SGM66099B [SGMICRO]
Synchronous Boost Converter with Ultra-Low Quiescent Current;
| 型号： | SGM66099B |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | Synchronous Boost Converter with Ultra-Low Quiescent Current |
| 文件： | 总17页 (文件大小：974K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM66099B
Synchronous Boost Converter
with Ultra-Low Quiescent Current
GENERAL DESCRIPTION
FEATURES
The SGM66099B is an ultra-low quiescent current
synchronous Boost converter. 1.15V to 5.2V operation
input voltage is suitable for Li-Mn battery, NiMH and
Li-Ion rechargeable batteries. The 1.7μA (TYP) quiescent
current maximizes the light load efficiency and also
increases the effective battery operation time. In
addition, the high-side synchronous rectifier provides
output disconnect feature which minimizes unnecessary
current drawn from the battery during shutdown mode.
● Operating Input Voltage Range: 1.15V to 5.2V
● Ultra-Low Quiescent Current
1.7µA (TYP) Ultra-Low IQ into VOUT Pin
0.05µA (TYP) Ultra-Low IQ into VIN Pin
● 1.2MHz Fixed Frequency Operation
● Adjustable Output Voltage from 2.5V to 5.2V
● 5.0V Fixed Output Voltage Version
● Power-Save Mode for Improved Efficiency at Low
Output Power
The SGM66099B is able to deliver 300mA output
current from 3.3V to 5V conversion, and achieves up to
93% efficiency at 200mA load.
● Regulated Output Voltage in Down Mode
● True Disconnection During Shutdown
● Up to 93% Efficiency from 10mA to 300mA Load
● -40℃ to +85℃ Operating Temperature Range
● Available in Green WLCSP-1.22×0.83-6B and
The device provides down mode where the desired
output voltage is regulated even when input voltage is
higher than the output. In addition, when the input
voltage is 300mV above the output voltage set point,
the device enters pass-through mode.
TDFN-2×2-6AL Packages
The device integrates various protection features such
as over-current protection, over-voltage protection and
thermal shutdown. In addition, the synchronous rectifier
supports short circuit protection which further improves
the robustness of the device.
APPLICATIONS
LCD Bias
Optical Heart Rate Monitor LED Bias
Portable and Wearable Applications
Low Power Wireless Applications
Battery Powered Systems
The SGM66099B provides both adjustable output
voltage and fixed output voltage versions. It is available
in Green WLCSP-1.22×0.83-6B and TDFN-2×2-6AL
packages.
TYPICAL APPLICATION
L
VIN
2.2μH
1.15V to 5.2V
CIN
10μF
SW
VOUT
2.5V to 5.2V
VIN
VOUT
REN
10kΩ
CFWD
22pF
COUT1
10μF
COUT2
10μF
SGM66099B-ADJ
R1
EN
CEN
10nF
FB
GND
R2
Figure 1. Typical Application Circuit
SG Micro Corp
AUGUST 2022 – REV. B
www.sg-micro.com
Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099B
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
DESCRIPTION
WLCSP-1.22×0.83-6B
TDFN-2×2-6AL
SGM66099B-5.0YG/TR
SGM66099B-5.0YTDI6G/TR
SGM66099B-ADJYG/TR
K8XX
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
-40℃ to +85℃
-40℃ to +85℃
-40℃ to +85℃
-40℃ to +85℃
SGM66099B-5.0
CGA
XXXX
WLCSP-1.22×0.83-6B
TDFN-2×2-6AL
G8XX
SGM66099B-ADJ
CH0
XXXX
SGM66099B-ADJYTDI6G/TR
MARKING INFORMATION
NOTE: XX = Date Code. XXXX = Date Code and Trace Code.
