BU52011HFV-TR [ROHM]
Omnipolar Detection Hall ICs; 全极霍尔检测芯片
| 型号： | BU52011HFV-TR |
| 厂家： | 
ROHM |
| 描述： | Omnipolar Detection Hall ICs |
| 文件： | 总32页 (文件大小：608K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Hall ICs
Omnipolar Detection Hall ICs
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
No.10045EGT02
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
●Description
The omnipolar Hall ICs are magnetic switches that can operate both S-and N-pole, upon which the output goes from Hi to
Low. In addition to regular single-output Hall ICs, We offer a lineup of dual-output units with a reverse output terminal (active
High).
●Features
1) Omnipolar detection
2) Micro power operation (small current using intermittent operation method)(BD7411G is excluded.)
3) Ultra-compact and thin wafer level CSP4 package (BU52054GWZ, BU52055GWZ)
4) Ultra-compact wafer level CSP4 package (BU52015GUL, BU52001GUL)
5) Ultra-Small outline package SSON004X1216 (BU52061NVX, BU52053NVX, BU52056NVX)
6) Ultra-Small outline package HVSOF5 (BU52011HFV, BU52021HFV)
7) Small outline package (BU52025G, BD7411G)
8) Line up of supply voltage
For 1.8V Power supply voltage (BU52054GWZ, BU52055GWZ, BU52015GUL, BU52061NVX, BU52053NVX,
BU52056NVX, BU52011HFV)
For 3.0V Power supply voltage (BU52001GUL)
For 3.3V Power supply voltage (BU52021HFV, BU52025G)
For 5.0V Power supply voltage (BD7411G)
9) Dual output type (BU52015GUL)
10) High ESD resistance 8kV (HBM) (6kV for BU52056NVX)
●Applications
Mobile phones, notebook computers, digital video camera, digital still camera, white goods etc.
●Lineup matrix
Supply
voltage
(V)
Operate
point
(mT)
Supply current
(AVG)
Output
type
Hysteresis Period
Package
Product name
(mT)
0.9
(ms)
50
(A)
※
※
※
※
※
※
※
※
※
※
※
BU52054GWZ
BU52055GWZ
BU52015GUL
BU52001GUL
BU52061NVX
BU52053NVX
BU52056NVX
BU52011HFV
BU52021HFV
BU52025G
1.65～3.60 +/-6.3
1.65～3.60 +/-4.1
1.65～3.30 +/-3.0
2.40～3.30 +/-3.7
1.65～3.60 +/-3.3
1.65～3.60 +/-3.0
1.65～3.60 +/-4.6
1.65～3.30 +/-3.0
2.40～3.60 +/-3.7
2.40～3.60 +/-3.7
4.50～5.50 +/-3.4
5.0µ
5.0µ
5.0µ
8.0µ
4.0µ
5.0µ
5.0µ
5.0µ
8.0µ
8.0µ
2.0m
CMOS
CMOS
CMOS
CMOS
CMOS
CMOS
CMOS
CMOS
CMOS
CMOS
CMOS
UCSP35L1
UCSP35L1
VCSP50L1
VCSP50L1
SSON004X1216
SSON004X1216
SSON004X1216
HVSOF5
0.8
0.9
0.8
0.9
0.9
0.8
0.9
0.8
0.8
0.4
50
50
50
50
50
50
50
50
50
-
HVSOF5
SSOP5
BD7411G
SSOP5
※Plus is expressed on the S-pole; minus on the N-pole
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
2011.12 - Rev.G
1/31
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
●Absolute maximum ratings
BU52054GWZ, BU52055GWZ (Ta=25℃)
BU52015GUL (Ta=25℃)
Parameter
Symbol
Ratings
Unit
V
Parameter
Symbol
VDD
Ratings
Unit
V
1
3
Power Supply Voltage
VDD
-0.1～+4.5※
Power Supply Voltage
Output Current
-0.1～+4.5※
Output Current
IOUT
Pd
±0.5
mA
mW
℃
IOUT
Pd
±0.5
mA
mW
℃
2
4
Power Dissipation
100※
Power Dissipation
420※
Operating
Temperature Range
Operating
Temperature Range
Topr
Tstg
-40～+85
Topr
Tstg
-40～+85
Storage
Temperature Range
Storage
Temperature Range
-40～+125
℃
-40～+125
℃
※1. Not to exceed Pd
※3. Not to exceed Pd
※2. Reduced by 1.00mW for each increase in Ta of 1℃ over 25℃
(mounted on 24mm×20mm Glass-epoxy PCB)
※4. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃
(mounted on 50mm×58mm Glass-epoxy PCB)
BU52001GUL (Ta=25℃)
BU52061NVX, BU52053NVX, BU52056NVX(Ta=25℃)
Parameter
Power Supply Voltage
Output Current
Symbol
VDD
Ratings
-0.1～+4.5※
±1
Unit
V
Parameter
Power Supply Voltage
Output Current
Symbol
VDD
Ratings
-0.1～+4.5※
±0.5
Unit
V
5
7
IOUT
Pd
mA
mW
℃
IOUT
Pd
mA
mW
℃
6
8
Power Dissipation
420※
Power Dissipation
2049※
Operating
Temperature Range
Operating
Temperature Range
Topr
-40～+85
Topr
-40～+85
Storage
Temperature Range
※5. Not to exceed Pd
Storage
Temperature Range
※7. Not to exceed Pd
Tstg
-40～+125
℃
Tstg
-40～+125
℃
※6. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃
(mounted on 50mm×58mm Glass-epoxy PCB)
※8. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃
(mounted on 50mm×58mm Glass-epoxy PCB)
BU52011HFV (Ta=25℃)
BU52021HFV (Ta=25℃)
Parameter
Symbol
VDD
Ratings
Unit
V
Parameter
Symbol
VDD
Ratings
Unit
V
9
11
Power Supply Voltage
-0.1～+4.5※
Power Supply Voltage
-0.1～+4.5※
Output Current
IOUT
Pd
±0.5
mA
mW
℃
Output Current
IOUT
Pd
±1
mA
mW
℃
10
12
Power Dissipation
536※
Power Dissipation
536※
Operating
Temperature Range
Operating
Temperature Range
Topr
Tstg
-40～+85
Topr
Tstg
-40～+85
Storage
Temperature Range
Storage
Temperature Range
-40～+125
℃
-40～+125
℃
※9. Not to exceed Pd
※11 Not to exceed Pd
※10. Reduced by5.36mW for each increase in Ta of 1℃ over 25℃
(mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB)
※12. Reduced by 5.36mW for each increase in Ta of 1℃ over 25℃
(mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB)
BU52025G (Ta=25℃)
BD7411G (Ta=25℃)
Parameter
Power Supply Voltage
Output Current
Symbol
VDD
Ratings
-0.1～+4.5※
±1
Unit
V
Parameter
Power Supply Voltage
Output Current
Symbol
VDD
Ratings
-0.3～+7.0※
±1
Unit
V
13
15
IOUT
Pd
mA
mW
℃
IOUT
Pd
mA
mW
℃
14
16
Power Dissipation
540※
Power Dissipation
540※
Operating
Temperature Range
Operating
Temperature Range
Topr
-40～+85
Topr
-40～+85
Storage
Temperature Range
※13. Not to exceed Pd
Storage
Temperature Range
※15. Not to exceed Pd
Tstg
-40～+125
℃
Tstg
-55～+150
℃
※14. Reduced by 5.40mW for each increase in Ta of 1℃ over 25℃
(mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB)
※16. Reduced by 5.40mW for each increase in Ta of 1℃ over 25℃
(mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB)
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
2011.12 - Rev.G
2/31
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
●Magnetic, Electrical characteristics
BU52054GWZ (Unless otherwise specified, VDD=1.80V, Ta=25℃)
Limits
Parameter
Symbol
Unit
V
Conditions
Min.
