BV1HD045EFJ-C_技术文档

Datasheet

IPD Series

Automotive 1ch 45 mΩ High-Side Switch

with Variable OCD and OCD Mask Function

BV1HD045EFJ-C

General Description

Key Specifications

BV1HD045EFJ-C is a 1-ch high-side switch for

automotive application. It has built-in over current

protection function, thermal shutdown protection function,

open load detection function and under voltage lockout

function. It is equipped with diagnostic output function for

abnormality detection. Since this IC can arbitrarily set the

over current protection value and the time until the limit is

set by an external component, the optimum over current

protection for the load can be easily realized.

◼ Power Supply Voltage Operating Range: 6 V to 28 V

◼ On Resistance (Tj=25°C):

◼ Over Current Limit:

◼ Standby Current (Tj=25°C):

45 mΩ (Typ)

21 A (Min)

0.5 μA (Max)

◼ Active Clamp Tolerance (Tj_{(START )}= 25 °C): 50 mJ

Package

HTSOP-J8

W (Typ) x D (Typ) x H (Max)

4.9 mm x 6.0 mm x 1.0 mm

Features

◼

Dual TSD^{(Note 1)}

AEC-Q100 Qualified^{(Note 2)}

Built-in Variable Over Current Limit Function

Built-in Variable Over Current Mask Time Setting

Function.

◼

Built-in Open Load Detection Function.

Built-in Under Voltage Lockout Function (UVLO)

Built-in Diagnostic Output

Low On-Resistance R_ON= 45 mΩ (Typ)

Monolithic Power Management IC with Control Unit

(CMOS) and Power MOSFET on a Single Chip

Low Voltage Operation (V_BB= 4.3 V)

HTSOP-J8

◼

(Note 1) This IC has thermal shutdown (Junction temperature detect)

and ΔTj Protection (Power-MOS steep temperature rising

detect).

(Note 2) Grade 1

Applications

Resistive Load, Inductive Load, Capacitive Load

◼

Typical Application Circuit

R_STPU

VBB

C_VBB

R_IN

IN

OUT

R_ST

ST

MCU

R_L

BV1HD045EFJ-C

DLY

SET

CDLY

GND

R_SET

R_GND

D_GND

〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.

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Table of Contents

General Description........................................................................................................................................................................1

Features..........................................................................................................................................................................................1

Applications ....................................................................................................................................................................................1

Key Specifications ..........................................................................................................................................................................1

Package..........................................................................................................................................................................................1

Typical Application Circuit ...............................................................................................................................................................1

Table of Contents............................................................................................................................................................................2

Pin Configuration ............................................................................................................................................................................3

Pin Description................................................................................................................................................................................3

Block Diagram ................................................................................................................................................................................3

Definition.........................................................................................................................................................................................4

Absolute Maximum Ratings ............................................................................................................................................................5

Thermal Resistance........................................................................................................................................................................6

Recommended Operating Conditions...........................................................................................................................................10

Electrical Characteristics...............................................................................................................................................................10

Typical Performance Curves.........................................................................................................................................................12

Measurement Circuit.....................................................................................................................................................................17

Timing Chart (Propagation Delay Time)........................................................................................................................................19

Function Description.....................................................................................................................................................................20

1.

2.

3.

4.

5.

Protection Function.........................................................................................................................................................20

Over Current Protection..................................................................................................................................................21

Open Load Detection......................................................................................................................................................24

Thermal Shutdown, ΔTj Protection Detection.................................................................................................................25

Other Protection .............................................................................................................................................................26

Applications Example ...................................................................................................................................................................27

I/O Equivalence Circuits................................................................................................................................................................28

Operational Notes.........................................................................................................................................................................29

Ordering Information.....................................................................................................................................................................31

Marking Diagram ..........................................................................................................................................................................31

Physical Dimension and Packing Information...............................................................................................................................32

Revision History............................................................................................................................................................................33

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Pin Configuration

Pin Description

Pin No.

