BM1Q021AFJ-LB (开发中) [ROHM]
This is the product guarantees long time support in Industrial market. This product is ideal for u;
| 型号： | BM1Q021AFJ-LB (开发中) |
| 厂家： | 
ROHM |
| 描述： | This is the product guarantees long time support in Industrial market. This product is ideal for u |
| 文件： | 总42页 (文件大小：1715K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
AC/DC Drivers
Quasi-resonant DC/DC Converters
BM1Q0xxAFJ-LB Series
General Description
Key Specifications
This is the product guarantees long time support in
Industrial market. This product is ideal for use in these
applications. The quasi-resonant controller type DC/DC
converter IC BM1Q0xxAFJ-LB provides the optimal
system for products with electrical outlets. For quasi-
resonant vibration operation, soft switching is realized,
contributing to low EMI.
◼
Operating Power Supply Voltage Range:
VCC: 8.9 V to 26.0 V
VH: -0.3 V to +650 V
600 μA(Typ)
◼
◼
◼
◼
Current at Switching Operation:
Current at Burst Operation:
Maximum Operating Frequency:
Operate Temperature Range:
350 μA (Typ)
120 kHz (Typ)
-40 °C to +105 °C
The switching MOSFET and current sensing resistor are
external, allowing for highly flexible power supply designs.
This IC has a built-in starter circuit that contributes to low
standby power and high speed startup.
Package
SOP-J7S
W (Typ) x D (Typ) x H (Max)
4.9 mm x 6.0 mm x 1.65 mm
When the IC is light load, the standby power is reduced
due to the built-in burst operation function and the lower
current consumption of the IC.
It also has a variety of built-in protection functions such as
soft start function, burst function, over current protection
per cycle, over voltage protection, overload protection,
and built-in the CS pin open protection, providing
excellent safety.
Features
◼ Long Time Support Product for Industrial Applications
◼ Quasi-resonant System
◼ Built-in 650 V Tolerate Starter Circuit
◼ Burst Operation at Light Load / Frequency Reduction
Function
◼ Maximum Frequency 120 kHz
◼ AC Input Voltage Correction Circuit
◼ VCC Pin Under Voltage Protection
◼ VCC Pin Over Voltage Protection
◼ Over Current Protection Circuit per Cycle
◼ Output Driver 12 V Clamp Circuit
◼ Soft Start Function
Lineup
Product Name
VCC OVP
Latch
Auto Restart
ZT OVP
Latch
Auto Restart
BM1Q002AFJ-LB
BM1Q021AFJ-LB
Applications
Industrial Equipment, Products that Require Electrical
Outlets, Such as Air Conditioners, AC Adapters, and TVs
◼ ZT Pin Trigger Mask Function
◼ ZT Pin Over Voltage Protection
◼ Output Overload Protection (Auto Restart)
◼ CS Pin Open Protection Circuit (Auto Restart)
Typical Application Circuit
FUSE
Diode
Bridge
AC
Vac
Filter
VCC OUT
VH
ZT
ERROR
AMP
IC
FB
CS
GND
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
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BM1Q0xxAFJ-LB Series
Pin Configuration
(TOP VIEW)
ZT
FB
CS
7
VH
１
2
3
6
5
VCC
OUT
GND 4
Pin Descriptions
ESD Protection
System
Pin No.
Pin Name
I/O
Function
VCC
GND
1
2
3
4
5
6
7
ZT
FB
CS
GND
OUT
VCC
VH
I
I
I
Zero current detect pin
Feedback signal input pin
Primary current sensing pin
GND pin
External MOS drive pin
Power supply pin
-
○
○
○
○
-
○
○
○
-
○
○
○
I/O
O
I/O
I
Starter circuit pin
-
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BM1Q0xxAFJ-LB Series
Block Diagram
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BM1Q0xxAFJ-LB Series
Description of Blocks
1
Starter Circuit the VH Pin
This IC has a built-in starter circuit in the VH pin. Therefore, it enables to be low standby power and high speed starting.
It can also be activated by opening starter circuit of the VH pin.
1.1
In Case of Using the VH Pin
The VH pin current flowing during operation is shown in Figure 2. After the IC is started, ISTART3 flows from the VH
pin. Loss due to this idling current is shown below.
ex) Power consumed by starter circuit alone
at 푉푎푐 = 100 푉,
푃표푤푒푟 = 100 푉 × 2 × 10 µ퐴 = 1.41 푚푊
√
at 푉푎푐 = 240 푉,
푃표푤푒푟 = 240 푉 × 2 × 10 µ퐴 = 3.38 푚푊
√
The start time is determined by the inrush current of the VH pin and the capacitor capacitance of the VCC pin.
