BM60055FV-CE2 [ROHM]
1ch Gate Driver Providing Galvanic Isolation 2500Vrms Isolation Voltage;
| 型号： | BM60055FV-CE2 |
| 厂家： | 
ROHM |
| 描述： | 1ch Gate Driver Providing Galvanic Isolation 2500Vrms Isolation Voltage 栅 |
| 文件： | 总41页 (文件大小：2812K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
1ch Gate Driver Providing Galvanic Isolation
2500Vrms Isolation Voltage
BM60055FV-C
General Description
Key Specifications
The BM60055FV-C is a gate driver with an isolation
voltage of 2500Vrms, I/O delay time of 250ns, minimum
input pulse width of 170ns. It incorporates the fault signal
output function (FLT_UVLO, FLT_SC, FLT_OT), under
voltage lockout (UVLO) function, short circuit protection
(SCP) function, over temperature protection (OT)
function, over current protection (OC) function, Soft turn
off function, 2 level turn off function, active miller
clamping function, switching controller function and
output state feedback function.
Isolation Voltage:
2500 [Vrms] (Max)
24 [V] (Max)
Maximum Gate Drive Voltage:
I/O Delay Time:
Minimum Input Pulse Width:
250 [ns] (Max)
170 [ns] (Max)
Package
W(Typ) x D(Typ) x H(Max)
9.2mm x 10.4mm x 2.4mm
SSOP-B28W
Features
Fault Signal Output Function
Under Voltage Lockout Function
Short Circuit Protection Function
Over Current Protection Function
Over Temperature Protection
Temperature Compensation of OC
Soft Turn Off Function of SCP
2 Level Turn Off Function
Active Miller Clamping
Switching Controller
Output State Feedback Function
AEC-Q100 Qualified (Note 1)
(Note 1:Grade1)
Applications
Automotive isolated IGBT/MOSFET inverter
gate drive.
Automotive DC-DC converter.
Industrial inverters system.
UPS system.
Typical Application Circuit
+
+
OSC
-
-
GND1
FLT_UVLO
INB
GND2
OUT2
FLT
TIMER
RESET
OSC
OUT1
S
R
PRE
DRIVER
VCC2
Q
OSFB
ECU
INA
OSFB
VCC2
PROOUT
TC
LOGIC
CURRENT
SOURCE
LOGIC
FLT_OT
FLT_SC
FB
+
-
TO
Temp
Compensation
2 level Turn
off Contol
-
TCOMP
RTOFF
LVOFF
-
TIMER
TIMER
+
+
DAC
+
COMP
V_BATT
VREG
FET_G
SENSE
GND1
V_BATT
Rectifier
/ Ripple filter
+
-
Snubber
REGULATOR
OSC
Filter
SCPIN
OCIN
Filter
Filter
GND1
SLOPE
OSC
+
-
VCC2
Filter
Q
S
R
Rectifier
/ Ripple filter
UVLOIN
GND2
MAX.Duty
UVLO_BATT
+
-
GND2
GND2
GND1
Figure 1. Typical Application Circuit
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays
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BM60055FV-C
Contents
General Description........................................................................................................................................................................1
Features..........................................................................................................................................................................................1
Applications ....................................................................................................................................................................................1
Key Specifications ..........................................................................................................................................................................1
Package
W(Typ) x D(Typ) x H(Max).......................................................................................................................1
Typical Application Circuit ...............................................................................................................................................................1
Contents .........................................................................................................................................................................................2
Recommended Range Of External Constants
Pin Configuration .........................................................................................3
Pin Descriptions..............................................................................................................................................................................3
Thermal Resistance(Note6) ................................................................................................................................................................5
Recommended Operating Conditions (Ta= -40°C to +125°C) ........................................................................................................5
Electrical Characteristics.................................................................................................................................................................6
(Unless otherwise specified Ta=-40°C to125°C, VBATT=4.5V to 30V, VCC2=9V to 24V) ...................................................................6
Typical Performance Curves...........................................................................................................................................................9
Figure 3. Main Power Supply Circuit Current 1 ...........................................................................................................................9
Figure 4. Main Power Supply Circuit Current 2 ...........................................................................................................................9
Figure 5. Output Side Circuit Current ..........................................................................................................................................9
Figure 6. FET_G ON-Resistance ................................................................................................................................................9
Figure 7. Soft-start Time............................................................................................................................................................10
Figure 9. COMP Pin Sink Current .............................................................................................................................................10
Figure 10. COMP Pin Source Current.......................................................................................................................................10
Figure 11. Over-Current Detection Threshold............................................................................................................................11
Figure 12. Logic input Filtering Time .........................................................................................................................................11
Figure 13. OUT1 Source ON-Resistance..................................................................................................................................11
Figure 14. OUT1 Sink ON-Resistance ......................................................................................................................................11
Figure 15. PROOUT ON-Resistance.........................................................................................................................................12
Figure 16. Turn ON time............................................................................................................................................................12
Figure 17. Turn OFF time..........................................................................................................................................................12
Figure 18. OUT2 ON Resistance ..............................................................................................................................................12
Figure 19. Over Current Detection Voltage ...............................................................................................................................13
Figure 20. Short Circuit Detection Voltage ................................................................................................................................13
Figure 21. Over Temperature Detection Voltage .......................................................................................................................13
Description of Functions and Examples of Constant Setting ........................................................................................................16
Selection of Components Externally Connected...........................................................................................................................28
I/O Equivalent Circuit ....................................................................................................................................................................29
Operational Notes.........................................................................................................................................................................33
1.
2.
3.
4.
5.
6.
7.
8.
Reverse Connection of Power Supply............................................................................................................................33
Power Supply Lines........................................................................................................................................................33
Ground Voltage...............................................................................................................................................................33
Ground Wiring Pattern....................................................................................................................................................33
Thermal Consideration ...................................................................................................................................................33
Recommended Operating Conditions.............................................................................................................................33
Inrush Current.................................................................................................................................................................33
Operation Under Strong Electromagnetic Field ..............................................................................................................33
Testing on Application Boards.........................................................................................................................................33
Inter-pin Short and Mounting Errors ...............................................................................................................................33
Unused Input Pins ..........................................................................................................................................................34
Regarding the Input Pin of the IC ...................................................................................................................................34
Ceramic Capacitor..........................................................................................................................................................34
9.
10.
11.
12.
13.
