GL480E00000F [SHARP]
Infrared Emitting Diode; 红外发光二极管
| 型号： | GL480E00000F |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Infrared Emitting Diode |
| 文件： | 总9页 (文件大小：525K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
GL480E00000F
Infrared Emitting Diode
GL480E00000F
■ Features
■ Agency Approvals/Compliance
1. Side view emission type
1. Compliant with RoHS directive (2002/95/EC)
2. Content information about the six substances
specified in “Management Methods for Control of
Pollution Caused by Electronic Information Prod-
ucts Regulation” (popular name: China RoHS)
2. Plastic mold with resin lens
3. Medium directivity angle (Δθ: 13ꢀ TYP.)
Peak emission wavelength: 950 nm TYP.
4. Radiant flux φe: 0.7 mW MIN.
(Chinese:
);
5. Lead free and RoHS directive component
refer to page 7
■ Applications
1. Office automation equipment
2. Audio visual equipment
3. Home appliances
4. Telecommunication equipment
5. Measuring equipment
6. Tooling machines
7. Computers
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D1-A01101EN
Date: March 30, 2007
©SHARP Corporation
GL480E00000F
■ Outline Dimensions
GL480E00000F/GL480QE0000F
2 - C0.5
1.15 0.2
0.75 0.2
Pink transparent
epoxy resin (GL480E00000F)
3.0 0.2
Transparent
expoxy resin (GL480QE0000F)
0.15 0.2
60ꢀ
R0.8 0.1
(1.7)
+0.3
2 - 0.45
-0.1
Pin Arrangement
2
1
No.
1
Name
Cathode
Anode
2
(2.54)
+0.3
-0.1
2 - 0.4
1.6 0.2
2.8 0.2
2
1
NOTES:
1. Units: mm
2. ( ): Reference dimensions
Sheet No.: D1-A01101EN
2
GL480E00000F
■ Absolute Maximum Ratings
(Ta = 25ꢀC)
Parameter
Forward current
Symbol
IF
Rating
Unit
mA
A
50
Peak forward current *1
Reverse voltage
IFM
1
6
VR
V
Power dissipation
P
75
mW
ꢀC
Operating temperature
Storage temperature
Topr
Tstg
Tsol
-25 to +85
-40 to +85
260
ꢀC
Soldering temperature *2
ꢀC
1 Pulse width: 100 µs, Duty ratio: 0.01
*
2 5 s (MAX.) positioned 1.4 mm from the resin edge. See Figure 11.
*
■ Electro-optical Charactertistics
Parameter
Forward voltage
Symbol
VF
Conditions
IF = 20 mA
IFM = 0.5 A
VR = 3 V
MIN.
–
TYP.
1.2
3.0
–
MAX.
Unit
V
1.4
4.0
10
3.0
–
Peak forward voltage
Reverse current
VFM
IR
–
V
–
µA
Radiant flux
Φ
IF = 20 mA
IF = 5 mA
IF = 5 mA
VR = 0, f = 1 MHz
–
0.7
–
–
mW
nm
e
Peak emission wavelength
Half intensity wavelength
Terminal capacitance
Response frequency
Angle of half intensity
λp
Δλ
Ct
950
45
–
–
nm
–
50
–
pF
fC
–
300
13
–
kHz
degrees
Δθ
IF = 20 mA
–
–
Fig. 1 Forward Current vs.
Fig. 2 Peak Forward Current vs. Duty Ratio
Ambient Temperature
10,000
Pulse width ≤ 100 µs
Ta = 25ꢀC
60
5,000
2,000
1,000
500
50
40
30
20
10
0
200
100
50
20
10
10-3
10-2
10-1
5
2
5
2
2
5
1
-25
0
25
50
75 85 100
Duty ratio
Ambient temperature Ta (ꢀC)
Sheet No.: D1-A01101EN
3
GL480E00000F
Fig. 3 Spectral Distribution
Fig. 5 Forward Current vs. Forward Voltage
100
500
IF = 5 mA
Ta = 25ꢀC
Ta
= 75ꢀC
50ꢀC
200
100
50
25ꢀC
0ꢀC
80
60
40
20
0
-20ꢀC
20
10
5
2
1
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
880
900
920
940
960
980 1,000 1,020 1,040
Forward voltage VF (V)
Wavelength λ (mm)
Fig. 6 Relative Radiant Flux vs.
Ambient Temperature
Fig. 4 Peak Emission Wavelength vs.
