BV1HJ180EFJ-C [ROHM]
BV1HJ180EFJ-C是一款车载单通道高边开关。内置输出异常模式接地故障检测功能（过电流限制功能）、电源故障检测功能、负载开路检测功能和、过热保护功能、低电压时输出OFF功能，还具有检测到异常时的诊断信息输出功能。另外，还支持冷启动，在电源电压大幅下降的情况下也可工作。;
| 型号： | BV1HJ180EFJ-C |
| 厂家： | 
ROHM |
| 描述： | BV1HJ180EFJ-C是一款车载单通道高边开关。内置输出异常模式接地故障检测功能（过电流限制功能）、电源故障检测功能、负载开路检测功能和、过热保护功能、低电压时输出OFF功能，还具有检测到异常时的诊断信息输出功能。另外，还支持冷启动，在电源电压大幅下降的情况下也可工作。 开关 |
| 文件： | 总32页 (文件大小：1090K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Automotive IPD Series
1ch High Side Switch
with output abnormality detection
BV1HJ180EFJ-C
General Description
Key Specifications
BV1HJ180EFJ-C is a 1ch high side switch for automotive
application. It has a built-in overcurrent limit function,
thermal shutdown protection function, open load
detection function, low power output-OFF function and
short-to-VCC detection function. It is equipped with
diagnostic output function for abnormality detection. It
also operates in deep drop of supply voltage, so it can
deal with cold cranking.
◼
Power Supply Operating Range
ON-Resistance (Tj = 25 °C)
Overcurrent Limit
Standby Current (Tj = 25 °C)
Active Clamp Tolerance (Tj = 25 °C)
UVLO Detection Voltage
4 V to 28 V
180 mΩ (Typ)
2.0 A (Min)
0.5 μA (Max)
55 mJ
◼
◼
◼
◼
◼
(in supply voltage decreasing):
2.8 V (Max)
Package
HTSOP-J8
W (Typ) x D (Typ) x H (Max)
4.9 mm x 6.0 mm x 1.0 mm
Features
◼
Cold Cranking Support
Keeps active status of output up to 2.8 V (Max)
when power supply voltage drops
AEC-Q100 Qualified (Note 1)
Built-in Overcurrent Protection Function (OCP)
Built-in Dual TSD (Note 2)
Built-in Open Load Detection Function
Built-in Short-to-VCC Detection Function
Built-in Under Voltage Lockout Function (UVLO)
Built-in Diagnostic Output
Monolithic power management IC with control unit
(CMOS) and power MOSFET mounted on a single
chip
◼
◼
◼
◼
◼
◼
◼
◼
HTSOP-J8
(Note 1) Grade 1
(Note 2) Two type of built-in temperature protection:
Junction temperature, and Δ Tj protection that detects sudden
temperature rise of the Power-MOS
Application
◼
Resistance load, inductance load and
capacitance load for automotive application
Typical Application Circuit
RST1PU
RST2PU
VBB
CVBB
RIN
IN
RST1
ST1
ST2
MCU
BV1HJ180EFJ-C
OUT
RL
RST2
GND
RGND
DGND
○Product structure：Silicon integrated circuit ○This product has no designed protection against radioactive rays
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Contents
General Description........................................................................................................................................................................1
Features..........................................................................................................................................................................................1
Application ......................................................................................................................................................................................1
Key Specifications ..........................................................................................................................................................................1
Package..........................................................................................................................................................................................1
Typical Application Circuit ...............................................................................................................................................................1
Contents .........................................................................................................................................................................................2
Pin Configuration ............................................................................................................................................................................3
Pin Description................................................................................................................................................................................3
Block Diagram ................................................................................................................................................................................3
Definition.........................................................................................................................................................................................4
Absolute Maximum Ratings ............................................................................................................................................................5
Recommended Operating Conditions.............................................................................................................................................6
Thermal Resistance........................................................................................................................................................................6
Electrical Characteristics...............................................................................................................................................................10
Typical Performance Curves.........................................................................................................................................................11
Measurement Circuit.....................................................................................................................................................................16
Timing Chart .................................................................................................................................................................................18
Function Description.....................................................................................................................................................................19
Application Circuit Diagram...........................................................................................................................................................23
I/O Equivalence Circuits................................................................................................................................................................24
Operational Notes.........................................................................................................................................................................25
Ordering Information.....................................................................................................................................................................27
Marking Diagram ..........................................................................................................................................................................27
Physical Dimension and Packing Information...............................................................................................................................28
Revision History............................................................................................................................................................................29
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Pin Configuration
(TOP VIEW)
1
8
IN
GND
ST1
ST2
OUT
7
6
5
2
3
4
OUT
OUT
OUT
EXP-PAD = VBB
Pin Description
Pin No.
