BM60210FV-C [ROHM]
High Voltage High & Low-side, Gate Driver;
| 型号： | BM60210FV-C |
| 厂家： | 
ROHM |
| 描述： | High Voltage High & Low-side, Gate Driver 栅 |
| 文件： | 总27页 (文件大小：1115K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
1200V High Voltage
High & Low-side, Gate Driver
BM60210FV-C
General Description
Key Specifications
The BM60210FV-C is a monolithic high and low side
gate drive IC, which can be drive high speed power
MOSFET and IGBT driver with bootstrap operation.
The floating channel can be used to driven an N-channel
power MOSFET or IGBT in the high side configuration
which operates up to 1200V.
It incorporates the fault signal output functions,
Under-voltage Lockout (UVLO) function and Miller clamp
function.
High-side floating supply voltage:
1200V
10V to 24V
3A
Output voltage range:
Min Output Current:
Turn ON/Off time:
Delay Matching:
Minimum input pulse width:
Operating temperature range:
75ns(Max)
25ns(Max)
60ns(Max)
-40°C to 125°C
Features
Package
W(Typ) x D(Typ) x H(Max)
6.50mm x 8.10mm x 2.01mm
Floating Channels for Bootstrap Operation to +1200V.
Gate drive supply range from 10V to24V
Built-in Under Voltage Lockout for Both Channels
3.3V and 5.0V Input Logic Compatible
Active Miller Clamping
SSOP-B20W
AEC-Q100 Qualified (Note 1)
(Note 1:Grade1)
Applications
MOSFET gate driver
IGBT gate driver
Typical Application Circuits
VCCB
Up to 1200V
NC
GND2
NC
GND1
UVLO
UVLO
S
R
ENA
INA
INB
ENA
INA
Pulse
Generator
Q
INB
VCCA
OUTAH
OUTAL
MCA
VREG
VCCB
OUTBH
OUTBL
MCB
Regulator
Pre-
driver
CVREG
Pre-
driver
NC
CVCCA
+
-
CVCCB
2V
GND2
TO
LOAD
NC
GND1
+
-
2V
1pin
Figure 1. Typical Application Circuits
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Contents
General Description........................................................................................................................................................................1
Features..........................................................................................................................................................................................1
Applications ....................................................................................................................................................................................1
Key Specifications...........................................................................................................................................................................1
Package
W(Typ) x D(Typ) x H(Max).........................................................................................................................................1
Typical Application Circuits .............................................................................................................................................................1
Recommended Range of External Constants.................................................................................................................................3
Pin Configuration ............................................................................................................................................................................3
Pin Descriptions..............................................................................................................................................................................3
Description of pins and cautions on layout of board .......................................................................................................................4
Description of functions and examples of constant setting .............................................................................................................5
Absolute Maximum Ratings ............................................................................................................................................................7
Recommended Operating Ratings..................................................................................................................................................8
Electrical Characteristics.................................................................................................................................................................9
Typical Performance Curves.........................................................................................................................................................10
Figure 8. VCCB circuit current 1 (OUTB=L).............................................................................................................................10
Figure 9. VCCB circuit current 2 (OUTB=H)............................................................................................................................10
Figure 10. VCCB circuit current 3 (INA=10kHz, Duty=50%)....................................................................................................10
Figure 11. VCCB circuit current 4 (INA=20kHz, Duty=50%)....................................................................................................10
Figure 12. VCCA circuit current 1 (OUTA=L)...........................................................................................................................11
Figure 13. VCCA circuit current 2 (OUTA=H) ..........................................................................................................................11
Figure 14. logic(INA/INB)H/L level input voltage......................................................................................................................11
Figure 15. OUTA output voltage vs INA input voltage (VCCB=15V, VCCA=15V, Ta=25°C).....................................................11
Figure 16. logic pull-down resistance ......................................................................................................................................12