Ordering Information.....................................................................................................................................................................35
Marking Diagrams.........................................................................................................................................................................35
Physical Dimension, Tape and Reel Information...........................................................................................................................36
Revision History............................................................................................................................................................................37
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BM60055FV-C
Recommended Range Of External Constants
Pin Configuration
Recommended Value
Pin Name
Symbol
Unit
Min
1.25
4.6
3
Typ
Max
50
30
-
28
1
2
GND1
GND2
UVLOIN
OCIN
TC
RTC
-
10
-
kΩ
kΩ
µF
µF
µF
27 SENSE
26 FET_G
25 VREG
RTOFF
VBATT
VCC2
VREG
RRTOFF
CVBATT
CVCC2
CVREG
3
4
SCPIN
LVOFF
0.4
0.1
-
-
5
V_BATT
COMP
FB
24
23
22
21
1
10
6
RTOFF
TCOMP
TO
7
8
FLT_SC
TC
20 FLT_OT
19 OSFB
9
PROOUT
VCC2
10
11
12
INA
18
INB
17
OUT1
OUT2 13
16 FLT_UVLO
15
14
GND2
GND1
Figure 2. Pin configuration
Pin Descriptions
Pin No.
1
Pin Name
Function
GND2
UVLOIN
OCIN
Output-side ground pin
2
Output-side UVLO setting pin
Over current detection pin
Short circuit detection pin
2-level turn off level setting pin
2-level turn off time setting pin
Temp compensation pin of OC
3
4
SCPIN
LVOFF
RTOFF
TCOMP
TO
5
6
7
8
Constant current output pin / Over temperature detection pin
Constant current setting resistor connection pin
Soft turn-off pin
9
TC
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
PROOUT
VCC2
Output-side power supply pin
OUT1
OUT2
GND2
GND1
FLT_UVLO
INB
Output pin
Input and output pin for miller clamp / Gate voltage input pin
Output-side ground pin
Input-side ground pin
Fault (UVLO) output pin
Control input pin B
INA
Control input pin A
OSFB
FLT_OT
FLT_SC
FB
Output state feedback output pin
Fault (OT) output pin
Fault (SCP) output pin
Error amplifier inverting input pin for switching controller
Error amplifier output pin for switching controller
Main power supply pin
COMP
V_BATT
VREG
FET_G
SENSE
GND1
Power supply pin for driving MOS FET for switching controller
MOS FET control pin for switching controller
Current feedback resistor connection pin for switching controller
Input-side ground pin
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BM60055FV-C
Absolute Maximum Ratings
Parameter
Symbol
VBATTMAX
VCC2MAX
VINMAX
Rating
Unit
V
-0.3 to+40.0(Note 2)
-0.3 to +30.0(Note 3)
-0.3 to 7.0(Note 2)
-0.3 to +7.0(Note 2)
Main Power Supply Voltage
Output-Side Supply Voltage
V
INA, INB Pin Input Voltage
V
FLT_UVLO Pin, FLT_SC Pin, FLT_OT Pin,
VFLTMAX
V
FLT_UVLO Pin, FLT_SC Pin, FLT_OT Pin,
OSFB Pin Output Current
IFLT
10
mA
FB Pin Input Voltage
VFBMAX
IFET_GPEAK
VSCPINMAX, VOCINMAX
VUVLOINMAX
VLVOFFINMAX
VTCOMPINMAX
VTOMAX
-0.3 to +7.0(Note 2)
1000
V
mA
V
FET_G Pin Output Current (Peak5µs)
SCPIN Pin, OCIN Pin Input Voltage
-0.3 to +6.0(Note 3)
-0.3 to VCC2+0.3(Note 3)
-0.3 to VCC2+0.3(Note 3)
-0.3 to VCC2+0.3(Note 3)
-0.3 to VCC2+0.3(Note 3)
8
UVLOIN Pin Input Voltage
LVOFF Pin Input Voltage
V
V
TCOMP Pin Input Voltage
TO Pin Input Voltage
V
V
TO Pin Output Current
ITOMAX
mA
mA
mA
mA
W
OUT1 Pin Output Current (Peak5µs)
OUT2 Pin Output Current (Peak5µs)
PROOUT Pin Output Current (Peak30µs)
Power Dissipation
IOUT1PEAK
IOUT2PEAK
IPROOUTPEAK10
Pd
5000(Note 4)
5000(Note 4)
2000(Note 4)
1.12(Note 5)
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Topr
-40 to +125
°C
°C
°C
Tstg
-55 to +150
Tjmax
+150
(Note 2) Relative to GND1
(Note 3) Relative to GND2
(Note 4) Should not exceed Pd and Tj=150C
(Note 5) Derate above Ta=25C at a rate of 9.0mW/C. Mounted on a glass epoxy of 114.3 mm 76.2 mm 1.6 mm.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
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BM60055FV-C
Thermal Resistance(Note6)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 8)
2s2p(Note 9)
TO252-J5 / TO252-3
Junction to Ambient
Junction to Top Characterization Parameter(Note 7)
θJA
112.9
34
64.4
23
°C/W
°C/W
ΨJT
(Note 6)Based on JESD51-2A(Still-Air)
(Note 7)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 8)Using a PCB board based on JESD51-3.
