SGM6010 [SGMICRO]

3A, 2MHz, Synchronous Buck Converter;
SGM6010
型号: SGM6010
厂家: Shengbang Microelectronics Co, Ltd    Shengbang Microelectronics Co, Ltd
描述:

3A, 2MHz, Synchronous Buck Converter

文件: 总10页 (文件大小:510K)
中文:  中文翻译
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SGM6010  
3A, 2MHz, Synchronous Buck Converter  
GENERAL DESCRIPTION  
FEATURES  
The SGM6010 is a synchronous, buck DC/DC converter  
with a range of 3V to 5.5V input voltage. This device is  
capable to provide a 3A continuous output current. It  
operates with a programmable frequency range of  
300kHz to 2MHz. The SGM6010 is highly efficient with  
peak efficiency at 95% when in operation. The 100%  
duty cycle could make the lowest dropout.  
3V to 5.5V Input Voltage Range  
Up to 95% High Efficiency  
120mΩ Low RDS(ON) Internal Switches  
300kHz to 2MHz Programmable Frequency  
3A Output Current  
0.8V Reference Allows Low Output Voltages  
Shutdown Current: 2μA (MAX)  
100% Duty Cycle for Lowest Dropout  
Forced Continuous PWM Mode Operation  
No External Power MOSFETs and Schottky Diode  
Required  
The forced continuous pulse width modulation (PWM)  
mode operation could decrease the ripple voltage to  
the lowest level and reduce noise and RF interference  
as well. No external power MOSFETs and Schottky  
diode are required because of the internal synchronous  
low on-resistance power switches. The external  
compensation can improve the transient response  
across the loads and output capacitors.  
Excellent Line and Load Transient Responses  
-40to +85Operating Temperature Range  
Available in a Green TDFN-3×3-10L Package  
The SGM6010 is available in a Green TDFN-3×3-10L  
package. It is rated over the -40to +85temperature  
range.  
APPLICATIONS  
Digital Book Readers  
Digital Cameras  
Portable Instruments  
Wireless and DSL Modems  
Battery-Powered Systems  
Microprocessor, DSP Power Supplies  
TYPICAL APPLICATION  
L
2.2μH  
3
VOUT  
6, 7  
VIN 5V  
PVDD  
AVDD  
EN/RT  
GND  
SW  
SW  
2.5V/3A  
CIN  
22μF  
4
9
8
C1  
22pF  
R1  
510kΩ  
1
2
5
SGM6010  
COUT  
FB  
22μF×2  
ROSC  
332kΩ  
R2  
240kΩ  
10  
PGND  
COMP  
RCOMP  
CCOMP  
10kΩ 4000pF  
Figure 1. Typical Application Circuit  
SG Micro Corp  
APRIL2014REV. A  
www.sg-micro.com  
SGM6010  
3A, 2MHz, Synchronous Buck Converter  
PACKAGE/ORDERING INFORMATION  
SPECIFIED  
TEMPERATURE  
RANGE  
PACKAGE  
DESCRIPTION  
ORDERING  
NUMBER  
PACKAGE  
MARKING  
PACKING  
OPTION  
MODEL  
SGM  
6010D  
XXXXX  
SGM6010  
TDFN-3×3-10L  
-40to +85℃  
SGM6010YTD10G/TR  
Tape and Reel, 3000  
MARKING INFORMATION  
NOTE: XXXXX = Date Code and Vendor Code.  
X X X X X  
Vendor Code  
Date Code - Week  
Date Code - Year  
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If  
you have additional comments or questions, please contact your SGMICRO representative directly.  
OVERSTRESS CAUTION  
ABSOLUTE MAXIMUM RATINGS  
Input Supply Voltage............................................ -0.3V to 6V  
Other I/O Voltages................. -0.3V to (AVDD/PVDD + 0.3V)  
SW Switch Voltage ...........................-0.3V to (PVDD + 0.3V)  
Peak SW Sink and Source Current.................................3.6A  
Power Dissipation, PD @ TA = +25℃  
Stresses beyond those listed in Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to  
absolute maximum rating conditions for extended periods  
may affect reliability. Functional operation of the device at any  
conditions beyond those indicated in the Recommended  
Operating Conditions section is not implied.  
TDFN-3×3-10L...............................................................2.2W  
Package Thermal Resistance  
ESD SENSITIVITY CAUTION  
TDFN-3×3-10L, θJA.................................................... 45/W  
Junction Temperature.................................................+150℃  
Storage Temperature Range.......................-65to +150℃  
Lead Temperature (Soldering, 10s)............................+260℃  
ESD Susceptibility  
This integrated circuit can be damaged if ESD protections are  
not considered carefully. SGMICRO recommends that all  
integrated circuits be handled with appropriate precautions.  