WLCSP-1.22×0.83-6B
TDFN-2×2-6AL
Serial Number
Y Y Y
X X X X
YY X X
Date Code - Week
Date Code - Year
Serial Number
Trace Code
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
VIN, SW, VOUT, FB, EN to GND...................... -0.3V to 6.0V
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
Package Thermal Resistance
WLCSP-1.22×0.83-6B, θJA ...................................... 143℃/W
TQFN-2×2-6AL, θJA ................................................. 105℃/W
Junction Temperature.................................................+150℃
Storage Temperature...................................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
ESD SENSITIVITY CAUTION
HBM.............................................................................4000V
CDM ............................................................................1000V
This integrated circuit can be damaged by ESD if you don’t
pay attention to ESD protection. SGMICRO recommends that
all integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because very small parametric changes could cause the
device not to meet its published specifications.
RECOMMENDED OPERATING CONDITIONS
Input Voltage Range.....................................1.15V (1) to 5.2V
Output Voltage Range ........................................2.5V to 5.2V
Operating Ambient Temperature Range........-40℃ to +85℃
Operating Junction Temperature Range......-40℃ to +125℃
NOTE 1: Refer to the “Start-Up and Low Supply Voltage
Operation” for detailed description.
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
AUGUST 2022
2
Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099B
PIN CONFIGURATIONS
(TOP VIEW)
(TOP VIEW)
1
2
GND
VOUT
FB
1
2
3
6
5
4
VIN
SW
EN
A
B
C
VIN
GND
GND
SW
EN
VOUT
FB
WLCSP-1.22×0.83-6B
TDFN-2×2-6AL
PIN DESCRIPTION
PIN
NAME
TYPE
FUNCTION
WLCSP-
TDFN-
1.22×0.83-6B
2×2-6AL
A1
6
1
5
2
4
3
VIN
GND
SW
P
G
O
O
I
Power Supply Input.
Ground.
A2
B1
B2
C1
C2
Switch Node. Drain connection of low-side power MOSFET.
Boost Converter Output.
VOUT
EN
Device Enable Node. Pulling this pin logic high enables the device, logic low
disables the device.
Voltage Feedback of Adjustable Output Voltage. Connect a resistive divider
to program the desired output voltage. Connect to the GND pin for fixed
output voltage version and do not leave FB pin floating.
FB
I
Exposed
Pad
—
GND
—
Connect to GND.
NOTE: I: input, O: output, G: ground, P: power for the circuit.
SG Micro Corp
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3
Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099B
ELECTRICAL CHARACTERISTICS
(VIN = 1.15V to 5.2V, CIN = 10μF, COUT = 20μF. Full = -40℃ to +85℃, typical values are at VIN = 3.7V, TA = +25℃, unless
otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
TEMP
MIN
TYP
MAX
UNITS
Power Supply
Input Voltage Range
VIN
1.15
5.2
V
+25℃
Quiescent Current into VIN Pin
No load, not switching
Full
0.05
1.7
0.30
µA
No load, not switching, Boost or down
mode (SGM66099B-ADJ)
No load, not switching, Boost or down
mode (SGM66099B-5.0)
Full
7.0
µA
IQ
Quiescent Current into VOUT Pin
Full
Full
12
22
µA
µA
Shutdown Current into VIN Pin
Output
ISD
EN = GND, VIN = 3.6V
0.1
1.0
Output Voltage Range
VOUT
Full
Full
2.5
5.2
V
V
V
V
V
SGM66099B-5.0, VIN < VOUT, PWM mode
SGM66099B-5.0, VIN < VOUT, PFM mode
VIN < VOUT, PWM mode
