STT6601 [SECOS]

N & P-Channel Enhancement Mode Mos.FET; N' P沟道增强模式Mos.FET
STT6601
型号: STT6601
厂家: SECOS HALBLEITERTECHNOLOGIE GMBH    SECOS HALBLEITERTECHNOLOGIE GMBH
描述:

N & P-Channel Enhancement Mode Mos.FET
N' P沟道增强模式Mos.FET

文件: 总6页 (文件大小:490K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
STT6601  
(N-Ch) 2.8 A, 30 V, RDS(ON) 68 mΩ  
(P-Ch) -2.8 A, -30 V, RDS(ON) 120 mΩ  
N & P-Channel Enhancement Mode Mos.FET  
Elektronische Bauelemente  
RoHS Compliant Product  
A suffix of “-C” specifies halogen and lead-free  
DESCRIPTION  
The STT6601 is the N and P Channel enhancement mode power FET produced using high cell-density, DMOS trench  
technology. This high density process is especially tailored to minimize on-state resistance and provide superior switching  
performance. These devices are particularly suited for low voltage applications such as notebook computer power management  
and other battery-powered circuits where high-side switching, low in-line power loss and resistance to transients are needed.  
FEATURES  
APPLICATIONS  
z N-Channel  
z Battery powered systems  
z Portable devices  
30V/2.8A, RDS(ON) = 68mΩ@VGS = 10 V  
z Power management in NB  
z DC to DC converter, load switch, DSC,  
LCD display inverter  
30V/2.3A, RDS(ON) = 78mΩ@VGS = 4.5 V  
30V/1.5A, RDS(ON) = 108mΩ@VGS = 2.5 V  
z P-Channel  
-30V/-2.8A, RDS(ON) = 105mΩ@VGS = 10 V  
-30V/-2.5A, RDS(ON) = 120mΩ@VGS = 4.5 V  
-30V/-1.5A, RDS(ON) = 150mΩ@VGS = 2.5 V  
z Super high density cell design for extremely low RDS(ON)  
z Exceptional on-resistance and maximum DC current capability  
z TSOP-6P package design  
PACKAGE DIMENSIONS  
Millimeter  
Min. Max.  
1.10 Max  
Millimeter  
Min. Max.  
REF.  
REF.  
0.45 Ref  
A
A1  
A2  
c
D
E
L
L1  
0
0.10  
1.00  
0.60 Ref  
0.70  
0°  
0.30  
10°  
0.12 Ref  
0.50  
b
e
e1  
2.70  
2.60  
1.40  
3.10  
3.00  
1.80  
0.95 Ref  
1.90 Ref  
Week code: A~Z (1~26); a ~ z (27 ~ 52)  
E1  
ABSOLUTE MAXIMUM RATINGS  
Ratings  
Parameter  
Symbol  
Unit  
N-Channel  
P-Channel  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
ID @TA=25  
ID @TA=70℃  
IDM  
30  
±12  
2.8  
2.3  
10  
-30  
±12  
-2.8  
-2.1  
V
V
Continuous Drain Current (TJ=150)  
Pulsed Drain Current  
A
A
-8  
PD @TA=25℃  
PD @TA=70℃  
IS  
1.15  
0.75  
Power Dissipation  
W
Continuous Source Current (Diode Conduction)  
Thermal Resistance- Junction to Ambient  
1.25  
50  
90  
-1.4  
52  
90  
A
T 10 sec  
RθJA  
/W  
Steady State  
Operating Junction and Storage Temperature Range  
Tj, Tstg  
-55 ~ +150  
01-June-2007 Rev. C  
Page 1 of 6  
STT6601  
(N-Ch) 2.8 A, 30 V, RDS(ON) 68 mΩ  