Figure 17. logic pull-down current ...........................................................................................................................................12
Figure 18. logic(INA)input mask time.......................................................................................................................................12
Figure 19. ENA input mask time..............................................................................................................................................12
Figure 20. OUTA ON resistance (Source)................................................................................................................................13
Figure 21. OUTA ON resistance (Sink)....................................................................................................................................13
Figure 22. OUTB ON resistance (Source)...............................................................................................................................13
Figure 23. OUTB ON resistance (Sink) ...................................................................................................................................13
Figure 24. Turn ON Time (INA=PWM, INB=L).........................................................................................................................14
Figure 25. Turn OFF Time (INA=PWM, INB=L).......................................................................................................................14
Figure 26. Turn ON Time (INA=L, INB=PWM).........................................................................................................................14
Figure 27. Turn OFF Time (INA=L, INB=PWM).......................................................................................................................14
Figure 28. MCA ON resistance................................................................................................................................................15
Figure 29. MCB ON resistance................................................................................................................................................15
Figure 30. MCA ON threshold .................................................................................................................................................15
Figure 31. MCB ON threshold .................................................................................................................................................15
Figure 32. VCCB UVLO ON/OFF voltage................................................................................................................................16
Figure 32. VCCB UVLOmask time ..........................................................................................................................................16
Figure 33. VCCA UVLO ON/OFF voltage................................................................................................................................16
Figure 34. VCCA UVLO mask time..........................................................................................................................................16
Power Dissipation .........................................................................................................................................................................17
Thermal Design ............................................................................................................................................................................17
I/O Equivalent Circuits ..................................................................................................................................................................18
Physical Dimension, Tape and Reel Information ..........................................................................................................................22
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Recommended Range of External Constants
Recommended Value
Pin Name
Symbol
Unit
Min.
0.1
0.1
0.1
Typ.
1.0
1.0
3.3
Max.
VCCA
VCCB
VREG
CVCCA
CVCCB
CVREG
-
-
µF
µF
µF
10.0
Pin Configuration
(TOP VIEW)
20
NC
GND2
NC
1
2
3
4
5
6
7
8
9
GND1
19 MCB
18 OUTBL
17 OUTBH
16 VCCB
15 VREG
14 INB
MCA
OUTAL
OUTAH
VCCA
NC
13 INA
GND2
12 ENA
NC 10
11
GND1
Pin Descriptions
Pin No.
1
Pin Name
Function
NC
GND2
NC
Non -connection
2
High -side ground pin
Non -connection
3
4
MCA
High-side Output pin for Miller Clamp
High-side Output pin (Sink)
High-side Output pin (Source)
High-side power supply pin
Non -connection
5
OUTAL
OUTAH
VCCA
NC
6
7
8
9
GND2
NC
High -side ground pin
10
11
12
13
14
15
16
17
18
19
20
Non -connection
GND1
ENA
Low -side and input-side ground pin
Input enabling signal input pin
Logic input for low side gate driver output
Logic input for low side gate driver output
Power supply pin for input circuit
INA
INB
VREG
VCCB
OUTBH
OUTBL
MCB
Low -side and input-side power supply pin
low-side Output pin (Source)
low-side Output pin (Sink)
low-side Output pin for Miller Clamp
Low -side and input-side ground pin
GND1
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Description of pins and cautions on layout of board
1）VCCA (High-side power supply pin)
The VCCA pin is a power supply pin on the high-side output. To reduce voltage fluctuations due to OUT pin output
current, connect a bypass capacitor between the VCCA and the GND2 pins.
2）GND2 (High -side ground pin)
The GND2 pin is a ground pin on the high-side. Connect the GND2 pin to the emitter / source of a high-side power
device.
3）VCCB (Low -side and input-side power supply pin)
The VCCB pin is a power supply pin on the low-side output. To reduce voltage fluctuations due to OUT pin output current,
connect a bypass capacitor between the VCCB and the GND2 pins.
4）GND1 (Low -side and input-side ground pin)
The GND1 pin is a ground pin on the low-side and the input side.
