BU52003GUL-E2 [ROHM]
Hall Effect Sensor, -2.9mT Min, -3.7mT Max, 0.40-2.60V, CMOS, Plastic/epoxy, Square, 4 Pin, Surface Mount, ROHS COMPLIANT, VSCP-4;
| 型号： | BU52003GUL-E2 |
| 厂家： | 
ROHM |
| 描述： | Hall Effect Sensor, -2.9mT Min, -3.7mT Max, 0.40-2.60V, CMOS, Plastic/epoxy, Square, 4 Pin, Surface Mount, ROHS COMPLIANT, VSCP-4 输出元件 传感器 换能器 |
| 文件： | 总22页 (文件大小：525K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Hall ICs
Unipolar Detection
Hall ICs
No.10045ECT03
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
●Description
The unipolar Detection Hall IC detects only either the N pole or S pole.
The output turns ON (active Low) upon detection.
●Features
1) Unipolar detection
2) Micropower operation (small current using intermittent operation method)
3) Ultra-compact CSP4 package (BU52002GUL, BU52003GUL)
4) Ultra- Small outline package (BU52012NVX)
5) Small outline package (BU52012HFV, BU52013HFV)
6) Line up of supply voltage
For 1.8V Power supply voltage (BU52012NVX, BU52012HFV, BU52013HFV)
For 3.0V Power supply voltage (BU52002GUL, BU52003GUL)
7) High ESD resistance 8kV(HBM)
●Applications
Mobile phones, notebook computers, digital video camera, digital still camera, etc.
●Lineup matrix
Supply
Supply
voltage
(V)
Operate
point
Hysteresis
(mT)
Period
(ms)
current
(AVG.)
(µA)
Function Product name
Output type
Package
(mT)
※
BU52002GUL 2.40～3.30
BU52012NVX 1.65～3.60
BU52012HFV 1.65～3.30
BU52003GUL 2.40～3.30
BU52013HFV 1.65～3.30
3.7
0.8
0.9
0.9
0.8
0.9
50
50
50
50
50
6.5
3.5
3.5
6.5
3.5
VCSP50L1
SSON004X1216
HVSOF5
CMOS
COMS
CMOS
CMOS
CMOS
※
3.0
S pole
N pole
※
3.0
※
-3.7
VCSP50L1
HVSOF5
※
-3.0
※Plus is expressed on the S-pole; minus on the N-pole
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
2010.08 - Rev.C
1/19
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
●Absolute maximum ratings
BU52002GUL,BU52003GUL (Ta=25℃)
BU52012NVX (Ta=25℃)
Parameter
Symbol
Ratings
Unit
V
Parameter
Symbol
VDD
Ratings
Unit
V
1
3
Power Supply Voltage
VDD
-0.1～+4.5※
Power Supply Voltage
Output Current
-0.1～+4.5※
Output Current
IOUT
Pd
±1
mA
mW
℃
IOUT
Pd
±0.5
mA
mW
℃
2
4
※
Power Dissipation
420※
Power Dissipation
2049
Operating
Temperature Range
Operating
Temperature Range
Topr
Tstg
-40～+85
Topr
Tstg
-40～+85
Storage
Temperature Range
Storage
Temperature Range
-40～+125
℃
-40～+125
℃
※1. Not to exceed Pd
※3. Not to exceed Pd
※2. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃
(mounted on 50mm×58mm Glass-epoxy PCB)
※4. Reduced by 5.36mW for each increase in Ta of 1℃ over 25℃
(mounted on 70mm×70mm×1.6mm Glass-epoxy PCB)
BU52012HFV,BU52013HFV (Ta=25℃)
Parameter
Symbol
Ratings
Unit
V
5
-0.1～+4.5※
Power Supply Voltage
VDD
Output Current
IOUT
Pd
mA
mW
℃
±0.5
6
536※
Power Dissipation
Operating
Temperature Range
Topr
Tstg
-40～+85
Storage
Temperature Range
℃
-40～+125
※5. Not to exceed Pd
※6. Reduced by 5.36mW for each increase in Ta of 1℃ over 25℃
(mounted on 70mm×70mm×1.6mm Glass-epoxy PCB)
●Magnetic, Electrical characteristics
BU52002GUL (Unless otherwise specified, VDD=3.0V, Ta=25℃)
Limits
Parameter
Symbol
Unit
Conditions
Min.