1.65
Typ.
Max.
3.60
Power Supply Voltage
VDD
1.80
BopS
BopN
BrpS
-
6.3
-6.3
5.4
-5.4
0.9
0.9
7.9
Operate Point
mT
mT
mT
ms
V
-7.9
-
3.5
-
Release Point
BrpN
-
-
-
-3.5
BhysS
BhysN
-
-
Hysteresis
Period
Tp
-
50
-
100
17
17
※
BrpN<B<BrpS
OUT =-0.5mA
Output High Voltage
Output Low Voltage
Supply Current
VOH
VDD-0.2
-
0.2
8
I
※
B<BopN, BopS<B
OUT =+0.5mA
VOL
-
-
-
-
-
V
I
IDD(AVG)
IDD(EN)
IDD(DIS)
5
µA Average
Supply Current During Startup Time
Supply Current During Standby Time
2.8
1.8
-
mA During Startup Time Value
µA During Standby Time Value
-
※17B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
2011.12 - Rev.G
3/31
© 2011 ROHM Co., Ltd. All rights reserved.
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BU52055GWZ (Unless otherwise specified, VDD=1.80V, Ta=25℃)
Limits
Parameter
Symbol
Unit
V
Conditions
Min.
1.65
Typ.
Max.
3.60
Power Supply Voltage
VDD
1.80
BopS
BopN
BrpS
-
4.1
-4.1
3.3
-3.3
0.8
0.8
5.5
Operate Point
mT
mT
mT
ms
V
-5.5
-
1.5
-
Release Point
BrpN
-
-
-
-1.5
BhysS
BhysN
-
-
Hysteresis
Period
Tp
-
50
-
100
18
18
※
BrpN<B<BrpS
OUT =-0.5mA
Output High Voltage
Output Low Voltage
Supply Current
VOH
VDD-0.2
-
0.2
8
I
※
B<BopN, BopS<B
OUT =+0.5mA
VOL
-
-
-
-
-
V
I
IDD(AVG)
IDD(EN)
IDD(DIS)
5
µA Average
Supply Current During Startup Time
Supply Current During Standby Time
2.8
1.8
-
mA During Startup Time Value
µA During Standby Time Value
-
※18B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
2011.12 - Rev.G
4/31
© 2011 ROHM Co., Ltd. All rights reserved.
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BU52015GUL (Unless otherwise specified, VDD=1.80V, Ta=25℃)
Limits
Parameter
Symbol
Unit
V
Conditions
Min.
1.65
Typ.
Max.
3.30
Power Supply Voltage
VDD
1.80
BopS
BopN
BrpS
-
3.0
-3.0
2.1
-2.1
0.9
0.9
5.0
Operate Point
mT
mT
mT
ms
V
-5.0
-
0.6
-
Release Point
BrpN
-
-
-
-0.6
BhysS
BhysN
-
-
Hysteresis
Period
Tp
-
50
-
100
19
19
※
OUT1: BrpN<B<BrpS
OUT2: B<BopN, BopS<B
IOUT = -0.5mA
Output High Voltage
Output Low Voltage
Supply Current 1
Supply Current During Startup Time 1
VOH
VDD-0.2
-
0.2
8
※
OUT1: B<BopN, BopS<B
OUT2: BrpN<B<BrpS
IOUT = +0.5mA
VOL
-
-
-
-
-
-
-
-
V
IDD1(AVG)
5
µA VDD=1.8V, Average
VDD=1.8V,
mA
IDD1(EN)
2.8
1.8
8
-
During Startup Time Value
VDD=1.8V,
Supply Current During Standby Time 1 IDD1(DIS)
-
µA
During Standby Time Value
Supply Current 2
IDD2(AVG)
12
-
µA VDD=2.7V, Average
VDD=2.7V,
Supply Current During Startup Time 2
IDD2(EN)
4.5
4.0
mA
µA
During Startup Time Value
VDD=2.7V,
Supply Current During Standby Time 2 IDD2(DIS)
-
During Standby Time Value
※19 B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
2011.12 - Rev.G
5/31
© 2011 ROHM Co., Ltd. All rights reserved.
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BU52001GUL (Unless otherwise specified, VDD=3.0V, Ta=25℃)
Limits
Parameter
Symbol
Unit
V
Conditions
Min.
2.4
Typ.
Max.
3.3
Power Supply Voltage
VDD
3.0
BopS
BopN
BrpS
-
3.7
-3.7
2.9
-2.9
0.8
0.8
5.5
Operate Point
mT
mT
mT
ms
V
-5.5
-
0.8
-
Release Point
BrpN
-
-
-
-0.8
BhysS
BhysN
-
-
Hysteresis
Period
Tp
-
50
-
100
-
20
20
※
BrpN<B<BrpS
OUT =-1.0mA
Output High Voltage
Output Low Voltage
Supply Current
VOH
VDD-0.4
I
※
B<BopN,BopS<B
OUT =+1.0mA
VOL
-
-
-
-
-
0.4
12
-
V
I
IDD(AVG)
IDD(EN)
IDD(DIS)
8
µA Average
Supply Current During Startup Time
Supply Current During Standby Time
4.7
3.8
mA During Startup Time Value
µA During Standby Time Value
-
※20 B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
2011.12 - Rev.G
6/31
© 2011 ROHM Co., Ltd. All rights reserved.
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BU52061NVX (Unless otherwise specified, VDD=1.80V, Ta=25℃)
Limits
Parameter
Symbol
Unit
V
Conditions
Min.
1.65
Typ.
Max.