Figure 3 shows reference start times. For example, when CVCC = 10 µF, it is charged within about 70 ms.
When the VCC pin is shorted to GND, the current of ISTART1 indicated by Figure 2 flows.
When the VH pin is shorted to GND, large current flows from VA to GND. To prevent it, insert a current limiting
resistor RVH between VA and the VH pin of the IC. At this time, the power of VH2/RVH is applied to RVH, so check
the allowable power before determining the resistor size. If one resistor cannot satisfy the allowable power,
connect two or above resistors in series.
Figure 1. Starter Circuit Block Diagram
160
ISTART2
140
120
100
80
60
40
ISTART1
ISTART3
20
0
VSC
10 V
VUVLO1
0
0
2
4
6
8
10
12
14
16
18
20
22
24
CVCC [µF]
VCC Pin Voltage[V]
Figure 2. Startup VH Current vs VCC Pin Voltage
Figure 3. Start Time (Reference Value)
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1.1
In Case of Using the VH Pin - continued
It shows operation waveform of startup in Figure 4.
VH Pin
Voltage
ISTART2
VH Pin
Input Current
ISTART1
ISTART3
VUVLO1
Vsc
VCC Pin
Voltage
Switching
VOUT
Set Voltage
D
A
B
C
Figure 4. Startup Waveform
A: By inserting to outlet, the VH pin voltage is applied. From the time, charging to the VCC pin starts from the
VH pin through starter circuit. The VCC pin voltage < VSC at this point, so the VH pin input current is limited
to ISTART1 by the VCC pin short protection function.
B: Because the VCC pin voltage > VSC, the VCC pin short protection function is released and current flows from
the VH pin input current.
C: Because the VCC pin voltage > VUVLO1, starter circuit is stopped and ISTART3 flows through the VH pin input
current. At this time, switching operation starts and VOUT starts rising, but the VCC pin voltage drops because
VOUT is not rising sufficiently. Since the VCC pin voltage always drops depending on the current consumed,
set it so that the VCC pin voltage > VUVLO2. The fall rate of the VCC pin voltage is determined by the VCC pin
capacitor capacitance and the current consumption of the IC, and the load current connected to the VCC pin.
(V/t = CVCC/ICC
)
D: Since VOUT has risen to specific voltage, the auxiliary winding applies a voltage to the VCC pin and the VCC
pin voltage stabilizes.
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1
Starter Circuit the VH Pin - continued
1.2
In Case of Unused the VH Pin
The structure that do not use the VH pin is shown in Figure 5. It is activated by opening starter circuit of the VH
pin and connecting a startup resistor RSTART to the VCC pin. At startup (before VCC UVLO releasing), the current
consumption IOFF of the VCC pin flows through RSTART, so set to an appropriate resistance.
FUSE
Diode
RSTART
Bridge
AC
Vac
Filter
VCC
CS
OUT
GND
VH
ZT
ERROR
AMP
IC
FB
Figure 5. Application Schematic Without Using VH Pin
1.2.1 Setting Method for the Startup Resistor
If you reduce RSTART value, standby power is increased, start time is shorter.
If you increase RSTART on the contrary, standby power is reduced, start time will be longer.
ex) Startup resistor RSTART setting
푅푆푇ꢀꢁ푇 = (푉푀퐼푁 − 푉푈ꢂ퐿푂ꢃ(max)) /푙푂퐹퐹(max)
Where:
푅푆푇ꢀꢁ푇 is the startup resistor
푉푀퐼푁 is the minimum input DC voltage
푉푈ꢂ퐿푂ꢃ is the VCC UVLO voltage1
ꢄ푂퐹퐹 is the operating current in standby mode
At Vac = 100 V, a margin of -30 % results in VMIN = 100 x √2 x 0.7 = 99 V.
In this case, because VUVLO1 (max) = 14.5 V, RSTART = (99 - 14.5)/25 μA = 3.38 MΩ.
For example, that RSTART = 2.0 MΩ with a margin of more than 3.38 MΩ.
For AC100 V, RSTART consumes Pd (RSTART) = (VH - VCC)2/RSTART = (141 V - 14.5 V)2/2.0 MΩ = 8.00 mW.
Thus, when starting up in RSTART, the standby power is increased compared to when using the VH pin.
However, confirm RSTART and the VCC pin capacitance by evaluating the actual application.
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Description of Blocks - continued
2
Startup Sequence (FB OLP: Auto Restart Mode)
The startup sequence of IC is shown in Figure 6. About each detail, explain in each section.
