STT6601 [SECOS]
N & P-Channel Enhancement Mode Mos.FET; N' P沟道增强模式Mos.FET型号: | STT6601 |
厂家: | SECOS HALBLEITERTECHNOLOGIE GMBH |
描述: | N & P-Channel Enhancement Mode Mos.FET |
文件: | 总6页 (文件大小:490K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
STT6601
(N-Ch) 2.8 A, 30 V, RDS(ON) 68 mΩ
(P-Ch) -2.8 A, -30 V, RDS(ON) 120 mΩ
N & P-Channel Enhancement Mode Mos.FET
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen and lead-free
DESCRIPTION
The STT6601 is the N and P Channel enhancement mode power FET produced using high cell-density, DMOS trench
technology. This high density process is especially tailored to minimize on-state resistance and provide superior switching
performance. These devices are particularly suited for low voltage applications such as notebook computer power management
and other battery-powered circuits where high-side switching, low in-line power loss and resistance to transients are needed.
FEATURES
APPLICATIONS
z N-Channel
z Battery powered systems
z Portable devices
30V/2.8A, RDS(ON) = 68mΩ@VGS = 10 V
z Power management in NB
z DC to DC converter, load switch, DSC,
LCD display inverter
30V/2.3A, RDS(ON) = 78mΩ@VGS = 4.5 V
30V/1.5A, RDS(ON) = 108mΩ@VGS = 2.5 V
z P-Channel
-30V/-2.8A, RDS(ON) = 105mΩ@VGS = 10 V
-30V/-2.5A, RDS(ON) = 120mΩ@VGS = 4.5 V
-30V/-1.5A, RDS(ON) = 150mΩ@VGS = 2.5 V
z Super high density cell design for extremely low RDS(ON)
z Exceptional on-resistance and maximum DC current capability
z TSOP-6P package design
PACKAGE DIMENSIONS
Millimeter
Min. Max.
1.10 Max
Millimeter
Min. Max.
REF.
REF.
0.45 Ref
A
A1
A2
c
D
E
L
L1
0
0.10
1.00
0.60 Ref
0.70
0°
0.30
10°
0.12 Ref
0.50
b
e
e1
2.70
2.60
1.40
3.10
3.00
1.80
0.95 Ref
1.90 Ref
Week code: A~Z (1~26); a ~ z (27 ~ 52)
E1
ABSOLUTE MAXIMUM RATINGS
Ratings
Parameter
Symbol
Unit
N-Channel
P-Channel
Drain-Source Voltage
Gate-Source Voltage
VDS
VGS
ID @TA=25℃
ID @TA=70℃
IDM
30
±12
2.8
2.3
10
-30
±12
-2.8
-2.1
V
V
Continuous Drain Current (TJ=150℃)
Pulsed Drain Current
A
A
-8
PD @TA=25℃
PD @TA=70℃
IS
1.15
0.75
Power Dissipation
W
Continuous Source Current (Diode Conduction)
Thermal Resistance- Junction to Ambient
1.25
50
90
-1.4
52
90
A
T ≦ 10 sec
RθJA
℃/W
℃
Steady State
Operating Junction and Storage Temperature Range
Tj, Tstg
-55 ~ +150
01-June-2007 Rev. C
Page 1 of 6
STT6601
(N-Ch) 2.8 A, 30 V, RDS(ON) 68 mΩ
(P-Ch) -2.8 A, -30 V, RDS(ON) 120 mΩ
N & P-Channel Enhancement Mode Mos.FET
Elektronische Bauelemente
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified)
Parameter
Drain-Source Breakdown
Voltage
Symbol Min.
Typ.
Max.