3.60
Power Supply Voltage
VDD
1.80
BopS
BopN
BrpS
2.3
-4.7
1.2
-3.4
-
3.3
-3.3
2.4
4.7
-2.3
3.4
-1.2
-
Operate Point
mT
mT
mT
ms
V
Release Point
BrpN
-2.4
0.9
0.9
BhysS
BhysN
Hysteresis
-
-
Period
Tp
-
50
-
100
21
21
※
BrpN<B<BrpS
OUT =-0.5mA
Output High Voltage
Output Low Voltage
Supply Current 1
Supply Current During Startup Time 1
VOH
VDD-0.2
-
0.2
7
I
※
B<BopN, BopS<B
OUT =+0.5mA
VOL
-
-
-
-
-
-
-
-
V
I
IDD1(AVG)
4
µA VDD=1.8V, Average
VDD=1.8V,
mA
IDD1(EN)
5.0
1.8
9
-
During Startup Time Value
VDD=1.8V,
Supply Current During Standby Time 1 IDD1(DIS)
-
µA
During Standby Time Value
Supply Current 2
IDD2(AVG)
16
-
µA VDD=3.0V, Average
VDD=3.0V,
Supply Current During Startup Time 2
IDD2(EN)
9.0
4.4
mA
µA
During Startup Time Value
VDD=3.0V,
Supply Current During Standby Time 2 IDD2(DIS)
-
During Standby Time Value
※21 B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
2011.12 - Rev.G
7/31
© 2011 ROHM Co., Ltd. All rights reserved.
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BU52053NVX (Unless otherwise specified, VDD=1.80V, Ta=25℃)
Limits
Parameter
Symbol
Unit
V
Conditions
Min.
1.65
Typ.
Max.
3.60
Power Supply Voltage
VDD
1.80
BopS
BopN
BrpS
-
3.0
-3.0
2.1
-2.1
0.9
0.9
5.0
Operate Point
mT
mT
mT
ms
V
-5.0
-
0.6
-
Release Point
BrpN
-
-
-
-0.6
BhysS
BhysN
-
-
Hysteresis
Period
Tp
-
50
-
100
22
22
※
BrpN<B<BrpS
OUT =-0.5mA
Output High Voltage
Output Low Voltage
Supply Current
VOH
VDD-0.2
-
0.2
8
I
※
B<BopN, BopS<B
OUT =+0.5mA
VOL
-
-
-
-
-
V
I
IDD(AVG)
IDD(EN)
IDD(DIS)
5
µA Average
Supply Current During Startup Time
Supply Current During Standby Time
2.8
1.8
-
mA During Startup Time Value
µA During Standby Time Value
-
※22B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
2011.12 - Rev.G
8/31
© 2011 ROHM Co., Ltd. All rights reserved.
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BU52011HFV (Unless otherwise specified, VDD=1.80V, Ta=25℃)
Limits
Parameter
Symbol
Unit
V
Conditions
Min.
1.65
Typ.
Max.
3.30
Power Supply Voltage
VDD
1.80
BopS
BopN
BrpS
-
3.0
-3.0
2.1
-2.1
0.9
0.9
5.0
Operate Point
mT
mT
mT
ms
V
-5.0
-
0.6
-
Release Point
BrpN
-
-
-
-0.6
BhysS
BhysN
-
-
Hysteresis
Period
Tp
-
50
-
100
23
23
※
BrpN<B<BrpS
OUT =-0.5mA
Output High Voltage
Output Low Voltage
Supply Current 1
Supply Current During Startup Time 1
VOH
VDD-0.2
-
0.2
8
I
※
B<BopN, BopS<B
OUT =+0.5mA
VOL
-
-
-
-
-
-
-
-
V
I
IDD1(AVG)
5
µA VDD=1.8V, Average
VDD=1.8V,
mA
IDD1(EN)
2.8
1.8
8
-
During Startup Time Value
VDD=1.8V,
Supply Current During Standby Time 1 IDD1(DIS)
-
µA
During Standby Time Value
Supply Current 2
IDD2(AVG)
12
-
µA VDD=2.7V, Average
VDD=2.7V,
Supply Current During Startup Time 2
IDD2(EN)
4.5
4.0
mA
µA
During Startup Time Value
VDD=2.7V,
Supply Current During Standby Time 2 IDD2(DIS)
-
During Standby Time Value
※23 B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
2011.12 - Rev.G
9/31
© 2011 ROHM Co., Ltd. All rights reserved.
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BU52056NVX (Unless otherwise specified, VDD=1.80V, Ta=25℃)
Limits
Parameter
Symbol
Unit
V
Conditions
Min.
1.65
Typ.
Max.
3.60
Power Supply Voltage
VDD
1.80
BopS
BopN
BrpS
-
4.6
-4.6
3.8
-3.8
0.8
0.8
6.4
Operate Point
mT
mT
mT
ms
V
-6.4
-
2.0
-
Release Point
BrpN
-
-
-
-2.0
BhysS
BhysN
-
-
Hysteresis
Period
Tp
-
50
-
100
24
24
※
BrpN<B<BrpS
OUT =-0.5mA
Output High Voltage
Output Low Voltage
Supply Current
VOH
VDD-0.2
-
0.2
8
I
※
B<BopN, BopS<B
OUT =+0.5mA
VOL
-
-
-
-
-
V
I
IDD(AVG)
IDD(EN)
IDD(DIS)
5
µA Average
Supply Current During Startup Time
Supply Current During Standby Time
2.8
1.8
-
mA During Startup Time Value
µA During Standby Time Value
-
※24B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
2011.12 - Rev.G
10/31
© 2011 ROHM Co., Ltd. All rights reserved.
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BU52021HFV,BU52025G (Unless otherwise specified, VDD=3.0V, Ta=25℃)
Limits
Parameter
Symbol
Unit
V
Conditions
Min.
2.4
Typ.
Max.
3.6
Power Supply Voltage
VDD
3.0
BopS
BopN
BrpS
-
3.7
-3.7
2.9
-2.9
0.8
0.8
5.5
Operate Point
mT
mT
mT
ms
V
-5.5
-
0.8
-
Release Point
BrpN
-
-
-
-0.8
BhysS
BhysN
-
-
Hysteresis
Period
Tp
-
50
-
100
-
25
25
※
BrpN<B<BrpS
OUT =-1.0mA
Output High Voltage
Output Low Voltage
Supply Current
VOH
VDD-0.4
I
※
B<BopN, BopS<B
OUT =+1.0mA
VOL
-
-
-
-
-
0.4
12
-
V
I
IDD(AVG)
IDD(EN)
IDD(DIS)
8
µA Average
Supply Current During Startup Time
Supply Current During Standby Time
4.7
3.8
mA During Startup Time Value
µA During Standby Time Value
-
※25 B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
2011.12 - Rev.G
11/31
© 2011 ROHM Co., Ltd. All rights reserved.