VH Pin
Voltage
VUVLO1
VUVLO2
VCC Pin
Voltage
Internal REF
Pull Up
tFOLP
tFOLP
tFOLP
VFLOP1
VFLOP2
FB Pin
Voltage
VOUT
Normal
Load
Over Load
Light Load
Burst Mode
IOUT
Switching
Soft Start
Time
K
A
B C
D
E
F
G H
I J
Figure 6. Startup Sequence Timing Chart
A: The VH pin voltage is applied, and the VCC pin voltage rises due to the startup resistor RSTART
B: When the VCC pin voltage > VUVLO1, this IC starts operation.
.
C: When the protection function is judged to be normal, switching operation starts. At this time, the VCC pin voltage
drops depending on the current consumption. Therefore, set it so that the VCC pin voltage > VUVLO2. This IC has a
soft start function to adjust the voltage level of the CS pin voltage so that excessive voltage rise and current rise do
not occur. Also, VOUT increases when switching starts.
D: At startup, set the output voltage to the specified voltage within tFOLP
.
E: When it is light load, burst operation is used to keep power consumption down.
F: When the FB pin voltage > VFOLP1, it starts overload operation.
G: If the FB pin voltage > VFOLP1 persists for tFOLP or above, the overload protection circuit stops switching.
Once the FB pin voltage < VFOLP2, FB OLP detection timer tFOLP is reset.
H: When the VCC pin the voltage < VUVLO2, the IC restarts.
I : Same as B.
J: Same as F.
K: Same as G.
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Description of Blocks - continued
3
The VCC Pin Protective Function
This IC has a built-in VCC UVLO and VCC OVP of the VCC pin, and VCC charge function that operates when the VCC
pin voltage drops. VCC UVLO and VCC OVP are for preventing the switching MOSFET from destroying for abnormal
voltages.
When the VCC pin voltage drops, the VCC charge function charges the high voltage line from the starter circuit to
stabilize the secondary output voltage.
3.1
VCC UVLO / VCC OVP
VCC UVLO is an auto restart mode with voltage hysteresis.
VCC OVP is a comparator with voltage hysteresis. BM1Q002AFJ-LB is latch mode and BM1Q021AFJ-LB is auto
restart mode.
The latch release (reset) condition after latch detection by VCC OVP is the VCC pin voltage < VLATCH
.
Figure 7 shows the time chart of VCC OVP latch mode, and Figure 8 shows the time chart of VCC OVP auto
restart mode. VCC OVP also has a built-in tLATCH mask time. This function masks surges that occur at the VCC
pin.
VH Pin
Voltage
tLATCH
VOVP1
VUVLO1
VCC Pin
Voltage
VUVLO2
VLATCH
0 V
ON
ON
VCC UVLO
OFF
OFF
ON
OFF
ON
OFF
OFF
VCC OVP
Switching
ON
OFF
OFF
Internal
Latch Signal
L : Normal
H : Latch
Time
H
A
B C D E
F
G
I
J
K
L
M
A
B
Figure 7. VCC UVLO / OVP (Latch Mode)
A: The VH pin voltage is applied and the VCC pin voltage rises.
B: The VCC pin voltage > VUVLO1, VCC UVLO function is released and switching operation starts.
C: The VCC pin voltage < VUVLO2, the switching operation is stopped by VCC UVLO function.
D: The VCC pin voltage > VUVLO1, VCC UVLO function is released and switching operation starts.
E: The VCC pin voltage drops until the output voltage stabilizes.
F: The VCC pin voltage rises.
G: The VCC pin voltage > VOVP1 is tLATCH on, VCC OVP activates the internal latch signal and stops the switching
operation. When switching operation is stopped, power is no longer supplied from the auxiliary winding and
the VCC pin voltage is reduced.
H: The VCC pin voltage < VUVLO2, the VCC pin voltage rises because the current consumed by the IC drops.
I: The VCC pin voltage > VUVLO1, switching does not operate because latching is in progress. The VCC pin voltage
drops because switching is stopped.
J: Same as H.
K: Same as I.
L: The VH pin voltage becomes open, the VCC pin voltage drops.
M: The VCC pin voltage < VLATCH, latch function is released.
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3.1
VCC UVLO / VCC OVP - continued
VH Pin
Voltage
VOVP1
VOVP2
VUVLO1
VCC Pin
Voltage
VUVLO2
0 V
ON
OFF
ON
VCC UVLO
OFF
ON
OFF
ON
OFF
VCC OVP
Switching
ON
OFF OFF
ON
OFF
OFF
Time
L
A
B
BC
D E
I
J
K
A
F
G
H
Figure 8. VCC UVLO / OVP (Auto Restart Mode)
A: The VH pin voltage is applied and the VCC pin voltage rises.