5）VREG (Power supply pin for input circuit)
The VCC1 pin is a power supply pin for the input circuit. To suppress voltage fluctuations due to the current to drive
internal transformers, connect a bypass capacitor between the VREG and the GND1 pins.
6）INA, INB, ENA (Control input terminal)
The INA, INB and ENA pins are used to determine output logic.
ENA
L
INA
X
INB
X
OUTA
OUTB
L
L
L
H
L
L
L
H
L
L
H
L
L
H
L
H
H
H
L
H
H
H
7）OUTAH, OUTAL, OUTBH, OUTBL (Output pin)
The OUTAH pin and the OUTBH pin are source side pins used to drive the gate of a power device, and the OUTAL pin
and the OUTBL pin are sink side pins used to drive the gate of a power device.
8）MCA, MCB (Output pin for Miller Clamp)
The MC pin is for preventing the increase in gate voltage due to the Miller current of the power device connected to the
OUT pin. If the Miller Clamp function is not used, short-circuit the MCA pin to the GND2 pin and the MCB pin to the
GND1 pin.
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Description of functions and examples of constant setting
1) Miller Clamp function
When INA=L and OUT pin voltage < VMCON (typ 2V), the internal MOSFET of the MC pin is turned ON.
INA
L
MC
Internal MOSFET of the MC pin
less than VMCON
X
ON
。
H
OFF
VCCA (VCCB)
PREDRIVER
OUTAH (OUTBH)
GATE
LOGIC
OUTAL (OUTBL)
MCA (MCB)
PREDRIVER
PREDRIVER
+
-
VMCON
GND2 (GND1)
Figure 2. Block diagram of Miller Clamp function.
tPOFFA
tPONA
H
INA(INB)
L
H
OUTA(OUTB)
L
H
GATE
VMCON
L
Hi-Z
L
MCA(MCB)
Figure 3. Timing chart of Miller Clamp function
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2) Under-voltage Lockout (UVLO) function
The BM60210FV-C incorporates the Under-voltage Lockout (UVLO) function both of VCCA and VCCB. When the power
supply voltage drops to the UVLO ON voltage (typ 8.5V), the OUT pin will output the “L” signal. In addition, to prevent
malfunctions due to noises, a mask time of tUVLOMSK (typ 2.5µs) is set on both the low and the high voltage sides.
This IC does not have a function which feeds back the high voltage side state to the low voltage side. After the high
voltage side UVLO is released, the input signal will take effect from the time after the input signal switches.
H
INA
L
VUVLOH
VCCA
OUTA
VUVLOL
H
L
Figure 4. Input-side UVLO Function Operation Timing Chart
H
L
INA (INB)
VCCB
VUVLOH
VUVLOL
H
Hi-Z
L
OUTA (OUTB)
Figure 5. Output-side UVLO Function Operation Timing Char
3）I/O condition table
Input
Output
V
C
C
B
V
C
C
A
O
U
T
O
U
T
No.
Status
E
N
A
I
N
B
I
N
A
M
C
B
M
C
A
B
A
1
2
3
4
5
6
7
8
9
VCCB UVLO
VCCA UVLO
Disable
UVLO
X
X
L
X
X
L
X
X
X
X
X
L
L
L
L
H
L
L
L
H
L
L
L
L
L
L
L
L
L
H
L
L
L
L
○
○
○
○
○
○
○
○
UVLO
UVLO
H
H
L
L
L
UVLO
H
X
L
Hi-Z
L
L
○
○
○
○
○
L
H
H
H
H
L
L
L
H
L
L
Hi-Z
L
Normal operation
H
H
H
H
L
L
○ : VCCA or VCCB > UVLO, X : Don't care
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4) Power supply startup / shutoff sequence
H
INA
INB
L
H
L
VUVLOL
VUVLOL
VUVLOH
VUVLOH
VUVLOH
VUVLOH
VCCA
VCCB
VUVLOL
VUVLOL
H
Hi-Z
L
OUTA
MCA
Hi-Z
L
H
Hi-Z
OUTB
MCB
L
Hi-Z
L
H
INA
INB
L
H
L
VUVLOL
VUVLOL
VUVLOH
VUVLOH
VUVLOH
VUVLOH
VCCA
VCCB
VUVLOL
VUVLOL
H
Hi-Z
L
OUTA
MCA
Hi-Z
L
H
Hi-Z
OUTB
MCB
L
Hi-Z
L
: Since the VCCA to GND2 pin voltage is low and the output MOS does not turn ON, the
output pins become Hi-Z.
