SGM6614 [SGMICRO]
18V Output, 15A, Fully Integrated Synchronous Boost Converter;
| 型号： | SGM6614 |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | 18V Output, 15A, Fully Integrated Synchronous Boost Converter |
| 文件： | 总6页 (文件大小：405K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM6614
18V Output, 15A, FullyIntegrated
Synchronous Boost Converter
GENERAL DESCRIPTION
FEATURES
The SGM6614 is a 15A switch current, fully integrated
synchronous Boost converter. The integrated switch
FET and rectifier switch with an 8.8mΩ low-side
on-resistance and a 12.2mΩ high-side on-resistance
respectively provide high conversion efficiency for
portable applications. The wide input voltage range of
2.17V to 18V offers flexibility to various input supplies
such as single-cell to multi-cell Lithium batteries. The
device can support up to 18V output.
● 2.17V to 18V Input Voltage Range
● 4.5V to 18V Output Voltage Range
● 2.4V Minimum Input Voltage for Startup
● 15A (TYP) Peak Switch Current Limit
● 8.8mΩ Low-side and 12.2mΩ High-side
MOSFETs
● Fixed 500kHz Switching Frequency
● High Efficiency
Up to 94.42% Efficiency at VIN = 3.6V, VOUT = 13V,
and IOUT = 2A
The SGM6614 adopts the fixed frequency peak current
mode control topology for main switch FET PWM duty
cycle control. The device operates in pulse width
modulation (PWM) mode at medium and heavy loads,
where two power FETs are alternately turned on in one
switching cycle. It automatically switches to pulse
frequency modulation (PFM) mode at light loads. PWM
mode adopts 500kHz switching frequency.
Up to 97.07% Efficiency at VIN = 7.2V, VOUT = 16V,
and IOUT = 2.5A
● 85µA (TYP) Quiescent Current into VOUT Pin
● Less than 1.5µA Shutdown Current
● Auto PFM at Light Loads
● 19V Output Over-Voltage Protection
● Cycle-by-Cycle Over-Current Protection
● Thermal Shutdown
The SGM6614 offers various protection features to
improve device robustness, such as over-voltage
protection, over-current protection and thermal shutdown.
● Available in a Green TQFN-3×2.5-11L Package
APPLICATIONS
The SGM6614 is available in a Green TQFN-3×2.5-11L
package.
Smart Speaker
Portable POS
Power Bank
TYPICAL APPLICAITION
L
VIN
CBOOT
CIN
RIN
SW
VOUT
FB
VOUT
BST
VIN
RFBT
COUT
ON
C1
SGM6614
EN
RFBB
OFF
VCC
AGND
PGND
COMP
CVCC
RCOMP
CCOMP
CP
Figure 1. Typical Application
SG Micro Corp
www.sg-micro.com
DECEMBER 2022 – REV. A
18V Output, 15A, Fully Integrated
Synchronous Boost Converter
SGM6614
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
SGMMEV
XXXXX
SGM6614
TQFN-3×2.5-11L
SGM6614XTSL11G/TR
Tape and Reel, 5000
-40℃ to +125℃
MARKING INFORMATION
NOTE: XXXXX = Date Code, Trace Code and Vendor Code.
X X X X X
Vendor Code
Trace Code
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
BST Voltage............................................ -0.3V to VSW + 5.5V
VIN, EN, VOUT, SW Voltages ........................... -0.3V to 20V
Other Pin Voltages............................................... -0.3V to 6V
Package Thermal Resistance
TQFN-3×2.5-11L, θJA ................................................. 63℃/W
Junction Temperature.................................................+150℃
Storage Temperature Range.......................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
HBM.............................................................................4000V
CDM ............................................................................1000V
RECOMMENDED OPERATING CONDITIONS
Input Voltage Range, VIN ...................................2.17V to 18V
Output Voltage Range, VOUT................................4.5V to 18V
Effective Inductance Range, L....................... 0.8µH to 5.6µH
Effective Input Capacitance Range, CIN...............10µF (TYP)
Effective Output Capacitance Range, COUT ..10µF to 1000µF
Operating Junction Temperature Range......-40℃ to +125℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
DECEMBER 2022
2
18V Output, 15A, Fully Integrated
Synchronous Boost Converter
SGM6614
PIN CONFIGURATION
(TOP VIEW)
VCC AGND SW
11 10
BST
8
9
FB
1
2
7
6
VIN
EN
COMP
PGND
3
5
VOUT
SW
4
TQFN-3×2.5-11L
PIN DESCRIPTION
PIN
1
NAME
FB
I/O
I
FUNCTION
Inverting Input of the Error Amplifier. Connect it to the midpoint of a resistor divider to set the
Boost output voltage.
Internal Error Amplifier Output. Connect the loop compensation components between the
COMP and AGND pins.
2
COMP
PGND
SW
O
P
P
P
I
3
Power Ground Pin. Source connection of the internal N-channel low-side MOSFET.
Switching Node. Drain connection of the internal N-channel low-side MOSFET.
The Boost Output Pin.
4, 9
5
VOUT
EN
6
Enable Pin. Logic high turns the converter on. Logic low turns the converter off.
Input Power Supply Pin.
7
VIN
I
N-Channel Rectify Switch Power Supply Pin. Connect a 0.1µF ceramic capacitor between the
BST and SW pins.
8
BST
O
-
10
11
AGND
VCC
Signal Ground Pin.
Internal Regulator Output Pin. Connect a ceramic capacitor greater than 1.0µF between the
VCC and the ground.
O
NOTE: I = input, O = output, P = power supply.
SG Micro Corp
www.sg-micro.com
DECEMBER 2022
3
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TQFN-3×2.5-11L
8 × b
2 × e1
5 × e
2 × b1
N11
D
PIN 1#
6 × L
N1
DETAIL A
L2
k
2 × e2
E
4 × b2
L1
e3
BOTTOM VIEW
TOP VIEW
5 × 0.50
8 × 0.25
2 × 0.49
2 × 0.225
6 × 0.55
C
SEATING PLANE
2 × 0.70
2 × 0.573
1.175
2 × 0.575
0.40
0.25
A
4 × 0.4
1.00
A2
A1
eee C
2 × 1.45
SIDE VIEW
1.30
2.85
2 × 1.25
ALTERNATE A-1 ALTERNATE A-2
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTION
RECOMMENDED LAND PATTERN (Unit: mm)
Dimensions In Millimeters
Symbol
MIN
0.700
0.000
MOD
-
-
MAX
0.800
0.050
A
A1
A2
b
b1
b2
D
0.203 REF
0.200
0.175
0.350
2.900
2.400
-
-
-
-
0.300
0.275
0.450
3.100
2.600
E
-
e
0.500 BSC
0.490 BSC
0.575 BSC
1.300 BSC
0.250 REF
-
e1
e2
e3
k
L
0.250
0.900
0.300
0.450
1.100
0.500
L1
L2
eee
-
-
0.080
NOTE: This drawing is subject to change without notice.
SG Micro Corp
TX00311.000
www.sg-micro.com
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
TQFN-3×2.5-11L
13"
12.4
2.80
3.30
1.10
4.0
8.0
2.0
12.0
Q2
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
13″
386
280
370
5
SG Micro Corp
www.sg-micro.com
TX20000.000
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