B: The VCC pin voltage > VUVLO1, VCC UVLO function is released and switching operation starts.
C: The VCC pin voltage < VUVLO2, the switching operation is stopped by VCC UVLO function.
D: The VCC pin voltage > VUVLO1, VCC UVLO function is released and switching operation starts.
E: The VCC pin voltage drops until the output voltage stabilizes.
F: The VCC pin voltage rises.
G: The VCC pin voltage > VOVP1, the switching operation is stopped by VCC OVP. When switching operation is
stopped, power is no longer supplied from the auxiliary winding and the VCC pin voltage is reduced.
H: The VCC pin voltage < VOVP2, switching operation is started by the auto restart.
I: The VH pin voltage becomes open, the VCC pin voltage drops.
J: Same as C.
K: The VCC pin voltage > VUVLO1, VCC UVLO function is released and the VCC pin voltage drops. However,
switching operation does not resume because the VH pin input voltage is open.
L: The VCC pin voltage < VUVLO2, VCC UVLO function operates. However, because the VH pin voltage is open,
the VCC pin voltage continues to drop.
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3
The VCC Pin Protective Function
3.2
The VCC Pin External Components
3.2.1 Capacitor Value of the VCC Pin
For stable operation of ICs, set the capacitor of the VCC pin to 1 μF or above. Note that if the VCC pin
capacitor is too large, the VCC pin responds slowly to VOUT. In addition, if the transformer is less coupled,
a large surge will be generated in the VCC pin, and the IC may be destroyed. In this case, provide a
resistor of approximately 10 Ω to 100 Ω in the path between the diode and the capacitor after the auxiliary
winding. For the constants, perform a waveform assessment of the VCC pin and set the VCC pin so that
the surges do not exceed the absolute maximum rating of the VCC pin voltage.
3.2.2 How to Set VCC OVP Protection When VOUT Is Increased
The VCC pin voltage is determined by VOUT and transformer ratio (Np: NS).
푉퐶퐶 푃푖푛 푉표푙푡푎푔푒 = 푉푂푈푇 × ꢅ푏/ꢅ푆 – 푉퐹
Where:
푉푂푈푇 is the output voltage
ꢅ푏 is the number of auxiliary winding
ꢅ푆 is the number of winding on secondary side
Therefore, if VOUT is increased, it can be protected by VCC OVP. VCC OVP protection setting is as follows.
VOUT
Np
Nb
NS
VCC
CS
OUT
GND
VH
ZT
IC
FB
Figure 9. VCC OVP
For example, if you want to protect VOUT x 1.3, set the number of winding so that it becomes 1.3 x (VOUT
x (Nb/NS) - VF) > VOVP1. VCC OVP protection does not detect VCC OVP protection against
instantaneous surge noise on the VCC pin because of tLATCH masking times. However, if the VCC pin
voltage is higher than VOVP1 for tLATCH periods or above due to factors such as poor trans binding, a
VCC OVP is detected. Therefore, be sure to check the application rating and set VCC OVP.
ZT OVP can also be used to protect VOUT
.
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Description of Blocks - continued
4
The VCC Charge Function
Once the VCC pin > VUVLO1, the VCC charge function operates when the VCC pin voltage drops to VCHG1 after the IC
starts up. At this time, it charges the VCC pin from the VH pin through the starter circuit, it does not occur VCC start
problem. When the IC charge the VCC pin and the VCC pin voltage > VCHG2, the charging function is finished. This
operation is shown in Figure 10.
VH Pin
Voltage
VUVLO1
VCHG2
VCHG1
VUVLO2
VCC Pin
Voltage
Switching
Charge
Charge Charge
VCC Recharge
Function
VOUT
B
A
C
D
E
F
H
G
Figure 10. VCC Pin Charging Operation
A: The VH pin voltage rises and the VCC charge function starts charging to the VCC pin.
B: The VCC pin voltage > VUVLO1, VCC UVLO function is released, the VCC charge function is stopped, and switching
operation starts.
C: The VCC pin voltage drops because the output voltage is not rising sufficiently at startup.
D: The VCC pin voltage < VCHG1, the VCC charge function operates and the VCC pin voltage rises.
E: The VCC pin voltage > VCHG2, the VCC charge function is stopped.
F: Same as D.
G: Same as E.
H: The output voltage rises, the auxiliary winding is charged to the VCC pin and the VCC pin voltage is stabilized.
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Description of Blocks - continued
5
DC/DC Converters Function
This IC operates the PFM (Pulse Frequency Modulation) mode control method.