2.4
Typ.
Max.
3.3
Power Supply Voltage
Operate Point
Release Point
Hysteresis
VDD
BopS
3.0
V
-
3.7
2.9
0.8
50
-
5.5
mT
mT
mT
ms
V
BrpS
0.8
-
BhysS
TP
-
-
100
-
Period
-
7
7
※
B<BrpS
OUT=-1.0mA
Output High Voltage
Output Low Voltage
Supply Current
VOH
VDD-0.4
I
※
BopS<B
OUT =+1.0mA
VOL
-
-
-
-
-
0.4
9
V
I
IDD(AVG)
IDD(EN)
IDD(DIS)
6.5
4.7
3.8
µA
mA
µA
Average
Supply Current
During Startup Time
-
During Startup Time Value
During Standby Time Value
Supply Current
During Standby Time
-
※7. B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
2010.08 - Rev.C
2/19
© 2010 ROHM Co., Ltd. All rights reserved.
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
BU52003GUL (Unless otherwise specified, VDD=3.0V, Ta=25℃)
Limits
Parameter
Symbol
Unit
Conditions
Min.
2.4
Typ.
Max.
3.3
Power Supply Voltage
Operate Point
Release Point
Hysteresis
VDD
BopN
3.0
V
-5.5
-3.7
-2.9
0.8
50
-
-
mT
mT
mT
ms
V
BrpN
-
-0.8
BhysN
TP
-
-
100
-
Period
-
8
8
※
BrpN<B
OUT=-1.0mA
Output High Voltage
Output Low Voltage
Supply Current
VOH
VDD-0.4
I
※
B<BopN
OUT =+1.0mA
VOL
-
-
-
-
-
0.4
9
V
I
IDD(AVG)
IDD(EN)
IDD(DIS)
6.5
4.7
3.8
µA
mA
µA
Average
Supply Current
During Startup Time
-
During Startup Time Value
During Standby Time Value
Supply Current
During Standby Time
-
※8. B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
2010.08 - Rev.C
3/19
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
BU52012NVX (Unless otherwise specified, VDD=1.80V, Ta=25℃)
Limits
Parameter
Symbol
Unit
Conditions
Min.
1.65
Typ.
Max.
3.60
Power Supply Voltage
Operate Point
VDD
BopS
1.80
V
-
3.0
2.1
0.9
50
-
5.0
mT
mT
mT
ms
V
Release Point
BrpS
0.6
-
Hysteresis
BhysS
-
-
Period
TP
-
100
9
9
※
※
B<BrpS
OUT =-0.5mA
Output High Voltage
Output Low Voltage
Supply Current 1
VOH
VDD-0.2
-
I
BopS<B
OUT =+0.5mA
VOL
-
-
-
-
-
-
-
-
0.2
V
I
IDD1(AVG)
IDD1(EN)
IDD1(DIS)
IDD2(AVG)
IDD2(EN)
IDD2(DIS)
3.5
2.8
1.8
8.0
5.3
5.2
5.5
µA
mA
µA
µA
mA
µA
VDD=1.8V, Average
VDD=1.8V,
Supply Current
During Startup Time 1
-
During Startup Time Value
Supply Current
During Standby Time 1
VDD=1.8V,
-
During Standby Time Value
Supply Current 2
12.5
VDD=3.0V, Average
Supply Current
During Startup Time 2
VDD=3.0V,
-
-
During Startup Time Value
Supply Current
During Standby Time 2
VDD=3.0V,
During Standby Time Value
※9. B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
2010.08 - Rev.C
4/19
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
BU52012HFV (Unless otherwise specified, VDD=1.80V, Ta=25℃)
Limits
Parameter
Symbol
Unit
Conditions
Min.