(Note 9)Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3mm x 76.2mm x 1.6mmt
2 Internal Layers
4 Layers
Top
Copper Pattern
Bottom
Copper Pattern
74.2mm2(Square)
Thickness
Copper Pattern
Thickness
Thickness
Footprints and Traces
70μm
74.2mm2 (Square)
35μm
70μm
Recommended Operating Conditions (Ta= -40°C to +125°C)
Parameter
Main Power Supply Voltage
Output-side Supply Voltage
Output side UVLO voltage
Symbol
Min
Max
Units
(Note 10)
VBATT
4.5
9
30.0
24
-
V
V
V
(Note 11)
VCC2
(Note11)
VUV2TH
6
(Note 10) GND1 reference
(Note 11) GND2 reference
Insulation Related Characteristics
Parameter
Symbol
RS
Characteristic
>109
Unit
Insulation Resistance (VIO=500V)
Insulation Withstand Voltage / 1min
Insulation Test Voltage / 1sec
Ω
VISO
2500
Vrms
Vrms
VISO
3000
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BM60055FV-C
Electrical Characteristics
(Unless otherwise specified Ta=-40°C to125°C, VBATT=4.5V to 30V, VCC2=9V to 24V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
FET_G Pin
General
Main Power Supply
Circuit Current 1
IBATT1
0.5
1.3
2.2
mA
switching operation
FET_G Pin
Main Power Supply
Circuit Current 2
IBATT2
ICC2
0.4
1.8
1.2
3.2
2.1
4.8
mA
mA
No Switching
RTC=10kΩ
Output Side Circuit Current
Switching Power Supply Controller
FET_G Output Voltage H1
VFETGH1
4.5
4.0
0
5.0
4.5
-
5.5
-
V
V
V
Ω
IOUT=0A(open)
V_BATT=4.5V
IOUT=0A(open)
IOUT=0A(open)
FET_G Output Voltage H2
VFETGH2
VFETGL
RONGH
FET_G Output Voltage L
FET_G ON-Resistance
(Source-side)
0.3
12
3
6
10mA
10mA
FET_G ON-Resistance
(Sink-side)
RONGL
0.3
0.6
1.3
Ω
Oscillation Frequency
Soft-start Time
fOSC_SW
tSS
80
-
100
-
120
50
kHz
ms
V
FB Pin Threshold Voltage
FB Pin Input Current
COMP Pin Sink Current
VFB
1.47
-0.8
-160
40
1.50
0
1.53
+0.8
-40
IFB
µA
µA
µA
ICOMPSINK
ICOMPSOURCE
-80
80
COMP Pin Source Current
Over Voltage Detection
Threshold
Under Voltage Detection
Threshold
160
VOVTH
VUVTH
VOCTH
1.60
1.23
0.17
1.65
1.30
0.20
1.70
1.37
0.23
V
V
V
Over-Current Detection
Threshold
V_BATT UVLO OFF Voltage
V_BATT UVLO ON Voltage
Maximum ON DUTY
VUVLOBATTH
VUVLOBATTL
DONMAX
4.05
3.95
75
4.25
4.15
85
4.45
4.35
95
V
V
%
ms
Protection Holding Time
tDCDCRLS
20
40
60
Logic Block
Logic High Level Input Voltage
Logic Low Level Input Voltage
Logic Pull-Down Resistance
Logic Input Filtering Time
Output
VINH
VINL
RIND
tINFIL
3.5
-
-
-
-
V
V
INA、INB
INA、INB
INA、INB
INA、INB
1.5
100
170
25
70
50
120
kΩ
ns
OUT1 ON-Resistance
IOUT=40mA
IOUT=40mA
RONH
0.25
0.60
1.35
Ω
(Source-side)
OUT1 ON-Resistance
(Sink-side)
RONL
Ω
0.05
5.0
0.40
-
1.15
-
VCC2=15V
Guaranteed by design
OUT1 Maximum Current
IOUTMAX
A
0.35
130
130
-60
0.70
190
190
0
1.45
250
250
+60
IPROOUT=40mA
PROOUT ON-Resistance
Turn ON time
RONPRO
tPON
Ω
ns
ns
ns
Turn OFF time
tPOFF
Propagation Distortion
tPDIST
tPOFF - tPON
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BM60055FV-C
Electrical Characteristics - continued
(Unless otherwise specified Ta=-40°C to125°C, VBATT=4.5V to 30V, VCC2=9V to 24V)
Parameter
Symbol
tRISE
Min
-
Typ
30
Max
50
Unit
ns
Conditions
Load=1nF
Rise Time
Fall Time
OUT2 ON-Resistance
OUT2 ON Threshold Voltage
Common Mode Transient Immunity
tFALL
RON2
VOUT2ON
CM
-
30
0.45
3.0
-
50
1.2
3.3
-
ns
Ω
V
Load=1nF
IOUT=40mA
0.1
2.7
100
kV/µs Design assurance
Protection Functions
Output-side UVLO OFF
Threshold Voltage
Output-side UVLO ON
Threshold Voltage
Output-side UVLO
Filtering Time
VUVLO2H
VUVLO2L
0.95
0.85
1.5
1.00
0.90
2.0
2.2
-
1.05
0.95
2.5
V
V
tUVLO2FIL
tDUVLO2OUT
tDUVLO2FLT
VOCDET
µs
µs
µs
Output-side UVLO Delay Time
(OUT)
1.5
2.9
Output-side UVLO Delay Time
(FLT_UVLO)
1.5
65
Over Current Detection
Voltage1
0.658
0.394
0.658
0.874
0.70
0.700
0.420
0.700
0.930
1.00
0.742
0.441
0.742
0.986
1.30
V
V
TCOMP=VCC2
Over Current Detection
Voltage2
TO=4V
VOCDET
TCOMP=GND2
TO=3V
Over Current Detection
Voltage3
VOCDET
V
TCOMP=GND2
TO=2.2V
Over Current Detection
Voltage4
VOCDET
V
TCOMP=GND2
Over Current Detection
Filtering Time
tDOCFIL
µs
µs
µs
µs
V
Over Current Detection
Delay Time (OUT)
Over Current Detection
Delay Time (PROUT)
Over Current Detection
Delay Time (FLT_SC)
Short Circuit Detection
Voltage
VDOCOUT
VDOCPROUT
VDOCFLT_SC
VSCPDET
tSCPFIL
0.73
0.73
0.75
0.95
0.10
0.17
0.19
0.23
1.03
1.03
1.05
1.00
0.20
0.23
0.25
0.29
1.33
1.33
1.35
1.05
0.30
0.38
0.40
0.44
OUT1=30kΩ Pull down
PROOUT=30kΩ Pull up
Short Circuit Detection
Filtering Time
µs
µs
µs
µs
Short Circuit Detection
Delay Time (OUT)
Short Circuit Detection
Delay Time (PROOUT)
Short Circuit Detection
Delay Time (FLT_SC)
TC Pin Voltage
tDSCPOUT
tDSCPPROOUT
tDSCPFLT_SC
OUT1=30kΩ Pull down
PROOUT=30kΩ Pull up
VTC
ITO
0.975
0.97
1.000
1.00
1.025
1.03
V
TO Pin Output Current
TO Pin Disconnect Detection
Voltage
mA
RTC=10kΩ
VTOH
7
8
9
V
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BM60055FV-C
Electrical Characteristics - continued
(Unless otherwise specified Ta=-40°C to125°C, VBATT=4.5V to 30V, VCC2=9V to 24V)
Parameter
Over Temperature Detection
Voltage(ON)
Symbol
Min
Typ
2.0
Max
2.04
Unit
V
Conditions
VOTDETON
1.96
Over Temperature Detection
Voltage(OFF)
VOTDETOFF
tDOTOUT
tDOTFLT
RONFLT
2.15
2
2.2
10
2.25
30
V
Over Temperature Detection
Delay time (OUT)
µs
OUT1=30kΩ Pull down
Over Temperature Detection
Delay Time (FLT_OT)
1
-
-
35
80
µs
FLT_UVLO, FLT_SC, FLT_OT,
ON-Resistance
30
Ω
IFLT=5mA
Fault (UVLO) Output
Holding Time
tUVLO_FLTRLS
tSCP_FLTRLS
VLVOFF1
20
20
40
40
60
60
0
ms
ms
mV
mV
Fault (SCP) Output
Holding Time
2-Level Turn Off Voltage
Offset 1
-300
-350
-150
-200
VCC2=15V, LVOFF=12V
VCC2=15V, LVOFF=8V
2-Level Turn Off Voltage
Offset 2
VLVOFF2
-50
2-Level Turn Off Enable
Threshold Voltage
2-Level Turn Off Time
Gate State H Detection
Threshold Voltage