4.84
5.00
5.02
1.000
1.010
5.70
5.70
100
5.10
Output Voltage
+25℃
Full
0.965
1.038
Feedback Reference Voltage
VREF
VIN < VOUT, PFM mode
+25℃
+25℃
+25℃
+25℃
Full
VOUT rising (WLCSP)
5.30
5.23
5.87
5.99
Output Over-Voltage Protection
Threshold
VOVP
V
VOUT rising (TDFN)
OVP Hysteresis
mV
nA
Leakage Current into FB Pin
Switching
IFB_LKG
VFB = 1.1V
VIN = 3.7V
10
50
Switching Frequency
Power Switch
fSW
Full
0.9
1.2
1.55
MHz
VOUT = 4.7V (TDFN)
VOUT = 4.7V (WLCSP)
VOUT = 3.3V (TDFN)
VOUT = 3.3V (WLCSP)
VOUT = 4.7V (TDFN)
VOUT = 4.7V (WLCSP)
VOUT = 3.3V (TDFN)
VOUT = 3.3V (WLCSP)
280
230
340
290
270
250
350
330
1.30
400
330
480
400
380
360
490
470
1.64
mΩ
mΩ
mΩ
mΩ
mΩ
mΩ
mΩ
mΩ
A
+25℃
+25℃
+25℃
+25℃
+25℃
+25℃
+25℃
+25℃
+25℃
Low-side Switch On-Resistance
Rectifier On-Resistance
RDS(ON)_LS
RDS(ON)_HS
Current Limit Threshold
ILIM
0.90
Control Logic
VIN ≤ 1.5V
VIN > 1.5V
VIN ≤ 1.5V
VIN > 1.5V
VEN = 5.0V
Full
Full
0.14 × VIN
0.3
V
V
EN Input Low Voltage Threshold
EN Input High Voltage Threshold
VIL
Full
0.8 × VIN
1.2
V
VIH
Full
V
Leakage Current into EN Pin
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
IEN_LKG
300
nA
℃
℃
+25℃
150
25
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Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099B
TYPICAL PERFORMANCE CHARACTERISTICS
CIN = 10μF and COUT = 20μF, unless otherwise noted.
Load Regulation
Current Limit vs. Temperature
VIN = 3.7V, VOUT = 5.0V
5.4
5.3
5.2
5.1
5.0
4.9
4.8
4.7
1.36
1.34
1.32
1.30
1.28
1.26
1.24
1.22
1.20
VIN = 1.5V
V
V
V
IN = 3.0V
IN = 3.6V
IN = 4.2V
VOUT = 5.0V
0.001 0.01
0.1
1
10
100 1000
-50 -25
0
25
50
75 100 125 150
Output Current (mA)
Temperature (℃)
Shutdown Current vs. Temperature
Reference Voltage vs. Temperature
VIN = 3.7V
0.06
0.05
0.04
0.03
0.02
0.01
0.00
1.009
1.007
1.005
1.003
1.001
0.999
0.997
0.995
VIN = 3.7V
Into VIN and SW
-50 -25
0
25
50
75 100 125 150
-50 -25
0
25
50
75 100 125 150
Temperature (℃)
Temperature (℃)
Output Voltage vs. Temperature
VIN = 3.7V, VOUT = 5.0V
Output Voltage vs. Temperature
VIN = 3.7V, VOUT = 3.3V
5.010
5.008
5.006
5.004
5.002
5.000
4.998
4.996
4.994
4.992
4.990
3.310
3.308
3.306
3.304
3.302
3.300
3.298
3.296
3.294
3.292
3.290
-50 -25
0
25
50
75 100 125 150
-50 -25
0
25
50
75 100 125 150
Temperature (℃)
Temperature (℃)
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Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099B
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
CIN = 10μF and COUT = 20μF, unless otherwise noted.
Switching Waveform at Heavy Load
Switching Waveform at Light Load
VIN = 3.7V, VOUT = 5.0V, IOUT = 200mA
VIN = 3.7V, VOUT = 5.0V, IOUT = 1mA
AC Coupled
AC Coupled
VOUT
VOUT
VSW
VSW
IL
IL
Time (500ns/div)
Time (50μs/div)
Start-up by VIN Pin
Start-up by EN Pin
VIN = 3.7V, VOUT = 5.0V, RL = 100Ω
VIN = 3.7V, VOUT = 5.0V, IOUT = 100mA
VIN
VEN
VOUT
VOUT
IL
IL
Time (500μs/div)
Time (1ms/div)
Line Transient Response
Load Transient Response
VIN = 2.4V to 3.7V, VOUT = 5.0V, IOUT = 200mA
VIN = 3.7V, VOUT = 5.0V, IOUT = 50mA to 200mA
AC Coupled
AC Coupled
VOUT
VOUT
VIN
IL
IL
IOUT
Time (200μs/div)
Time (200μs/div)
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Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099B
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
CIN = 10μF and COUT = 20μF, unless otherwise noted.
