SGM48524D [SGMICRO]
Dual 5A, High-Speed, Low-Side Gate Driver with Negative Input Voltage Capability;
| 型号： | SGM48524D |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | Dual 5A, High-Speed, Low-Side Gate Driver with Negative Input Voltage Capability 栅 |
| 文件： | 总8页 (文件大小：479K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM48524D
Dual 5A, High-Speed, Low-Side Gate Driver
with Negative Input Voltage Capability
GENERAL DESCRIPTION
FEATURES
The SGM48524D is a dual high-speed low-side gate
driver for power switches. It has rail-to-rail driving
capability and can sink or source up to 5A peak current
with capacitive loads. The propagation delays are very
short and well matched between the two channels that
make the device well suited for applications that need
accurate dual gate driving such as synchronous
rectifiers. The matched propagation delays also allow
for paralleling the two channels when higher driving
current is required (such as for paralleled switches).
The input voltage thresholds are fixed, independent of
supply voltage (VDD), and compatible with low voltage
TTL and CMOS logic. Noise immunity is excellent due
to the wide hysteresis window between the input low
and high thresholds. The device has internal
pull-up/pull-down resistors on the input pins to ensure
low state on the driver output when the input is floating.
● Two Independent Gate Drive Channels
● 5A Source and 5A Sink Peak Currents
● Wide Supply Voltage Range: 4.5V to 18V
● TTL and CMOS Compatible Logic Threshold
● Logic Levels Independent of Supply Voltage
● Hysteretic Input Logic for High Noise Immunity
● Outputs Held Low when Inputs are Floating
● Fast Propagation Delays: 18ns (TYP)
● Fast Rise Time: 7ns (TYP)
● Fast Fall Time: 7ns (TYP)
● Ringing Suppression
● Negative Voltage Capability on INx Pins:
-10V when (VDD - VINx) ≤ 20V
● Negative Voltage Capability on ENx Pins:
-10V when (VDD - VENx) ≤ 20V
● Negative Voltage Capability on OUTx Pin:
-2V (Pulse < 200ns)
● Protection Features
The SGM48524D is available in Green SOIC-8,
TDFN-3×3-8L and MSOP-8 (Exposed Pad) packages.
Thermal Shutdown Protection
Under-Voltage Lockout
● -40℃ to +140℃ Operating Temperature Range
● Available in Green SOIC-8, MSOP-8 (Exposed
Pad) and TDFN-3×3-8L Packages
APPLICATIONS
DC/DC Converters
Solar Power, Motor Drivers
Switched-Mode Power Supplies
Gate Drive for Emerging Wide Bandgap Devices
SG Micro Corp
MARCH 2023 – REV. A. 1
www.sg-micro.com
Dual 5A, High-Speed, Low-Side Gate Driver
with Negative Input Voltage Capability
SGM48524D
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
SGM
48524DXS8
XXXXX
SGM03F
XPMS8
XXXXX
SGM
SOIC-8
SGM48524DXS8G/TR
Tape and Reel, 4000
Tape and Reel, 4000
Tape and Reel, 4000
-40℃ to +140℃
-40℃ to +140℃
-40℃ to +140℃
MSOP-8
(Exposed Pad)
SGM48524D
SGM48524DXPMS8G/TR
SGM48524DXTDB8G/TR
TDFN-3×3-8L
03CDB
XXXXX
MARKING INFORMATION
NOTE: XXXXX = Date Code, Trace Code and Vendor Code.
X X X X X
Vendor Code
Trace Code
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS
OVERSTRESS CAUTION
VDD ................................................................... -0.3V to 20V
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
Continuous INA, INB when (VDD - VINx) ≤ 20V
................................................................. -10V to VDD + 0.3V
Continuous ENA, ENB when (VDD - VENx) ≤ 20V
................................................................. -10V to VDD + 0.3V
Continuous OUTA, OUTB (DC) .............. -0.3V to VDD + 0.3V
Pulse OUTA, OUTB (Pulse < 200ns)......... -2V to VDD + 0.3V
Package Thermal Resistance
ESD SENSITIVITY CAUTION
SOIC-8, θJA .............................................................. 121℃/W
MSOP-8 (Exposed Pad), θJA...................................... 55℃/W
TDFN-3×3-8L, θJA ...................................................... 70℃/W
Junction Temperature.................................................+150℃
Storage Temperature Range .......................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failure to observe proper handling and installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
HBM.............................................................................7000V
CDM ............................................................................1000V
RECOMMENDED OPERATING CONDITIONS
Supply Voltage Range .........................................4.5V to 18V
Operating Junction Temperature Range......-40℃ to +140℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
MARCH 2023
2
Dual 5A, High-Speed, Low-Side Gate Driver
with Negative Input Voltage Capability
SGM48524D
PIN CONFIGURATIONS
(TOP VIEW)
ENA
INA
1
2
3
4
8
7
6
5
ENB
OUTA
VDD
GND
INB
OUTB
SOIC-8
(TOP VIEW)
(TOP VIEW)
ENA
INA
1
2
3
4
8
7
6
5
ENB
1
2
3
4
8
7
6
5
ENB
ENA
INA
OUTA
VDD
OUTA
VDD
GND
GND
GND
INB
GND
INB
OUTB
OUTB
MSOP-8 (Exposed Pad)
TDFN-3×3-8L
PIN DESCRIPTION
PIN
1
NAME
ENA
INA
I/O
I
FUNCTION
Channel A Enable Input. Pull ENA high or leave it floating to enable OUTA output. Pull ENA
low to disable OUTA output, ignoring INA state.