1.65
Typ.
Max.
3.30
Power Supply Voltage
Operate Point
VDD
BopS
1.80
V
-
3.0
2.1
0.9
50
-
5.0
mT
mT
mT
ms
V
Release Point
BrpS
0.6
-
Hysteresis
BhysS
-
-
Period
TP
-
100
10
10
※
B<BrpS
OUT =-0.5mA
Output High Voltage
Output Low Voltage
Supply Current 1
VOH
VDD-0.2
-
0.2
5.5
-
I
※
BopS<B
OUT =+0.5mA
VOL
-
-
-
-
-
-
-
-
V
I
IDD1(AVG)
IDD1(EN)
IDD1(DIS)
IDD2(AVG)
IDD2(EN)
IDD2(DIS)
3.5
2.8
1.8
6.5
4.5
4.0
µA
mA
µA
µA
mA
µA
VDD=1.8V, Average
VDD=1.8V,
Supply Current
During Startup Time 1
During Startup Time Value
Supply Current
During Standby Time 1
VDD=1.8V,
-
During Standby Time Value
Supply Current 2
9
VDD=2.7V, Average
Supply Current
During Startup Time 2
VDD=2.7V,
-
During Startup Time Value
Supply Current
During Standby Time 2
VDD=2.7V,
-
During Standby Time Value
※10. B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
2010.08 - Rev.C
5/19
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
BU52013HFV (Unless otherwise specified, VDD=1.80V, Ta=25℃)
Limits
Parameter
Symbol
Unit
Conditions
Min.
1.65
Typ.
Max.
3.30
Power Supply Voltage
Operate Point
VDD
BopN
1.80
V
-5.0
-3.0
-2.1
0.9
50
-
mT
mT
mT
ms
V
Release Point
BrpN
-
-
-
-0.6
Hysteresis
BhysN
-
Period
TP
100
11
11
※
VDD
-0.2
BrpN<B
Output High Voltage
Output Low Voltage
Supply Current 1
VOH
-
-
0.2
5.5
-
IOUT =-0.5mA
※
B<BopN
I
VOL
-
-
-
-
-
-
-
-
V
OUT =+0.5mA
IDD1(AVG)
IDD1(EN)
IDD1(DIS)
IDD2(AVG)
IDD2(EN)
IDD2(DIS)
3.5
2.8
1.8
6.5
4.5
4.0
µA
mA
µA
µA
mA
µA
VDD=1.8V, Average
VDD=1.8V,
Supply Current
During Startup Time 1
During Startup Time Value
Supply Current
During Standby Time 1
VDD=1.8V,
-
During Standby Time Value
Supply Current 2
9
VDD=2.7V, Average
Supply Current
During Startup Time 2
VDD=2.7V,
-
During Startup Time Value
Supply Current
During Standby Time 2
VDD=2.7V,
-
During Standby Time Value
※11. B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
2010.08 - Rev.C
6/19
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
●Figure of measurement circuit
Bop/Brp
Tp
200Ω
VDD
GND
VDD
GND
VDD
VDD
OUT
100µF
OUT
Oscilloscope
V
The period is monitored by Oscilloscope.
Fig.2 Tp measurement circuit
Bop and Brp are measured with applying the magnetic field
from the outside.
Fig.1 Bop,Brp measurement circuit
VOH
Product Name
IOUT
VDD
GND
VDD
OUT
100µF
BU52002GUL, BU52003GUL
1.0mA
IOUT
BU52012NVX, BU52012HFV,
BU52013HFV
V
0.5mA
Fig.3
VOH measurement circuit
VOL
Product Name
IOUT
VDD
VDD
OUT
100µF
BU52002GUL, BU52003GUL
1.0mA
GND
IOUT
V
BU52012NVX, BU52012HFV,
BU52013HFV
0.5mA
Fig.4 VOL measurement circuit
IDD
A
VDD
2200µF
VDD
OUT
GND
Fig.5
IDD measurement circuit
www.rohm.com
2010.08 - Rev.C
7/19
© 2010 ROHM Co., Ltd. All rights reserved.