Pin Name

DLY

Function

Over current mask time setting pin

GND pin

1

2

GND

ST

3

Diagnostic output pin

4

5 to 7

8

IN

Input pin, with internal pull-down resistor

Output pin

OUT

SET

VBB

Over current limit value setting pin

Power supply pin

EXP-PAD

Block Diagram

VBB

lnternal

Supply

Active

Charge

Pump

Clamp

Gate Driver

IN

OCD

Over Current

Detction

ΔTj Protection

Control

Logic

Thermal

Shut Down

ST

Open Lead

Detection

Internal Supply

UVLO

OUT

Variable

Over Current

Limit Mask

DLY

Time Setting

OCD

SET

GND

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Definition

I_BB

VBB

V_DSV_BB

I_IN

IN

I_OUT

OUT

ST

V_OUT

I_ST

I_SET

I_DLY

SET

DLY

V_ST

GND

I_GND

Figure 1. Voltage and Current Definition

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Absolute Maximum Ratings (Ta = 25 °C)

Parameter

Symbol

Rating

Unit

VBB - OUT Voltage

V_DS

V_BB

-0.3 to Internal clamp^{(Note 1)}

-0.3 to +40

V

Power Supply Voltage

Set Voltage

V_SET

V_IN, V_DLY

V_ST

-0.3 to V_BB+0.3

-0.3 to +7.0

Internal limit^{(Note 2)}

10

V

Input Voltage

V

Diagnostic Output Voltage

Output Current

V

I_OUT

A

Diagnostic Output Current

Storage Temperature Range

Maximum Junction Temperature

I_ST

mA

°C

Tstg

-55 to +150

150

Tjmax

Active Clamp Energy (Single Pulse)

Tj_(START)= 25 °C, I_OUT= 4 A^{(Note 3)(Note 4)}

E_{AS (25 °C)}

E_{AS (150 °C)}

V_BBLIM

50

25

24

mJ

V

Active Clamp Energy (Single Pulse)

Tj_(START)= 150 °C, I_OUT= 4 A^{(Note 3)(Note 4)}

Supply Voltage

for Short Circuit Protection^{(Note 5)}

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

(Note 1) Internally limited by output clamp voltage.

(Note 2) Internally limited by fixed over current limit.

(Note 3) Maximum active clamp energy using single pulse of IOUT(START) = 4 A and VBB = 14 V.

When IC is turned off in the condition that inductive load is connected, the OUT pin is fell below 0 V. This energy is dissipated by BV1HD045EFJ-C.

This energy can be calculated with following equation:

푅_ꢀ× 퐼_{푂푈푇ꢁ푆푇퐴ꢂ푇)}

푉_퐵퐵− 푉_퐷푆

퐿

푉_퐵퐵− 푉_퐷푆

푅_ꢀ

퐸_퐴푆= 푉_퐷푆×

× [

× 푙푛 (1 −

ꢃ + 퐼_{푂푈푇ꢁ푆푇퐴ꢂ푇)}

]

푅_ꢀ

Following equation simplifies under the assumption of R_L= 0 Ω.

1

푉_퐵퐵

푉_퐵퐵− 푉_퐷푆

ꢄ

퐸_퐴푆= × 퐿 × 퐼_{푂푈푇ꢁ푆푇퐴ꢂ푇)}× ꢁ 1 −

2

)

(Note 4) Not 100% tested.

(Note 5) Maximum power supply voltage that can detect short circuit protection.

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Thermal Resistance^{(Note 1)}

Parameter

Symbol

Typ

Unit

Condition

HTSOP-J8

(Note 2)

130.3

36.8

25.9

20

°C / W

1s

2s

Between Junction and Surroundings Temperature

Thermal Resistance

(Note 3)

(Note 4)

(Note 2)

(Note 3)

(Note 4)

θ_JA

2s2p

1s

Between Junction and the top center

of the outside surface of the component package

Ψ_JT

8

2s

Thermal Characterization Parameter ^{(Note 5)}

6

2s2p

(Note 1) The thermal impedance is based on JESD51-2A (Still-Air) standard. It is used the chip of BV1HD045EFJ-C

(Note 2) JESD51-3 standard FR4 114.3 mm x 76.2 mm x 1.57 mm 1-layer (1s)

(Top copper foil: ROHM recommended Footprint + wiring to measure, 2 oz. copper.)

(Note 3)JESD51-5 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 2-layers (2s)

(Top copper foil: ROHM recommended Footprint + wiring to measure/

Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,

copper (top & reverse side) 2 oz.)