Pin Name
IN
Function
Input pin. Pull-down resistor is connected internally.
Active High to turn on the switch.
Ground pin
1
2
GND
ST1
ST2
3
4
Self–diagnostic output pin 1
Self-diagnostic output pin 2
Switch output pin
5
OUT
OUT
OUT
OUT
VBB
6
Switch output pin
7
8
Switch output pin
Switch output pin
EXP-PAD
Power input pin, switch input pin
Block Diagram
VBB
lnternal
Supply
UVLO
Charge
Pump
Clamp
IN
Gate Driver
Thermal
Shut Down
Control
Logic
Over Current
Detction
Open Load
Detection
ST1
ST2
Battery Short
Detection
OUT
GND
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Definition
IBB
VBB
VDS VBB
IOUT
OUT
IIN
IN
VOUT
IST
ST1,ST2
VST
GND
IGND
Figure 1. Voltage and Current Definition
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Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
VBB - OUT Voltage
VDS
VBB
VIN
-0.3 to +45
-0.3 to +40
-0.3 to +7.0
- 0.3 to +7.0
Internal limit (Note 1)
10
V
V
Power Supply Voltage
Input Voltage
V
Diagnostic Output Voltage
Output Current
VST
IOUT
IST
V
A
Diagnostic Output Current
Junction Temperature Width
Storage Temperature Range
Maximum Junction Temperature
mA
°C
°C
°C
Tj
-40 to +150
-55 to +150
+150
Tstg
Tjmax
Active Clamp Energy (Single Pulse)
Tj(START) = 25 °C, IOUT = 1 A(Note 2)
EAS(25 °C)
EAS(150 °C)
VBBLIM
55
25
28
mJ
mJ
V
Active Clamp Energy (Single Pulse)
Tj(START) = 150 °C, IOUT = 1 A(Note 2)
Supply Voltage
for Short Circuit Protection (Note 3)
(Note 1) Internally limited by over current limit.
(Note 2) Not 100 % tested.
(Note 3) Maximum power supply voltage that can detect short circuit protection.
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Caution 3: When IC turns off with an inductive load, reverse energy has to be dissipated in the BV1HJ180EFJ-C. This energy can be calculated by the
following equation:
1
푉퐵퐴푇
퐸퐿 = ꢀ퐼푂푈푇(푆푇퐴푅푇)ꢁ × ꢂ1 −
2
ꢃ
푉퐵퐴푇 − 푉푂푈푇(퐶퐿)
Where:
L is the inductance of the inductive load.
IOUT(START) is the output current at the time of turning off.
VOUT(CL) is the output clamp voltage.
The IC integrates the active clamp function to internally absorb the reverse energy EL which is generated when the inductive load is turned off.
When the active clamp operates, the thermal shutdown function does not work. Decide a load so that the reverse energy EL is active clamp
tolerance EAS (refer to Figure .2) or under when inductive load is used.