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
●Technical (Reference) Data
BU52002GUL (VDD=2.4～3.3V type)
8.0
6.0
8.0
6.0
100
90
80
70
60
50
40
30
20
10
0
Ta = 25°C
VDD=3.0V
V
DD=3.0V
Bop S
Brp S
Bop S
Brp S
4.0
4.0
2.0
2.0
0.0
0.0
-2.0
-4.0
-6.0
-8.0
-2.0
-4.0
-6.0
-8.0
-60 -40 -20
0
20 40 60 80 100
-60 -40 -20
0
20 40 60 80 100
2.0
2.4
2.8
3.2
3.6
AMBIENT TEMPERATURE [
]
℃
SUPPLY VOLTAGE
V
［ ］
AMBIENT TEMPERATURE [
]
℃
Fig.6 Bop,Brp – Ambient temperature
Fig.7 Bop,Brp – Supply voltage
Fig.8 TP –Ambient temperature
100
20.0
20.0
18.0
90
18.0
16.0
14.0
12.0
10.0
8.0
VDD=3.0V
Ta = 25°C
Ta = 25°C
80
70
60
50
40
30
20
10
0
16.0
14.0
12.0
10.0
8.0
6.0
6.0
4.0
4.0
2.0
2.0
0.0
0.0
-60 -40 -20
0
20 40 60 80 100
2.0
2.4
2.8
3.2
3.6
2.0
2.4
2.8
3.2
3.6
SUPPLY VOLTAGE [V]
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Fig.11 IDD – Supply voltage
Fig.10 IDD – Ambient temperature
Fig.9 TP – Supply voltage
BU52003GUL (VDD=2.4～3.3V type)
8.0
8.0
100
90
80
70
60
50
40
30
20
10
0
Ta = 25°C
6.0
6.0
VDD=3.0V
VDD=3.0V
4.0
2.0
0.0
4.0
2.0
0.0
Brp N
Bop N
Brp N
-2.0
-2.0
-4.0
-6.0
-8.0
-4.0
Bop N
-6.0
-8.0
-60 -40 -20
0
20 40 60 80 100
-60 -40 -20
0
20 40 60 80 100
2.0
2.4
2.8
3.2
3.6
AMBIENT TEMPERATURE [
]
℃
SUPPLY VOLTAGE
V
］
［
AMBIENT TEMPERATURE [
]
℃
Fig.14 TP – Ambient temperature
Fig.13 Bop,Brp – Supply voltage
Fig.12 Bop,Brp – Ambient temperature
100
20.0
20.0
Ta = 25°C
90
80
70
60
50
40
30
20
10
0
18.0
18.0
VDD=3.0V
Ta = 25°C
16.0
14.0
12.0
10.0
8.0
16.0
14.0
12.0
10.0
8.0
6.0
6.0
4.0
4.0
2.0
2.0
0.0
0.0
-60 -40 -20
0
20 40 60 80 100
2.0
2.4
2.8
3.2
3.6
2.0
2.4
2.8
3.2
3.6
SUPPLY VOLTAGE [V]
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Fig.16
I
DD – Ambient temperature
Fig.17 IDD – Supply voltage
Fig.15 TP –Supply voltage
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
2010.08 - Rev.C
8/19
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
BU52012NVX (VDD=1.65～3.6V type)
8.0
6.0
100
90
80
70
60
50
40
30
20
10
0
8.0
6.0
Ta = 25°C
VDD=1.8V
VDD=1.8V
Bop S
Brp S
Bop S
Brp S
4.0
4.0
2.0
2.0
0.0
0.0
-2.0
-4.0
-6.0
-8.0
-2.0
-4.0
-6.0
-8.0
-60 -40 -20
0
20 40 60 80 100
-60 -40 -20
0
20 40 60 80 100
1.4 1.8 2.2 2.6 3.0 3.4 3.8
SUPPLY VOLTAGE
AMBIENT TEMPERATURE [
]
℃
V
［
］
AMBIENT TEMPERATURE [
]
℃
Fig.18 Bop,Brp – Ambient temperature
Fig.20 TP – Ambient temperature
Fig.19 Bop,Brp – Supply voltage
20.0
100
20.0
18.0
16.0
14.0
12.0
10.0
8.0
90
VDD=1.8V
18.0
Ta = 25°C
Ta = 25°C
16.0
14.0
12.0