(Note 4) JESD51-5/- 7 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 4-layers (2s2p)

(Top copper foil: ROHM recommended Footprint + wiring to measure/

2 inner layers and copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,

copper (top & reverse side/inner layers) 2 oz./1 oz.)

(Note 5) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface

of the component package.

■

PCB Layout 1 layer (1s)

Footprint

300 mm²

600 mm²

1200 mm²

Figure 2. PCB Layout 1 Layer (1s)

Dimension

Value

1.57 mm ± 10 %

Board Finish Thickness

Board Dimension

76.2 mm x 114.3 mm

FR4

Board Material

Copper Thickness (Top Layer)

Copper Foil Area Dimension

0.070 mm (Cu:2 oz)

Footprint / 100 mm²/ 600 mm²/ 1200 mm²

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Thermal Resistance – continued

■

PCB Layout 2 layers (2s)

Top Layer

Bottom Layer

Top Layer

Bottom Layer

Via

Isolation Clearance Diameter : ≥0.6 mm

Cross Section

Figure 3. PCB Layout 2 Layers (2s)

Dimension

Value

1.60 mm ± 10 %

76.2 mm x 114.3 mm

FR4

Board Finish Thickness

Board Dimension

Board Material

Copper Thickness (Top/Bottom Layers)

Thermal Vias Separation/Diameter

0.070 mm (Cu +Plating)

1.2 mm / 0.3 mm

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Thermal Resistance – continued

■

PCB Layout 4 layers (2s2p)

TOP Layer

Top Layer

2nd/Bottom Layers

3rd Layer

2nd Layer

3rd Layer

Bottom Layer

Via

Isolation Clearance Diameter : ≥0.6 mm

Cross Section

Figure 4. PCB Layout 4 Layers (2s2p)

Dimension

Value

Board Finish Thickness

Board Dimension

1.60 mm ± 10 %

76.2 mm x 114.3 mm

FR4

Board Material

Copper Thickness (Top/Bottom Layers)

Copper Thickness (Inner Layers)

Thermal Vias Separation/Diameter

0.070 mm (Cu +Plating)

0.035 mm

1.2 mm / 0.3 mm

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Thermal Resistance – continued

■

Transient Thermal Resistance (Single Pulse)

Figure 5. Transient Thermal Resistance

■

Thermal Resistance (θ_JAvs Copper foil area- 1s)

Figure 6. Thermal Resistance

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Recommended Operating Conditions

Parameter

Symbol

Min

Typ

Max

Unit

Power Supply Voltage

Operating Temperature

Input Frequency

V_BB

Topr

f_IN

6

-40

-

14

-

28

+150

1

V

°C

-

kHz

Electrical Characteristics (Unless otherwise specified 6 V ≤ V_BB≤ 28 V, -40 °C ≤ Tj ≤ +150 °C)

Parameter

[Power Supply]

Symbol

Min

Typ

Max

Unit

Conditions

V_BB= 14 V, V_IN= 0 V

V_OUT= 0 V, Tj = 25 °C

-

0.5

20

5

µA

Standby Current

I_BBL

V_BB= 14 V, V_IN= 0 V

V_OUT= 0 V, Tj = 150 °C

V_BB= 14 V, V_IN= 5 V

V_OUT= open

Operating Current

I_BBH

3

mA

UVLO Detection Voltage

UVLO Hysteresis Voltage

[Input (V_IN)]

V_UVLO

-

4.3

V

V_UVHYS

0.15

0.30

0.45

High-Level Input Voltage

Low-Level Input Voltage

Input Voltage Hysteresis

High-Level Input Current

Low-Level Input Current

[Output]