2
I
Non-Inverting Input to Channel A. OUTA is held low if INA is unbiased or left floating.
3
GND
INB
―
I
Ground. Reference pin for all signals.
4
Non-Inverting Input to Channel B. OUTB is held low if INB is unbiased or left floating.
5
OUTB
VDD
OUTA
ENB
GND
O
I
Channel B Output.
Power Supply Input.
Channel A Output.
6
7
O
I
Channel B Enable Input. Pull ENB high or leave it floating to enable OUTB output. Pull ENB
low to disable OUTB output, ignoring INB state.
8
Exposed
Pad
Exposed Pad. It is internally connected to GND. Connect it to a large ground plane to maximize
thermal performance; not intended as an electrical connection point.
―
NOTE: I: input, O: output.
SG Micro Corp
www.sg-micro.com
MARCH 2023
3
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOIC-8
0.6
D
e
2.2
E1
E
5.2
b
1.27
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
c
θ
A2
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
1.750
0.250
1.550
0.510
0.250
5.100
4.000
6.200
MIN
MAX
0.069
0.010
0.061
0.020
0.010
0.200
0.157
0.244
A
A1
A2
b
1.350
0.100
1.350
0.330
0.170
4.700
3.800
5.800
0.053
0.004
0.053
0.013
0.006
0.185
0.150
0.228
c
D
E
E1
e
1.27 BSC
0.050 BSC
L
0.400
0°
1.270
8°
0.016
0°
0.050
8°
θ
NOTES:
1. Body dimensions do not include mode flash or protrusion.
2. This drawing is subject to change without notice.
SG Micro Corp
TX00010.000
www.sg-micro.com
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
MSOP-8 (Exposed Pad)
D1
1.80
E1
E
E2
1.55 4.8
1.02
b
e
0.65
0.41
RECOMMENDED LAND PATTERN (Unit: mm)
D
L
A
c
A1
θ
A2
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
MIN
MAX
0.043
0.006
0.037
0.015
0.009
0.122
0.075
A
A1
A2
b
0.820
0.020
0.750
0.250
0.090
2.900
1.700
1.100
0.150
0.950
0.380
0.230
3.100
1.900
0.032
0.001
0.030
0.010
0.004
0.114
0.067
c
D
D1
e
0.65 BSC
0.026 BSC
E
2.900
4.750
1.450
0.400
0°
3.100
5.050
1.650
0.800
6°
0.114
0.187
0.057
0.016
0°
0.122
0.199
0.065
0.031
6°
E1
E2
L
θ
NOTES:
1. Body dimensions do not include mode flash or protrusion.
2. This drawing is subject to change without notice.
SG Micro Corp
TX00016.000
www.sg-micro.com
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-3×3-8L
D
e
N8
D1
k
E
E1
N4
N1
L
b
BOTTOM VIEW
TOP VIEW
2.3
1.5 2.725
A
A1
A2
0.675
SIDE VIEW
0.65
0.24
RECOMMENDED LAND PATTERN (Unit: mm)
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
0.800
0.050
MIN
0.028
0.000
MAX
0.031
0.002
A
A1
A2
D
0.700
0.000
0.203 REF
0.008 REF
2.900
2.200
2.900
1.400
3.100
2.400
3.100
1.600
0.114
0.087
0.114
0.055
0.122
0.094
0.122
0.063
D1
E
E1
k
0.200 MIN
0.650 TYP
0.008 MIN
0.026 TYP
b
0.180
0.375
0.300
0.575
0.007
0.015
0.012
0.023
e
L
NOTE: This drawing is subject to change without notice.
SG Micro Corp
TX00058.000
www.sg-micro.com
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
SOIC-8
13″
13″
13″
12.4
12.4
12.4
6.40
5.20
3.35
5.40
3.30
3.35
2.10
1.50
1.13
4.0
4.0
4.0
8.0
8.0
8.0
2.0
2.0
2.0
12.0
12.0
12.0
Q1
Q1
Q1
MSOP-8
(Exposed Pad)
TDFN-3×3-8L
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
13″
386
280
370
5
SG Micro Corp
www.sg-micro.com
TX20000.000
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