10.0
8.0
80
70
60
50
40
30
20
10
0
6.0
6.0
4.0
4.0
2.0
2.0
0.0
0.0
-60 -40 -20
0
20 40 60 80 100
1.4 1.8 2.2 2.6 3.0 3.4 3.8
1.4
1.8 2.2
2.6 3.0
3.4 3.8
SUPPLY VOLTAGE [V]
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Fig.21 TP – Supply voltage
Fig.23 IDD – Supply voltage
Fig.22 IDD – Ambient temperature
BU52012HFV (VDD=1.65～3.3V type)
100
8.0
8.0
Ta = 25°C
90
VDD=1.8V
6.0
6.0
VDD=1.8V
Bop S
80
70
60
50
40
30
20
10
0
Bop S
4.0
2.0
4.0
2.0
Brp S
Brp S
0.0
0.0
-2.0
-4.0
-6.0
-2.0
-4.0
-6.0
-8.0
-8.0
-60 -40 -20
0
20 40 60 80 100
-60 -40 -20
0
20 40 60 80 100
1.4 1.8 2.2 2.6 3.0 3.4 3.8
AMBIENT TEMPERATURE [
]
℃
SUPPLY VOLTAGE
V
［ ］
AMBIENT TEMPERATURE [
]
℃
Fig.25 Bop,Brp – Supply voltage
Fig.24 Bop,Brp – Ambient temperature
Fig.26 TP – Ambient temperature
20.0
100
20.0
18.0
16.0
14.0
12.0
10.0
8.0
90
VDD=1.8V
18.0
Ta = 25°C
Ta = 25°C
16.0
14.0
12.0
10.0
8.0
80
70
60
50
40
30
20
10
0
6.0
6.0
4.0
4.0
2.0
2.0
0.0
0.0
-60 -40 -20
0
20 40 60 80 100
1.4 1.8 2.2 2.6 3.0 3.4 3.8
1.4
1.8 2.2
2.6 3.0
3.4 3.8
SUPPLY VOLTAGE [V]
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Fig.27 TP – Supply voltage
Fig.29
I
DD – Supply voltage
Fig.28 IDD – Ambient temperature
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
2010.08 - Rev.C
9/19
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
BU52013HFV (VDD=1.65～3.3V type)
8.0
6.0
8.0
6.0
100
90
80
70
60
50
40
30
20
10
0
Ta = 25°C
VDD=1.8V
VDD=1.8V
4.0
4.0
2.0
2.0
0.0
0.0
Brp N
Bop N
Brp N
Bop N
-2.0
-4.0
-6.0
-8.0
-2.0
-4.0
-6.0
-8.0
-60 -40 -20
0
20 40 60 80 100
-60 -40 -20
0
20 40 60 80 100
1.4 1.8 2.2 2.6 3.0 3.4 3.8
SUPPLY VOLTAGE
AMBIENT TEMPERATURE [
]
℃
V
［
］
AMBIENT TEMPERATURE [
]
℃
Fig.32 TP – Ambient temperature
Fig.31 Bop,Brp – Supply voltage
Fig.30 Bop,Brp – Ambient temperature
100
20.0
20.0
90
18.0
Ta = 25°C
18.0
VDD=1.8V
Ta = 25°C
80
70
60
50
40
30
20
10
16.0
14.0
12.0
10.0
8.0
16.0
14.0
12.0
10.0
8.0
6.0
6.0
4.0
4.0
2.0
2.0
0
0.0
0.0
1.4 1.8 2.2 2.6 3.0 3.4 3.8
-60 -40 -20
0
20 40 60 80 100
1.4 1.8 2.2 2.6 3.0 3.4 3.8
SUPPLY VOLTAGE [V]
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Fig.35 IDD – Supply voltage
Fig.33 TP – Supply voltage
Fig.34 IDD – Ambient temperature
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
2010.08 - Rev.C
10/19
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
●Block Diagram
BU52002GUL, BU52003GUL
0.1µF
VDD
A1
Adjust the bypass capacitor value as
necessary, according to voltage noise
conditions, etc.