V_INH

V_INL

2.8

-

V

-

1.5

-

V_INHYS

I_INH

0.3

50

-

V

-

150

+10

µA

V_IN= 5 V

V_IN= 0 V

I_INL

-10

V_BB= 8 V to 19 V, Tj = 25 °C

I_OUT= 1A

-

45

-

60

100

75

mΩ

µA

V_BB= 8 V to 19 V, Tj = 150 °C

I_OUT= 1A

Output On Resistance

Output Leak Current

R_ON

V_BB= 4.5 V, Tj = 25 °C

I_OUT= 1A

-

V_IN= 0 V,

V_OUT= 0 V, Tj = 25 °C

-

0.5

10

I_OUTL

V_IN= 0 V,

V_OUT= 0 V, Tj = 150 °C

-

µA

V_BB= 14 V, R_L= 6.5 Ω

Tj = 25 °C

Output ON Slew Rate

SR_ON

SR_OFF

t_OUTON

t_OUTOFF

V_DSCLP

-

0.3

70

50

48

1.0

175

125

55

V/µs

µs

V_BB= 14 V, R_L= 6.5 Ω

Tj = 25 °C

Output OFF Slew Rate

-

V_BB= 14 V, R_L= 6.5 Ω

Tj = 25 °C

Output ON Propagation Delay Time

Output OFF Propagation Delay Time

Output Clamp Voltage

-

V_BB= 14 V, R_L= 6.5 Ω

Tj = 25 °C

-

µs

V_IN= 0 V,

I_OUT= 10 mA

41

V

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Electrical Characteristics (Unless otherwise specified 6 V ≤ V_BB≤ 28 V, -40 °C ≤ Tj ≤ +150 °C) - continued

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

[Diagnostic Output]

Diagnostic Output Low Voltage

Diagnostic Output Leak Current

V_STL

I_STL

t_STON

t_STOFF

-

0.5

10

V

V_IN= 5 V, I_ST= 1 mA

V_IN= 0 V, V_ST= 5 V

μA

μs

Diagnostic Output ON

Propagation Delay Time

V_BB= 14 V, R_L= 6.5 Ω

Tj = 25 °C

100

50

250

125

Diagnostic Output OFF

Propagation Delay Time

V_BB= 14 V, R_L= 6.5 Ω

Tj = 25 °C

[Diagnostic Function]

Fixed Over Current Limit

I_LIMH

I_LIMSET

V_OLD

21

2.8

2.0

-30

150

-

30

4.1

3.0

-10

175

15

40

5.4

4.0

-

A

V_IN= 5 V

Variable Over Current Limit

V_IN= 5 V, R_SET= 47 kΩ

V_IN= 0 V

Open Load Detection Voltage

Open Load Detection Sink Current

Thermal Shutdown^{(Note 1)}

V

V_IN= 0 V,

V_OUT= 5 V

I_OLD

μA

°C

T_TSD

200

-

Thermal Shutdown Hysteresis^{(Note 1)}

T_TSDHYS

T_DTJ

ΔTj Protection Temperature^{(Note 1)}

-

120

-

(Note 1) Not 100% tested.

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Typical Performance Curves

(Unless otherwise specified V_BB= 14 V, V_IN= 5 V, Tj = 25 °C)

0.3

30

25

20

15

10

5

V_IN= 0V

0.2

0.1

0.0

-0.1

-0.2

-0.3

0

5

10

15

20

25

30

35

40

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Supply Voltage: V_BB[V]

Figure 7. Standby Current vs Supply Voltage

Figure 8. Standby Current vs Junction Temperature

6

5

4

3

2

1

0

6

5

4

3

2

1

0

-50

0

50

100

150

0

5

10

15

20

25

30

35

40

Supply voltage: V_BB[V]

Junction Temperature: T_j[°C]

Figure 9. Operating Current vs Supply Voltage

Figure 10. Operating Current vs Junction Temperature

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Typical Performance Curves - continued

(Unless otherwise specified V_BB= 14 V, V_IN= 5 V, Tj = 25 °C)

5

4

3

2

1

0

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

V_INH

V_INL

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature: Tj [°C]

Figure 11. UVLO Detection Voltage vs Junction Temperature

Figure 12. Input Voltage vs Junction Temperature

150

125

100

75

65

55

45

35

25

75

I_INH

50

25

I_INL

0

-50

0

50

100

150

0

5

10

15

20

25

30

35

40

Junction Temperature: Tj [°C]

Supply Voltage: V_BB[V]

Figure 13. Input Current vs Junction Temperature

Figure 14. Output ON Resistance vs Supply Voltage

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Typical Performance Curves - continued

(Unless otherwise specified V_BB= 14 V, V_IN= 5 V, Tj = 25 °C)

100

90

80

70

60

50

40

30

20

10

0

10

8

6

4

2

0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature: T_j[°C]

Junction Temperature: Tj [°C]