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BD7411G (Unless otherwise specified, VDD=5.0V, Ta=25℃)
Limits
Parameter
Symbol
Unit
V
Conditions
Min.
4.5
Typ.
Max.
5.5
Power Supply Voltage
VDD
5.0
BopS
BopN
BrpS
-
3.4
-3.4
3.0
5.6
Operate Point
mT
mT
mT
V
-5.6
-
1.5
-
Release Point
BrpN
-
-
-
-3.0
0.4
0.4
-1.5
BhysS
BhysN
-
-
Hysteresis
26
26
※
BrpN<B<BrpS
IOUT =-1.0mA
Output High Voltage
Output Low Voltage
Supply Current
VOH
VOL
IDD
4.6
-
-
-
0.4
4
※
B<BopN, BopS<B
-
-
V
I
OUT =+1.0mA
2
mA
※26 B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
Radiation hardiness is not designed.
www.rohm.com
2011.12 - Rev.G
12/31
© 2011 ROHM Co., Ltd. All rights reserved.
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
●Figure of measurement circuit
Tp
BOP/BRP
200Ω
VDD
GND
VDD
VDD
VDD
OUT
OUT
100µF
Oscilloscope
GND
V
Bop and Brp are measured with applying the magnetic field from the outside.
The period is monitored by Oscilloscope.
Fig.2 Tp mesurement circuit
Fig.1 Bop,Brp mesurement circuit
Product Name
IOUT
VOH
BU52001GUL, BU52021HFV,
BU52025G, BD7411G
1.0mA
BU52054GWZ, BU52055GWZ,
BU52015GUL, BU52061NVX,
BU52053NVX, BU52056NVX,
BU52011HFV
VDD
0.5mA
OUT
VDD
100µF
IOUT
GND
V
Fig.3 VOH mesurement circuit
VOL
Product Name
IOUT
BU52001GUL, BU52021HFV,
BU52025G, BD7411G
1.0mA
VDD
BU52054GWZ, BU52055GWZ,
BU52015GUL, BU52061NVX,
BU52053NVX, BU52056NVX,
BU52011HFV
OUT
VDD
0.5mA
100µF
IOUT
GND
V
Fig.4 VOL measurement circuit
IDD
Product Name
C
A
BU52054GWZ, BU52055GWZ,
BU52015GUL, BU52001GUL,
BU52061NVX, BU52053NVX,
BU52056NVX, BU52011HFV,
BU52021HFV, BU52025G
VDD
2200µF
100µF
VDD
OUT
C
GND
BD7411G
Fig.5 IDD measurement circuit
www.rohm.com
2011.12 - Rev.G
13/31
© 2011 ROHM Co., Ltd. All rights reserved.
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
●Technical (Reference) Data
BU52054GWZ(VDD=1.65～3.6V type)
8.0
6.0
8.0
6.0
100
90
80
70
60
50
40
30
20
10
0
Bop S
Brp S
Bop S
Brp S
VDD=1.8V
4.0
4.0
Ta = 25°C
VDD=1.8V
2.0
2.0
0.0
0.0
-2.0
-4.0
-6.0
-8.0
-2.0
-4.0
-6.0
-8.0
Brp N
Bop N
Bop N
-60 -40 -20
0
20 40 60 80 100
-60 -40 -20
0
20 40 60 80 100
1.4
1.8
2.2
2.6
3.0
3.4
3.8
AMBIENT TEMPERATURE [℃]
AMBIENT TEMPERATURE [℃]
SUPPLY VOLTAGE [V]
Fig.6 Bop,Brp– Ambient temperature
Fig.7 Bop,Brp– Supply voltage
Fig.8 TP– Ambient temperature
100
14.0
16.0
90
14.0
12.0
10.0
8.0
12.0
10.0
8.0
Ta = 25°C
80
Ta = 25°C
VDD=1.8V
70
60
50
40
30
20
10
0
6.0
6.0
4.0
4.0
2.0
2.0
0.0
0.0
1.4
1.8
2.2
2.6
3.0
3.4
3.8
-60 -40 -20
0
20 40 60 80 100
[℃]
1.4
1.8
2.2
2.6
3.0
3.4
3.8
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE
SUPPLY VOLTAGE [V]
Fig.11 IDD– Supply voltage
Fig.10 IDD– Ambient temperature
Fig.9 TP– Supply voltage
BU52055GWZ(VDD=1.65～3.6V type)
8.0
8.0
100
90
80
70
60
50
40
30
20
10
0
VDD=1.8V
Ta = 25°C
6.0
6.0
4.0
VDD=1.8V
Bop S
Bop S
Brp S
4.0
Brp S
2.0
0.0
2.0
0.0
-2.0
-4.0
-6.0
-8.0
-2.0
-4.0
-6.0
-8.0
Brp N
Bop N
Brp N
Bop N
-60 -40 -20
0
20 40 60 80 100
1.4
1.8
2.2
2.6
3.0
3.4
3.8
-60 -40 -20
0
20 40 60 80 100
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
AMBIENT TEMPERATURE [
]
℃
Fig.13 Bop,Brp– Supply voltage
Fig.14 TP – Ambient temperature
Fig.12 Bop,Brp– Ambient temperature
16.0
14.0
12.0
10.0
8.0
100
Ta = 25°C
VDD=1.8V
90
14.0
12.0
10.0
8.0
Ta = 25°C
80
70
60
50
40
30
20
10
0
6.0
6.0
4.0
4.0
2.0
2.0
0.0
0.0
1.4
1.8
2.2
2.6
3.0
3.4
3.8
1.4
1.8
2.2
2.6
3.0
3.4
3.8
-60 -40 -20
0
20 40 60 80 100
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
SUPPLY VOLTAGE [V]
Fig.16
IDD– Ambient temperature
Fig.15 TP– Supply voltage
Fig.17 IDD– Supply voltage
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2011.12 - Rev.G
14/31
© 2011 ROHM Co., Ltd. All rights reserved.