: Since the VCCB to GND1 pin voltage is low and the output MOS does not turn ON, the
output pins become Hi-Z.
Figure 6. Power Supply Startup / Shutoff Sequence
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Absolute Maximum Ratings
Parameter
Symbol
Limits
Unit
High side floating supply voltage
High side offset voltage
VCCA
GND2
VOUTA
VCCB
-0.3～+1230(Note 1)
VCCA-30～VCCA+0.3
GND2-0.3～VCCA+0.3
-0.3～+30.0(Note 1)
-0.3～+VCCB+0.3 or +30.0(Note 1)
-0.3～+VCCB+0.3 or +30.0(Note 1)
5.0(Note 2)
V
V
High side floating output voltage OUTA
Low side and logic fixed supply voltage
Low side output voltage OUTB
Logic input voltage (INA, INB)
OUTA pin output current (Peak 1µs)
OUTB pin output current (Peak 1µs)
MCA pin output current (Peak 1µs)
MCB pin output current (Peak 1µs)
Power dissipation
V
V
VOUTB
VIN
V
V
IOUTAPEAK
IOUTBPEAK
IMCAPEAK
IMCBPEAK
Pd
A
5.0(Note 2)
A
5.0(Note 2)
A
5.0(Note 2)
A
1.19(Note 3)
W
°C
°C
°C
Operating temperature range
Storage temperature range
Topr
-40～+125
Tstg
-55～+150
Junction temperature
Tjmax
+150
(Note 1) Relative to GND1.
(Note 2) Should not exceed Pd and Tj=150°C
(Note 3) Derate by 9.5mW/°C when operating above Ta=25°C. Mounted on a glass epoxy of 70mm ×70mm ×1.6mm.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Ratings
Parameter
High side floating supply voltage
High side floating supply offset voltage
High side (OUTA) output voltage
High side (OUTB) output voltage
Logic input voltage (INA, INB)
Low side supply voltage
Symbol
VCCA
GND2
VOUTA
VOUTB
VIN
Min.
GND2+10
-
Max.
GND2+24
1200
Units
V
V
GND2
GND1
GND1
10
VCCA
VCCB
VCCB
24
V
V
V
VCCB
Ta
V
Ambient temperature
-40
+125
°C
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Electrical Characteristics
（Unless otherwise specified Ta=-40°C to 125°C、VCCA=10V to 24V、VCCB=10V to 24V）
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
General
VCCB circuit current 1
VCCB circuit current 2
VCCB circuit current 3
VCCB circuit current 4
VCCA circuit current 1
VCCA circuit current 2
Logic block
ICC11
ICC12
ICC12
ICC13
ICC21
ICC22
0.31
0.28
0.36
0.41
0.26
0.22
0.47
0.40
0.53
0.61
0.47
0.45
0.84
0.79
0.92
1.07
0.72
0.66
mA
mA
mA
mA
mA
mA
OUTB=L
OUTB=H
INA =10kHz, Duty=50%
INA =20kHz, Duty=50%
OUTA=L
OUTA=H
Logic high level input voltage
Logic low level input voltage
Logic pull-down resistance
Logic pull-down current
Logic input minimum pulse width
ENA input mask time
VINH
VINL
2.0
0
-
-
VCCB
0.8
V
V
INA, INB, ENA
INA, INB, ENA
INA, INB, ENA < 3V
INA, INB, ENA ≥ 3V
INA, INB
RIND
25
20
-
50
50
-
100
150
60
kΩ
µA
ns
µs
IIND
tINMIN
tENAMSK
0.6
1
1.4
ENA
Output
0.4
0.2
0.9
0.6
2.0
1.3
IOUT=-40mA, OUTA, OUTB
IOUT=40mA, OUTA, OUTB
OUT ON resistance (Source)
OUT ON resistance (Sink)
RONH
RONL
Ω
Ω
Guaranteed by design,
OUTA, OUTB
Guaranteed by design,
OUTA, OUTB
OUT maximum current (Source)