1000
Tj(start)=25ºC
100
Tj(start)=150ºC
10
1
0.1
1.0
10.0
Output Current (Start): IOUT(START)[A]
Figure 2. Active Clamp Energy (Single Pulse) vs Output Current (Start)
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Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Power Supply Voltage Operating
Operating Temperature
Input Frequency
VBB
Topr
fIN
4
-40
-
14
-
28
+150
1
V
°C
-
kHz
Thermal Resistance(Note 1)
Parameter
Symbol
Typ
Unit
Condition
HTSOP-J8
(Note 2)
169.8
50.7
37.8
°C/W
°C/W
°C/W
1s
2s
Between Junction and Surroundings Temperature
Thermal Resistance
(Note 3)
(Note 4)
θJA
2s2p
(Note 1) The thermal impedance is based on JESD51-2A (Still-Air) standard. It is used the chip of BV1HJ180EFJ-C
(Note 2) JESD51-3 standard FR4 114.3 mm x 76.2 mm x 1.57 mm 1-layer (1s)
(Top copper foil: ROHM recommended Footprint + wiring to measure, 2 oz. copper.)
(Note 3)JESD51-5 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 2-layers (2s)
(Top copper foil: ROHM recommended Footprint + wiring to measure/
Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,
copper (top & reverse side) 2 oz.)
(Note 4) JESD51-5/- 7 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 4-layers (2s2p)
(Top copper foil: ROHM recommended Footprint + wiring to measure/
2 inner layers and copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,
copper (top & reverse side/inner layers) 2 oz./1 oz.)
■
PCB Layout 1 layer (1s)
Footprint
300 mm2
600 mm2
1200 mm2
Figure 3. PCB Layout 1 Layer (1s)
Dimension
Value
Board Finish Thickness
Board Dimension
1.57 mm ± 10 %
76.2 mm x 114.3 mm
FR4
Board Material
Copper Thickness (Top Layer)
Copper Foil Area Dimension
0.070 mm (Cu: 2 oz)
Footprint/100 mm2/600 mm2/1200 mm2
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BV1HJ180EFJ-C
Thermal Resistance – continued
■
PCB Layout 2 layers (2s)
Top Layer
Bottom Layer
Top Layer
Bottom Layer
Via
Isolation Clearance Diameter: ≥ 0.6 mm
Cross Section
Figure 4. PCB Layout 2 Layers (2s)
Dimension
Board Finish Thickness
Board Dimension
Value
1.60 mm ± 10 %
76.2 mm x 114.3 mm
FR4
Board Material
Copper Thickness (Top/Bottom Layers)
Thermal Vias Separation/Diameter
0.070 mm (Cu +Plating)
1.2 mm/0.3 mm
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BV1HJ180EFJ-C
Thermal Resistance – continued
■
PCB Layout 4 layers (2s2p)
TOP Layer
2nd/Bottom Layers
3rd Layer
Top Layer
2nd Layer
3rd Layer
Bottom Layer
Via
Isolation Clearance Diameter: ≥0.6 mm
Cross Section
Figure 5. PCB Layout 4 Layers (2s2p)
Dimension
Value
Board Finish Thickness
Board Dimension
1.60 mm ± 10 %
76.2 mm x 114.3 mm
FR4
Board Material
Copper Thickness (Top/Bottom Layers)
Copper Thickness (Inner Layers)
Thermal Vias Separation/Diameter
0.070 mm (Cu +Plating)
0.035 mm
1.2 mm/0.3 mm
