SGM48526 [SGMICRO]
Dual 5A, High-Speed, Low-Side Gate Driver with Negative Input Voltage Capability;
| 型号： | SGM48526 |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | Dual 5A, High-Speed, Low-Side Gate Driver with Negative Input Voltage Capability 栅 |
| 文件： | 总10页 (文件大小：639K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM48523/SGM48524A
SGM48525/SGM48526
Dual 5A, High-Speed, Low-Side Gate Drivers
with Negative Input Voltage Capability
GENERAL DESCRIPTION
FEATURES
The SGM48523/4A/5/6 are dual high-speed low-side
gate drivers for MOSFET and IGBT power switches.
They have rail-to-rail driving capability and can sink and
source up to 5A peak current with capacitive loads. The
propagation delays are very short and well matched
between the two channels that make the device very fit
for applications that need accurate dual gate driving
such as synchronous rectifiers. The matched
propagation delays also allow for paralleling the two
channels when higher driving current is required for
example for paralleled switches. The input voltage
thresholds are fixed, independent of supply voltage
(VDD) and are compatible with low voltage TTL and
CMOS logic. Noise immunity is excellent due to the
wide hysteresis window between the input low and high
thresholds. The devices have internal pull-up/pull-down
resistors on the input pins to ensure low state on the
driver outputs when the inputs are floating.
● Two Independent Gate Drive Channels
● 4.5V to 18V Single Supply Range (VDD)
● 5A Peak Source/Sink Pulse Current Drive
● Independent Enable Pin for Each Channel
● TTL and CMOS Compatible Logic Threshold
● Logic Levels Independent of Supply Voltage
● Hysteretic Input Logic for High Noise Immunity
● Outputs are Logic Low when Inputs are Floating
● Negative Voltage Handling Capability:
-8V DC at Inputs
-2V, 200ns Pulse for Outputs (OUTx)
● Glitch-Free Operation at Power-Up and Power-
Down: Outputs Pulled Low during Supply UVLO
● Fast Propagation Delays: 18ns (TYP)
● Fast Rise Time: 8ns (TYP)
● Fast Fall Time: 8ns (TYP)
● Delay Matching between Two Channels: 1ns (TYP)
● Channels can be Paralleled for Higher Drive Current
● -40℃ to +140℃ Operating Temperature Range
● Packaging:
The SGM48523/4A/5 offer 3 logic options: dual inverting
(SGM48523), dual non-inverting (SGM48524A), and
one inverting and one non-inverting (SGM48525). They
have independent enable pins (ENA and ENB) for each
channel with active-high logic that can be left open for
normal operation because of internal pull-up to VDD.
The SGM48526 offers a flexible dual input design
which can be configured as inverting (-INx) or
non-inverting (+INx) for each channel. Both inputs
(+INx or -INx) can control the output state. Typically,
one input is used for gate pulse and the other one is
used for enable/disable function.
SGM48523/4A/5 Available in Green SOIC-8,
MSOP-8 (Exposed Pad) and TDFN-3×3-8L
Packages
SGM48526 Available in a Green TDFN-3×3-8L
Package
APPLICATIONS
Power MOSFETs
IGBT Driving for Power Supplies
DC/DC Converters
Solar Power, Motor Drivers
Gate Drive for Emerging Wide Bandgap Devices
The SGM48523/4A/5 are available in SOIC-8, MSOP-8
(Exposed Pad) and TDFN-3×3-8L packages. The
SGM48526 is available in a Green TDFN-3×3-8L
package. They operate over a temperature range of
-40℃ to +140℃.
SG Micro Corp
JANUARY2022–REV. A
www.sg-micro.com
SGM48523/SGM48524A
SGM48525/SGM48526
Dual 5A, High-Speed, Low-Side Gate Drivers
with Negative Input Voltage Capability
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
SGM
48523XS8
XXXXX
SGM48523
XPMS8
XXXXX
SGM
48523DB
XXXXX
SGM
CM9XS8
XXXXX
SGMR67
XPMS8
XXXXX
SGM
R66DB
XXXXX
SGM
48525XS8
XXXXX
SGM48525
XPMS8
XXXXX
SGM
48525DB
XXXXX
SGM
SOIC-8
SGM48523XS8G/TR
Tape and Reel, 4000
Tape and Reel, 4000
Tape and Reel, 4000
Tape and Reel, 4000
Tape and Reel, 4000
Tape and Reel, 4000
Tape and Reel, 4000
Tape and Reel, 4000
Tape and Reel, 4000
Tape and Reel, 4000
-40℃ to +140℃
-40℃ to +140℃
-40℃ to +140℃
-40℃ to +140℃
-40℃ to +140℃
-40℃ to +140℃
-40℃ to +140℃
-40℃ to +140℃
-40℃ to +140℃
-40℃ to +140℃
MSOP-8
(Exposed Pad)
SGM48523
SGM48523XPMS8G/TR
SGM48523XTDB8G/TR
SGM48524AXS8G/TR
SGM48524AXPMS8G/TR
SGM48524AXTDB8G/TR
SGM48525XS8G/TR
TDFN-3×3-8L
SOIC-8
MSOP-8
(Exposed Pad)
SGM48524A
TDFN-3×3-8L
SOIC-8
MSOP-8
(Exposed Pad)
SGM48525
SGM48526
SGM48525XPMS8G/TR
SGM48525XTDB8G/TR
SGM48526XTDB8G/TR
TDFN-3×3-8L
TDFN-3×3-8L
48526DB
XXXXX
MARKING INFORMATION
NOTE: XXXXX = Date Code, Trace Code and Vendor Code.