OUT maximum current (Sink)
IOUTMAXH
IOUTMAXL
3.0
3.0
4.5
3.9
-
-
A
A
OUT Turn ON time
tPON
tPOFF
tPDISTA
tDM
35
35
-25
-
55
55
0
75
75
25
25
-
ns
ns
ns
ns
ns
ns
Ω
OUTA, OUTB
OUT Turn OFF time
OUT Propagation distortion
Delay matching, HS&LS turn ON/OFF
OUT Rise time
OUTA, OUTB
tPOFF – tPON, OUTA, OUTB
-
tRISE
-
50
50
0.65
OUT-GND 間10nF, OUTA, OUTB
OUT-GND 間10nF, OUTA, OUTB
IMC=40mA, MCA, MCB
OUT Fall time
tFALL
-
-
0.20
1.40
MC ON resistance
RONMC
VMCON
VVREG
CM
MC ON threshold voltage
VREG output voltage
Common Mode Transient Immunity
Protection functions
UVLO OFF voltage
1.8
4.2
2
4.7
-
2.2
5.2
-
V
V
MCA, MCB
100
kV/µs Guaranteed by design
VUVLOH
VUVLOL
9.0
8.0
1.0
9.5
8.5
2.5
10.0
9.0
V
V
VCCA, VCCB
VCCA, VCCB
VCCA, VCCB
UVLO ON voltage
UVLO mask time
tUVLOAMSK
5.0
µs
INA
(INB)
50%
50%
tPON
tPOFF
90%
90%
50%
50%
10%
OUTA
(OUTB)
10%
tFALL
tRISE
Figure 7. IN-OUT Timing Chart
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Typical Performance Curves
0.80
0.75
0.70
0.65
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.85
0.80
0.75
0.70
0.65
Ta=125°C
0.60
Ta=125°C
Ta=25°C
0.55
0.50
0.45
0.40
0.35
0.30
Ta=25°C
Ta=-40°C
Ta=-40°C
20 22
10
12
14
16
18
24
10
12
14
16
18
20
22
24
VCCB[V]
VCCB [V]
Figure 8. VCCB circuit current 1
(OUTB=L)
Figure 9. VCCB circuit current 2
(OUTB=H)
0.95
0.90
0.85
0.80
0.75
0.70
0.65
0.60
0.55
0.50
0.45
0.40
0.35
1.10
1.00
0.90
0.80
0.70
0.60
0.50
0.40
Ta=125°C
Ta=25°C
Ta=125°C
Ta=-40°C
20 22
Ta=25°C
14 16
VCCB [V]
Ta=-40°C
20 22 24
10
12
14
16
18
24
10
12
18
VCCB[V]
Figure 10. VCCB circuit current 3
Figure 11. VCCB circuit current 4
（INA=10kHz, Duty=50%）
(INA=20kHz, Duty=50%）
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Typical Performance Curves - continued
0.75
0.70
0.65
0.70
0.65
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
Ta=125°C
Ta=125°C
0.60
0.55
0.50
0.45
0.40
0.35
Ta=25°C
Ta=25°C
Ta=-40°C
0.30
0.25
Ta=-40°C
10
12
14
16
18
20
22
24
10
12
14
16
18
20
22
24
VCCA [V]
VCCA [V]
Figure 12. VCCA circuit current 1
Figure 13. VCCA circuit current 2
(OUTA=H)
(OUTA=L）
3.0
2.5
2.0
1.5
1.0
0.5
0.0
24
20
16
12
8
VCCB=10V
VCCB=15V
VCCB=24V
VCCB=15V
H level
L level
VCCB=10V
VCCB=15V
VCCB=24V
4
0
10
12
14
16
18
20
22
24
0
1
2
3
4
5
VCCA[V]
INA [V]
Figure 15. OUTA output voltage vs INA input voltage
(VCCB=15V, VCCA=15V, Ta=25°C)
Figure 14. logic(INA/INB)H/L level
input voltage
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Typical Performance Curves - continued
100
90
160
140
120
100
80
80
VCCB=10V
VCCB=15V
VCCB=24V
VCCB=10V
VCCB=15V
VCCB=24V
70
60
50
40
30
20
60
40
20
-50
-25
0
25
50
Ta [°C]
75
100 125
-50
-25
0
25
50
Ta [°C]
75
100 125
Figure 16. logic pull-down resistance
Figure 17. logic pull-down current
60
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
50
40
30
20
10
0
VCCB=10V
VCCB=15V
VCCB=24V