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BV1HJ180EFJ-C
Thermal Resistance – continued
■
Transient Thermal Resistance (Single Pulse)
Figure 6. Transient Thermal Resistance
■
Thermal Resistance (θJA vs Copper foil area- 1s)
Figure 7. Thermal Resistance
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Electrical Characteristics (unless otherwise specified VBB = 4 V to 28 V, Tj = -40 °C to 150 °C)
Limit
Parameter
Power Supply
Symbol
Unit
Condition
Min
Typ
Max
VBB = 14 V, VIN = 0 V,
VOUT = 0 V, Tj = 25 °C
VBB = 14 V, VIN = 0 V,
VOUT = 0 V, Tj = 150 °C
Standby current 1
Standby current 2
IBBL1
IBBL2
-
-
-
-
0.5
20
μA
μA
Operating Current
IBBH
-
-
-
3.0
4.5
2.8
mA
V
VBB = 14 V, VIN = 5 V, VOUT = open
UVLO Detection Voltage
UVLO Hysteresis
VUVLO
VUVHYS
-
-
0.45
V
Input
High Level Input Voltage
Low Level Input Voltage
Input Hysteresis
VINH
VINL
VHYS
IINH
2.1
-
-
-
V
V
-
-
0.9
-
0.15
50
-
V
High Level Input Current
Low Level Input Current
Power MOS Output
-
150
+10
μA
μA
VIN = 5 V
VIN = 0 V
IINL
-10
VBB = 8 V to 28 V, Tj = 25 °C,
IOUT = 1 A
VBB = 8 V to 28 V, Tj = 150 °C,
IOUT = 1 A
VBB = 4 V, Tj = 25 °C,
IOUT = 1 A
VBB = 2.8 V, Tj = 150 °C,
IOUT = 200 mA
Output ON Resistance 1
Output ON Resistance 2
Output ON Resistance 3
Output ON Resistance 4
RON1
RON2
RON3
RON4
-
-
-
-
180
240
400
mΩ
mΩ
mΩ
mΩ
-
-
-
300
1800
Output Leak Current 1
Output Leak Current 2
IOUTL1
IOUTL2
-
-
-
-
0.5
10
μA
μA
VIN = 0 V, VOUT = 0 V, Tj = 25 °C
VIN = 0 V, VOUT = 0 V, Tj = 150 °C
VBB = 14 V, RL = 15 Ω
VOUT = 20 % -> 80 % of VBB
VBB = 14 V, RL = 15 Ω
VOUT = 80 % -> 20 % of VBB
Output Slew Rate when ON
Output Slew Rate when OFF
SRON
-
-
0.3
0.3
1.0
1.0
V/μs
V/μs
SROFF
Propagation Delay when ON
Propagation Delay when OFF
Output Clamp Voltage
tOUTON
tOUTOFF
VDS
-
-
60
60
50
120
120
55
μs
μs
V
VBB = 14 V, RL = 15 Ω
VBB = 14 V, RL = 15 Ω
VIN = 0 V, IOUT = 10 mA
45
Diagnostics
Diagnostic Output L Voltage
Diagnostic Output Leak Current
VSTL
ISTL
-
-
-
-
0.5
10
V
IST = 1 mA
VST = 5 V
µA
Propagation Delay Time when
Diagnostic Output is ON
Propagation Delay Time when
Diagnostic Output is OFF
tSTON
-
-
100
50
200
125
µs
µs
VBB = 14 V, RL = 15 Ω
VBB = 14 V, RL = 15 Ω
tSTOFF
Protection Circuit
Overcurrent Limit Value
ILIM
2.0
3.2
4.4
A
V
V
VDS > 5 V
Short-to-VBB Detection Voltage
Open Load Detection Voltage
VSHV
VOLD
VBB-1.8 VBB-1.2 VBB-0.5
VBB = 6 V to 28 V, VIN = 0 V
VBB = 6 V to 28 V, VIN = 0 V
VBB = 6 V to 28 V, VIN = 0 V,
VOUT = 4 V
2.0
-
3.0
8
4.0
24
Open Load Detection Sink Current
IOLD
µA
Open Load Detection Time
Thermal Shutdown (Note 1)
Thermal Shutdown Hysteresis (Note 1)
tOLD
TTSD
-
150
8
200
175
15
350
200
24
µs
°C
°C
VBB = 6 V to 28 V, VIN = 5 V to 0 V
TTSDHYS
Operating Temperature Detection
TDTJ
-
90
-
°C
Value (Note 1)
(Note 1) Not 100 % tested.