X X X X X
Vendor Code
Trace Code
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
SG Micro Corp
www.sg-micro.com
JANUARY 2022
2
SGM48523/SGM48524A
SGM48525/SGM48526
Dual 5A, High-Speed, Low-Side Gate Drivers
with Negative Input Voltage Capability
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
Supply Voltage, VDD........................................... -0.3V to 20V
INA, INB, ENA, ENB Voltage................................ -8V to 20V
OUTA, OUTB Voltage (DC) .....................-0.3V to VDD + 0.3V
OUTA, OUTB Voltage (Pulse < 200ns).......-2V to VDD + 0.3V
Package Thermal Resistance
SOIC-8, θJA .............................................................. 121℃/W
MSOP-8 (Exposed Pad), θJA...................................... 55℃/W
TDFN-3×3-8L, θJA...................................................... 70℃/W
Junction Temperature.................................................+150℃
Storage Temperature Range.......................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
HBM.............................................................................4000V
CDM ............................................................................1000V
RECOMMENDED OPERATING CONDITIONS
Supply Voltage Range.........................................4.5V to 18V
Input Voltage, INA, INB......................................... -2V to 18V
Enable Voltage, ENA and ENB............................. -2V to 18V
Operating Junction Temperature Range......-40℃ to +140℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
JANUARY 2022
3
SGM48523/SGM48524A
SGM48525/SGM48526
Dual 5A, High-Speed, Low-Side Gate Drivers
with Negative Input Voltage Capability
PIN CONFIGURATIONS
SGM48523 (TOP VIEW)
SGM48524A (TOP VIEW)
ENA
INA
1
2
3
4
8
7
6
5
ENB
ENA
INA
1
2
3
4
8
7
6
5
ENB
OUTA
VDD
OUTA
VDD
GND
INB
GND
INB
OUTB
OUTB
SOIC-8
SOIC-8
SGM48525 (TOP VIEW)
SGM48523/4A/5 (TOP VIEW)
ENA
INA
1
2
3
4
8
7
6
5
ENB
1
2
3
4
8
7
6
5
ENB
ENA
OUTA
VDD
INA
GND
INB
OUTA
GND
GND
INB
VDD
OUTB
OUTB
SOIC-8
MSOP-8 (Exposed Pad)
SGM48526 (TOP VIEW)
SGM48523/4A/5 (TOP VIEW)
ENA
INA
1
2
3
4
8
7
6
5
ENB
-INA
-INB
1
2
3
4
8
7
6
5
+INA
OUTA
VDD
+INB
OUTA
VDD
GND
GND
GND
INB
GND
OUTB
OUTB
TDFN-3×3-8L
TDFN-3×3-8L
SG Micro Corp
www.sg-micro.com
JANUARY 2022
4
SGM48523/SGM48524A
SGM48525/SGM48526
Dual 5A, High-Speed, Low-Side Gate Drivers
with Negative Input Voltage Capability
PIN DESCRIPTIONS
Table 1. Pin Functions of SGM48523, SGM48524A and SGM48525
PIN
1
NAME
ENA
INA
I/O
I
FUNCTION
Channel A Enable Input. Pull ENA high or leave it floating to enable OUTA output. Pull ENA low to
disable OUTA output, ignoring INA state.
Channel A Input. Inverting configuration in SGM48523/5 and non-inverting configuration in
SGM48524A. OUTA is logic low if INA is unbiased or left floating.
2
I
3
GND
INB
―
I
Ground. Reference pin for all signals.
Channel B Input. Inverting configuration in SGM48523 and non-inverting configuration in
SGM48524A/5. OUTB is logic low if INB is unbiased or left floating.