VCCB=10V
VCCB=15V
VCCB=24V
-50
-25
0
25
50
75
100 125
-50
-25
0
25
50
75
100 125
Ta [°C]
Ta [°C]
Figure 19. ENA input mask time
Figure 18. logic(INA)input mask time
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Typical Performance Curves - continued
2.0
1.8
1.4
1.2
1.0
0.8
0.6
0.4
0.2
VCCA=10V
VCCA=15V
VCCA=24V
VCCA=10V
1.6
VCCA=15V
VCCA=24V
1.4
1.2
1.0
0.8
0.6
0.4
-50
-25
0
25
50
75
100 125
-50
-25
0
25
50
75
100 125
Ta [°C]
Ta [°C]
Figure 21. OUTA ON resistance (Sink)
Figure 20. OUTA ON resistance (Source)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
VCCB=10V
VCCB=15V
VCCB=24V
VCCB=10V
VCCB=15V
VCCB=24V
-50
-25
0
25
50
75
100 125
-50
-25
0
25
50
75
100 125
Ta [°C]
Ta [°C]
Figure 22. OUTB ON resistance (Source)
Figure 23. OUTB ON resistance (Sink)
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Typical Performance Curves - continued
75
75
70
65
60
55
50
45
40
35
70
VCCA=10V
VCCA=15V
VCCA=24V
VCCA=10V
VCCA=15V
VCCA=24V
65
60
55
50
45
40
35
-50
-25
0
25
50
75
100 125
-50
-25
0
25
50
75
100 125
Ta [°C]
Ta [°C]
Figure 24. Turn ON Time
(INA=PWM, INB=L)
Figure 25. Turn OFF Time
(INA=PWM, INB=L)
75
70
65
60
55
50
45
40
35
75
70
65
60
55
50
45
40
35
VCCB=10V
VCCB=15V
VCCB=24V
VCCB=10V
VCCB=15V
VCCB=24V
-50
-25
0
25
50
75
100 125
-50
-25
0
25
50
75
100 125
Ta [°C]
Ta [°C]
Figure 26. Turn ON Time
(INA=L, INB=PWM)
Figure 27. Turn OFF Time
(INA=L, INB=PWM)
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Typical Performance Curves - continued
1.4
1.4
1.2
1.0
0.8
0.6
0.4
0.2
1.2
VCCA=10V
VCCA=15V
VCCA=24V
VCCB=10V
VCCB=15V
VCCB=24V
1.0
0.8
0.6
0.4
0.2
-50
-25
0
25
50
75
100 125
-50
-25
0
25
50
75
100 125
Ta [°C]
Ta [°C]
Figure 28. MCA ON resistance
Figure 29. MCB ON resistance
2.2
2.1
2.0
1.9
1.8
2.2
2.1
2.0
1.9
1.8
VCCA=10V
VCCA=15V
VCCA=24V
VCCB=10V
VCCB=15V
VCCB=24V
-50
-25
0
25
50
75
100 125
-50
-25
0
25
50
75
100 125
Ta [°C]
Ta [°C]
Figure 30. MCA ON threshold
Figure 31. MCB ON threshold
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Typical Performance Curves - continued
10.0
5.0
4.0
3.0
2.0
1.0
9.5
VUVLOBH
9.0
8.5
VUVLOBL
8.0
-50
-25
0
25
50
75
100 125
-50
-25
0
25
50
75
100 125
Ta [°C]
Ta [°C]
Figure 32. VCCB UVLO ON/OFF voltage
Figure 33. VCCB UVLOmask time
10.0
5.0
4.0
3.0
2.0
1.0
9.5
9.0
8.5
8.0
VUVLOAH
VUVLOAL
-50
-25
0
25
Ta [°C]
50
75
100 125
-50
-25
0
25
50
75
100 125
Ta [°C]
Figure 34. VCCA UVLO ON/OFF voltage
Figure 35. VCCA UVLO mask time
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Power Dissipation
Measurement machine: TH156（Kuwano Electric）
Measurement condition: ROHM board
Board size: 70×70×1.6mm3
1.5
1-layer board: θja=105.3°C/W
1.19 W
1.0
0.5
0
0
25
50
75
Ambient Temperature: Ta[°C]
Figure 36. SSOP-B20W Derating Curve
100
125
150
Thermal Design
Please make sure that the IC’s chip temperature Tj is not over 150°C, while considering the IC’s power consumption (W),