TIMING LOGIC
HALL
The CMOS output terminals enable direct connection to
the PC, with no external pull-up resistor required.
ELEMENT
×
B1 OUT
A2
GND
Fig.36
A2
B2
A1
B1
A1
A2
PIN No. PIN NAME
FUNCTION
POWER SUPPLY
GROUND
COMMENT
A1
A2
B1
B2
VDD
GND
OUT
N.C.
OUTPUT
B1
Surface
B2
OPEN or Short to GND.
Reverse
BU52012NVX
0.1µF
VDD
Adjust the bypass capacitor value as
necessary, according to voltage
noise conditions, etc.
4
The CMOS output terminals enable direct
connection to the PC, with no external pull-up
resistor required.
TIMING LOGIC
HALL
ELEMENT
×
OUT
1
2
GND
4
Fig.37
3
2
3
2
4
1
PIN No. PIN NAME
FUNCTION
OUTPUT
COMMENT
1
2
3
4
OUT
GND
N.C.
VDD
GROUND
OPEN or Short to GND.
1
POWER SUPPLY
Surface
Reverse
www.rohm.com
2010.08 - Rev.C
11/19
© 2010 ROHM Co., Ltd. All rights reserved.
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
BU52012HFV, BU52013HFV
0.1µF
VDD
Adjust the bypass capacitor value as
necessary, according to voltage noise
conditions, etc.
4
TIMING LOGIC
HALL
The CMOS output terminals enable direct connection to
the PC, with no external pull-up resistor required.
ELEMENT
×
OUT
5
2
GND
Fig.38
4
3
4
3
5
1
5
1
PIN No. PIN NAME
FUNCTION
GROUND
COMMENT
1
2
3
4
5
N.C.
GND
N.C.
VDD
OUT
OPEN or Short to GND.
OPEN or Short to GND.
POWER SUPPLY
OUTPUT
2
2
Surface
Reverse
●Description of Operations
The unipolar detection Hall IC adopts an intermittent operation
method to save energy. At startup, the Hall elements, amp,
comparator and other detection circuit power ON and magnetic
detection begins. During standby, the detection circuits power
OFF, thereby reducing current consumption. The detection results
are held while standby is active, and then output.
(Micropower Operation)
IDD
Period
Startup time
Standby
Reference period: 50ms (MAX100ms)
Reference startup time: 24µs
t
Fig.39
(Offset Cancelation)
VDD
The Hall elements form an equivalent Wheatstone (resistor)
bridge circuit. Offset voltage may be generated by a differential in
this bridge resistance, or can arise from changes in resistance
due to package or bonding stress. A dynamic offset cancellation
circuit is employed to cancel this offset voltage.
I
When Hall elements are connected as shown in Fig. 40 and a
magnetic field is applied perpendicular to the Hall elements,
voltage is generated at the mid-point terminal of the bridge. This
is known as Hall voltage.
＋
B
×
Hall Voltage
Dynamic cancellation switches the wiring (shown in the figure) to
redirect the current flow to a 90˚ angle from its original path, and
thereby cancels the Hall voltage.
The magnetic signal (only) is maintained in the sample/hold
circuit during the offset cancellation process and then released.