Figure 15. Output ON Resistance vs Junction Temperature

Figure 16. Output leak Current vs Junction Temperature

1.0

0.8

0.6

175

150

125

100

t_OUTON

75

0.4

SR_OFF

t_OUTOFF

50

SR_ON

0.2

25

0

0.0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Figure 17. Output Slew Rate vs Junction Temperature

Figure 18. Output ON, OFF Propagation Delay Time

vs Junction Temperature

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Typical Performance Curves - continued

(Unless otherwise specified V_BB= 14 V, V_IN= 5 V, Tj = 25 °C)

55

53

51

49

47

45

43

41

0.5

0.4

0.3

0.2

0.1

0.0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Figure 19. Output Clamp Voltage vs Junction Temperature

Figure 20. Diagnostic Output Low Voltage

vs Junction Temperature

6

5

4

3

2

1

0

250

200

150

t_STON

100

t_STOFF

50

0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Figure 21. Diagnostic Output ON, OFF

Propagation Delay Time vs Junction Temperature

Figure 22. Variable Over Current Limit

vs Junction Temperature

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Typical Performance Curves - continued

(Unless otherwise specified V_BB= 14 V, V_IN= 5 V, Tj = 25 °C)

1000

100

10

5

4

3

2

1

0

T_j(start)=25ºC

T_j(start)=150ºC

-50

0

50

100

150

0.1

1.0

Output Current: I_OUT[A]

10.0

Junction Temperature: Tj [ºC]

Figure 23. Open Load Detection Voltage

vs Junction Temperature

Figure 24. Active Clamp Energy vs Output Current

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Measurement Circuit

V_BB

VBB

IN

ST

SET

DLY

SET

DLY

V_IN

V_ST

V_IN

OUT

GND

Figure 25. Standby Current

Low-Level Input Current

Output Leak Current

Figure 26. Operating Current

Diagnostic Output Leak Current

V_BB

VBB

IN

VBB

IN

ST

SET

DLY

SET

DLY

V_IN

V_IN47kΩ

0.1μF

OUT

GND

1kΩ

I_OUT

Figure 27. UVLO Detection Voltage

UVLO Hysteresis Voltage

High-Level Input Voltage

Low-Level Input Voltage

Input Voltage Hysteresis

High-Level Input Current

Thermal Shutdown

Figure 28. Output ON Resistance

Output Clamp Voltage

Thermal Shutdown Hysteresis

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Measurement Circuit - continued

V_BB

VBB

IN

10kΩ

ST

Monitor

SET

DLY

SET

I_ST

V_IN

OUT

47kΩ

0.1μF

OUT

V_ST

DLY

Monitor

6.5Ω

GND

1kΩ

GND

Figure 29. Output ON Slew Rate

Output OFF Slew Rate

Figure 30. Diagnostic Output Low Voltage

Output ON Propagation Delay Time

Output OFF Propagation Delay Time

Diagnostic Output ON Propagation Delay Time

Diagnostic Output OFF Propagation Delay Time

V_BB

VBB

IN

10kΩ

ST

SET

DLY

SET

DLY

V_IN

47kΩ

OUT

V_ST

OUT

V_ST

0.1μF

GND

Monitor

V_OUT

Figure 31. Fixed Over Current Limit

Variable Over Current Limit

Figure 32. Open Load Detection Voltage

Open Load Detection Sink Current

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Timing Chart (Propagation Delay Time)

VBB

V_INH

V_INL

IN

tOUTOFF

SR_ON

80%

20%

OUT

tOUTON

SROFF

ST

t_STON

tSTOFF

Figure 33. Timing Chart

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Function Description

1. Protection Function

Table 1. Detection and Release Conditions of Each Protection Function and Diagnostic Output

Mode

Conditions

IN

ST

Standby

Operating

-

Low

High

Low

High

Low

High

Low

High

Low

High

Low

High

Low

Normal

Condition

-

Detect V_OUT≥ 3.0 V (Typ)

Release V_OUT≤ 2.6 V (Typ)

Detect V_BB≤ 4.3 V (Max)

Release V_BB≥ 4.7 V (Max)

Detect Tj ≥ 175 °C (Typ)

Release Tj ≤ 160 °C (Typ)

Detect ΔTj ≥ 120 °C (Typ)

Release ΔTj ≤ 30 °C (Typ)

Detect I_OUT≥ I_LIMSET

Open Load Detect (OLD)

Low Voltage Output OFF

(UVLO)

Thermal Shutdown (TSD)^{(Note 1)}

ΔTj Protection^{(Note 2)}

Over Current Protection (OCP)

Release I_OUT< I_LIMSET

(Note 1) Thermal shutdown is automatically restored to normal operation.

