23-21UBGC/TR8 [ROITHNER]
Reverse Package Chip LED; 反向套餐LED芯片
| 型号： | 23-21UBGC/TR8 |
| 厂家： | 
Roithner LaserTechnik GmbH |
| 描述： | Reverse Package Chip LED |
| 文件： | 总8页 (文件大小：120K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Device Numberʚ
ECNʚ
23-21UBGC/TR8
MODEL NO:
DSE-231-009 REV. 1.0
Reverse Package Chip LED
Page: 1/8
ʓʓʓʓ
͙ Package Dimensionsʚ
͙ Featuresʚ
z Package in 8mm tape on 7“ diameter
reel.
z Compatible with automatic placement
equipment.
z Compatible with infrared and vapor
phase reflow solder process.
z Mono-color type.
͙ Descriptionʚ
z
The 23-21 SMD Taping is much smaller than
leaded components, thus enable smaller board
size, higher packing density, reduced storage space
and finally smaller equipment to be obtained.
z
Besides, lightweight makes them ideal for
miniature application, etc.
ˮ Notesʚ
͙ Applicationsʚ
Tolerances Unless Dimension ̄0.1mm
Anglē0.5͈
z
z
z
z
Automotive: backlighting in dashboard and switch.
Telecommunication: indicator and backlighting in telephone and fax.
Flat backlight for LCD, switch and symbol.
General use.
Unit = mm
CHIP
PART NO
Lens Color
Material
Emitted Color
GaN/SiC
Substrate
Super Blue
Green
Water Clear
23-21UBGC/TR8
Device Numberʚ
ECNʚ
23-21UBGC/TR8
MODEL NO:
DSE-231-009 REV. 1.0
Reverse Package Chip LED
Page: 2/8
ʓʓʓʓ
ˮ Package Dimensionsʚ
ˮ Loaded quantity per reel 2000 pcs/reelʚ
Device Numberʚ
ECNʚ
23-21UBGC/TR8
MODEL NO:
DSE-231-009 REV. 1.0
Reverse Package Chip LED
Page: 3/8
ʓʓʓʓ
ˮ Absolute Maximum Ratings at Ta = 25̺ :
Parameter
Symbol
Vr
Rating
Unit
V
5
30
Reverse Voltage
Forward Current
If
mA
̺
-20 ~ +80
-30 ~ +90
260 (for 5 second)
1000
Topr
Tstg
Tsol
ESD
Pd
Operating Temperature
Storage Temperature
Soldering Temperature
Electrostatic Discharge
Power Dissipation
̺
̺
V
120
mW
Peak Forward
Current(Duty 1/10 @
1KHZ)
100
If(Peak)
mA
ˮ Electronic Optical Characteristics :
Parameter
Symbol
Iv
Min.
-----
34
Typ.
3
Max.
-----
-----
-----
-----
Unit
Condition
If=2mA
Luminous intensity
mcd
mcd
deg
nm
58
If=20mA
If=20mA
If=20mA
Viewing Angle
2ϰ1/2
ϳp
-----
-----
130
502
Peak Wavelength
Dominant
ϳd
-----
-----
505
30
-----
-----
nm
nm
If=20mA
If=20mA
Wavelength
Spectrum Radiation
Bandwidth
˦ϳ
Forward Voltage
Reverse Current
Vf
Ir
V
If=20mA
Vr=5V
-----
-----
3.5
4.0
50
-----
ϴA
Device Numberʚ
ECNʚ
23-21UBGC/TR8
MODEL NO:
DSE-231-009 REV. 1.0
Reverse Package Chip LED
Page: 4/8
ʓʓʓʓ
ˮ Reliability Test Item And Condition :
Test
Sample
NO
Item
Test Conditions
Ac/Re
0/1
Hours/Cycle
5 SEC
Size
1
Solder Heat
TEMP : 260̺ ̄ 5 ̺
76 Pcs
H : +85̺ 30min
̝ 5 min
2
3
Temperature Cycle
Thermal Shock
50 CYCLE 76 Pcs
50 CYCLE 76 Pcs
0/1
0/1
L : -55̺ 30min
H : +100̺ 5min
̝ 10 sec
L : -10̺ 5min
4
5
6
High Temperature Storage
Low Temperature Storage
DC Operating Life
TEMP : 100̺
TEMP : -55̺
If = 20 mA
1000 HRS 76 Pcs
1000 HRS 76 Pcs
1000 HRS 76 Pcs
0/1
0/1
0/1
High Temperature /
High Humidity
7
85̺/85% RH
1000 HRS 76 Pcs
0/1
Device Numberʚ
ECNʚ
23-21UBGC/TR8
MODEL NO:
DSE-231-009 REV. 1.0
Reverse Package Chip LED
Page: 5/8
ʓʓʓʓ
ˮ Typical Electro-Optical Characteristic Curves :
Device Numberʚ
ECNʚ
23-21UBGC/TR8
MODEL NO:
DSE-231-009 REV. 1.0
Reverse Package Chip LED
Page: 6/8
ʓʓʓʓ
ˮ Test Circuit :
R
LED
ˮ Precautions For Use :
1. Over-current-proof
Customer must apply resistors for protection , otherwise slight voltage shift will cause
big current change ( Burn out will happen ).
2. Storage time
2.1 The operation of temperature and R.H. are : 5̺~35̺, R.H.60%.
2.2 Once the package is opened, the products should be used within a week.
Otherwise, they should be keeping in a dampproof box with desiccants.
Considering the tape life , we suggest our customers to use our products
within a year(from production date).
2.3 If opened more than one week in an atmosphere 5̺~35̺, R.H.60%,
they should be treated at 60̺̄5̺for 15hrs.
2.4 When you discover that the desiccant in the package has a pink color
(normal = blue) , you should treat them in the same conditions as 2.3.
Device Numberʚ
ECNʚ
23-21UBGC/TR8
MODEL NO:
DSE-231-009 REV. 1.0
Reverse Package Chip LED
Page: 7/8
ʓʓʓʓ
ˮ Soldering heat reliability ( DIP ) :
Please refer to the following figure :
ˮ Soldering Iron :
Basic spec is ̉5 sec when 260̺.If temperature is higher, time should be shorter (+10̺
̨ -1sec). Power dissipation of iron should be smaller than 15 W , and temperature should
be controllable. Surface temperature of the device should be under 230 ̺.
ˮ Rework :
1. Customer must finish rework within 5 sec under 260̺.
2. The head of iron can not touch copper foil.
3. Twin-head type is preferred.
ˤ
̂
Device Numberʚ
ECNʚ
23-21UBGC/TR8
MODEL NO:
DSE-231-009 REV. 1.0
Reverse Package Chip LED
Page: 8/8
ʓʓʓʓ
ˮ Reflow Temp / Timeʚ
cooling
to rise
preheat
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