－
GND
Fig.40
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
2010.08 - Rev.C
12/19
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
(Magnetic Field Detection Mechanism)
S
N
S
S
N
S
N
Flux
Flux
Fig.41
The Hall IC cannot detect magnetic fields that run horizontal to the package top layer.
Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer.
www.rohm.com
2010.08 - Rev.C
13/19
© 2010 ROHM Co., Ltd. All rights reserved.
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
BU52002GUL,BU52012HFV
S-Pole
N
S
N
S
S
N
OUT [V]
Flux
High
Flux
High
High
Low
B
Brp S
S-Pole
Bop S
0
N-Pole
Magnetic flux density [mT]
Fig.42 S-Pole Detection
BU52002GUL, BU52012HFV detects and outputs for the S-pole only. Since it is unipolar, it does not recognize the N-pole.
BU52003GUL, BU52013HFV
N-Pole
N
S
N
S
S
N
OUT [V]
Flux
Flux
High
High
B
High
Low
Bop N Brp N
N-Pole
0
S-Pole
Magnetic flux density [mT]
Fig.43 N-Pole Detection
BU52003GUL, BU52013HFV detects and outputs for the N-pole only. Since it is unipolar, it does not recognize the S-pole.
The unipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of the package. There is an
inverse relationship between magnetic flux density and the distance separating the magnet and the Hall IC: when distance
increases magnetic density falls. When it drops below the operate point (Bop), output goes HIGH. When the magnet gets
closer to the IC and magnetic density rises, to the operate point, the output switches LOW. In LOW output mode, the
distance from the magnet to the IC increases again until the magnetic density falls to a point just below Bop, and output
returns HIGH. (This point, where magnetic flux density restores HIGH output, is known as the release point, Brp.) This
detection and adjustment mechanism is designed to prevent noise, oscillation and other erratic system operation.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
2010.08 - Rev.C
14/19
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
●Intermittent Operation at Power ON
Power ON
VDD
Startup time
Standby time
High
Startup time
Standby time
Supply current
(Intermittentaction)
Indefinite
interval
OUT
(No magnetic
field present)
Indefinite
interval
OUT
(Magnetic
field present)
Low
Fig.44
The unipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during startup, as
shown in Fig.44. It outputs to the appropriate terminal based on the detection result and maintains the output condition
during the standby period. The time from power ON until the end of the initial startup period is an indefinite interval, but it
cannot exceed the maximum period, 100ms. To accommodate the system design, the Hall IC output read should be
programmed within 100ms of power ON, but after the time allowed for the period ambient temperature and supply voltage.
●Magnet Selection
Of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume
than ferrite, thereby enabling the highest degree of miniaturization, thus, neodymium is best suited for small equipment
applications. Fig.45 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. The
graph plots the correlation between the distance (L) from three versions of a 4mm X 4mm cross-section neodymium magnet
(1mm, 2mm, and 3mm thick) and magnetic flux density. Fig.46 shows Hall IC detection distance – a good guide for
determining the proper size and detection distance of the magnet. Based on the BU52012HFV, BU52013HFV operating
point max 5.0 mT, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 7.6mm, 9.22mm, and
10.4mm, respectively. To increase the magnet’s detection distance, either increase its thickness or sectional area.
10
9
t=3mm
8
7
t=1mm
t=2mm
6
5
4
3
2
1
0
7.6mm 9.2mm
10.4mm
0
X
2
4
6
8
10
12
14
16
18
20
Distance between magnet and Hall IC [mm]
Fig.45
Magnet material: NEOMAX-44H (material)
Maker: NEOMAX CO.,LTD.
Magnet
t
Y
t
X=Y=4mm
t=1mm,2mm,3mm
L: Variable
…Flux density measuring point
Magnet size
Fig.46 Magnet Dimensions and Flux Density Measuring Point
www.rohm.com
2010.08 - Rev.C
15/19
© 2010 ROHM Co., Ltd. All rights reserved.
