GMI-10-1-2.00-G-10-2-P [SAMTEC]
Board Connector,;
| 型号： | GMI-10-1-2.00-G-10-2-P |
| 厂家： | 
SAMTEC |
| 描述： | Board Connector, 连接器 |
| 文件： | 总1页 (文件大小：879K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
F-217
GMI–30–2–1.27–G–10
GMI–10–2–1.27–G–10
(1.00 mm) .0394"
GMI SERIES
LOW PROFILE ONE-PIECE ARRAY
Dual compression
or single compression
with solder balls
SPECIFICATIONS
Up to
400 pins
For complete specifications and
recommended PCB layouts see
www.samtec.com?GMI
Insulator Material:
Black LCP
APPLICATION
Contact Material:
Copper Alloy
Plating:
Au over 50 µ" (1.27 µm) Ni
Operating Temp Range:
Testing Now!
(1.27 mm) .050"
with style –2 or
(2.00 mm) .079"
with style –1
Current Rating:
Testing Now!
RoHS Compliant:
Yes
PROCESSING
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0.05 mm) .002" (10-20)
(0.08 mm) .003" (30)
HIGH-SPEED CHANNEL PERFORMANCE
GMI @ 1.27 mm Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
45
or contact SIG@samtec.com
G
b
p
s
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
BOARD
SPACING
OTHER
OPTION
POSITIONS
PER ROW
SOLDER
TYPE
STYLE
PLATING ROWS
GMI
FILE NO. E111594
(Style –1 only)
(Style –1 only)
–10
–G
–1
= Single
Compression
with Solder
Ball
–1.27
= (1.27 mm)
.050"
Board space
(Style –2 only)
=Ten
= 10 µ"
APPLICATION
–2
–P
Rows
(0.25 µm)
–10, –20,
–30, –40
= Lead-Free
96.5% Sn/
= Pick &
Place Pad
Gold in
contact area
3% Ag/.5% Cu
–2
= Dual
Compression
–2.00
= (2.00 mm)
.079"
Board space
(Style –1 only)
(No. of positions x (1.00) .03937)
+ (6.80) .268
Dual compression or single
compression with solder balls
10
01
(0.90)
.035
DIA
(12.00)
.472
(9.00)
.354
(1.10)
.043
DIA
(1.10)
.043
DIA
(1.00)
.03937
(1.00)
.03937
(1.27)
.050
(1.42)
.056
(0.30)
(No. of positions x
(1.00) .03937) +
(4.00) .157
(2.00)
.079
.012
TYP
BOTH
SIDES
10 X 10
DUAL COMPRESSION
(STYLE –2)
20 X 10
SINGLE COMPRESSION WITH SOLDER BALLS
(STYLE –1)
Note: Some lengths,
styles and options are
non-standard, non-returnable.
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
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