Unit
Test Conditions
VGS=0, ID=250uA
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
30
BVDSS
-
-
-
-
V
-30
-
1.6
-1.0
-
VGS=0, ID=-250uA
0.8
VDS=VGS, ID=250uA
VDS=VGS, ID=-250uA
VDS=4.5V, ID=-6.0A
VDS=-10V, ID=-2.8A
VDS= 0 V, VGS=±12 V
VDS= 0 V, VGS=±12 V
VDS=24 V, VGS=0 V
VDS=-24V, VGS=0 V
VDS=24V, VGS=0 V, TJ=55℃
VDS=-24V, VGS=0 V, TJ=55℃
VDS ≧5V, VGS=10 V
VDS ≦ -5V, VGS= -10 V
VGS=10V, ID=2.8A
Gate Threshold Voltage
Forward Transconductance
Gate Leakage Current
V
S
VGS(th)
-0.4
-
4.6
gfs
-
4
-
-
-
-
-
-
-
-
-
-
±100
±100
1
nA
IGSS
-
-
Zero Gate Voltage Drain Current
-
-1
uA
A
IDSS
(Tj=25℃)
-
10
-10
-
-
6
On-State Drain Current
ID(on)
-6
-
-
-
0.048 0.068
0.077 0.105
0.054 0.078
0.092 0.120
0.079 0.108
0.118 0.150
VGS=-10V, ID=-2.8A
VGS=4.5V, ID=2.3A
-
Drain-Source On-Resistance
Ω
RDS(ON)
-
VGS=-4.5V, ID=-2.5A
VGS=2.5V, ID=1.5A
-
-
VGS=-2.5V, ID=-1.5A
-
4.2
5.8
0.6
0.8
1.5
1.5
2.5
6
6
-
-
-
-
-
-
-
-
-
-
-
-
-
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Qg
-
N-Channel
VDS=15V, VGS=4.5V , ID=2.0A
P-Channel
-
nC
Qgs
-
VDS=-15V, VGS=-4.5V ,ID=-2.0A
-
Qgd
-
-
Td(on)
-
Turn-on Time
Turn-off Time
-
2.5
3.9
20
40
4
N-Channel
VDD=15V
P-Channel
VDD=-15V
RL=15Ω
Tr
-
ns RL=10Ω
VGEN=10V
RG=3Ω
-
VGEN=-10V
RG=3Ω
Td(off)
-
-
Tf
-
15
01-June-2007 Rev. C
Page 2 of 6
STT6601
(N-Ch) 2.8 A, 30 V, RDS(ON) 68 mΩ
(P-Ch) -2.8 A, -30 V, RDS(ON) 120 mΩ
N & P-Channel Enhancement Mode Mos.FET
Elektronische Bauelemente
CHARACTERISTIC CURVES (N-Channel)
01-June-2007 Rev. C
Page 3 of 6
STT6601
(N-Ch) 2.8 A, 30 V, RDS(ON) 68 mΩ
(P-Ch) -2.8 A, -30 V, RDS(ON) 120 mΩ
N & P-Channel Enhancement Mode Mos.FET
Elektronische Bauelemente
01-June-2007 Rev. C
Page 4 of 6
STT6601
(N-Ch) 2.8 A, 30 V, RDS(ON) 68 mΩ
(P-Ch) -2.8 A, -30 V, RDS(ON) 120 mΩ
N & P-Channel Enhancement Mode Mos.FET
Elektronische Bauelemente
CHARACTERISTIC CURVES (N-Channel)
01-June-2007 Rev. C
Page 5 of 6
STT6601
(N-Ch) 2.8 A, 30 V, RDS(ON) 68 mΩ
(P-Ch) -2.8 A, -30 V, RDS(ON) 120 mΩ
N & P-Channel Enhancement Mode Mos.FET
Elektronische Bauelemente
01-June-2007 Rev. C
Page 6 of 6
相关型号:
STT6602
N-Ch: 3.3A, 30V, RDS(ON) 65 m P-Ch: -2.3A, -30V, RDS(ON) 120 m N & P-Channel Enhancement Mode Mos.FET
SECOS
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