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
●Position of the Hall effect IC(Reference)
HVSOF5
0.6
VCSP50L1
SSON004X1216
0.6
0.55
0.8
0.8
0.55
0.35
0.2
0.2
(UNIT: mm)
●Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition)
VCSP50L1 SSON004X1216
Please avoid having potential overstress from
PCB material, strength, mounting positions.
If you had any further questions or concerns,
please contact your Rohm sales and affiliate.
HVSOF5
(UNIT: mm)
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
2010.08 - Rev.C
16/19
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
●Operation Notes
1) Absolute maximum ratings
Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or
destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this
way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in
excess of absolute rating limits.
2) GND voltage
Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower
than the potential of all other pins.
3) Thermal design
Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
4) Pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning
or orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted
together, or if shorts occur between the output pin and supply pin or GND.
5) Positioning components in proximity to the Hall IC and magnet
Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore
the magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in
the design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and
evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design.
6) Operation in strong electromagnetic fields
Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause
the IC to malfunction.
7) Common impedance
Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example,
employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or
capacitor.
8) GND wiring pattern
When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set
PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes
due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same
way, care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components.
9) Exposure to strong light
Exposure to halogen lamps, UV and other strong light sources may cause the IC to malfunction. If the IC is subject to such
exposure, provide a shield or take other measures to protect it from the light. In testing, exposure to white LED and
fluorescent light sources was shown to have no significant effect on the IC.
10) Power source design
Since the IC performs intermittent operation, it has peak current when it’s ON. Please taking that into account and under
examine adequate evaluations when designing the power source.
www.rohm.com
2010.08 - Rev.C
17/19
© 2010 ROHM Co., Ltd. All rights reserved.
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
●Ordering part number
B
U
5
2
0
0
2
G U
L
-
E
2
Part No.
Part No.
52002,52003,
52012,52013
Package
GUL : VSCP50L1
HFV : HVSOF5
Packaging and forming specification
E2: Embossed tape and reel
(VSCP50L1)
NVX: SSON004X1216
TR: Embossed tape and reel
(HVSOF5, SSON004X1216)
VCSP50L1(BU52002GUL)
<Tape and Reel information>
1PIN MARK
Tape
Embossed carrier tape
3000pcs
Quantity
E2
1.10±0.1
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
S
0.08
S
φ
4- 0.25±0.05
0.05
A B
A
B
B
A
1
2
0.30±0.1
0.50
Direction of feed
1pin
Reel
Order quantity needs to be multiple of the minimum quantity.
(Unit : mm)
∗
VCSP50L1(BU52003GUL)
<Tape and Reel information>
1PIN MARK
Tape
Embossed carrier tape
Quantity
3000pcs
E2
1.10±0.1
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
S
0.08
S
φ
4- 0.25±0.05
0.05
A B
A
B
B
A
1
2
0.30±0.1
0.50
Direction of feed
1pin
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
HVSOF5
<Tape and Reel information>
1.6 0.05
(0.8)
(0.3)
Tape
Embossed carrier tape
Quantity
3000pcs
1.0 0.05
TR
Direction
of feed
5
1
4
3
4
5
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
3
2 1
2
1pin
0.13 0.05
S
0.1
S
0.5
0.22 0.05
Direction of feed
Order quantity needs to be multiple of the minimum quantity.
M
0.08
Reel
∗
(Unit : mm)
www.rohm.com
2010.08 - Rev.C
18/19
© 2010 ROHM Co., Ltd. All rights reserved.
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
SSON004X1216
<Tape and Reel information>
1.2 0.1
Tape
Embossed carrier tape
5000pcs
Quantity
TR
Direction
of feed
1PIN MARK
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
S
0.08
S
+0.05
0.65 0.1
0.2
-
0.04
1
2
4
3
Direction of feed
Order quantity needs to be multiple of the minimum quantity.
1pin
0.75 0.1
Reel
(Unit : mm)
∗
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
2010.08 - Rev.C
19/19
Daattaasshheeeett
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
相关型号：
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