4
5
OUTB
VDD
OUTA
ENB
GND
O
I
Channel B Output.
Power Supply Input.
Channel A Output.
6
7
O
I
Channel B Enable Input. Pull ENB high or leave it floating to enable OUTB output. Pull ENB low to
disable OUTB output, ignoring INB state.
8
Exposed
Pad
―
Exposed Pad. It should be soldered to PCB board and connected to GND.
Table 2. Pin Function of SGM48526
PIN
1
NAME
-INA
I/O
I
FUNCTION
Channel A Inverting Input. When +INA is used as a non-inverting input, pull -INA down to GND to
enable OUTA output. OUTA is logic low if -INA is unbiased or left floating.
Channel B Inverting Input. When +INB is used as a non-inverting input, pull -INB down to GND to
enable OUTB output. OUTB is logic low if -INB is unbiased or left floating.
2
-INB
I
3
GND
OUTB
VDD
―
O
I
Ground. Reference pin for all signals.
Channel B Output.
4
5
Power Supply Input.
6
OUTA
+INB
+INA
GND
O
I
Channel A Output.
Channel B Non-Inverting Input. When -INB is used as an inverting input, pull +INB up to VDD to
enable OUTB output. OUTB is logic low if +INB is unbiased or left floating.
7
Channel A Non-Inverting Input. When -INA is used as an inverting input, pull +INA up to VDD to
enable OUTA output. OUTA is logic low if +INA is unbiased or left floating.
8
I
Exposed
Pad
―
Exposed Pad. It should be soldered to PCB board and connected to GND.
NOTE: I: input, O: output.
SG Micro Corp
www.sg-micro.com
JANUARY 2022
5
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOIC-8
0.6
D
e
2.2
E1
E
5.2
b
1.27
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
c
θ
A2
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
1.750
0.250
1.550
0.510
0.250
5.100
4.000
6.200
MIN
MAX
0.069
0.010
0.061
0.020
0.010
0.200
0.157
0.244
A
A1
A2
b
1.350
0.100
1.350
0.330
0.170
4.700
3.800
5.800
0.053
0.004
0.053
0.013
0.006
0.185
0.150
0.228
c
D
E
E1
e
1.27 BSC
0.050 BSC
L
0.400
0°
1.270
8°
0.016
0°
0.050
8°
θ
SG Micro Corp
www.sg-micro.com
TX00010.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
MSOP-8 (Exposed Pad)
D1
1.80
E1
E
E2
1.55 4.8
1.02
b
e
0.65
0.41
RECOMMENDED LAND PATTERN (Unit: mm)
D
L
A
c
A1
θ
A2
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
MIN
MAX
0.043
0.006
0.037
0.015
0.009
0.122
0.075
A
A1
A2
b
0.820
0.020
0.750
0.250
0.090
2.900
1.700
1.100
0.150
0.950
0.380
0.230
3.100
1.900
0.032
0.001
0.030
0.010
0.004
0.114
0.067
c
D
D1
e
0.65 BSC
0.026 BSC
E
2.900
4.750
1.450
0.400
0°
3.100
5.050
1.650
0.800
6°
0.114
0.187
0.057
0.016
0°
0.122
0.199
0.065
0.031
6°
E1
E2
L
θ
SG Micro Corp
www.sg-micro.com
TX00016.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-3×3-8L
D
e
N8
D1
k
E
E1
N4
N1
L
b
BOTTOM VIEW
TOP VIEW
2.3
1.5 2.725
A
A1
A2
0.675
SIDE VIEW
0.65
0.24
RECOMMENDED LAND PATTERN (Unit: mm)
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
0.800
0.050
MIN
0.028
0.000
MAX
0.031
0.002
A
A1
A2
D
0.700
0.000
0.203 REF
0.008 REF
2.900
2.200
2.900
1.400
3.100
2.400
3.100
1.600
0.114
0.087
0.114
0.055
0.122
0.094
0.122
0.063
D1
E
E1
k
0.200 MIN
0.650 TYP
0.008 MIN
0.026 TYP
b
0.180
0.375
0.300
0.575
0.007
0.015
0.012
0.023
e
L
SG Micro Corp
www.sg-micro.com
TX00058.000
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
SOIC-8
13″
13″
13″
12.4
12.4
12.4
6.40
5.20
3.35
5.40
3.30
3.35
2.10
1.50
1.13
4.0
4.0
4.0
8.0
8.0
8.0
2.0
2.0
2.0
12.0
12.0
12.0
Q1
Q1
Q1
MSOP-8
(Exposed Pad)
TDFN-3×3-8L
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
13″
386
280
370
5
SG Micro Corp
www.sg-micro.com
TX20000.000
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