Gate State L Detection
Threshold Voltage
VLVOFFTH
tRTOFF
0.7
1.93
4.5
1.0
2.3
5.0
1.3
2.67
5.5
V
µs
V
RRTOFF=16kΩ
VOSFBH
VOSFBL
ROSFB
4.0
-
4.5
30
5.0
80
V
OSFB Output ON-Resistance
Ω
IOSFB=5mA
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BM60055FV-C
Typical Performance Curves
2.1
1.9
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
1.7
125℃
125℃
25℃
25℃
1.5
1.3
1.1
-40℃
-40℃
0.9
0.7
0.5
5
15
VBATT[V]
25
5
15
VBATT[V]
25
Figure 3. Main Power Supply Circuit Current 1
(FET_G Pin switching operation)
Figure 4. Main Power Supply Circuit Current 2
(FET_G Pin No Switching)
4.8
4.3
3.8
3.3
2.8
2.3
1.8
10
8
125℃
6
Source Side
25℃
4
-40℃
2
Sink Side
80
0
-40
0
40
120
9
14
19
24
VCC2[V]
Ta[℃]
Figure 5. Output Side Circuit Current
Figure 6. FET_G ON-Resistance
(10mA)
(RTC=10kΩ)
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BM60055FV-C
Typical Performance Curves – continued
50
40
30
20
10
0
1.53
1.52
1.51
1.50
1.49
1.48
1.47
-40
0
40
80
120
-40
0
40
80
120
Ta[℃]
Ta[℃]
Figure 7. Soft-start Time
Figure 8. FB Pin Threshold Voltage
160
140
120
100
80
-40
-60
-80
-100
-120
-140
-160
60
40
-40
0
40
80
120
-40
0
40
80
120
Ta[℃]
Ta[℃]
Figure 9. COMP Pin Sink Current
Figure 10. COMP Pin Source Current
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Typical Performance Curves - continued
170
160
150
140
130
120
110
100
90
0.23
0.21
0.19
0.17
INA OFF Pulse
INA ON Pulse
INB OFF Pulse
INB ON Pulse
80
70
-40
0
40
Ta[℃]
80
120
-40
0
40
80
120
Ta[℃]
Figure 11. Over-Current Detection Threshold
Figure 12. Logic input Filtering Time
(INA,INB)
1.05
0.85
0.65
0.45
0.25
0.05
1.25
1.05
0.85
0.65
0.45
0.25
-40
0
40
80
120
-40
0
40
80
120
Ta[℃]
Ta[℃]
Figure 13. OUT1 Source ON-Resistance
(IOUT=40mA)
Figure 14. OUT1 Sink ON-Resistance
(IOUT=40mA)
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BM60055FV-C
Typical Performance Curves - continued
250
230
210
190
170
150
130
1.45
1.18
0.90
0.63
0.35
-40
0
40
80
120
-40
0
40
80
120
Ta[℃]
Ta[℃]
Figure 15. PROOUT ON-Resistance
(IPROOUT=40mA)
Figure 16. Turn ON time
250
230
210
190
170
150
130
1.1
0.9
0.7
0.5
0.3
0.1
-40
0
40
80
120
-40
0
40
80
120
Ta[℃]
Ta[℃]
Figure 17. Turn OFF time
Figure 18. OUT2 ON Resistance
(IOUT=40mA)
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Typical Performance Curves - continued
1.05
1.04
1.03
1.02
1.01
1.00
0.99
0.98
0.97
0.96
0.95
TO=2.2V (TCOMP=GND2)
0.9
0.8
TO=3V (TCOMP=GND2)
TCOMP=VCC2
0.7
0.6
0.5
TO=4V (TCOMP=GND2)
0.4
-40
0
40
80
120
-40
0
40
80
120
Ta[℃]
Ta[℃]
Figure 19. Over Current Detection Voltage
Figure 20. Short Circuit Detection Voltage
2.21
2.16
2.11
2.06
2.01
1.96
OFF Voltage
ON Voltage
-40
0
40
80
120
Ta[℃]
Figure 21. Over Temperature Detection Voltage
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Description of Pins and Cautions on Layout of Board
1. V_BATT (Main power supply pin)
This is the main power supply pin. Connect a bypass capacitor between V_BATT and GND1 in order to suppress voltage
variations. Make sure that power is supplied even when the switching power supply is not used, since the internal
reference voltage of the input side of chip is generated from this power supply.
2. GND1 (Input-side ground pin)
The GND1 pin is a ground pin for the input side.
3. GND2 (Output-side ground pin)
The GND2 pin is a ground pin for the output side. Connect GND2 pin to the emitter / source of the output device.
4. INA, INB (Control input pin A, Control input pin B)
They are pins for determining the output logic.
INB
H
INA
L
OUT1
L
L
H
H
L
L
L
L
H
H
5. FLT_UVLO, FLT_SC, FLT_OT (Fault output pins)
These pins have open drains that output fault signals when faults occur (i.e., when the under voltage lockout function
(UVLO) or short circuit protection function (SCP) or over current protection function (OC) or over temperature protection
(OT) is activated).
State
FLT_UVLO
FLT_SC
Hi-Z
Hi-Z
L
FLT_OT
Hi-Z
Hi-Z
Hi-Z
L
While in normal operation
Hi-Z
L
V_BATT UVLO or VCC2 UVLO or TO pin open
SCP or OC
OT
Hi-Z
Hi-Z
Hi-Z
6. OSFB (Output pin for monitoring gate condition)
This is an open drain pin which outputs the state of gate logic of the output element monitored with OUT2 pin.
OUT2(input)
OSFB
Hi-Z
L
H
L
7. FB (Error amplifier inverting input pin for switching controller)
This is a voltage feedback pin of the switching controller. This pin combine with voltage monitoring at over voltage
protection function and under voltage protection function for switching controller. When over voltage or under voltage
protection is activated, switching controller will be at OFF state (FET_G pin outputs Low). When the protection holding
time (tDCDCRLS) is completed, the protection function will be released. Under voltage function is not activated during
soft-start.
8. COMP (Error amplifier output pin for switching controller)
This is the gain control pin of the switching controller. Connect a phase compensation capacitor and resistor. When the
switching controller is not used, connect it to GND1.
9. VREG (Power supply pin for the driving MOS FET of the switching controller)
This is the power supply pin for the driving MOSFET of the switching controller transformer drive. Be sure to connect a
capacitor between VREG and GND1 even when the switching controller is not used, in order to prevent oscillation and to
suppress voltage variation due to FET_G output current.
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Description of Pins and Cautions on Layout of Board – continued
10. FET_G (MOS FET control pin for switching controller)
This is a MOSFET control pin for the switching controller transformer drive. Leave it open when the switching controller is
not used.