Failureto observe proper handlingand installation procedures  
can cause damage. ESD damage can range from subtle  
performance degradation tocomplete device failure. Precision  
integrated circuits may be more susceptible to damage  
because even small parametric changes could cause the  
device not to meet the published specifications.  
HBM.............................................................................2000V  
MM.................................................................................200V  
RECOMMENDED OPERATING CONDITIONS  
Operating Temperature Range.......................-40to +85℃  
DISCLAIMER  
SG Micro Corp reserves the right to make any change in  
circuit design, or specifications without prior notice.  
SG Micro Corp  
www.sg-micro.com  
APRIL 2014  
2
SGM6010  
3A, 2MHz, Synchronous Buck Converter  
PIN CONFIGURATION  
(TOP VIEW)  
1
2
3
4
5
10  
9
EN/RT  
GND  
SW  
COMP  
FB  
8
AVDD  
PVDD  
PVDD  
7
SW  
6
PGND  
TDFN-3×3-10L  
PIN DESCRIPTION  
PIN  
NAME  
EN/RT  
GND  
FUNCTION  
Oscillator Resistor Input. Put a resistor between this pin and ground to program the switching frequency. If this pin  
connects to AVDD, the device will be shut down.  
1
Signal Ground. This pin connects all the small-signal components and compensation components which connect to  
the PGND conversely.  
2
3,4  
5
SW  
Internal Power MOSFET Switches Output. Put an inductor to this pin.  
PGND  
PVDD  
AVDD  
FB  
Power Ground. This pin is connected to the negative terminal of CIN and COUT with the shortest path.  
Power Input Supply. Put a capacitor to decouple this pin to PGND.  
6,7  
8
Analog Signal Power Supply. Put a capacitor to decouple this pin to GND. Normally AVDD is equal to PVDD.  
Feedback Pin. Feedback voltage of a resistive divider connected across the output is received by this pin.  
9
Error Amplifier Compensation Point. To stabilize the control loop, the external compensation elements are  
connected to this pin.  
10  
COMP  
GND  
Exposed  
Pad  
Power Ground Exposed Pad. Must be connected to GND plane.  
SG Micro Corp  
APRIL 2014  
www.sg-micro.com  
3
SGM6010  
3A, 2MHz, Synchronous Buck Converter  
ELECTRICAL CHARACTERISTICS  
(VIN = 3.3V, TA = -40to +85, typical values are at TA = +25, unless otherwise noted.)  
PARAMETER  
Input Voltage Range  
SYMBOL  
VIN  
CONDITIONS  
MIN  
3
TYP  
MAX  
5.5  
UNITS  
V
V
Feedback Reference Voltage  
Feedback Input Bias Current  
VREF  
0.772  
-0.4  
0.8  
0.1  
0.828  
0.4  
IFB  
μA  
VFB = 0.78V, ROSC = 332kΩ,  
Not Switching  
Active Mode  
Shutdown  
410  
600  
2.0  
Input DC Bias Current  
IS  
μA  
Output Voltage Line Regulation  
Output Voltage Load Regulation  
ΔVOUT  
VIN = 2.6V to 5.5V  
0.1  
%/V  
%/A  
VIN = 5V, VOUT = 2.5V,  
ILOAD = 0 to 3A  
VLOADREG  
0.15  
Error Amplifier Transconductance  
Current Sense Trans-Resistance  
gm  
800  
0.4  
1
μs  
Ω
ROSC  
ROSC = 332kΩ, TA = 25  
Switching Frequency  
ISW = 0.5A, TA = 25℃  
ISW = 0.5A, TA = 25℃  
TA = 25℃  
0.75  
0.3  
1.25  
2
MHz  
MHz  
mΩ  
mΩ  
A
Oscillator Frequency  
fOSC  
Switch On Resistance, High  
Switch On Resistance, Low  
Peak Current Limit  
RPMOS  
RNMOS  
IPK  
120  
100  
210  
160  
3.3  
3.5  
VDD Rising  
2.2  
Under-Voltage Lockout Threshold  
Shutdown Threshold  
UVLO  
V
V
VDD Failing  
2.05  
VIN - 0.7  
VIN - 0.4  
SG Micro Corp  
www.sg-micro.com  
APRIL 2014  
4
SGM6010  
3A, 2MHz, Synchronous Buck Converter  
TYPICAL PERFORMANCE CHARACTERISTICS  
Reference Voltage vs. Input Voltage  
Reference Voltage vs. Temperature  
0.805  
0.803  
0.801  
0.799  
0.797  
0.795  
0.804  
0.803  
0.802  
0.801  