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BV1HJ180EFJ-C
Typical Performance Curves
(Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C)
20
15
10
5
0.5
0.4
0.3
0.2
0.1
0.0
0
0
5
10
15
20
25
30
35
40
-50
0
50
100
150
Junction Temperature: Tj [ºC]
Power Supply Voltage: VBB [V]
Figure 8. Standby Current vs Power Supply Voltage
Figure 9. Standby Current vs Junction Temperature
4.5
4.5
3.0
1.5
0.0
3.0
1.5
0.0
-50
0
50
100
150
0
5
10
15
20
25
30
35
40
Power Supply Voltage: VBB [V]
Junction Temperature: Tj [°C]
Figure 10. Circuit Current vs Power Supply Voltage
Figure 11. Circuit Current vs Junction Temperature
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Typical Performance Curves - continued
(Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C)
4
3
2
1
0
2.5
2.0
1.5
1.0
0.5
0.0
VINH
VINL
-50
0
50
100
150
-50
0
50
100
150
Junction Temperature: Tj [°C]
Junction Temperature: Tj [°C]
Figure 12. UVLO Detection Voltage vs Junction Temperature
Figure 13. Input Voltage vs Junction Temperature
150
125
100
75
500
400
300
200
100
0
IINH
50
25
IINL
0
-50
0
50
100
150
0
5
10
15
20
25
30
35
40
Junction Temperature: Tj [°C]
Power Supply Voltage : VBB [V]
Figure 14. Input Current vs Junction Temperature
Figure 15. Output ON Resistance vs Supply Voltage
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Typical Performance Curves - continued
(Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C)
1800
1500
1200
900
10
8
6
VBB = 2.8 V
4
600
VBB = 4 V
2
300
VBB = 14 V
0
0
-50
0
50
100
150
-50
0
50
100
150
Junction Temperature: Tj [°C]
Junction Temperature: Tj [°C]
Figure 16. Output ON Resistance vs Junction Temperature
Figure 17. Output leak Current vs Junction Temperature
120
100
1.0
0.8
0.6
80
tOUTON
60
SRON
tOUTOFF
0.4
40
20
0
SROFF
0.2
0.0
-50
0
50
100
150
-50
0
50
100
150
Junction Temperature: Tj [ºC]
Junction Temperature: Tj [ºC]
Figure 18. Output Slew Rate vs Junction Temperature
Figure 19. Output ON, OFF Propagation Delay Time
vs Junction Temperature
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Typical Performance Curves - continued
(Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C)
0.5
0.4
0.3
0.2
0.1
0.0
55
53
51
49
47
45
-50
0
50
100
150
-50
0
50
100
150
Junction Temperature: Tj [ºC]
Junction Temperature: Tj [ºC]
Figure 20. Output Clamp Voltage vs
Junction Temperature
Figure 21. Diagnostic Output Low Voltage
vs Junction Temperature
200
6.4
5.6
4.8
4.0
3.2
2.4
1.6
0.8
0.0
150
100
50
tSTON
tSTOFF
0
-50
0
50
100
150
-50
0
50
100
150
Junction Temperature: Tj [ºC]
Junction Temperature: Tj [ºC]
Figure 22. Diagnostic Output ON, OFF
Propagation Delay Time vs Junction Temperature
Figure 23. Overcurrent Limit Value
vs Junction Temperature
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BV1HJ180EFJ-C
Typical Performance Curves - continued
(Unless otherwise specified VBB VBB = 14 V, IN = 5 V, Tj =25 °C)
VBB-2.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
VBB-1.6
VBB-1.2
VBB-0.8
VBB-0.4
-50
0
50
100
150
-50
0
50
100
150
Junction Temperature: Tj [ºC]
Junction Temperature: Tj [ºC]
Figure 24. Short-to-VBB Detection Voltage
vs Junction Temperature
Figure 25. Open Load Detection Voltage
vs Output Current
400
300
200
100
0
-50
0
50
100
150
Junction Temperature: Tj [ºC]
Figure 26. Open Load Detection Time
vs Junction Temperature
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BV1HJ180EFJ-C
Measurement Circuit
VBB
VBB
VBB
ST1, ST2
VBB
ST1, ST2
IN
IN
VIN
VIN
OUT
OUT
GND
GND
Figure 27. Standby Current 1/2
Figure 28.Operating Current