11. SENSE (Connection to the current feedback resistor of the switching controller)
This is a pin connected to the resistor of the switching controller current feedback. FET_G pin output duty is controlled by
the voltage value of this pin. This pin combines with current monitoring at over current protection function for switching
controller. When over current protection is activated, switching controller will be at OFF state (FET_G pin outputs Low).
When the protection holding time (tDCDCRLS) is completed, the over current function will be released.
12. OUT1(Output pin)
The OUT1 pin is a gate driving pin.
13. OUT2 (Miller clamp pin)
The OUT2 pin is for preventing the increase in gate voltage due to the Miller current of the power device connected to the
OUT pin. It also functions as a pin for monitoring gate voltage for for miller clamp function and output state feedback
function. If both functions are not used, short-circuit the OUT2 pin to the GND2 pin.
14. PROOUT (Soft turn-OFF pin)
This pin is for soft turn-OFF of output pin when short-circuit protection or over current protection is in action.
15. SCPIN (Short circuit current detection pin)
This pin is used to detect current for short circuit protection. When the SCPIN voltage exceeds the voltage set with the
VSCPDET parameter, the SCP function will be activated, this will make the IC function in an open state. To avoid such
trouble, connect a resistor between the SCPIN and the GND2 or short the SCPIN pin to GND2 when the SCP function is
not used.
16. OCIN (Over current detection pin)
This pin is used to detect current for over current protection. When the OCIN voltage exceeds the voltage set with the
VOCDET parameter, the OC function will be activated, this will make the IC function in an open state. To avoid such trouble,
connect a resistor between the OCIN and the GND2 or short the OCIN pin to GND2 when the OC function is not used.
17. TCOMP (Temperature compensation pin)
This pin is for temperature compensation of over current detection. If the function is used, connect TCOMP to GND2. If the
function is not used, connect TCOMP to VCC2.
18. LVOFF (2-level turn off level setting pin)
The LVOFF pin is a pin used to make setting of 2-level turn off time. The voltage of LVOFF pin is 2-level turn off level.
When the VLVOFF > VLVOFFTH, 2-level turn off function is activated
19. RTOFF (2-level turn off time setting pin)
The RTOFF pin is a pin used to make the setting of 2-level turn off time. Connect a resistor RRT between RTOFF and the
GND2 pin.
20. TC (Resistor connection pin for setting constant current source output)
The TC pin is a resistor connection pin for setting the constant current output. If an arbitrary resistance value is connected
between TC and GND2, it is possible to set the constant current value output from TO.
21. TO (Constant current output / sensor voltage input pin)
The TO pin is constant current output / voltage input pin. It can be used as a temperature protection input by connecting
an element with arbitrary impedance between TO pin and GND. Furthermore, the TO pin disconnect detection function is
built-in.
22. UVLOIN (Output-side UVLO setting input pin)
The UVLOIN pin is a pin for deciding UVLO setting value of VCC2. The threshold value of UVLO can be set by dividing
the resistance voltage of VCC2 and inputting such value.
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Description of Functions and Examples of Constant Setting
1. Fault Status Output
This function is used to output a fault signal from the FLT_UVLO pin when the under voltage lockout function (UVLO) is
activated, the FLT_SC pin when the short circuit protection function (SCP) or over current protection (OC) is activated,
and the FLT_OT pin when the over temperature protection (OT) is activated.
The functions of UVLO and SCP/OC is to hold the fault signal until fault output holding time (tUVLO_FLTRLS, tSCP_FLTRLS,) is
completed.
Status
Normal
UVLO
FLT_UVLO pin
Fault occurs (UVLO or SCP or OC)
Status
Hi-Z
L
Hi-Z
L
FLT_UVLO
FLT_SC
Status
Normal
SCP, OC
FLT_SC pin
Hi-Z
L
Figure 22. Fault Status Output Timing Chart (SCP/OC,UVLO)
The OT function holds the fault signal until TO pin voltage goes high above VTODETOFF.
Status
Normal
OT
FLT_OT pin
Hi-Z
L
Status
Fault occurs (OT)
Hi-Z
FLT_OT
L
～35us
Figure 23. Fault Status Output Timing Chart (OT)
When UVLO function is activated during SCP or OC, the Fault output holding time occurs after UVLO cancellation.
Fault occurs (SCP or OC)
SCP or OC Status
Fault occurs (UVLO)
UVLO Status
Hi-Z
FLT_SC
L
Hi-Z
FLT_UVLO
L
Fault output holding time (tUVLO_FLTRLS
)
Figure 24. Fault Status Output Timing Chart (SCP/OC and UVLO)
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2. Under Voltage Lockout (UVLO) Function
BM60055FV-C incorporates the under voltage lockout (UVLO) function on V_BATT and VCC2. When the power supply
voltage drops to the UVLO ON voltage, OUT1 turns off and the FLT_UVLO pin will both output the “L” signal.
When the power supply voltage rises to the UVLO OFF voltage, these pins will be reset. However, during the fault output
holding time set in “Fault status output” section, the OUT pin and the FLT_UVLO pin will hold the “L” signal. In addition, to
prevent mis-triggering due to noise, mask time tUVLO2FIL are set on both low and high voltage sides.
H
L
INA
V
VUUVVLLOOBBAATTTTLH
V_BATT
Hi-Z
L
FLT_UVLO
H
L
H
L
OUT1
FET_G
Figure 25. V_BATT UVLO Function Operation Timing Chart
H
L
INA
UVLOIN
V
V
UVLO2H
UVLO2L
Hi-Z
L
FLT_UVLO
H
OUT1
L
H
L
FET_G
Figure 26. VCC2 UVLO Function Operation Timing Chart
When VLVOFF < VLVOFFTH, normal turn off is activated.
H
L
IN
VLVOFFTH
L
VLVOFF
VUVLOBATTH /VUVLO2H
VUVLOBATTL /VUVLO2L
V_BATT
UVLOIN
H
OUT1
OUT2
Hi-Z
L
Hi-Z
L
Hi-Z
PROOUT
L
Hi-Z
FLT_UVLO
L
Gate voltage
VOUT2ON
tUVLOBATTH
tUVLO2FIL
tUVLOBATTH
tUVLO2FIL
Fault output holding time
Figure 27. UVLO Operation Timing Chart (Normal Turn off)
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BM60055FV-C
When VLVOFF > VLVOFFTH, 2-level turn off is activated.
H
L
IN
VLVOFF
H
VLVOFFTH
VUVLOBATTH /VUVLO2H
VUVLOBATTL /VUVLO2L
V_BATT
UVLOIN
H
OUT1
OUT2
VLVOFF
L
Hi-Z
L
Hi-Z
PROOUT
L
Hi-Z
FLT_UVLO
L
VLVOFF
VOUT2ON
Gate voltage
tUVLOBATTH
tUVLO2FIL
tUVLOBATTH
tUVLO2FIL
Fault output holding time
Figure 28. UVLO Operation Timing Chart (2 level turn off)
Description of Functions and Examples of Constant Setting - continued
3. Short Circuit Protection (SCP) Function
When the SCPIN pin voltage exceeds a voltage set with the VSCPDET parameter, the SCP function will be activated. When
the SCP function is activated, soft turn off is activated.