Load Regulation
Line Regulation
AC Coupled
AC Coupled
VOUT
VOUT
VIN
IL
IL
IOUT
VIN = 3.7V, VOUT = 5.0V, IOUT = 0mA to 250mA
VIN = 2.4V to 5.3V, VOUT = 5.0V, IOUT = 200mA
Time (50ms/div)
Time (50ms/div)
Load Efficiency with Different Inputs
Quiescent Current into VOUT Pin vs. Temperature
100
90
80
70
60
50
40
30
20
10
0
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
VIN = 3.7V
No Switching
VIN = 1.5V
V
V
V
IN = 3.0V
IN = 3.6V
IN = 4.2V
SGM66099B-ADJ
OUT = 5.0V
V
0.001 0.01
0.1
1
10
100
1000
-50 -25
0
25
50
75 100 125 150
Output Current (mA)
Temperature (℃)
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AUGUST 2022
7
Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099B
FUNCTIONAL BLOCK DIAGRAM
SW
VOUT
Fixed
Current
Sense
Boost
Gate
Voltage
Start-up
VIN
Driver
Fixed
Voltage
PWM
Control
-
FB
Adjustable
+
VREF
VDOWN
+
2.2V
-
Down Mode
-
VIN
+
-
VOUT
VOUT
+
Pass-Through
Logic
Control
+
-
VOUT
OCP, OVP,
VPSTH
Thermal
Shutdown
GND
EN
Current Sense
Figure 2. Block Diagram
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AUGUST 2022
8
Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099B
DETAILED DESCRIPTION
The SGM66099B synchronous Boost converter is
designed for Li-Ion battery powered systems, where the
compact solution size and battery operation time are
key criterions. The device can operate with a wide input
while the supply voltage can drop to as low as 0.3V for
maintain the output voltage with light loadings.
During the output short-to-ground case, as output
voltage declines below 2.2V, the SGM66099B reduces
the current limit to about 200mA to reduce power
dissipation within the device. As the short circuit
condition is removed, the device resumes operation
and goes through a soft-start sequence to regulate the
set output voltage.
voltage from 1.15V to 5.2V. The 1.7μA (TYP) quiescent
current and light load power-save mode further improve
the system efficiency. The device employs peak current
mode control with 1.3A (TYP) peak switch current limit.
The SGM66099B is capable of disconnecting the output
from input when the device is disabled to avoid
unnecessary current consumption. The integrated down
mode and pass-through mode ensure a smooth
operation when input voltage is close to or higher than
the set output voltage. The device can operate both in
the adjustable output voltage version and fixed output
voltage version.
Over-Voltage Protection
SGM66099B integrates over-voltage protection (OVP)
to protect the device in the event of feedback resistor
short-to-ground or incorrect feedback resistor value
being populated. The SGM66099B stops switching
when the OVP threshold of 5.7V (TYP) is reached. The
device implements 100mV OVP hysteresis. When the
output voltage is 100mV lower than the OVP threshold,
the device resumes switching.
Start-up and Enable
Logic high on EN pin enables the SGM66099B, while a
logic low disables the device. During logic low state, the
device stops operation, and the output voltage is
completely disconnected from the input voltage. During
logic low state, the shutdown current is less than 1μA.