Low Level Input Current
Output Leak Current 1/2
Diagnostic Output Leak Current
VBB
VBB
VBB
VBB
IN
ST1, ST2
IN
ST1, ST2
VIN
OUT
VIN
OUT
GND
1 kΩ
GND
Figure 29. UVLO Detection Voltage
UVLO Hysteresis
Figure 30. Output ON Resistance 1/2/3/4
Output Clamp Voltage
High Level Input Voltage
Low Level Input Voltage
Input Voltage Hysteresis
High Level Input Current
Thermal Shutdown
Thermal Shutdown Hysteresis
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Measurement Circuit - continued
VBB
VBB
VBB
IN
VBB
ST1, ST2
IN
10 kΩ
ST1, ST2
Monitor
Monitor
IST
VIN
VIN
OUT
OUT
Monitor
GND
1 kΩ
GND
15 Ω
Figure 31. Output ON Slew Rate
Output OFF Slew Rate
Figure 32. Diagnostic Output Low Voltage
Output ON Propagation Delay Time
Output OFF Propagation Delay Time
Diagnostic Output ON Propagation Delay Time
Diagnostic Output OFF Propagation Delay Time
VBB
VBB
1 kΩ
VBB
VBB
IN
IN
10 kΩ
10 kΩ
ST1, ST2
ST1, ST2
Monitor
Monitor
VIN
OUT
GND
OUT
GND
Figure 33. Overcurrent Limit
Short to VBB Detection Voltage
Figure 34.Diagnostic Output Low Voltage
Open Load Detection Voltage
Open Load Detection Sink Current
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Timing Chart
VBB
IN
VINL
VINH
SRON
tOUTOFF
80 %
80 %
20 %
20 %
tOUTON
OUT
ST1
SROFF
tSTON
tSTOFF
ST2
Figure 35. ON/OFF Operation Timing Chart
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Function Description
1. Protection Function
Table 1. Detection and Release Conditions of Each Protection Function and Diagnostic Output
Mode
Conditions
IN
ST1
ST2
Standby
Operating
-
Low
High
Low
Low
Low
Low
High
High
High
High
High
High
High
Low
Low
High
Low
Low
High
Low
High
Low
High
Low
High
High
High
High
Low
Normal
Condition
-
Detect VOUT ≥ 3.0 V (Typ)
Release VOUT ≤ 2.4 V (Typ)
Detect VOUT ≥ VBB - 1.2 V (Typ)
Release VOUT ≤ VBB - 1.6 V (Typ)
Detect Tj ≥ 175 °C (Typ)
Release Tj ≤ 160 °C (Typ)
Detect ΔTj ≥ 90 °C (Typ)
Release ΔTj ≤ 30 °C (Typ)
Detect IOUT ≥ 3.2 A (Typ)
Release IOUT ≤ 3.2 A (Typ)
Open Load Detect (OLD)
Short-to-VBB Detection
Thermal Shutdown (TSD)
ΔTj Protection (Note 1)
High
High
High
High
High
High
High
Over Current Protection
(OCP)
(Note 1) Protect function by detecting Power-MOS sharp increase of temperature difference with control circuit.
This IC has a built-in abnormal detection function as mentioned above and outputs the abnormal condition
with ST1 and ST2 pins.
It will automatically recover when the abnormality is resolved.
ST1 outputs the diagnostic result that detects the output voltage.
ST1 change from High to Low when OUT rise more than VBB – 1.2 V (typ) during normal operation.
And change from Low to High when detect each protection or OUT is less than VBB - 1.6 V (Typ).
ST2 is output to identify the difference between Open Load Detection and Short-to-VBB Detection during
IN = Low.
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Function Description - continued
2. Overcurrent Protection
This IC has a built-in overcurrent protection function. When overcurrent flows in the output, the output current is limited
to 3.2 A (Typ) and self-diagnostic output (ST1) becomes High.
Figure 36 shows the timing chart during output short to GND fault.
3. Thermal Shutdown and ΔTj Protection
3.1 Thermal Shutdown Protection
This IC has a built-in thermal shutdown protection function. When the IC chip temperature exceeds175 °C (Typ), the
output is turned OFF and self-diagnostic output (ST1) becomes High. When the temperature goes below 160 °C
(Typ), output will self-reset and operation becomes normal.