(P-Ch) -2.8 A, -30 V, RDS(ON) 120 mΩ  
N & P-Channel Enhancement Mode Mos.FET  
Elektronische Bauelemente  
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified)  
Parameter  
Drain-Source Breakdown  
Voltage  
Symbol Min.  
Typ.  
Max.  
Unit  
Test Conditions  
VGS=0, ID=250uA  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
30  
BVDSS  
-
-
-
-
V
-30  
-
1.6  
-1.0  
-
VGS=0, ID=-250uA  
0.8  
VDS=VGS, ID=250uA  
VDS=VGS, ID=-250uA  
VDS=4.5V, ID=-6.0A  
VDS=-10V, ID=-2.8A  
VDS= 0 V, VGS=±12 V  
VDS= 0 V, VGS=±12 V  
VDS=24 V, VGS=0 V  
VDS=-24V, VGS=0 V  
VDS=24V, VGS=0 V, TJ=55℃  
VDS=-24V, VGS=0 V, TJ=55℃  
VDS 5V, VGS=10 V  
VDS -5V, VGS= -10 V  
VGS=10V, ID=2.8A  
Gate Threshold Voltage  
Forward Transconductance  
Gate Leakage Current  
V
S
VGS(th)  
-0.4  
-
4.6  
gfs  
-
4
-
-
-
-
-
-
-
-
-
-
±100  
±100  
1
nA  
IGSS  
-
-
Zero Gate Voltage Drain Current  
-
-1  
uA  
A
IDSS  
(Tj=25)  
-
10  
-10  
-
-
6
On-State Drain Current  
ID(on)  
-6  
-
-
-
0.048 0.068  
0.077 0.105  
0.054 0.078  
0.092 0.120  
0.079 0.108  
0.118 0.150  
VGS=-10V, ID=-2.8A  
VGS=4.5V, ID=2.3A  
-
Drain-Source On-Resistance  
RDS(ON)  
-
VGS=-4.5V, ID=-2.5A  
VGS=2.5V, ID=1.5A  
-
-
VGS=-2.5V, ID=-1.5A  
-
4.2  
5.8  
0.6  
0.8  
1.5  
1.5  
2.5  
6
6
-
-
-
-
-
-
-
-
-
-
-
-
-
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Qg  
-
N-Channel  
VDS=15V, VGS=4.5V , ID=2.0A  
P-Channel  
-
nC  
Qgs  
-
VDS=-15V, VGS=-4.5V ,ID=-2.0A  
-
Qgd  
-
-
Td(on)  
-
Turn-on Time  
Turn-off Time  
-
2.5  
3.9  
20  
40  
4
N-Channel  
VDD=15V  
P-Channel  
VDD=-15V  
RL=15Ω  
Tr  
-
ns RL=10Ω  
VGEN=10V  
RG=3Ω  
-
VGEN=-10V  
RG=3Ω  
Td(off)  
-
-
Tf  
-
15  
01-June-2007 Rev. C  
Page 2 of 6  
STT6601  
(N-Ch) 2.8 A, 30 V, RDS(ON) 68 mΩ  
(P-Ch) -2.8 A, -30 V, RDS(ON) 120 mΩ  
N & P-Channel Enhancement Mode Mos.FET  
Elektronische Bauelemente  
CHARACTERISTIC CURVES (N-Channel)  
01-June-2007 Rev. C  
Page 3 of 6  
STT6601  
(N-Ch) 2.8 A, 30 V, RDS(ON) 68 mΩ  
(P-Ch) -2.8 A, -30 V, RDS(ON) 120 mΩ  
N & P-Channel Enhancement Mode Mos.FET  
Elektronische Bauelemente  
01-June-2007 Rev. C  
Page 4 of 6  
STT6601  
(N-Ch) 2.8 A, 30 V, RDS(ON) 68 mΩ  
(P-Ch) -2.8 A, -30 V, RDS(ON) 120 mΩ  
N & P-Channel Enhancement Mode Mos.FET  
Elektronische Bauelemente  
CHARACTERISTIC CURVES (N-Channel)  
01-June-2007 Rev. C  
Page 5 of 6  
STT6601  
(N-Ch) 2.8 A, 30 V, RDS(ON) 68 mΩ  
(P-Ch) -2.8 A, -30 V, RDS(ON) 120 mΩ  
N & P-Channel Enhancement Mode Mos.FET  
Elektronische Bauelemente  
01-June-2007 Rev. C  
Page 6 of 6  

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