package power (Pd) and ambient temperature (Ta). When Tj=150°C is exceeded, the function as a semiconductor will not
operate and some problems (ex. Abnormal operation of various parasitic elements and increasing of leak current) occur.
Constant use under these circumstances leads to deterioration and eventually IC may destruct. Tjmax=150°C must be strictly
followed under all circumstances.
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I/O Equivalent Circuits
Name
Pin No
I/O equivalence circuits
Function
OUTAH
6
High-side Output pin (Source)
VCCA (VCCB)
OUTAL
5
OUTA H(OUTBH)
OUTAL(OUTBL)
High-side Output pin (Sink)
OUTBH
17
18
4
low-side Output pin (Source)
GND2 (GND1)
OUTBL
low-side Output pin (Sink)
MCA
VCCA (VCCB)
High-side Output pin for Miller Clamp
MCA (MCB)
MCB
19
13
14
12
GND2 (GND1)
low-side Output pin for Miller Clamp
INA
Logic input for high side gate driver output
INB
VCCB
Internal power
supply
INA
INB
ENA
Logic input for low side gate driver output
ENA
GND1
Input enabling signal input pin
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Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply terminals.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
5.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
7.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
10. Unused Input Terminals
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to
the power supply or ground line.
11. Regarding Input Pins of the IC
This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 37. Exampstruct
12. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
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Ordering Information
F V
B M 6 0 2 1 0
-
CE 2
Part Number
Package
Rank
FV: SSOP-B20W
C for Automotive applications
Packaging and forming specificationE2:
Embossed tape and reel
Marking Diagram
SSOP-B20W(TOP VIEW)
Part Number Marking
LOT Number
B M 6 0 2 1 0
1PIN MARK
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Physical Dimension, Tape and Reel Information
Package Name
SSOP-B20W
<Tape and Reel information>
Tape
Embossed carrier tape
2000pcs
Quantity
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
Direction of feed
1pin
Reel
Order quantity needs to be multiple of the minimum quantity.
∗
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Revision History
Date
Revision
Changes
19.Feb.2016
001
New Release
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Datasheet
BM60210FV-C - Web Page
Part Number
Package
Unit Quantity
BM60210FV-C
SSOP-B20W
2000
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
2000
Taping
inquiry
Yes
相关型号：
BM60212FV-C
BM60212FV-C是可驱动使用阴极负载方式的Nch-MOSFET及IGBT的1200V高耐压高边/低边驱动器。内置内置镜夹功能/低电压时误动作防止功能（UVLO）。
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