When the SCP function is activated, OUT pin voltage will be set to the “Hi-Z” level and the PROOUT pin voltage will be set
to “L” level first. Next, OUT2 pin voltage < VOUT2ON, internal MOS of OUT2 pin is turned ON (miller clamping) and OUT1 will
become L.
H
IN
L
VSCDET
SCPIN
H
OUT1
Hi-Z
L
Hi-Z
OUT2
L
Hi-Z
PROOUT
L
Hi-Z
FLT_SC
L
Gate voltage
VOUT2ON
tON or tON+ RTOFF
t
tON or tON+ RTOFF
t
tON or tON+ RTOFF
t
tSCPFIL
tSCPFIL
Fault output holding time
Fault output holding time
Figure 29. SCP Operation Timing Chart
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4. Over Current Protection (OC) Function
When the OCIN pin voltage exceeds a voltage set with the VOCDET parameter, the OC function will be activated. When the
OC function is activated, soft turn off is activated.
When the OC function is activated, OUT pin voltage will be set to the “Hi-Z” level and the PROOUT pin voltage will be set
to “L” level first. Next, OUT2 pin voltage < VOUT2ON, internal MOS of OUT2 pin is turned ON (miller clamping) and OUT1 will
become L.
H
IN
L
VOCDET
OCIN
H
OUT1
Hi-Z
L
Hi-Z
OUT2
L
Hi-Z
PROOUT
L
Hi-Z
FLT_SC
L
Gate voltage
VOUT2ON
tON or tON+ RTOFF
t
tON or tON+ RTOFF
t
tON or tON+ RTOFF
t
tASFIL
tASFIL
Fault output holding time
Figure 30. OC Operation Timing Chart
Fault output holding time
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Description of Functions and Examples of Constant Setting - continued
5. 2-Level Turn Off
When VLVOFF > VLVOFFTH, 2-level turn off is activated.
2-level turn off time tRTOFF and voltage level VLVOFF is adjustable by external elements of RTOFF pin and LVOFF pin.
The values of the 2-level turn off level VLVOFF is determined by the values of the voltage of LVOFF pin.
The values of the 2-level turn off time tRTOFF is determined by the values of the resistor RRT according to the following
formula (typical values):
[us]
[
]
tRTOFF =0.145×RRT kΩ +0.05
The propagation delay time (ON) of the OUT1 is delayed for the same time as the 2-level turn off time tRTOFF.
When VLVOFF < VLVOFFTH, Turn on time does not include 2-level turn off time and normal turn off is activated.
VCC2
RTOFF
timer
Gate on/off
RRT
OUT1
3 state buffer
LVOFF
+
-
GND2
Figure 31. 2 level turn off function block diagram
H
VLVOFF
VLVOFFTH
L
H
IN
L
H
VLVOFF
OUT1
L
PROOUT
L
H
VLVOFF
Gate voltage
VOUT2ON
L
tON
tOFF
tON
tRTOFF
tON
tRTOFF
Figure 32. Timing Chart of Turn Off
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6. Temperature Compensation of OC
When TCOMP = GND2, Temperature compensation of OC is activated.
If the function is not used, connect TCOMP to VCC2.
TCOMP=GND2
The temperature of OC detection voltage can be compensated in accordance with TO voltage.
[V]
VOC = 0.283 VTO +1.552
TCOMP=VCC2
[V]
VOC = 0.7
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Description of Functions and Examples of Constant Setting - continued
7. Miller Clamping
When OUT1=L and OUT2 pin voltage < VOUT2ON, internal MOS of OUT2 pin is turned ON, and Miller clamp function
operates.
OUT2 pin
IN
OUT2
input voltage
Not more than
VOUT2ON
L
L
H
X
Hi-Z
VCC2
OUT1
PREDRIVER
PREDRIVER
LOGIC
OUT2
GND2
PREDRIVER
+
-
Figure 33. Block Diagram of Miller Clamp Function
H
L
INA
SCPIN
VSCDET
Hi-Z
L
FLT_SC
OUT1
H
Hi-Z
L
OUT2
(input)
VOUT2ON
H
L
PROOUT
Hi-Z
L
OUT2
(output)
tON
tFLTRLS
Figure 34. Timing chart of Miller Clamp Function
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Description of Functions and Examples of Constant Setting - continued
8. Over Temperature Protection Function
Constant current is supplied from TO pin from the built-in constant current circuit. This current value can be adjusted in
accordance with the resistance value connected between TC and GND2. Furthermore, TO pin has voltage input function,
and when the TO pin voltage < VOTDETON, OUT1 turns off and FLT_OT becomes L. When the TO pin voltage goes high
above VOTDETOFF, the OT function will be released.
VTC 10
Constant current value
RTC
VCC2
×10
FLT_OT
TO
filter
Z
TC
RTC
GND2
Figure 35. Block Diagram of Temperature Monitor Function
When VLVOFF < VLVOFFTH, normal turn off is activated.
H
IN
L
VLVOFF
TO
VLVOFFTH
L
VOTDETOFF
VOTDETON
H
OUT1
L
Hi-Z
OUT2
L
Hi-Z
PROOUT
L
Hi-Z
FLT_OT
L
Gate voltage
VOUT2ON
tOTFIL
tOTFIL
~ 35us
Figure 36. OT Operation Timing Chart (Normal turn off)
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Description of Functions and Examples of Constant Setting – continued
When VLVOFF > VLVOFFTH, 2-level turn off is activated.
H
L
IN
VLVOFF
VLVOFFTH
L
VOTDETOFF
VOTDETON
TO
H
OUT1
L
Hi-Z
OUT2
L
Hi-Z
PROOUT
L
Hi-Z
FLT_OT
L
VLVOFFTH
VOUT2ON
Gate voltage
tOTFIL
tOTFIL
~ 35us
Figure 37. OT Operation Timing Chart (2 level turn off)
9. Switching Controller
(1) Basic action
This IC has a built-in switching power supply controller which repeats ON/OFF synchronizing with internal clock.
When V_BATT voltage is supplied (V_BATT > VUVLOBATTH), FET_G pin starts switching by soft-start. Output voltage is
determined by the following equation by external resistance and winding ratio “n” of flyback transformer (n= VOUT2 side
winding number/VOUT1
VOUT2 V R1 R2
FB
/R2
side winding nunmber)
V
(2) MAX DUTY
When, for example, output load is large, and voltage level of SENSE pin does not reach current detection level, output
is forcibly turned OFF by Maximum On Duty (DONMAX).