By monitoring the FB pin, the ZT pin, and the CS pin, the optimum system is supplied as a DC/DC. The FB pin and the
CS pin control the ON width (turn OFF) of the switching MOSFET, and the ZT pin controls the OFF width (turn ON).
IC internal QR operation block diagram and QR basic operation are shown in Figure 11, Figure 12.
Figure 11. IC Internal QR Operation Block Diagram
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5
DC/DC Converters Function - continued
tONDELAY
ZT Pin
Voltage
Bottom
Detect
SET
OUT Pin Voltage
FB/AVCS or VLIM
CS Pin
Voltage
RESET
Drain Voltage
Switching ON
tON
A
BC
D
E
F G
Figure 12. QR Basic Operation
A: MOSFET is turned ON by outputting the SET signal from the oscillator inside the IC.
At this time, noise is generated in the CS pin because the DRAIN - SOURCE capacitance of MOSFET is
discharged. This noise is called Leading Edge. This IC has a built-in filter for this noise. The minimum ON width of
the IC is tMIN by this filter and the delay time. After that, the current flows through MOSFET and the voltage VCS
RS*Ip is applied to the CS pin.
=
B: The CS pin voltage rises above the FB pin voltage/AVCS or the over current detection voltage VLIM, RESET signal is
output and the OUT pin voltage is turn OFF.
C: There is a delay tONDELAY from the point of B to turn OFF actually. This time results in a difference in maximum
power due to AC voltage. This IC has a built-in function to reduce this difference.
D: The energy stored in the transformer during tON is discharged to the secondary, and the drain voltage starts free
vibration due to transformer Lp value and Cds (DRAIN - SOURCE capacitance) of MOSFET.
E: Since the switching frequency is determined internally in the IC, the SET signal is output from the internal oscillator
and turn ON the MOSFET by process of certain time from A.
F: Same as B.
G: Same as C.
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5
DC/DC Converters Function - continued
5.1
Determination of ON Width (Turn OFF)
The ON width is controlled by the FB pin and the CS pin.
The ON width is determined by comparing the FB pin voltage to 1/AV and the CS pin voltage. As shown in Figure
13, the comparator level is changed by comparing with VLIM1A generated in the IC.
The CS pin is shared with over current limiter circuit by each pulse. It also changes the maximum blanking
frequency and the over current limiter level by changing in the FB pin.
mode 1: Burst operation
mode 2: Frequency reduction operation (Decreases the maximum frequency.)
mode 3: Maximum frequency operation (Operates at the maximum frequency.)
mode 4: Overload operation (Detects the overload condition and stops the pulsing operation.)
Maximum Operating
Frequency [kHz]
mode 2
mode 1
mode 3
mode 4
fSW1
fSW2
FB Pin
Voltage
[V]
VFBSW2
0.0
VFBSW1
VFOLP1
CSꢀ
Limiter [V]
mode 1 mode 2
mode 3
mode 4
VLIM1A or VLIM1B
VLIM2A or VLIM2B
FB Pin
Voltage
[V]
VFOLP1
0.0
VFBSW2
VFBSW1
Figure 13. Relationship of FB Pin Voltage to Over Current Limiter and Maximum Frequency
The ON width tON is determined by the CS Limiter (VCS).
푡푂푁 = (ꢆ푝 × 푉ꢇ푆)/(푉 × 푅푆)
퐼푁
Where:
ꢆ푝 is the primary inductance value
푉
퐼푁
is the VH pin voltage (Figure 11)
푅푆 is the sense resistor (Figure 11)
To adjust the over current limiter level to perform soft start function and over current protection switching at the
input voltage.
In such cases, VLIM1A, VLIM1B, VLIM2A, VLIM2B is as follows.
Table 1. Over Current Protection Voltage
AC = 100 V
AC = 230 V
Soft Start
VLIM1A
VLIM2A
VLIM1B
VLIM2B
Start to 0.5 ms
0.5 ms to 1 ms
1 ms to 2 ms
2 ms to 4 ms
4 ms to
0.063 V (12 %)
0.125 V (25 %)
0.250 V (50 %)
0.375 V (75 %)
0.500 V (100 %)
0.016 V (3 %)
0.032 V (6 %)
0.063 V (12 %)
0.094 V (19 %)
0.125 V (25 %)
0.044 V (10 %)
0.088 V (20 %)
0.175 V (40 %)
0.263 V (60 %)
0.350 V (70 %)
0.011 V (2 %)
0.022 V (4 %)
0.044 V (9 %)
0.066 V (13 %)
0.087 V (18 %)
() is shown comparative value with VLIM1A in AC = 100 V and normal operation.