(Note 2) Protect function by detecting PowerMOS sharp increase of temperature difference with control circuit.

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Function Description – continued

2. Over Current Protection

2.1 Over Current Limiting Operation

This IC has two over current limiting functions, fixed over current limit (I_LIMH) for protecting the IC and variable over

current limit (I_LIMSET) for protecting the load. The variable over current limit (I_LIMSET) can be set by connecting an external

resistor to the SET pin. It is also possible to set the variable over current mask time (t_DLY) by connecting an external

capacitor to the DLY pin.

Timing chart for switching from fixed over current setting (I_LIMH) to variable over current limit (I_LIMSET) are shown at

Figure 34.

IN

V_SET= 1 V(Typ)

SET

0 V

①

②

③

④

I_LIMH

I_LIMSET

Normal Current

I_OUT

t_DLY

V_DLY= 0.8 V(Typ)

0 V

DLY

ST

Figure 34. Over Current Detection Timing Chart

①

②

③

④

When the load current (I_OUT) rises and exceeds variable over current limit (I_LIMSET), external capacitor C_DLYis

charged by 5 μA (Typ).

When the load current (I_OUT) more rises and exceeds fixed over current limit (I_LIMH), I_OUTis limited to fixed over

current limit value (I_LIMH) and ST = High indicating an abnormal condition.

When the DLY pin voltage V_DLYreaches 0.8 V (Typ) (after t_DLY), C_DLYis discharged. I_OUTis limited to variable over

current limit value (I_LIMSET) and ST = High indicating an abnormal condition.

When output current I_OUTbecomes less than the variable over current limit value (_LIMSET), the diagnostic output

pin (ST) is turned to low.

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Function Description – continued

2.2 Setting of Variable Overcurrent Limit Value

There are two values in the over current limit of this IC; fixed over current limit value (I_LIMH) and the variable over current

limit value (I_LIMSET) that can be set by external resistance R_SET. The variable over current limit value (I_LIMSET) set for the

value of RSET is as follows. R_SETshould be set within the range of 7.5 kΩ to 330 kΩ.

Table 2. Variable Over Current Limit for R_SET

Variable Over Current Limit (I_LIMSET) [A]

R_SET[kΩ]

Min

Typ

Max

7.5

10

7.78

11.39

15.00

6.95

4.82

3.50

2.80

1.98

1.61

1.19

0.78

0.51

10.17

7.06

5.13

4.10

2.90

2.36

1.74

1.30

1.01

13.39

9.30

6.76

5.40

3.81

3.10

2.29

1.82

1.52

20

33

47

75

100

150

220

330

100

Max

Typ

Min

10

1

0.1

1

10

100

1000

R_SET[kΩ]

Figure 35. Variable Over Current Limit vs R_SET

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Function Description – continued

2.3 Variable Over Current Limit Mask Time Setting

The variable over current mask time (t_DLY) can be set by using external capacitor C_DLY. t_DLYis the switching time from

the over current detected timing until the over current limit value (I_LIMSET) set by R_SET

.

The approximate expressions for variable over current mask time (t_DLY) are shown below.

퐶

ꢅꢆꢇ

푡_{퐷ꢀ푌_푀푎푥}= 0.28 × _ꢈꢉ

[s]

ꢊ6

푡_{퐷ꢀ푌_푇푦푝}= 0.20 × ^퐶_ꢈꢉ

ꢅꢆꢇ

ꢊ6

푡_{퐷ꢀ푌_푀푖ꢋ}= 0.12 × ^퐶_ꢈꢉ

ꢅꢆꢇ

ꢊ6

C_DLY: External Capacitor Value

t_DLY: Variable Over Current Mask Time

0.1

0.01

Max

Typ

Min

0.001

0.0001

0.001

0.01

0.1

1

C_DLY[µF]

Figure 36. Variable Over Current Mask Time vs C_DLY

2.4 The SET Pin and the DLY Pin Setting

The DLY pin can be used by GND short^{(Note 1)}or Open.

DLY = GND: The variable over current limit is disabled and only fixed over current limit is operational.