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BU52015GUL, BU52011HFV (VDD=1.65～3.3V type)
100
90
80
70
60
50
40
30
20
10
0
8.0
6.0
8.0
6.0
VDD=1.8V
Ta = 25°C
VDD=1.8V
Bop S
4.0
4.0
Bop S
Brp S
2.0
2.0
Brp S
Brp N
0.0
0.0
Brp N
Bop N
-2.0
-4.0
-6.0
-8.0
-2.0
-4.0
-6.0
-8.0
Bop N
-60 -40 -20
0
20 40 60 80 100
1.4
1.8
2.2
2.6
3.0
3.4
3.8
-60 -40 -20
0
20 40 60 80 100
AMBIENT TEMPERATURE [
]
℃
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Fig.19 Bop,Brp Supply voltage
Fig.18 Bop,Brp– Ambient temperature
Fig.20 TP – Ambient temperature
14.0
14.0
100
90
12.0
10.0
8.0
12.0
10.0
8.0
Ta = 25°C
80
VDD=1.8V
Ta = 25°C
70
60
50
40
30
20
10
0
6.0
6.0
4.0
4.0
2.0
2.0
0.0
0.0
-60 -40 -20
0
20 40 60 80 100
1.4
1.8
2.2
2.6
3.0
3.4
3.8
1.4 1.8 2.2 2.6 3.0 3.4 3.8
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
SUPPLY VOLTAGE [V]
Fig.23 IDD – Supply voltage
Fig.21 TP– Supply voltage
Fig.22 IDD– Ambient temperature
BU52001GUL (VDD=2.4～3.3V type)
8.0
8.0
100
90
80
70
60
50
40
30
20
10
0
Ta = 25°C
VDD=3.0V
6.0
6.0
VDD=3.0V
Bop S
Bop S
4.0
4.0
2.0
2.0
Brp S
Brp S
0.0
0.0
-2.0
-2.0
Brp N
Brp N
-4.0
-4.0
Bop N
Bop N
-6.0
-8.0
-6.0
-8.0
-60 -40 -20
0
20 40 60 80 100
2.0
2.4
2.8
3.2
3.6
-60 -40 -20
0
20 40 60 80 100
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
AMBIENT TEMPERATURE [
]
℃
Fig.25 Bop,Brp– Supply voltage
Fig.24 Bop,Brp–Ambient temperature
Fig.26 TP– Ambient temperature
100
90
14.0
14.0
Ta = 25°C
12.0
10.0
8.0
12.0
10.0
8.0
Ta = 25°C
80
VDD=3.0V
70
60
50
40
30
20
10
0
6.0
6.0
4.0
4.0
2.0
2.0
0.0
0.0
2.0
2.4
2.8
3.2
3.6
2.0
2.4
2.8
3.2
3.6
-60 -40 -20
0
20 40 60 80 100
SUPPLY VOLTAGE [V]
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Fig.29 IDD – Supply voltage
Fig.27 TP– Supply voltage
Fig.28 IDD– Ambient temperature
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2011.12 - Rev.G
15/31
© 2011 ROHM Co., Ltd. All rights reserved.
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BU52061NVX(VDD=1.65～3.6V type)
8.0
100
90
80
70
60
50
40
30
20
10
0
8.0
VDD=1.8V
Ta = 25°C
6.0
4.0
6.0
4.0
VDD=1.8V
Bop S
Bop S
2.0
2.0
Brp S
Brp N
Brp S
Brp N
0.0
0.0
-2.0
-4.0
-6.0
-8.0
-2.0
-4.0
-6.0
-8.0
Bop N
Bop N
-60 -40 -20
0
20 40 60 80 100
1.4
1.8
2.2
2.6
3.0
3.4
3.8
-60 -40 -20
0
20 40 60 80 100
AMBIENT TEMPERATURE [
]
℃
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Fig.30 Bop,Brp– Ambient temperature
Fig.31 Bop,Brp– Supply voltage
Fig.32 TP – Ambient temperature
100
14.0
12.0
10.0
8.0
14.0
VDD=1.8V
90
12.0
10.0
8.0
Ta = 25°C
80
Ta = 25°C
70
60
50
40
30
20
10
0
6.0
6.0
4.0
4.0
2.0
2.0
0.0
0.0
1.4
1.8
2.2
2.6
3.0
3.4
3.8
1.4
1.8
2.2
2.6
3.0
3.4
3.8
-60 -40 -20
0
20 40 60 80 100
AMBIENT TEMPERATURE [
]
℃
SUPPLY VOLTAGE [V]
SUPPLY VOLTAGE [V]
Fig.34 IDD– Ambient temperature
Fig.33 TP– Supply voltage
Fig.35
IDD – Supply voltage
BU52053NVX (VDD=1.65～3.6V type)
8.0
8.0
100
90
80
70
60
50
40
30
20
10
0
Ta = 25°C
VDD=1.8V
6.0
4.0
6.0
VDD=1.8V
Bop S
Brp S
Bop S
4.0
2.0
2.0
Brp S
0.0
0.0
Brp N
Brp N
Bop N
-2.0
-4.0
-6.0
-8.0
-2.0
-4.0
Bop N
-6.0
-8.0
-60 -40 -20
0
20 40 60 80 100
-60 -40 -20
0
20 40 60 80 100
1.4
1.8
2.2
2.6
3.0
3.4
3.8
AMBIENT TEMPERATURE [
]
℃
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Fig.36 Bop,Brp– Ambient temperature
Fig.37 Bop,Brp– Supply voltage
Fig.38 TP – Ambient temperature
14.0
100
16.0
Ta = 25°C
90
Ta = 25°C
VDD=1.8V
14.0
12.0
10.0
8.0
12.0
10.0
8.0
80
70
60
50
40
30
20
10
0
6.0
6.0
4.0
4.0
2.0
2.0
0.0
0.0
1.4
1.8
2.2
2.6
3.0
3.4
3.8
-60 -40 -20
0
20 40 60 80 100
1.4
1.8
2.2
2.6
3.0
3.4
3.8
AMBIENT TEMPERATURE [
]
℃
SUPPLY VOLTAGE [V]
SUPPLY VOLTAGE [V]
Fig.41 IDD – Supply voltage
Fig.40
IDD– Ambient temperature
Fig.39 TP– Supply voltage
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2011.12 - Rev.G
16/31
© 2011 ROHM Co., Ltd. All rights reserved.