The difference between AC100 V and AC230 V is the CS current switching function shown in (5.3).
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BM1Q0xxAFJ-LB Series
5
DC/DC Converters Function - continued
5.2 L.E.B. (Leading Edge Blanking) Function
When the MOSFET for switching is turned ON, surge current occurs in cause of capacitance or rush current.
Therefore, when the CS pin voltage rises temporarily, over current limiter circuit may miss detections.
To prevent miss detections, the IC build in blanking function. This function masks the CS pin voltage for tLEB after
the OUT pin switches to L→H.
This blanking function can reduce the noise filter of the CS pin.
However, if the CS pin noise does not converge less than 250 ns, attach an RC filter to the CS pin as shown in
Figure 14. At this time, delay time occurs to the CS pin detection by RC filter.
Also, even if the filter in not attached, it is recommended that it is attached RCS to the CS pin as surge provision.
RCS recommended resistor value is 1 kΩ. If you want to filter, adjust the resistor with CCS
.
VOUT
VH
VCC
7
6
Starter
+
-
+
-
Clamp
Circuit
VCC Recharge
Regulator
VCC UVLO
NOUT
Internal
Supply
+
-
ZT ACSNS Comp.
+
-
+
VCC OVP
-
OSC
ZT OVP Comp.
OSC
1 Shot
Timeout
ZT Comp.
ZT
+
-
1
OR
AND
Trigger
POUT
S
R
Q
AND
OUT
5
Detect LOGIC
FBOLP_OH
PRE
Driver
AND
ZT Blanking
NOUT
OUT(H->L)
OR
VREF
Max Frequency
Control
FB
Burst Comp.
BURST_OH
+
-
2
VREF
OLP1
FBOLP_OH
Delay
Timer
Stop
Timer
+
-
Soft Start
tss1 tss2 tss3 tss4
FB/4
-
-
+
DCDC Comp.
CS
3
CURRENT SENSE (V-V Change)
Normal : ×1.0
Leading Edge
Blanking
Rcs
Ccs
RS
4
GND
Figure 14. CS Pin Peripheral Circuit
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BM1Q0xxAFJ-LB Series
5
DC/DC Converters Function - continued
5.3
CS Over Current Protection Switching Function
As the input voltage (VH) increases, the ON time decreases and the operating frequency also increases. As a
result, the maximum capable power is increased for constant over current limiter. Therefore, it takes measures
with switched the over current protection function inside the IC. In case of high voltage, set the over current limiter
level that determines the ON time to 0.7 times the normal level.
The ZT pin detects an over current by monitoring the ZT inflow current and switches the protective function.
When MOSFET turns ON, the auxiliary winding voltage Vb has negative voltage to be affected input voltage VH.
The ZT pin is clamped inside the IC around 0 V. The calculation formula in that case is shown below.
Figure 15 shows block diagram and Figure 16, Figure 17 shows the charts.
(
)
(
)
ꢄ푍푇 = 푉푏 − 푉푍푇 /푅푍푇ꢃ = 푉푏/푅푍푇ꢃ = 푉퐻 × ꢅ푏 /(ꢅ푝 × 푅푍푇ꢃ
)
[A]
푅푍푇ꢃ = 푉푏/ꢄ푍푇
[Ω]
Where:
ꢄ푍푇 is the ZT inflow current
푉 is the auxiliary winding voltage
푏
푉푍푇 is the ZT pin voltage
푅푍푇ꢃ is the ZT pin resistor 1
푉퐻 is the input voltage
ꢅ푝 is the primary winding
ꢅ푏 is the auxiliary winding
From the above, set the input voltage VH with the resistor value of RZT1. At this time, set the timing with CZT
because the ZT bottom detection voltage is determined.
The ZT current switched CS has IZTHYS hysteresis. Once the ZT pin current exceeds IZT1 and is detected by the
comparator, the gain is 0.7 times until it drops to IZT2.
VCC
VH
7
6
Starter
+
-
+
-
Clamp
Circuit
VCC Recharge
Regulator
VCC UVLO
NOUT
Internal
Supply
+
-
ZT ACSNS Comp.
+
+
-
VCC OVP
-
OSC
ZT OVP Comp.
OSC
1 Shot
Timeout
ZT Comp.
ZT
+
-
1
OR
AND
Trigger
POUT
S
R
Q
AND
OUT
5
Detect LOGIC
FBOLP_OH
PRE
Driver
AND
ZT Blanking
NOUT
OUT(H->L)
OR
VREF
Max Frequency
Control
FB
Burst Comp.