In this case, please set the SET pin OPEN or connect a resistor with 7.5 kΩ or above.

DLY = OPEN: Variable over current mask time is 10 μs or less.

(Note 1) Please short to GND of IC.

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Function Description – continued

3. Open Load Detection

VBB

Internal

Supply

Clamp

SOLD

ROLD

IN

Gate

Driver

OUT

Control

Logic

V_OLD

ST

R1

R2

V_REF

R^PD

RL

GND

Figure 37. Open Load Detection Block Diagram

Open load can be detected by connecting an external resistance R_OLDbetween power supply V_BBand output (the OUT pin)

and connecting an external pulled down resistance R_PDbetween GND and output.

To reduce the standby current of the system, an open load resistance switch S_OLDis recommended.

The resistance R_PDis 4.3 kΩ or less recommended. Because output OUT not decline to GND when R_Lvalue is large.

The value of external resistance R_OLDis decided based on used minimum power supply voltage (V_BB), external resistance

R_PDand open detection voltage V_OLD

.

The equation for calculating the R_OLDvalue is shown below.

ꢌ

×ꢂ

푃ꢅ

ꢍꢍ

푅_푂ꢀ퐷

<

− 푅_ꢏ퐷[Ω]

ꢌ

ꢎꢆꢅꢁMax)

When R_PDis 4.3 kΩ, the above formula is summarized as follows.

푅_푂ꢀ퐷< 푉_퐵퐵× 1.075 × 10³− 4.ꢐ × 10³[Ω]

R_OLDvalue is fell below the above calculated result.

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Function Description – continued

4. Thermal Shutdown, ΔTj Protection Detection

4.1 Thermal Shutdown Protection

This IC has a built-in thermal shutdown protection function. When the IC temperature is 175 °C (Typ) or more, the

output is OFF. Diagnostic output (ST) outputs High. When the IC temperature falls below the 160 °C (Typ) or less, the

output is automatically restored to normal operation.

4.2 ΔTj Protection

This IC has a built-in ΔTj protection function that turns OFF the output when the temperature difference (T_DTJ) between

the POWER-MOS unit (T_POWER-MOS) and the control unit (T_AMB) in the IC is 120 °C (Typ) or more. ΔTj protection also

has a built-in hysteresis (T_DTJHYS) that returns the output to normal state when the temperature difference becomes

30 °C (Typ) or less.

Figure 38 shows the timing chart of thermal shutdown protection and ΔTj protection during output short to GND fault.

IN

I_LIMH

I_OUT

TTSD

T_POWER-MOS

T_TSDHYS

T_AMB

T_DTJ

T_DTJHYS

TSD

Operation

ΔTj Protection Operation

ST

ΔTj Release

TSD Detect

TSD Release

ΔTj Detect

OCP Detect

Figure 38. Thermal Shutdown Protection and ΔTj Protection Timing Chart

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Function Description – continued

5. Other Protection

5.1 GND Open Protection

VBB

Internal

Supply

Clamp

IN

Gate

Driver

ROLD

OUT

Control

Logic

ST

R1

R2

V_REF

RL

GND

Figure 39. GND Open Protection Block Diagram

When the GND of the IC is open, the output switches OFF regardless of IN voltage.

(However, the self-diagnosis output ST is invalid.)

When an inductive load is connected, active clamp operates when the GND pin becomes open.

5.2 MCU I/O Protection

VBB

Internal

Supply

Clamp

IN

Gate

Driver

OUT

Control

Logic

ST

R1

MCU

R2

V_REF

RL

GND

Figure 40. MCU I/O Protection

Negative surge voltage to the IN pin, the ST pin may cause damage to the MCU's I/O pins. In order to prevent those

damages, it is recommended to insert limiting resistors between IC pins and MCU.