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BU52056NVX(VDD=1.65～3.6V type)
8.0
6.0
100
90
80
70
60
50
40
30
20
10
0
8.0
6.0
VDD=1.8V
Ta = 25°C
Bop S
Brp S
VDD=1.8V
Bop S
Brp S
4.0
4.0
2.0
2.0
0.0
0.0
-2.0
-4.0
-6.0
-8.0
-2.0
-4.0
-6.0
-8.0
Brp N
Bop N
Brp N
Bop N
1.4
1.8
2.2
2.6
3.0
3.4
3.8
-60 -40 -20
0
20 40 60 80 100
-60 -40 -20
0
20 40 60 80 100
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
AMBIENT TEMPERATURE [
]
℃
Fig.42 Bop,Brp– Ambient temperature
Fig.43 Bop,Brp– Supply voltage
Fig.44 TP – Ambient temperature
14.0
14.0
100
VDD=1.8V
Ta = 25°C
Ta = 25°C
90
12.0
10.0
8.0
12.0
10.0
8.0
80
70
60
50
40
30
20
10
0
6.0
6.0
4.0
4.0
2.0
2.0
0.0
0.0
-60 -40 -20
0
20 40 60 80 100
1.4
1.8
2.2
2.6
3.0
3.4
3.8
1.4
1.8
2.2
2.6
3.0
3.4
AMBIENT TEMPERATURE [
]
℃
SUPPLY VOLTAGE [V]
SUPPLY VOLTAGE [V]
Fig.45 TP– Supply voltage
Fig.46 IDD– Ambient temperature
Fig.47 IDD– Supply voltage
BU52021HFV, BU52025G (VDD=2.4～3.6V type)
8.0
8.0
6.0
100
90
80
70
60
50
40
30
20
10
0
VDD=3.0V
VDD=3.0V
Ta = 25°C
6.0
4.0
Bop S
Bop S
Brp S
4.0
2.0
2.0
Brp S
Brp N
0.0
0.0
Brp N
Bop N
-2.0
-4.0
-6.0
-8.0
-2.0
-4.0
-6.0
-8.0
Bop N
-60 -40 -20
0
20 40 60 80 100
-60 -40 -20
0
20 40 60 80 100
2.0
2.4
2.8
3.2
3.6
4.0
AMBIENT TEMPERATURE [
]
℃
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Fig.49 Bop,Brp– Supply voltage
Fig.48 Bop,Brp–Ambient temperature
Fig.50 TP – Ambient temperature
14.0
100
90
14.0
VDD=3.0V
Ta = 25°C
12.0
10.0
8.0
12.0
10.0
8.0
Ta = 25°C
80
70
60
50
40
30
20
10
0
6.0
6.0
4.0
4.0
2.0
2.0
0.0
0.0
-60 -40 -20
0
20 40 60 80 100
2.0
2.4
2.8
3.2
3.6
4.0
2.0
2.4
2.8
3.2
3.6
4.0
AMBIENT TEMPERATURE [
]
℃
SUPPLY VOLATAGE [V]
SUPPLY VOLTAGE [V]
Fig.52 IDD – Ambient temperature
Fig.53
I
DD – Supply voltage
Fig.51 TP – Supply voltage
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.12 - Rev.G
17/31
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BD7411G (VDD=4.5～5.5V type)
8.0
6.0
8.0
6.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
VDD=5.0V
Ta = 25°C
VDD=5.0V
Bop S
Bop S
Brp S
4.0
4.0
2.0
2.0
Brp S
Brp N
0.0
0.0
Brp N
Bop N
-2.0
-4.0
-6.0
-8.0
-2.0
-4.0
-6.0
-8.0
Bop N
4.0
4.5
5.0
5.5
6.0
-60 -40 -20
0
20 40 60 80 100
-60 -40 -20
0
20 40 60 80 100
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
AMBIENT TEMPERATURE
［℃］
Fig.54 Bop,Brp–Ambient temperature
Fig.55 Bop,Brp– Supply voltage
Fig.56 IDD – Ambient temperature
6.0
5.0
Ta = 25°C
4.0
3.0
2.0
1.0
0.0
4.0
4.5
5.0
5.5
6.0
SUPPLY VOLTAGE [V]
Fig.57
IDD – Supply voltage
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.12 - Rev.G
18/31
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
●Block Diagram
BU52054GWZ, BU52055GWZ
VDD
Adjust the bypass capacitor
value as necessary, according
to voltage noise conditions, etc.
0.1µF
B1
TIMING LOGIC
HALL
ELEMENT
The CMOS output terminals enable direct
connection to the PC, with no external pull-up
resistor required.
×
B2 OUT
A1,A2
GND
Fig.58
FUNCTION
A2
B2
A1
B1
A1
A2
PIN No.
A1
PIN NAME
GND
COMMENT
GROUND
GROUND
A2
GND
B1
VDD
POWER SUPPLY
OUTPUT
B2
OUT
B1
B2
Surface
Reverse
BU52015GUL
VDD
0.1µF
B2
Adjust the bypass capacitor value as
necessary, according to voltage noise
conditions, etc.
TIMING LOGIC
OUT1
A1
HALL
ELEMENT
The CMOS output terminals enable direct
connection to the PC, with no external pull-up
resistor required.
GND
VDD
×
OUT2
A2
B1
GND
Fig.59
A2
B2
A1
B1
A1
A2
PIN No.
A1
PIN NAME
OUT1
OUT2
GND
FUNCTION
COMMENT
Output pin (Active Low)
Output pin (Active High)
GROUND
A2
B1
B1
Surface
B2
B2
VDD
Power Supply Voltage
Reverse
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.12 - Rev.G
19/31
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BU52001GUL
VDD
0.1µF
A1
Adjust the bypass capacitor value as
TIMING LOGIC
HALL
necessary, according to voltage noise conditions, etc.
ELEMENT
×
B1 OUT
The CMOS output terminals enable direct connection
to the PC, with no external pull-up resistor required.
A2
GND
Fig.60
A2
A1
A1
A2
PIN No.
A1
PIN NAME
VDD
FUNCTION
POWER SUPPLY
GROUND
COMMENT
A2
GND
B1
OUT
OUTPUT
B2
N.C.
OPEN or Short to GND.
B1
B2
Surface
B2
B1
Reverse
BU52061NVX, BU52053NVX, BU52056NVX
VDD
0.1µF
4
Adjust the bypass capacitor value as
necessary, according to voltage noise
conditions, etc.
TIMING LOGIC
HALL
ELEMENT
×
OUT
1
2
The CMOS output terminals enable direct
connection to the PC, with no external pull-up
resistor required.
GND
Fig.61
4
3
3
2
4
1
PIN No.
PIN NAME
OUT
FUNCTION
OUTPUT
COMMENT
1
2
3
4
GND
GROUND
N.C.
OPEN or Short to GND.
1
2
VDD
POWER SUPPLY
Surface
Reverse
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2011.12 - Rev.G
20/31
© 2011 ROHM Co., Ltd. All rights reserved.
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BU52011HFV, BU52021HFV
VDD
0.1µF
4
Adjust the bypass capacitor value as
necessary, according to voltage noise
conditions, etc.
TIMING LOGIC
HALL
The CMOS output terminals enable direct connection
to the PC, with no external pull-up resistor required.
ELEMENT
×
OUT
5
2
GND
Fig.62
4
3
4
3
5
1
5
1
PIN No.
PIN NAME
N.C.
FUNCTION
GROUND
COMMENT
1
2
3
4
5
OPEN or Short to GND.
GND
N.C.
