE: Unit: mm
● Presence of ODCs
This product shall not contain the following materials, and they are not used in the production process for this
product:
• Regulated substances: CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform). Specific
brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
• Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl
ethers (PBDE).
Sheet No.: DG-072011
12
GM5ZR96270A
--- Transportation control and safety equipment
(i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP’s devices.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high
level of reliability and safety such as:
--- Space applications
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data materials, struc-
ture, and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
--- Telecommunication equipment (trunk lines)
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.
scuba)
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or
in part, without the express written permission of
SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
--- Office automation equipment
--- Telecommunication equipment (terminal)
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliabilty such as:
Sheet No.: DG-072011
13
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