(3) Pinconditions when the switching power supply controller is not used
Implement pin connection as shown below when switching power supply is not used.
Pin Number
Pin Name
FB
Treatment Method
Connect to VREG
Connect to GND1
Connect power supply
Connect capacitor
No connection
22
23
24
25
26
27
COMP
V_BATT
VREG
FET_G
SENSE
Connect to GND1
10. Output State Feedback Function
When gate logic of output device monitored with OUT2 pin is H, a logic H is the output from OSFB pin. When OUT2 pin is
L, a logic L is the output from OSFB pin.
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Description of Functions and Examples of Constant Setting - continued
11. I/O Condition Table
Input
Output
No.
Status
1
2
UVLO
UVLO
UVLO
UVLO
UVLO
UVLO
UVLO
UVLO
UVLO
UVLO
UVLO
UVLO
UVLO
UVLO
UVLO
UVLO
H
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
X
X
L
X
X
X
X
X
X
L
X
X
L
L
L
L
X
X
L
L
H
H
L
L
L
L
X
X
X
H
H
L
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
H
L
Z
L
T
T
L
L
T
T
L
L
Z
L
T
T
L
L
L
Z
L
Z
L
Z
L
Z
L
Z
L
Z
L
Z
L
Z
L
Z
L
Z
Z
Z
Z
Z
L
Z
Z
Z
L
Z
Z
Z
Z
Z
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
Z
Z
Z
Z
Z
Z
Z
Z
L
L
Z
Z
Z
Z
L
Z
Z
L
L
L
L
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
V_BATT UVLO
SCP
3
H
L
4
L
V_BATT UVLO
OT
5
L
H
L
6
L
L
7
H
H
H
H
H
H
H
H
H
H
L
H
H
L
H
L
8
L
V_BATT UVLO
VCC2 UVLO
9
X
X
H
H
H
H
H
H
L
H
L
10
11
12
13
14
15
16
17
L
X
X
H
H
L
H
L
V_BATT UVLO
OC
H
L
V_BATT UVLO
H
L
L
SCP
OT
VCC2 UVLO
X
H
〇
〇
〇
〇
〇
〇
〇
〇
〇
〇
18
19
20
21
22
23
24
25
26
H
H
H
H
H
L
L
L
L
H
H
L
L
L
L
L
H
H
L
L
L
L
L
L
X
X
X
X
X
L
X
X
X
X
X
H
H
L
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
L
H
L
L
L
L
L
L
T
T
L
L
L
Z
L
Z
L
Z
L
Z
L
L
L
L
L
L
Z
Z
Z
Z
L
Z
Z
L
L
L
L
L
L
L
L
L
L
L
Z
Z
Z
Z
Z
L
L
Z
Z
Z
Z
Z
Z
L
Z
L
L
L
L
L
L
L
SCP
OT
H
L
SCP
VCC2 UVLO
H
L
L
L
OT
VCC2 UVLO
L
L
H
L
L
L
L
○: V_BATT > UVLO, X: Don't care, Z: Hi-Z, T: 2-level turn off
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25/37
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BM60055FV-C
Description of Functions and Examples of Constant Setting - continued
Input
Output
No.
Status
27
28
29
30
31
32
33
34
35
36
37
38
39
H
H
L
L
L
L
L
L
L
L
L
L
L
H
H
L
H
H
H
H
H
H
L
X
X
L
L
L
L
L
L
L
L
H
H
L
X
X
H
H
L
X
X
X
X
X
X
X
X
X
X
X
X
H
X
X
X
X
X
X
X
X
X
X
X
X
X
H
L
Z
L
T
T
L
L
T
T
Z
L
Z
L
T
Z
L
Z
L
Z
L
Z
L
Z
L
Z
L
Z
L
Z
Z
Z
Z
Z
Z
Z
Z
Z
L
Z
Z
Z
Z
Z
Z
Z
Z
L
L
L
L
Z
Z
Z
L
L
Z
Z
L
L
Z
Z
Z
Z
L
L
Z
Z
Z
L
L
L
L
Z
Z
Z
Z
Z
Z
Z
Z
L
Z
L
Z
L
L
L
L
L
Z
L
Z
〇
〇
〇
〇
〇
〇
〇
〇
〇
〇
〇
〇
〇
SCP
OT
H
L
L
L
H
L
L
L
H
H
H
H
H
H
H
H
H
L
H
L
L
VCC2 UVLO
L
H
L
L
L
H
H
H
X
X
H
H
L
OC
H
40
41
42
43
44
45
46
47
48
49
50
L
L
L
L
L
L
L
L
L
L
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
L
L
L
L
L
L
L
H
L
H
H
H
L
L
L
L
L
L
L
L
X
X
X
H
H
H
H
L
L
H
L
T
L
L
Z
L
Z
Z
Z
Z
Z
L
Z
L
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
L
Z
L
Z
L
Z
L
Z
L
Z
L
〇
〇
〇
〇
〇
〇
〇
〇
〇
〇
〇
L
L
H
H
L
H
L
H
H
H
H
T
T
L
Normal
H
L
L
H
H
L
H
L
L
L
H
L
L
L
L
○: V_BATT > UVLO, X: Don't care, Z: Hi-Z, T: 2-level turn off
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TSZ22111 • 15 • 001
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Description of Functions and Examples of Constant Setting - continued
12. Power Supply Startup / Shutdown Sequence
H
L
INA
VUVLOBATTL
VUVLO2H
VUVLOBATTL
V_BATT
VCC2
0V
VUVLO2H
0V
H
Hi-Z
OUT1
L
Hi-Z
OUT2
PROOUT
L
Hi-Z
L
Hi-Z
FLT_UVLO
L
H
L
INA
V_BATT
VUVLOBATTH
VUVLO2L
VUVLOBATTH
VUVLO2L
0V
0V
VCC2
OUT1
H
Hi-Z
L
Hi-Z
OUT2
L
Hi-Z
PROOUT
FLT_UVLO
L
Hi-Z
L
: Since the VCC2 to GND2 pin voltage is low and the output MOS does not turn ON,
the output pins become Hi-Z conditions.
:Since the V_BATT pin voltage is low and the FLT_UVLO output MOS does not turn
ON, the output pins become Hi-Z conditions.