OPEN or Short to GND.
VDD
POWER SUPPLY
OUTPUT
2
2
OUT
Surface
Reverse
BU52025G
VDD
0.1µF
4
Adjust the bypass capacitor value as
necessary, according to voltage noise
conditions, etc.
TIMING LOGIC
HALL
The CMOS output terminals enable direct
connection to the PC, with no external pull-up
resistor required.
ELEMENT
×
OUT
5
2
GND
Fig.63
4
3
4
3
5
1
5
1
PIN No.
PIN NAME
N.C.
FUNCTION
GROUND
COMMENT
1
2
3
4
5
OPEN or Short to GND.
GND
N.C.
OPEN or Short to GND.
2
2
VDD
POWER SUPPLY
OUTPUT
Surface
Reverse
OUT
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2011.12 - Rev.G
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© 2011 ROHM Co., Ltd. All rights reserved.
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BD7411G
VDD
5
0.1µF
Adjust the bypass capacitor
value as necessary, according
to voltage noise conditions, etc.
TIMING LOGIC
REG
The CMOS output terminals enable direct
connection to the PC, with no external pull-up
resistor required.
HALL
ELEMENT
×
OUT
4
2
GND
Fig.64
4
3
4
3
5
5
1
PIN No.
PIN NAME
N.C.
FUNCTION
GROUND
COMMENT
1
2
3
4
5
OPEN or Short to GND.
GND
N.C.
OPEN or Short to GND.
OUT
OUTPUT
1
2
2
Surface
VDD
POWER SUPPLY
Reverse
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2011.12 - Rev.G
22/31
© 2011 ROHM Co., Ltd. All rights reserved.
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
●Description of Operations
(Micropower Operation)
The bipolar detection Hall IC adopts an intermittent operation method
to save energy. At startup, the Hall elements, amp, comparator and
other detection circuits power ON and magnetic detection begins.
During standby, the detection circuits power OFF, thereby reducing
current consumption. The detection results are held while standby is
active, and then output.
IDD
Period
Startup time
Standby time
Reference period: 50ms (MAX100ms)
Reference startup time: 48µs
※BD7411G don’t adopts an intermittent operation method.
t
Fig.65
(Offset Cancelation)
The Hall elements form an equivalent Wheatstone (resistor) bridge
circuit. Offset voltage may be generated by a differential in this bridge
resistance, or can arise from changes in resistance due to package or
bonding stress. A dynamic offset cancellation circuit is employed to
cancel this offset voltage.
VDD
I
When Hall elements are connected as shown in Fig. 66 and a
magnetic field is applied perpendicular to the Hall elements, voltage is
generated at the mid-point terminal of the bridge. This is known as Hall
voltage.
Dynamic cancellation switches the wiring (shown in the figure) to
redirect the current flow to a 90˚ angle from its original path, and
thereby cancels the Hall voltage.
+
B
×
Hall Voltage
The magnetic signal (only) is maintained in the sample/hold circuit
during the offset cancellation process and then released.
－
GND
Fig.66
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2011.12 - Rev.G
23/31
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
(Magnetic Field Detection Mechanism)
S
N
S
S
N
S
Magnetic
Flux
Magnetic
Flux
Fig.67
The Hall IC cannot detect magnetic fields that run horizontal to the package top layer.
Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer.
N
S
N
S
S
N
OUT [V]
Magnetic
Magnetic
High
Flux
Flux
High
High
Low
Low
B
0
Bop N
Brp N
Bop S
Brp S
Magnetic flux density [mT]
Fig.68
N-Pole
S-Pole
The bipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of the package. There is an
inverse relationship between magnetic flux density and the distance separating the magnet and the Hall IC: when distance
increases magnetic density falls. When it drops below the operate point (Bop), output goes HIGH. When the magnet gets
closer to the IC and magnetic density rises, to the operate point, the output switches LOW. In LOW output mode, the
distance from the magnet to the IC increases again until the magnetic density falls to a point just below Bop, and output
returns HIGH. (This point, where magnetic flux density restores HIGH output, is known as the release point, Brp.) This
detection and adjustment mechanism is designed to prevent noise, oscillation and other erratic system operation.
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2011.12 - Rev.G
24/31
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
●Intermittent Operation at Power ON
Power ON
VDD
Startup time
Standby time
High
Startup time
Standby time
Supply current
(Intermittentaction)
Indefinite
interval
OUT
(No magnetic
field present)
Indefinite
interval
OUT
(Magnetic
field present)
Low
Fig.69
The bipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during startup, as
shown in Fig. 69. It outputs to the appropriate terminal based on the detection result and maintains the output condition
during the standby period. The time from power ON until the end of the initial startup period is an indefinite interval, but it
cannot exceed the maximum period, 100ms. To accommodate the system design, the Hall IC output read should be
programmed within 100ms of power ON, but after the time allowed for the period ambient temperature and supply voltage.
※BD7411G don’t adopts an intermittent operation method.
●Magnet Selection
Of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume
than ferrite, thereby enabling the highest degree of miniaturization, Thus, neodymium is best suited for small equipment
applications. Fig. 70 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. The
graph plots the correlation between the distance (L) from three versions of a 4mm X 4mm cross-section neodymium magnet
(1mm, 2mm, and 3mm thick) and magnetic flux density. Fig. 71 shows Hall IC detection distance – a good guide for
determining the proper size and detection distance of the magnet. Based on the BU52011HFV, BU52015GUL operating
point max 5.0 mT, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 7.6mm, 9.22mm, and
10.4mm, respectively. To increase the magnet’s detection distance, either increase its thickness or sectional area.
10
9
t=3mm
8
t=1mm
7
6
5
4
3
2
1
0
t=2mm
7.6mm 9.2mm
10.4mm
0
2
4
6
8
10
12
14
16
18
20
Magnet Hall IC distance L [mm]
Fig.70
X
Magnet
t
Magnet material: NMX-44CH
Maker: Hitachi Metals.,LTD
t
Y
X=Y=4mm
t=1mm,2mm,3mm
L: Variable
…Flux density measuring point
Magnet size
Fig.71 Magnet Dimensions and Flux Density Measuring Point
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2011.12 - Rev.G
25/31
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
●Position of the Hall Effect IC(Reference)
UCSP35L1
0.40
VCSP50L1
0.55
SSON004X1216
0.6
HVSOF5
0.6
SSOP5
0.8
0.8
1.45
0.8
0.55
0.40
0.6
0.2
0.35
0.2
0.25
(UNIT:mm)
●Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition)
UCSP35L1
VCSP50L1
SSON004X1216
SD
b3
e
Reference
Value
Symbol
e
0.40
Φ0.20
0.20
Please avoid having potential overstress
from PCB material, strength, mounting
positions.