BURST_OH
+
-
2
VREF
OLP1
FBOLP_OH
Delay
Timer
Stop
Timer
+
-
Soft Start
tss1 tss2 tss3 tss4
FB/4
-
-
+
DCDC Comp.
CS
CURRENT SENSE (V-V Change)
Normal : ×1.0
Leading Edge
Blanking
3
RS
4
GND
Figure 15. Block Diagram of CS Switching Current
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BM1Q0xxAFJ-LB Series
5.3
CS Over Current Protection Switching Function - continued
CS
mode 1 mode 2
mode 3
ꢀLimiter [V]
mode 4
VLIM1A
VLIM1B
IZT < IZT2
IZT > IZT1
VLIM2A
VLIM2B
0.0
VFOLP1
VFBSW2
VFBSW1
FB Pin Voltage [V]
Figure 16. CS Switching: CS Limiter vs FB Pin Voltage
CS
ꢀLimiter [V]
VLIM1A
VLIM1B
IZT2 IZT1
ZT Pin Current [mA]
Figure 17. CS Switching: CS Limiter vs ZT Pin Current
ex) Setting Method (Switch between AC100 V and AC230 V.)
AC100 V system 141 V ± 28 V (±20 % margin)
AC230 V system 325 V ± 65 V (±20 % margin)
In the above case, set to switch the CS detection current between 169 V and 260 V. For example, when performing
the switching of AC230 V from AC100 V at VH = 214 V, Np = 100, and Nb = 15.
(
)
푉푏 = 푉 × ꢅ푏/ꢅ푝 = 214 푉 × 15/100 × −1 = −32.1 [V]
퐼푁
푅푍푇ꢃ = 푉푏/ꢄ푍푇 = −32.1 푉/−1 푚퐴 = 32.1 [kΩ]
Where:
푉 is the auxiliary winding voltage
푏
푉
퐼푁
is the input voltage
ꢅ푝 is the primary winding
ꢅ푏 is the auxiliary winding
푅푍푇ꢃ is the ZT pin resistor
ꢄ푍푇 is the ZT pin inrush current
Therefore, set RZT1 = 32 kΩ.
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BM1Q0xxAFJ-LB Series
5
DC/DC Converters Function - continued
5.4
Determination of OFF Width (Turn ON)
The OFF width is controlled at the ZT pin. While switching is OFF, the power stored in the coil is supplied to the
secondary output capacitor. When the supply is completed, there is no current flowing to the secondary side. For
that reason, the drain voltage of the switching MOSFET drops. Therefore, the voltage on the auxiliary winding
side also drops.
The ZT pin is powered by the voltage divided by RZT1 and RZT2. When the voltage drops VZT1 or below, switching
is turned ON by the ZT comparator.
To detect zero currents in the ZT pin, a time constant is created by CZT and RZT1, RZT2. However, since RZT1 and
RZT2 must be set by the AC voltage compensation function and ZT OVP function, the bottom time adjustment is
CZT setting. tOFF1 is calculated by the following equation.
퐿
ꢈ
푡푂퐹퐹ꢃ
=
× ꢄ푆
ꢌ
ꢂ
+ ꢂ
ꢉꢊꢋ
Where:
푡푂퐹퐹ꢃ is the transformer discharge time
ꢆ푆 is the secondary inductance value
푉푂푈푇 is the output voltage
푉퐹 is the forward voltage of the diode on the secondary side
ꢄ푆 is the secondary peak current
For this reason, the switching frequency is as follows.
( ) ( )
= 1/{ 푡푂푁 ꢎ 푡푂퐹퐹ꢃ ꢎ ꢅ − 1 × 푡ꢁ ꢎ 1/2 × 푡푄ꢁ}
푓
푆ꢍ
푡푄ꢁ = 2 × 휋 × ꢆ × 퐶
ꢏ
푝
푑푠
Where:
is the switching frequency
푓
푆ꢍ
ꢅ is the number of bottoms
푡푄ꢁ is the resonance time
ꢆ푝 is the primary inductance value
퐶푑푠 is the MOSFET DRAIN – SOURCE capacitance
The low load frequency reduction period has a limit as shown in Figure 13, so the bottom detection operation is
performed at a frequency lower than the frequency indicated by Figure 13.
In addition, the ZT pin has a built-in ZT trigger mask function and ZT trigger timeout function.
5.5
ZT Trigger Mask Function
Noise may be superimposed on the ZT pin when switching is turned from ON to OFF. In this case, the ZT
comparator is masked during tZTMASK to prevent ZT comparator operation errors. This is shown in Figure 18.