Power-Save Mode under Light Load
Condition
The SGM66099B enters into power-save mode under
The SGM66099B is able to start up from 1.15V input
voltage with larger than 3kΩ load. Before the output
voltage reaches 2.2V during the start-up phase, the
switch current is limited to about 200mA. Therefore, if
the load during start-up is too heavy, the device will fail
to charge the output voltage to above 2.2V after
soft-start time expires, and it will not be able to start up
successfully.
light load condition.
Down Mode and Pass-Through Mode
SGM66099B offers down mode feature where the
device can still regulate the set output voltage even
when the input voltage is higher than output voltage. If
the input voltage continues increasing in down mode,
the device automatically enters pass-through mode.
Care should be taken in pass-through mode, where the
input voltage should not exceed the recommended
maximum input voltage.
Over-Current and Short Circuit Protection
The SGM66099B implements cycle-by-cycle current
limit during an over-current event. When the current limit
threshold (ILIM) is reached, the low-side power MOSFET
is turned off to prevent the inductor current from further
increase. During over-current event, the output voltage
will drop until a constant power state is reached
between input and output. If the current limit causes the
output to drop below the input voltage, the SGM66099B
enters down mode, where the peak current is still
limited by ILIM cycle-by-cycle. If the output continues
dropping below 2.2V, the device enters start-up
process again.
In down mode, the control logic pulls the gate of PMOS
to the input voltage rather than ground. This method
allows effective control of inductor current when VIN
>
VOUT. Thermal consideration should be taken in down
mode, where the voltage drop on the PMOS increases
as the delta of VIN and VOUT increases.
In pass-through mode, the complimentary switching
action stops. The gate of PMOS is pulled to ground for
always-on and the low-side switch remains off. The
output voltage is equal to the input voltage minus the
voltage drop across the DC resistance (DCR) of the
inductor and the on-resistance of the rectified PMOS.
The SGM66099B may not be shut down by pulling the
EN to logic low when the supply voltage is below 0.85V,
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Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099B
DETAILED DESCRIPTION (continued)
SGM66099B enters down mode when the input voltage
is equal to or higher than VOUT - 100mV. It remains in
down mode until the VIN is more than VOUT + 0.3V and
then automatically enters pass-through mode. In
pass-through mode, the high-side PMOS is always
turned on to pass the input voltage to the output. As VIN
drops below 1% above the target output voltage, the
device exits pass-through mode and returns to down
mode. The device exits down mode and returns to
normal Boost switching operation as VIN drops 150mV
below the target output voltage.
Thermal Shutdown
A thermal shutdown function is implemented to prevent
damage caused by excessive heat and power
dissipation. Once a junction temperature of +150℃
(TYP) is exceeded, the device is shut down. The device
is released from shutdown automatically when the
junction temperature decreases by 25℃.
Voltage (V)
Down
Mode
Down
Mode
Pass-Through
300mV
1% VOUT
VOUT
VIN
100mV
150mV
t
Figure 3. Down Mode and Pass-Through Mode
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Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099B
APPLICATION INFORMATION
L
VIN
2.2μH
2.7V to 4.2V
CIN
10μF
SW
VOUT
5V
VIN
VOUT
REN
10kΩ
CFWD
22pF
COUT1
10μF
COUT2
10μF
SGM66099B-ADJ
R1
EN
CEN
10nF
FB
GND
R2
Figure 4. 5V Output Boost Converter
For fixed output voltage version, connect the FB pin to
GND and do not leave FB pin floating.
Design Requirements
5V output at 1mA load current is used to provide
system bias power or LED bias voltage from a single
cell Li-Ion battery as an example. The selection of
external component values for the SGM66099B-ADJ
can reference the following design procedure.
Maximum Output Current
The maximum output load capability of SGM66099B
depends on the minimum desired operation input
voltage and the current limit of the device. The
maximum load current can be estimated by Equation 2,
Table 1. Design Requirements
PARAMETERS
Input Voltage
VALUES
2.7V ~ 4.2V
5V
I
V ⋅(ILIM
-
LH ) ⋅η
IN
2
(2)
IOUT(MAX)
=
Output Voltage
VOUT
Output Current
1mA
where η is the conversion efficiency, using 85% for
estimation, ILH is the inductor peak-to-peak ripple
current and ILIM is the switch current limit.