If you had any further questions or
concerns, please contact your Rohm
sales and affiliate.
b3
SD
SE
0.20
HVSOF5
SSOP5
(UNIT:mm)
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2011.12 - Rev.G
26/31
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
●Terminal Equivalent Circuit Diagram
OUT , OUT1, OUT2
VDD
Because they are configured for CMOS (inverter) output, the
output pins require no external resistance and allow direct
connection to the PC. This, in turn, enables reduction of the
current that would otherwise flow to the external resistor during
magnetic field detection, and supports overall low current
(micropower) operation.
GND
Fig.72
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2011.12 - Rev.G
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BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
●Notes for use
1) Absolute maximum ratings
Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or
destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this
way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in
excess of absolute rating limits.
2) GND voltage
Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower
than the potential of all other pins.
3) Thermal design
Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
4) Pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning
or orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted
together, or if shorts occur between the output pin and supply pin or GND.
5) Positioning components in proximity to the Hall IC and magnet
Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore
the magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in
the design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and
evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design.
6) Slide-by position sensing
Fig.73 depicts the slide-by configuration employed for position sensing. Note that when the gap (d) between the magnet
and the Hall IC is narrowed, the reverse magnetic field generated by the magnet can cause the IC to malfunction. As seen
in Fig.74, the magnetic field runs in opposite directions at Point A and Point B. Since the bipolar detection Hall IC can
detect the S-pole at Point A and the N-pole at Point B, it can wind up switching output ON as the magnet slides by in the
process of position detection. Fig. 75 plots magnetic flux density during the magnet slide-by. Although a reverse magnetic
field was generated in the process, the magnetic flux density decreased compared with the center of the magnet. This
demonstrates that slightly widening the gap (d) between the magnet and Hall IC reduces the reverse magnetic field and
prevents malfunctions.
10
8
Reverse
Magnetic
Field
Magnet
Slide
6
4
Magnetic Flux
2
0
-2
-4
-6
-8
-10
A
S
B
Hall IC
L
Magnetic Flux
0
1
2
3
4
5
6
7
8
9
10
N
Fig.74
Horizontal distance from the magnet [mm]
Fig.75
Fig.73
7) Operation in strong electromagnetic fields
Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause
the IC to malfunction.
8) Common impedance
Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example,
employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or
capacitor.
9) GND wiring pattern
When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set
PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes
due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same
way, care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components.
10)Exposure to strong light
Exposure to halogen lamps, UV and other strong light sources may cause the IC to malfunction. If the IC is subject to such
exposure, provide a shield or take other measures to protect it from the light. In testing, exposure to white LED and
fluorescent light sources was shown to have no significant effect on the IC.
11)Power source design
Since the IC performs intermittent operation, it has peak current when it’s ON. Please taking that into account and under
examine adequate evaluations when designing the power source.
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2011.12 - Rev.G
28/31
© 2011 ROHM Co., Ltd. All rights reserved.
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
●Ordering part number
B U
5
2
0
0
1
G U
L
-
E
2
Part No.
BU, BD
Part No.
Package
Packaging and forming specification
E2: Embossed tape and reel
(UCSP35L1, VSCP50L1)
TR: Embossed tape and reel
(SSON004X1216,HVSOF5, SSOP5)
52054, 52055, 52015
52001, 52061, 52053
52056, 52011, 52021
52025, 7411
GWZ : UCSP35L1
GUL : VSCP50L1
NVX : SSON004X1216
HFV : HVSOF5
G
: SSOP5
UCSP35L1(BU52054GWZ)
<Tape and Reel information>
Tape
Embossed carrier tape
3000pcs
1PIN MARK
Quantity
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
0.80±0.05
(
)
S
S
0.06
φ
4- 0.20 0.05
0.05 A B
A
B
A
B
1
2
Direction of feed
1pin
0.2±0.05
0.4
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
UCSP35L1(BU52055GWZ)
<Tape and Reel information>
Tape
Embossed carrier tape
1PIN MARK
Quantity
3000pcs
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
0.80±0.05
(
)
S
S
0.06
φ
4- 0.20 0.05
0.05 A B
A
B
A
B
1
2
Direction of feed
1pin
0.2±0.05
0.4
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
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2011.12 - Rev.G
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BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
VCSP50L1(BU52015GUL)
<Tape and Reel information>
1PIN MARK
Tape
Embossed carrier tape
3000pcs
Quantity
E2
1.10±0.1
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
S
0.08
S
φ
4- 0.25±0.05
0.05
A B
A
B
B
A
1
2
0.30±0.1
0.50
Direction of feed
1pin
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
VCSP50L1(BU52001GUL)
<Tape and Reel information>
1PIN MARK
Tape
Embossed carrier tape
Quantity
3000pcs
E2
1.10±0.1
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
S
0.08
S
φ
4- 0.25±0.05
0.05
A B
A
B
B
A
1
2
0.30±0.1
0.50
Direction of feed
1pin
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
SSON004X1216
<Tape and Reel information>
1.2 0.1
Tape
Embossed carrier tape
Quantity
5000pcs
TR
Direction
of feed
1PIN MARK
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
S
0.08
S
+0.05
0.65 0.1
0.2
-
0.04
1
2
4
3
Direction of feed
Order quantity needs to be multiple of the minimum quantity.
1pin
0.75 0.1
Reel
(Unit : mm)
∗
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2011.12 - Rev.G
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BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
HVSOF5
<Tape and Reel information>
1.6 0.05
1.0 0.05
(0.8)
(0.3)
Tape
Embossed carrier tape
3000pcs
Quantity
TR
Direction
of feed
5
1
4
3
4
5
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
3
2 1
2
1pin
0.13 0.05
S
0.1
S
0.5
0.22 0.05
Direction of feed
Order quantity needs to be multiple of the minimum quantity.
M
0.08
Reel
∗
(Unit : mm)
SSOP5
<Tape and Reel information>
°
°
+
−4
2.9 0.2
4
6
°
4
Tape
Embossed carrier tape
5
Quantity
3000pcs
TR
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
2
3
1pin
+0.05
0.13
−0.03
S
+0.05
−0.04
0.42
0.1
0.95
S
Direction of feed
Order quantity needs to be multiple of the minimum quantity.
Reel
(Unit : mm)
∗
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2011.12 - Rev.G
31/31
© 2011 ROHM Co., Ltd. All rights reserved.
Notice
N o t e s
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which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
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The technical information specified herein is intended only to show the typical functions of and
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use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
nication devices, electronic appliances and amusement devices).
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While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
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The Products are not designed or manufactured to be used with any equipment, device or
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© 2011 ROHM Co., Ltd. All rights reserved.
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