Figure 38. Power Supply Startup / Shutdown Sequence
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TSZ02201-0818ABH00120-1-2
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TSZ22111 • 15 • 001
BM60055FV-C
Selection of Components Externally Connected
Recommended
Recommended
Recommended
ROHM
MCR03EZP
Recommended
ROHM
MCR100JZH
MCR18EZP
LTR50UZP
ROHM
sumida
MCR03EZP
CEEH139C
CEER117
+
+
OSC
-
-
GND1
GND2
OUT2
FLT_UVLO
INB
TIMER
FLT
RESET
OSC
OUT1
PRE
DRIVER
S
R
VCC2
Q
OSFB
ECU
INA
VCC2
OSFB
PROOUT
LOGIC
CURRENT
SOURCE
LOGIC
FLT_OT
FLT_SC
TC
TO
+
-
2 level Turn
off Contol
Temp
Compensation
FB
TCOMP
RTOFF
LVOFF
-
+
-
TIMER
TIMER
+
DAC
+
COMP
V_BATT
V_BATT
Rectifier
/ Ripple filter
+
-
Snubber
REGULATOR
OSC
Filter
VREG
FET_G
SENSE
GND1
SCPIN
OCIN
Filter
Filter
SLOPE
GND1
VCC2
OSC
+
-
Filter
Q
S
R
Rectifier
/ Ripple filter
UVLOIN
GND2
+
-
MAX.Duty
UVLO_BATT
GND2
GND2
GND1
Recommended
ROHM
MCR100JZH
LTR50UZP
Recommended
ROHM
MCR03EZP
Recommended
ROHM
MCR03EZP
MCR18EZP
Recommended
ROHM
RB168M150
Recommended
ROHM
LTR18EZP
Figure 39. For using switching power supply controller
Recommended
ROHM
MCR100JZH
MCR18EZP
LTR50UZP
Recommended
ROHM
MCR03EZP
Recommended
ROHM
MCR03EZP
+
+
OSC
-
-
GND1
GND2
FLT_UVLO
INB
FLT
OSC
TIMER
OUT2
OUT1
VCC2
PROOUT
TC
RESET
PRE
DRIVER
S
R
VCC2
Q
OSFB
INA
ECU
OSFB
FLT_OT
FLT_SC
FB
LOGIC
LOGIC
CURRENT
SOURCE
+
-
TO
Temp
Compensation
2 level Turn
off Contol
-
TCOMP
RTOFF
LVOFF
SCPIN
OCIN
-
TIMER
TIMER
+
+
DAC
+
COMP
V_BATT
VREG
FET_G
V_BATT
+
-
REGULATOR
OSC
Filter
Filter
Filter
SLOPE
OSC
+
-
Filter
Q
S
R
GND1
SENSE
GND1
UVLOIN
GND2
+
-
MAX.Duty
UVLO_BATT
GND1
GND2
GND1
Recommended
ROHM
MCR100JZH
LTR50UZP
Recommended
ROHM
MCR03EZP
Figure 40. For non-using switching power supply controller
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TSZ02201-0818ABH00120-1-2
15.Feb.2016 Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
28/37
TSZ22111 • 15 • 001
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I/O Equivalent Circuit
Pin Name
Pin No.
Input Output Equivalent Circuit Diagram
Pin Function
Internal Power
Supply
VCC2
UVLOIN
2
UVLOIN
Output-side UVLO setting pin
GND2
VCC2
Internal Power
Supply
OCIN
3
4
Over current detection pin
OCIN
SCPIN
SCPIN
Short circuit detection pin
GND2
VCC2
Internal Power
Supply
LVOFF
5
6
7
LVOFF
2-level turn off level setting pin
GND2
VCC2
Internal Power
Supply
RTOFF
RTOFF
2-level turn off time setting pin
GND2
VCC2
Internal Power
Supply
TCOMP
TCOMP
GND2
Temperature compensation pin
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TSZ02201-0818ABH00120-1-2
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29/37
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BM60055FV-C
I/O Equivalent Circuit - continued
Pin Name
Pin No.
Input Output Equivalent Circuit Diagram
Pin Function
Internal power
supply
TO
VCC2
TO
8
Constant current output pin /
sensor voltage input pin
TC
TC
9
Constant current setting resistor
connection pin
GND2
VCC2
PROOUT
10
PROOUT
Soft turn-off pin /Gate voltage input pin
GND2
VCC2
OUT1
12
OUT1
Output pin
GND2
Internal power
supply
VCC2
OUT2
13
OUT2
GND2
Output pin for miller clamp
/ Gate voltage input pin
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
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15.Feb.2016 Rev.001
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BM60055FV-C
I/O Equivalent Circuit - continued
Pin Name
Pin No.
Input Output Equivalent Circuit Diagram
Pin Function
FLT_UVLO
16
UVLO fault output pin
FLT_UVLO
OSFB
FLT_SC
FLT_OT
OSFB
18
Output state feedback output pin
FLT_OT
19
OT fault output pin
FLT_SC
GND1
20
SCP fault output pin
Internal power
supply
V_BATT
INB
17
Control input pin B
INA
INB
INA
18
GND1
Control input pin A
Internal power
supply
V_BATT
FB
22
FB
Error amplifier inverting input pin
for switching controller
GND1
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
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15.Feb.2016 Rev.001
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BM60055FV-C
I/O Equivalent Circuit - continued
Pin Name
Pin
No.
Input Output Equivalent Circuit Diagram
Pin Function
Internal power
supply
V_BATT
COMP
COMP
23
Error amplifier output pin
for switching controller
GND1
V_BATT
VREG
Internal power
supply
25
Power supply pin for driving
MOS FET
of switching controller
VREG
FET_G
GND1
FET_G
26
MOS FET control pin
for switching controller
Internal power
suppy
V_BATT
SENSE
27
SENSE
GND1
Current feedback resistor
connection pin
for switching controller
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TSZ22111 • 15 • 001
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15.Feb.2016 Rev.001
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BM60055FV-C
Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6.
7.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
9.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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TSZ22111 • 15 • 001
BM60055FV-C
Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 42. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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TSZ22111 • 15 • 001
BM60055FV-C
Ordering Information
-
B M 6
0
0
5
5
F
V
C E 2
Part Number
Package
FV : SSOP-B28W
Product class
C : for Automotive applications
Packaging and forming specification
E2 : Embossed tape and reel
(SSOP-B28W)
Marking Diagrams
SSOP-B28W (TOP VIEW)
Part Number Marking
LOT Number
B M 6 0 0 5 5
1PIN MARK
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15.Feb.2016 Rev.001
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35/37
TSZ22111 • 15 • 001
BM60055FV-C
Physical Dimension, Tape and Reel Information
Package Name
SSOP-B28W
(Max 9.55 (include.BURR))
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© 2014 ROHM Co., Ltd. All rights reserved.
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BM60055FV-C
Revision History
Date
Revision
001
Changes
New Release
15.Feb.2016
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TSZ02201-0818ABH00120-1-2
15.Feb.2016 Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
37/37
TSZ22111 • 15 • 001
Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Datasheet
BM60055FV-C - Web Page
Part Number
Package
Unit Quantity
BM60055FV-C
SSOP-B28W
1500
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
1500
Taping
inquiry
Yes
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