0.800  
0.799  
0.798  
0.797  
VIN = 3.3V  
75 100  
2.5  
3
3.5  
4
4.5  
5
5.5  
-50  
-25  
0
25  
50  
Input Voltage (V)  
Temperature ()  
Quiescent Current vs. Temperature  
Quiescent Current vs. Input Voltage  
455  
430  
405  
380  
355  
330  
600  
550  
500  
450  
400  
350  
300  
VIN = 3.3V  
75 100  
-50  
-25  
0
25  
50  
2.5  
3
3.5  
4
4.5  
5
5.5  
Input Voltage (V)  
Temperature ()  
Output Voltage vs. Temperature  
Peak Current Limit vs. Input Voltage  
2.532  
2.530  
2.528  
2.526  
2.524  
2.522  
2.520  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
VIN = 3.3V  
ILOAD = 0A  
-50  
-25  
0
25  
50  
75  
100  
3
3.5  
4
4.5  
5
5.5  
Temperature (℃)  
Input Voltage (V)  
SG Micro Corp  
www.sg-micro.com  
APRIL 2014  
5
SGM6010  
3A, 2MHz, Synchronous Buck Converter  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
Frequency vs. Temperature  
Efficiency vs. Load Current  
VIN = 4.5V  
1.25  
1.21  
1.17  
1.13  
1.09  
1.05  
100  
80  
60  
40  
20  
0
VIN = 5.0V  
VIN =5.5V  
VOUT = 2.5V  
1000 10000  
0.1  
1
10  
100  
-50  
-25  
0
25  
50  
75  
100  
Load Current (mA)  
Temperature ()  
Load Transient Response  
Output Ripple  
VIN = 5V, VOUT = 2.5V  
OUT = 0A to 3A  
I
VOUT  
VSW  
VOUT  
ILOAD  
ILOAD  
VIN = 5V, VOUT = 2.5V  
OUT = 0A to 3A  
I
Time (100μs/div)  
Time (400ns/div)  
Start-Up with Heavy Load  
Start-Up with No Load  
VIN  
VIN = 5V, VOUT = 2.5V  
IOUT = 0A  
VIN = 5V, VOUT = 2.5V  
OUT = 3A  
I
VSW  
VIN  
VSW  
VOUT  
VOUT  
IIN  
IIN  
Time (400μs/div)  
Time (400μs/div)  
SG Micro Corp  
www.sg-micro.com  
APRIL 2014  
6
SGM6010  
3A, 2MHz, Synchronous Buck Converter  
REVISION HISTORY  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
Changes from Original (APRIL 2014) to REV.A  
Page  
Changed from product preview to production data.............................................................................................................................................All  
SG Micro Corp  
www.sg-micro.com  
APRIL 2014  
7
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
TDFN-3×3-10L  
D
e
N10  
D1  
k
E
E1  
N5  
N1  
b
L
BOTTOM VIEW  
TOP VIEW  
2.4  
1.7 2.8  
A
A1  
A2  
0.6  
SIDE VIEW  
0.24  
0.5  
RECOMMENDED LAND PATTERN (Unit: mm)  
Dimensions  
In Millimeters  
Dimensions  
In Inches  
Symbol  
MIN  
MAX  
0.800  
0.050  
MIN  
0.028  
0.000  
MAX  
0.031  
0.002  
A
A1  
A2  
D
0.700  
0.000  
0.203 REF  
0.008 REF  
2.900  
2.300  
2.900  
1.500  
3.100  
2.600  
3.100  
1.800  
0.114  
0.091  
0.114  
0.059  
0.122  
0.103  
0.122  
0.071  
D1  
E
E1  
k
0.200 MIN  
0.500 TYP  
0.008 MIN  
0.020 TYP  
b
0.180  
0.300  
0.300  
0.500  
0.007  
0.012  
0.012  
0.020  
e
L
SG Micro Corp  
TX00060.000  
www.sg-micro.com  
PACKAGE INFORMATION  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
P2  
P0  
W
Q2  
Q4  
Q2  
Q4  
Q2  
Q4  
Q1  
Q3  
Q1  
Q3  
Q1  
Q3  
B0  
Reel Diameter  
P1  
A0  
K0  
Reel Width (W1)  
DIRECTION OF FEED  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF TAPE AND REEL  
Reel Width  
Reel  
Diameter  
A0  
B0  
K0  
P0  
P1  
P2  
W
Pin1  
Package Type  
W1  
(mm)  
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant  
TDFN-3×3-10L  
13″  
12.4  
3.35  
3.35  
1.13  
4.0  
8.0  
2.0  
12.0  
Q1  
SG Micro Corp  
TX10000.000  
www.sg-micro.com  
PACKAGE INFORMATION  
CARTON BOX DIMENSIONS  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF CARTON BOX  
Length  
(mm)  
Width  
(mm)  
Height  
(mm)  
Reel Type  
Pizza/Carton  
13″  
386  
280  
370  
5
SG Micro Corp  
www.sg-micro.com  
TX20000.000  

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