Output Voltage Ripple
±50mV
Programming the Output Voltage
External resistor dividers R1 and R2 (see Figure 4) can
be used to set the output voltage. The typical voltage at
the FB pin is VREF of 1.0V.
For worst-case condition analysis, the minimum input
voltage, maximum Boost output voltage and minimum
current limit (ILIM) should be used.
R1 + R2
(1)
VOUT = VREF
×
Inductor Selection
R2
Inductor selection is one of the most important
criterions for switch mode power supply, because the
inductor selection may affect the power supply’s
transient response, loop stability, efficiency and
steady-state operation. Inductor parameters of DC
resistance (DCR), inductance and saturation current
are critical for a smooth and efficient power supply
operation.
The leakage current into the FB pin affects the
accuracy of output voltage. To minimize the leakage
current effect, the current flowing through R2 should be
100 times greater than FB pin leakage current. Small
R2 increases the noise immunity, while large R2
reduces the leakage current flowing through feedback
resistors, which improves the no load efficiency of the
device. 1MΩ and 249kΩ resistors are selected for R1
and R2 respectively in this case. ±1% accuracy
resistors are recommended for R1 and R2 to improve
output voltage accuracy.
The internal compensation of the device is optimized
with 1μH and 2.2μH. When VOUT is higher than 3V,
2.2μH inductance should be selected. When VOUT is
less than 3V, 1.1μH inductance should be selected.
An external feed-forward capacitor (CFWD) from 10pF to
22pF in parallel with R1 is recommended to improve
device’s stability.
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11
Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099B
APPLICATION INFORMATION (continued)
Table 2. List of Inductors
Inductance
(µH)
Saturation
Current (A)
DC Resistance
Size
VOUT (V)
Part Number
Manufacturer
(MΩ)
L × W × H (mm3)
2.2
2.2
2.2
1.0
1.0
1.0
1.95
1.7
80
92
2.5 × 2.0 × 1.2
2.5 × 2.0 × 1.1
2.0 × 1.6 × 1.0
2.5 × 2.0 × 1.2
2.5 × 2.0 × 1.0
2.0 × 1.2 × 1.0
74404024022
LQH2HPN2R2MJR
VLS201610CX-2R2M
74404024010
Würth Elektronik
muRata
> 3.0
1.45
2.6
163
37
TDK
Würth Elektronik
TDK
≤ 3.0
2.3
48
MLP2520W1R0MT0S1
LQM21PN1R0MGH
1.5
80
muRata
Capacitor Selection
Layout
The input capacitor of Boost converter not only
minimizes input voltage ripple, but also reduces any
voltage spike presenting on IC’s VIN pin. A 10μF, low
ESR and X5R or higher temperature coefficient
ceramic capacitor is recommended to place as close to
the VIN and GND pins as possible to improve transient
response and EMI behavior.
In addition to component selection, layout is a critical
step to ensure the performance of any switch mode
power supplies. Poor layout could result in system
instability, EMI failure, and device damage. Thus, place
the inductor, input and output capacitors as close to the
IC as possible, and use wide and short traces for
current carrying traces to minimize PCB inductance.
Boost converter’s output capacitor plays a significant
role in ensuring good system performance. The
location of output capacitor will have an effect on the
switching spikes on the SW pin, which ultimately affects
EMI performance and potentially damages the IC due
to large switching spikes. The current loop formed by
the output capacitor flowing from the VOUT pin and
back to the GND pin should be as small as possible.
Therefore, a ceramic cap should be placed as close to
the VOUT and GND pins of the IC as possible.
For Boost converter, the current loop of the output
capacitor from VOUT pin back to the GND pin of the
device should be as small as possible.