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Applications Example

R_STPU

VBB

C_VBB

R_IN

IN

R_OLD

OUT

R_ST

ST

MCU

R_PD

R_L

BV1HD045EFJ-C

DLY

SET

CDLY

GND

R_SET

R_GND

D_GND

Value

Symbol

Purpose

MCU Voltage: 5 V^{(Note 1)(Note 2)}

R_IN

R_ST

4.7 kΩ

Limit resistance for negative surge

Pull up ST pin to MCU power supply,

these pins are open drain output

R_STPU

10 kΩ

R_SET

C_VBB

C_DLY

R_GND

D_GND

R_PD

47 kΩ

10 µF

0.1 µF

1 kΩ

-

For variable over current limit value^{(Note 3)}

For battery line voltage spike filter

For variable over current mask time^{(Note 3)}

For current limit for reverse battery connection

BV1HD045EFJ-C protection for reverse battery connection

For output pulled down

4.3 kΩ

2 kΩ

R_OLD

For open load detection

(Note 1) Please set R_INand MCU voltage according to the rule of the electrical characteristic input department V_IN.

Particularly, when you use 3.3 V MCU, please set them to satisfy High level input voltage (V_INH).

(Note 2) GND voltage of IC rises when you use R_GNDand D_GND

.

When GND voltage of IC rises, the input voltage IN pin rises, too.

Please set a constant to satisfy the following formula and contents of Note 1 about the input voltage.

High level input voltage (V_INH) < MCU voltage – (R_IN) x High level input current (I_INH) – GND voltage

(Note 3) GND voltage of IC rises when you use R_GNDand D_GND

.

When GND voltage of IC rises, the voltage of the SET pin and the DLY pin of the variable overcurrent setting rises, too.

Please use it in consideration of rise in GND voltage.

It is available with a characteristic as it is showed in Figure 35 and Figure 36 when you connect R_SETand C_DLYto GND of IC.

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I/O Equivalence Circuits

SET

DLY

VBB

SET

DLY

20 Ω

IN

ST

9 kΩ

150 Ω

IN

ST

91 kΩ

OUT

VBB

OUT

193 kΩ

307 kΩ

Resistance values shown in the diagrams above are typical values.

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Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3.

4.

Ground Voltage

Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a voltage

below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

6.

Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing

of connections.

7.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

8.

9.

Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power

supply or ground line.

10. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

11. Thermal Shutdown Function (TSD)

This IC has a built-in thermal shutdown function that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD function that will turn OFF power output pins. When the

Tj falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD function operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD function be used in a set design or for any purpose other than protecting the IC from

heat damage.

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Operational Notes – continued

12. Over Current Protection Function (OCP)

This IC incorporates an integrated overcurrent protection function that is activated when the load is shorted. This

protection function is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection function.

13. Active Clamp Operation

The IC integrates the active clamp function to internally absorb the reverse energy which is generated when the

inductive load is turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a

load so that the reverse energy is active clamp tolerance (refer to Figure 24. Active Clamp Energy vs Output Current)

or under when inductive load is used.

14. Open Power Supply Pin

When the power supply pin (VBB) becomes open at ON (IN = High), the output is switched to OFF regardless of

input voltage. If an inductive load is connected, the active clamp operates when VBB is open and becomes the same

potential as that on the ground. At this time, the output voltage drops down to -48 V (Typ).

15. Open GND Pin

When the GND pin becomes open at ON (IN = High), the output is switched to OFF regardless of input voltage. If an

inductive load is connected, the active clamp operates when the GND pin is open.

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Ordering Information

B V 1 H D 0 4 5 E F J

-

C E 2

Package

EFJ: HTSOP-J8

Product Rank

C: Automotive product

Packaging and Forming Specification

E2: Embossed tape and reel

Marking Diagram

HTSOP-J8(TOP VIEW)

Part Number Marking

1 H D 0 4 5

LOT Number

Pin 1 Mark

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Physical Dimension and Packing Information

Package Name

HTSOP-J8

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Revision History

Date

Revision

001

Changes

04.Mar.2021

02.Mar.2023

New Release

Page 3 Modify EXP-PAD description in Pin Description.

Page 23 Note 1 about GND short is added.

Page 27 MCU voltage is defined in Applications Example.

Note 1, Note 2 and Note 3 are added.

002

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Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

,

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.004


型号：	BV1HD045EFJ-C
厂家：	ROHM
描述：	BV1HD045EFJ-C是一款车载用单通道高边开关。内置过电流保护功能、过热保护功能、负载开路检测功能、低电压时输出OFF功能，还具有检测到异常时的诊断信息输出功能。由于可以通过外置元件将过电流限值和到达限值的时间设置为任意值，因此可以轻松对负载实现更好的过电流保护。开关过电流保护
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BV1HD045EFJ-C [ROHM]

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