Ambient Temperature
1,000
20
IF = constant
IF = 5 mA
10
5
975
950
925
900
2
1
0.5
0.2
0.1
0
25
50
75
100
-25
-25
0
25
50
75
100
Ambient temperature Ta (ꢀC)
Ambient temperature Ta (ꢀC)
Sheet No.: D1-A01101EN
4
GL480E00000F
Fig. 7 Radiant Flux vs. Foward Current
Fig. 9 Relative Collector Current
vs. Distance
10
Ta = 25ꢀC
100
5
2
IF = 20 mA
Ta = 25ꢀC
1
Pulse
(Pulse width
≤ 100 µs)
0.5
10
DC
0.2
0.1
1
0.05
0.02
0.01
1
10
100
1,000
0.1
0.1
1
10
100
Forward current IF (mA)
Distance to detector (mm)
Fig. 8 Relative Radiant Intensity
Fig. 10 Radiation Diagram
vs. Distance
-20ꢀ
-10ꢀ
0ꢀ
+10ꢀ
+20ꢀ (Ta = 25ꢀC)
+30ꢀ
100
Ta = 25ꢀC
100
-30ꢀ
80
10
60
40
20
+40ꢀ
+50ꢀ
-40ꢀ
-50ꢀ
1
+60ꢀ
+70ꢀ
-60ꢀ
-70ꢀ
+80ꢀ
+90ꢀ
-80ꢀ
-90ꢀ
0.1
0.1
1
10
100
0
Distance to detector (mm)
Angular displacement θ
Sheet No.: D1-A01101EN
5
GL480E00000F
■ Design Considerations
Design Guidelines
1. Allow for natural degradation of the LED as a result of long continuous operation. This part will have 50% deg-
radation in output after 5 years of continuous use.
2. This product is not designed to be electromagnetic- and ionized-particle-radiation resistant.
■ Manufacturing Guidelines
Cleaning Instructions
1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the
optical characteristics.
2. Solvent cleaning: Solvent temperature should be 45ꢀC or below. Immersion time should be 3 minutes or less.
3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning
time, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi-
tions to confirm the harmlessness of the ultrasonic cleaning methods.
4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.
Fig. 11 Soldering Area
1.4 mm
Solderable
■ Packing Specifications
1. Parts are packed in a vinyl bag, at an average quantity of 1,000 pieces per bag.
2. Bags are secured in a box as shown in illustration on page 8.
3. Product mass: 0.09 g (approx.)
Sheet No.: D1-A01101EN
6
GL480E00000F
■ Presence of ODCs (RoHS Compliance)
This product shall not contain the following materials, and they are not used in the production process for this
product:
• Regulated substances: CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform). Specific
brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
• Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl
ethers (PBDE).
• Content information about the six substances specified in “Management Methods for Control of Pollution
Caused by Electronic Information Products Regulation” (Chinese:
)
Toxic and Hazdardous Substances
Polybrominated
diphenyl ethers
(PBDE)
Category
Hexavalent
Polybrominated
biphenyls (PBB)
Lead (Pb) mercury (Hg) Cadmium (Cd)
chromiun (Cr6+
)
Infrared Emitting Diode
✓
✓
✓
✓
✓
✓
NOTE: ✓ indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement
as described in SJ/T 11363-2006 standard.
Sheet No.: D1-A01101EN
7
GL480E00000F
■ Package Specification
Product (1,000 pieces)
Inner packing
Vinyl bag
NOTES:
1. Inner packing material: Vinyl bag (Polyethylene)
2. Quantity: 1,000 pieces/bag
Outer packing
Cushioning material (2 sheets)
Vinyl bag with products (2 bags)
Cushioning material (2 sheets)
Packing case
Cellophane tape
NOTES:
1. Outer material : Packing case (Corrugated cardboard),
Cushioning material (Urethane), Cellophane tape
2. Quantity: 2,000 pieces/box
Model No., Quantity, and Lot No.
3. Regular packaged mass: Approximately 270 g
4. Label: Model No., Quantity, and Lot No.
Sheet No.: D1-A01101EN
8
GL480E00000F
--- Transportation control and safety equipment
(i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP’s devices.
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high
level of reliability and safety such as:
--- Space applications
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data materials, struc-
ture, and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
--- Telecommunication equipment (trunk lines)
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.
scuba)
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or
in part, without the express written permission of
SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
--- Office automation equipment
--- Telecommunication equipment (terminal)
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliabilty such as:
Sheet No.: D1-A01101EN
9
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