3.2 ΔTj Protection
This IC has a built-in ΔTj protection function. When the difference (TDTJ) between the temperature (TPOWER-MOS) of
Power-MOS part in the IC and the temperature (TAMB) of the control part is 90 °C (Typ) or more, the output is turned
off.
The delta Tj protector has a built-in hysteresis that returns to normal when the temperature difference reaches 30 °C
(Typ) or less (TDTJREL).
Figure 36 shows the timing chart during output short to GND fault.
IN
ILIM
IOUT
TTSD
TPOWER-MOS
TTSDHYS
TAMB
TDTJ
TDTJREL
TSD
Operation
ΔTj Protection Operation
ST1
TSD Detect
TSD Release
Figure 36. Timing Chart during output short to GND fault
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Function Description - continued
4. Open Load Detection
VBB
VBB
Internal
Supply
Clamp
SOLD
ROLD
IN
Gate
Driver
OUT
Control
Logic
VOLD
ST
R1
R2
VREF
RL
GND
Figure 37. Open Load Detection Block Diagram
By inserting an external resistor ROLD between the power supply VBB and the output OUT, this IC detects a disconnection of
the load when the input IN is low and self-diagnostic output (ST1) becomes Low.
When the OUT voltage is higher than the Short-to-VBB Detection Voltage VBB-1.2 V (Typ), the auto-diagnostic output (ST2)
becomes Low, so that the open-load and short-to-VBB can be distinguished.
An undetected period is provided to prevent false detection immediately after the output is turned off. Therefore, it is
possible to judge the abnormality after the Open Load Detection Time 350 μs (Max) after switching the input IN to Low.
Similarly, immediately after the power supply (VBB) is turned on, the open-load and short-to-VBB are not detected for 350
μs (Max).
Also, note that if RL is large enough, the open-load may be detected without lowering the output OUT even if the input IN is
low.
The external resistance ROLD value for detecting the open-load can be calculated from the maximum value of the Open
Load Detection Voltage VOLD and the minimum value of the power supply voltage VBB used by the following equation.
ꢅ
×(푅
+푅
ꢈ(푀푖푛)
) − (ꢄꢌ(ꢍꢎꢏ) ꢐ ꢄꢁ(ꢍꢎꢏ)) [kΩ]
ꢆꢆ(푀푖푛)
ꢇ(푀푖푛)
ꢄ푂퐿퐷
<
ꢅ
ꢉꢊꢋ(Max)
ꢄ푂퐿퐷 < 푉퐵퐵(ꢍꢎꢏ) × 75 − 300 [kΩ]
To distinguish between the open-load state and the short-to-VBB state, set ROLD value to be greater than ROLD value of the
following equation and less than ROLD value of the above equation, which is obtained from the maximum value of the Short-
to-VBB Detection Voltage VSHV
.
ꢅ
×(푅
+푅
ꢈ(푀푖푛)
) − (ꢄꢌ(ꢍꢓꢏ) ꢐ ꢄꢁ(ꢍꢎꢏ)) [kΩ]
ꢆꢆ(푀푖푛)
ꢇ(푀푖푛)
ꢄ푂퐿퐷
ꢄ푂퐿퐷
>
>
ꢅ
ꢑ퐻ꢒ(Max)
ꢅ
ꢆꢆ(푀푖푛)
× 300 − 300 [kΩ]
ꢅ
ꢑ퐻ꢒ(Max)
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Function Description - continued
5. Other Detection
5.1 GND open protection
5V
VBB
Clamp
IN
Internal
supply
ST1
ST2
Control
logic
OUT
GND
Figure 38. GND Open Detection Block Diagram
When GND of the IC is open, the output is switched OFF regardless of the input voltage.
However, self-diagnostic output is not flagged. When an inductive load is connected,
the active clamp operates when the GND pin is open
5.2 MCU I/O Protection
VBB
5V
Internal
supply
Clamp
IN
ST1
ST2
Control
logic
OUT
MCU
GND
Figure 39. MCU I/O Protection
As a countermeasure to prevent damage from the surge voltage, limiting resistance is inserted in between input terminal
and MCU.
