GMI-10-2-1.27-G-10

更新时间:2024-09-18 19:00:17
品牌:SAMTEC
描述:Board Connector,

GMI-10-2-1.27-G-10 概述

Board Connector, 集管和边缘连接器

GMI-10-2-1.27-G-10 规格参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8536.69.40.40Factory Lead Time:3 weeks
风险等级:5.76连接器类型:BOARD CONNECTOR
联系完成配合:GOLD OVER NICKEL (50)联系完成终止:Gold (Au) - with Nickel (Ni) barrier
触点材料:COPPER ALLOYJESD-609代码:e4
Base Number Matches:1

GMI-10-2-1.27-G-10 数据手册

通过下载GMI-10-2-1.27-G-10数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。

PDF下载
F-217  
GMI–30–2–1.27–G–10  
GMI–10–2–1.27–G–10  
(1.00 mm) .0394"  
GMI SERIES  
LOW PROFILE ONE-PIECE ARRAY  
Dual compression  
or single compression  
with solder balls  
SPECIFICATIONS  
Up to  
400 pins  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?GMI  
Insulator Material:  
Black LCP  
APPLICATION  
Contact Material:  
Copper Alloy  
Plating:  
Au over 50 µ" (1.27 µm) Ni  
Operating Temp Range:  
Testing Now!  
(1.27 mm) .050"  
with style –2 or  
(2.00 mm) .079"  
with style –1  
Current Rating:  
Testing Now!  
RoHS Compliant:  
Yes  
PROCESSING  
Lead-Free Solderable:  
Yes  
SMT Lead Coplanarity:  
(0.05 mm) .002" (10-20)  
(0.08 mm) .003" (30)  
HIGH-SPEED CHANNEL PERFORMANCE  
GMI @ 1.27 mm Stack Height  
Rating based on Samtec reference channel.  
For full SI performance data visit Samtec.com  
45  
or contact SIG@samtec.com  
G
b
p
s
RECOGNITIONS  
For complete scope of  
recognitions see  
www.samtec.com/quality  
BOARD  
SPACING  
OTHER  
OPTION  
POSITIONS  
PER ROW  
SOLDER  
TYPE  
STYLE  
PLATING ROWS  
GMI  
FILE NO. E111594  
(Style –1 only)  
(Style –1 only)  
–10  
–G  
–1  
= Single  
Compression  
with Solder  
Ball  
–1.27  
= (1.27 mm)  
.050"  
Board space  
(Style –2 only)  
=Ten  
= 10 µ"  
APPLICATION  
–2  
–P  
Rows  
(0.25 µm)  
–10, –20,  
–30, –40  
= Lead-Free  
96.5% Sn/  
= Pick &  
Place Pad  
Gold in  
contact area  
3% Ag/.5% Cu  
–2  
= Dual  
Compression  
–2.00  
= (2.00 mm)  
.079"  
Board space  
(Style –1 only)  
(No. of positions x (1.00) .03937)  
+ (6.80) .268  
Dual compression or single  
compression with solder balls  
10  
01  
(0.90)  
.035  
DIA  
(12.00)  
.472  
(9.00)  
.354  
(1.10)  
.043  
DIA  
(1.10)  
.043  
DIA  
(1.00)  
.03937  
(1.00)  
.03937  
(1.27)  
.050  
(1.42)  
.056  
(0.30)  
(No. of positions x  
(1.00) .03937) +  
(4.00) .157  
(2.00)  
.079  
.012  
TYP  
BOTH  
SIDES  
10 X 10  
DUAL COMPRESSION  
(STYLE –2)  
20 X 10  
SINGLE COMPRESSION WITH SOLDER BALLS  
(STYLE –1)  
Note: Some lengths,  
styles and options are  
non-standard, non-returnable.  
WWW.SAMTEC.COM  
Due to technical progress, all designs, specifications and components are subject to change without notice.  

GMI-10-2-1.27-G-10 相关器件

型号 制造商 描述 价格 文档
GMI-20-2-1.27-G-10 SAMTEC Board Connector 获取价格
GMI-30-2-1.27-G-10 SAMTEC Board Connector 获取价格
GMI-40-1-2.00-G-10-2-P SAMTEC Board Connector 获取价格
GMI-40-2-1.27-G-10 SAMTEC Board Connector 获取价格
GMJ107BB7104KA8T TAIYO YUDEN Soft Termination MLCC for Telecommunications infrastructure and Industrial equipment / Medical devices 获取价格
GMJ107BB7104KAHT TAIYO YUDEN Soft Termination MLCC for Automotive 获取价格
GMJ107BB7104MA8T TAIYO YUDEN Soft Termination MLCC for Telecommunications infrastructure and Industrial equipment / Medical devices 获取价格
GMJ107BB7104MAHT TAIYO YUDEN Industrial Applications 获取价格
GMJ107BB7224KA8T TAIYO YUDEN Soft Termination MLCC for Telecommunications infrastructure and Industrial equipment / Medical devices 获取价格
GMJ107BB7224KAHT TAIYO YUDEN Soft Termination MLCC for Automotive 获取价格

GMI-10-2-1.27-G-10 相关文章

  • Bourns 密封通孔金属陶瓷微调电位计产品选型手册(英文版)
    2024-09-20
    5
  • Bourns 精密环境传感器产品选型手册(英文版)
    2024-09-20
    8
  • Bourns POWrTher 负温度系数(NTC)热敏电阻手册 (英文版)
    2024-09-20
    8
  • Bourns GMOV 混合过压保护组件产品选型手册(英文版)
    2024-09-20
    6