ADJ ONLY
GND
VOUT
COUT
GND
COUT
Boost topology presents right-half-plane-zero which is
dictated by inductance. In addition, the output capacitor
sets the corner frequency of the converter for current
mode controlled method. Therefore, for a larger
inductor, a larger output capacitor must be used. The
device’s internal compensation is optimized to operate
with inductance values between 1μH and 2.2μH,
CIN
EN
resulting in the minimum output capacitor value of 20μF
(nominal value). Increasing the output capacitor can
reduce output ripple in PWM mode.
Due to the nature of ceramic capacitors’ DC bias effect,
effective capacitance at the bias voltage should be
verified. GRM188R60J106ME84D, a 10μF ceramic
capacitor, is used for VOUT rail. It has high effective
capacitance value under DC biased condition.
VIN
SW
Figure 5. SGM66099B PCB Layout
In the case of load hot-plugging, the input capacitance
of load device needs to be less than 1/10 of the output
capacitance of SGM66099B.
SG Micro Corp
www.sg-micro.com
AUGUST 2022
12
Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099B
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
AUGUST 2022 ‒ REV.A.4 to REV.B
Page
Updated typical performances of Load Regulation and Load Efficiency with Different Inputs ........................................................................... 5, 7
MAY 2022 ‒ REV.A.3 to REV.A.4
Page
Added PCB Layout............................................................................................................................................................................................12
Updated Detailed Description section............................................................................................................................................................9, 10
AUGUST 2021 ‒ REV.A.2 to REV.A.3
Page
Updated Figure 1 and Application Information section...................................................................................................................................1, 11
JULY 2021 ‒ REV.A.1 to REV.A.2
Page
Updated the Functional Block Diagram and product description sections ...................................................................................1, 8, 9, 10, 11, 12
FEBRUARY 2021 ‒ REV.A to REV.A.1
Page
Updated FB pin function ................................................................................................................................................................................3, 11
Changes from Original (JUNE 2020) to REV.A
Page
Changed from product preview to production data.............................................................................................................................................All
SG Micro Corp
www.sg-micro.com
AUGUST 2022
13
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
WLCSP-1.22×0.83-6B
A1 CORNER
0.23
0.21
6 × Φ
0.4
0.4
RECOMMENDED LAND PATTERN
TOP VIEW
0.830± 0.025
6 × Φ0.270± 0.020
2
1
A
B
C
0.4
0.198± 0.020
0.040± 0.005
0.362± 0.013
0.600± 0.038
0.4
BOTTOM VIEW
SIDE VIEW
NOTES:
1. All linear dimensions are in millimeters.
2. This drawing is subject to change without notice.
SG Micro Corp
TX00151.000
www.sg-micro.com
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-2×2-6AL
D
e
N6
L
D1
E1
E
N3
N1
b
BOTTOM VIEW
TOP VIEW
1.60
0.55
1.00
2.60
A
A1
A2
SIDE VIEW
0.30
0.65
RECOMMENDED LAND PATTERN (Unit: mm)
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
0.800
0.050
MIN
MAX
0.031
0.002
A
A1
A2
D
0.700
0.000
0.028
0.000
0.203 REF
0.008 REF
1.900
1.500
1.900
0.900
0.250
2.100
1.700
2.100
1.100
0.350
0.075
0.059
0.075
0.035
0.010
0.083
0.067
0.083
0.043
0.014
D1
E
E1
b
e
0.650 BSC
0.026 BSC
L
0.174
0.326
0.007
0.013
NOTE: This drawing is subject to change without notice.
SG Micro Corp
TX00132.000
www.sg-micro.com
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
WLCSP-1.22×0.83-6B
TDFN-2×2-6AL
7″
7″
9.5
9.5
0.91
2.30
1.31
2.30
0.71
1.10
4.0
4.0
4.0
4.0
2.0
2.0
8.0
8.0
Q1
Q1
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
7″ (Option)
7″
368
442
227
410
224
224
8
18
SG Micro Corp
www.sg-micro.com
TX20000.000
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