Recommended input resistance range values are 4.7 kΩ to 10 kΩ.
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Application Circuit Diagram
RST1PU
RST2PU
VBB
CVBB
RIN
IN
ROLD
OUT
RST1
ST1
ST2
MCU
BV1HJ180EFJ-C
RL
RST2
GND
RGND
DGND
Figure 40. Application Circuit Diagram
Symbol
Value
Purpose
RIN
4.7 kΩ
4.7 kΩ
10 kΩ
1 µF
Limit resistance for negative surge
Limit resistance for negative surge
RST1, RST2
RST1PU, RST2PU
CVBB
Pull up ST1/ST2 pin to MCU power supply, these pins are open drain output
For battery line voltage spike filter
RGND
1 kΩ
-
For current limit for reverse battery connection
BV1HJ180EFJ-C protection for reverse battery connection
For open load detection
DGND
ROLD
51 kΩ
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I/O Equivalence Circuits
IN
ST1, ST2
10 kΩ
10 kΩ
90 kΩ
150 Ω
ST1
ST2
IN
OUT
VBB
OUT
254.5 kΩ
245.5 kΩ
Resistance values shown in the diagrams above are typical values
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Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
4.
Ground Voltage
Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a
voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other specially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So, unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
10. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
11. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown function that prevents heat damage to the IC. Normal operation should
always be within the IC’s maximum junction temperature rating. If by any chance the rating is exceeded for a
continued period, the junction temperature (Tj) will rise which will activate the TSD function that will turn OFF power
output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD function operates in a situation that exceeds the absolute maximum ratings and therefore, under
no circumstances, should the TSD function be used in a set design or for any purpose other than protecting the IC
from heat damage.
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Operational Notes – continued
12. Over Current Protection Function (OCP)
This IC incorporates an integrated overcurrent protection function that is activated when the load is shorted. This
protection function is effective in preventing damage due to sudden and unexpected incidents. However, the IC
should not be used in applications characterized by continuous operation or transitioning of the protection function.
13. Active Clamp Operation
The IC integrates the active clamp function to internally absorb the reverse energy EL which is generated when the
inductive load is turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a
load so that the reverse energy EL is active clamp tolerance EAS (refer to Figure 2. Active Clamp Energy (Single
Pulse) vs Output Current (Start)) or under when inductive load is used.
14. OPEN Power Supply Pin
When power supply pin (VBB) becomes open at ON (IN = High), the output is switched to OFF regardless of input
voltage. If an inductive load is connected, the active clamp operates when VBB is OPEN and becomes the same
potential as that on the ground. At this time, the output voltage drops down to -50 V (Typ).
15. OPEN GND Pin
When GND pin becomes open at ON (IN = High), the output is switched to OFF regardless of the input voltage. If
an inductive load is connected, the active clamp operates when GND pin is open.
16. OUT Pin Voltage
Ensure that keep OUT pin voltage less than (VBB + 0.3 V) at any time, even during transient condition.
Otherwise malfunction or other problems can occur.
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Ordering Information
B V 1 H J 1 8 0 E F J
-
CE 2
V1: 1ch
Product Rank
H: High side switch
Package
EFJ: HTSOP-J8
C: Automotive product Packaging and
Forming Specification
E2: Embossed tape and reel
Marking Diagram
HTSOP-J8 (TOP VIEW)
Part Number Marking
1 H J 1 8 0
LOT Number
Pin 1 Mark
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Physical Dimension and Packing Information
Package Name
HTSOP-J8
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Revision History
Date
Revision
001
Changes
14.Jul.2021
New Release
P.10 Electrical Characteristics
Limit of Open Load Detection Time is changed.
Limit of Thermal Shutdown Hysteresis is changed.
P.21 Function Description
08.Oct.2021
002
Value of Open Load Detection Time is changed.
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
相关型号：
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