MBT801-S [SEOUL]
surface-mount LED; 表面贴装LED
| 型号： | MBT801-S |
| 厂家： | 
Seoul Semiconductor |
| 描述： | surface-mount LED |
| 文件： | 总11页 (文件大小：454K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Specification
MBT801-S
SSC
고객명
Drawn
Approval
Approval
Rev. 00
November 2007
www.ZLED.com
MBT801-S
1. Features
2. Absolute Maximum Ratings
3. Electro Characteristics
4. Optical characteristics
5. Outline Dimension
6. Packing
7. Soldering
8. Precaution for use
9. Handling of Silicone Resin LEDs
Rev. 00
November 2007
www.ZLED.com
MBT801-S
MBT801-S
Description
Features
This surface-mount LED
comes in PLCC standard
package dimension. It has a
substrate made up of a molded
plastic reflector sitting on top
of a bent lead frame. The die is
attached within the reflector
cavity and the cavity is
• Industry Standard
PLCC SMT package
• High brightness
using AlInGaP and
InGaN dice
technologies
encapsulated by epoxy or
silicone
• Available in multiple
colors
The package design coupled
with careful selection of
component materials allow
these products to perform with
high reliability in a larger
temperature range -40℃ to
100℃. The high reliability
feature is crucial to Automotive
interior and Indoor ESS.
• High volume, high
reliability
Applications
• Interior automotive
• Electronic Signs and
Signals
• Office Automation,
Electrical Appliances,
Industrial Equipment
Rev. 09
December2006
www.ZLED.com
1. Features
• BLUE colored SMT package
• Material InGaN/SiC
• Suitable for all SMT assembly methods
Suitable for all soldering methods
• RoHS Compliant
Rev. 00
November 2007
www.ZLED.com
2. Absolute maximum ratings
Parameter
Symbol
Pd
Value
Unit
mW
mA
mA
V
Power Dissipation
Forward Current
120
IF
30
*2
Peak Forward Current
Reverse Voltage
IFM
90
VR
5
Operating Temperature
Storage Temperature
Topr
Tstg
-40 ~ +100
-40 ~ +100
oC
oC
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
*2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio.
3. Electric characteristics
Parameter
Forward Voltage
Symbol
Condition
IF =20mA
VR=5V
Min
2.7
-
Typ
3.2
-
Max
4.0
10
600
-
Unit
V
VF
IR
Reverse Current
Luminance Intensity *1
µA
IV
IF =20mA
IF =20mA
IF =20mA
IF =20mA
IF =20mA
70
-
335
465
470
23
mcd
nm
nm
nm
deg.
Peak Wavelength
λP
λd
∆λ
Dominant Wavelength
Spectral Bandwidth 50%
Viewing Angle *2
464
-
476
-
2θ
-
120
-
½
*1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of
the LED package. Luminous Intensity Measurement allowance is ±10%
*2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.
Rev. 00
November 2007
www.ZLED.com
4. Optical characteristics
Relative Luminous Intensity vs Forward Current
Forward Current vs. Forward Voltage
O
O
(Ta=25 C )
(Ta=25 C )
100
10
1
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
0
5
10
15
20
25
30
Forward Current IF [mA]
Forward Voltage VF (V)
Forward Current Derating Curve
Radiation Diagram
O
(Ta=25 C )
40
30
20
10
0
0
30
-30
60
-60
90
-90
-40
-20
0
20
40
60
80
100
120
O
Ambient Temperature TA [ C]
Rev. 00
November 2007
www.ZLED.com
5.outline dimension
Recommended Solder Pattern
1.9
2.8
0.8
2.2
0.15
Anode
Cathode
Cathode Mark
2.2
( Tolerance: ±0.2, Unit: mm )
6. packing
1.55
± 0.05
4.0±0.1
0.22±0.05
2.0±0.05
1.0±0.1
8°
3.1±0.1
2.22±0.1
11.4±0.1
9.0 ±0.3
+0
-3
180
2.0 ±0.2
LABLE
13±0.2
30°
10
22
(1) Quantity : 2000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from
the carrier tape at the angle of 10º to the carrier tape
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package
Rev. 00
November 2007
www.ZLED.com
● Reel Packing Structure
Reel
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
SIZE (mm)
TYPE
a
c
b
7inch 245 220 142
1 SIDE
c
1
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
RoHS
b
PART NUMBER :
a
SEOUL SEMICONDUCTOR CO., LTD.
Rev. 00
November 2007
www.ZLED.com
7. soldering
(1) Lead Solder
Lead Solder
Lead Solder
o
o
2.5~5 C / sec.
240 C Max.
10 sec. Max.
Pre-heat
120~150℃
Pre-heating
Pre-heat time
120 sec. Max.
240℃ Max.
10 sec. Max.
o
60sec. Max.
120~150 C
2.5~5 C / sec.
o
Above 200 C
Peak-Temperature
Soldering time Condition
120sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
o
Lead Free Solder
150~200℃
o
1~5 C / sec.
260 C Max.
10 sec. Max.
Pre-heat
Pre-heating
o
Pre-heat time
120 sec. Max.
260℃ Max.
60sec. Max.
o
150~200
C
1~5 C / sec.
o
Above 220 C
Peak-Temperature
Soldering time Condition
10 sec. Max.
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the encapsulated
part.
So when using the chip mounter, the picking up nozzle that does not affect
the silicone resign should be used.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Rev. 00
November 2007
www.ZLED.com
8. precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a
desicator) with a desiccant. Otherwise, to store them in the following
environment is recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 70%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may
affect the light transmission efficiency, causing the light intensity to drop. Attention
in followed; Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 10%
(3) In the case of more than 1 week passed after opening or change color of
indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC.
(4) Any mechanical force or any excess vibration shall not be accepted to apply
during cooling process to normal temperature after soldering.
(5) Quick cooling shall be avoided.
(6) Components shall not be mounted on warped direction of PCB.
(7) Anti radioactive ray design is not considered for the products.
(8) This device should not be used in any type of fluid such as water, oil, organic
solvent etc. When washing is required, IPA should be used.
(9) When the LEDs are illuminating, operating current should be decided after
considering the ambient maximum temperature.
(10) The LEDs must be soldered within seven days after opening the moisture-proof
packing.
(11) Repack unused products with anti-moisture packing, fold to close any opening
and then store in a dry place.
(12) The appearance and specifications of the product may be modified for
improvement without notice.
Rev. 00
November 2007
www.ZLED.com
9. Handling of Silicone Resin LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as
possible. Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies
to LEDs without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure on the
surface of the resin must be prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs.
These conditions must be considered during the handling of such devices. Compared to
standard encapsulants, silicone is generally softer, and the surface is more likely to
attract dust.
As mentioned previously, the increased sensitivity to dust requires special care
during processing. In cases where a minimal level of dirt and dust particles cannot be
guaranteed, a suitable cleaning solution must be applied to the surface after the
soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it
must be assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the
LED.
Rev. 00
November 2007
www.ZLED.com
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