ON
OFF
ON
OFF
ON
Switching
OUT
ZT Pin
Voltage
tZTMASK
tZTMASK
ZT Trigger
Mask
Time
A
B
C
D
E
F
G
Figure 18. ZT Pin Trigger Mask Function
A: The OUT output is turned high, switching is turned ON.
B: The OUT output goes low, switching is turned OFF. At this time, the surge noise occurs to the ZT pin, but the
ZT comparator does not operate during tZTMASK
.
C: tZTMASK ends.
D: Same as A.
E: Same as B.
F: Same as C.
G: Same as A.
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BM1Q0xxAFJ-LB Series
5
DC/DC Converters Function - continued
5.6
ZT Trigger Timeout Function
ZT Trigger Timeout Function 1
This is a function that forcibly turns ON switching when the ZT pin voltage does not become higher than VZT2
during tZTOUT1 due to a drop in the output voltage or a short at the ZT pin such as at startup.
ZT Trigger Timeout Function 2
This function forces switching to ON when the following is not detected in tZTOUT2 after the ZT comparator detects
the bottom. This function operates after the ZT comparator detects a signal once. It does not operate at startup or
when the output voltage drops. This function works when the auxiliary winding voltage is attenuated and the
bottom cannot be detected.
ZT Pin GND
Short
ZT Pin
Voltage
VZT2
VZT1
Bottom
Detection
tZTOUT2
tZTOUT2
tZTOUT2
Timeout
tZTOUT1
tZTOUT1
tZTOUT1
Timeout
CS
Pin Voltage
OUT
Pin Voltage
Time
A
BC
D E
F
G H
I
Figure 19. ZT Pin Trigger Timeout Function
A: At startup, IC starts to operate by the ZT trigger timeout function 1 because the ZT pin voltage < VZT2 during
tZTOUT1
.
B: The OUT pin voltage turns ON.
C: The OUT pin voltage turns OFF.
D: The maximum value of the ZT pin voltage becomes lower than VZT2 due to vibration damping.
E: The OUT pin voltage turned ON after tZTOUT2 from the point of D by the ZT trigger timeout function 2.
F: Same as D.
G: The OUT pin voltage turned ON after tZTOUT2 from the point of F by the ZT trigger timeout function 2.
H: The ZT pin and GNDs are short circuited.
I: The OUT pin voltage turned ON after tZTOUT1 by the ZT trigger timeout function 1.
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BM1Q0xxAFJ-LB Series
Description of Blocks - continued
6
Soft Start Function
Normally, when the AC voltage is applied, a large current flow through AC/DC power supply. This IC has a built-in soft
start function to prevent large changes in the output voltage and output current during startup. This function is reset
when the VCC pin voltage falls VUVLO2 or below, and soft start is executed at the next AC power on.
The soft start function performs the following operations after starting. (Refer to 5.1)
Start to tSS1 → Sets CS limiter to 12.5 % when normal.
tSS1 to tSS2 → Sets CS limiter to 25 % when normal.
tSS2 to tSS3 → Sets CS limiter to 50 % when normal.
tSS3 to tSS4 → Sets CS limiter to 75 % when normal.
tSS4 to → Normal operation
7
ZT OVP
ZT OVP is detected when the ZT pin voltage > VZTL
.
BM1Q002AFJ-LB is latch operation and BM1Q021AFJ-LB is auto restart operation.
BM1Q002AFJ-LB has a built-in mask time tLATCH. This function masks surges that occur at the pin. This tLATCH is built-in
VCC OVP.
When BM1Q021AFJ-LB is ZT OVP protected, switching is stopped for tZTOVP. After tZTOVP, switching restarts.
ZT OVP supports DC detection and pulse detection for the ZT pin.
7.1
DC Detection
In the case of BM1Q002AFJ-LB, switching stops when the ZT pin Voltage > VZTL continues for tLATCH.
in the case of BM1Q021AFJ-LB, switching stops when the ZT pin Voltage > VZTL continues for tZTMASK
The operation of BM1Q002AFJ-LB is shown in Figure 20.
.
tLATCH
tLATCH
VZTL
ZTꢀPin
PULSE
PULSE
Voltage
ON
OFF
Switching
C
D
E
A
B
Figure 20. ZT OVP and Latch Mask Function
A: Switching turn ON and the ZT pin voltage starts pulsed operation.
B: The ZT pin voltage is higher than VZTL
.
C: The ZT pin voltage > VZTL status is within tLATCH, so switching resumes normal operation.
D: Same as B.
E: The ZT pin voltage > VZTL status continued for tLATCH, so switching turn OFF to operate latched.
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BM1Q0xxAFJ-LB Series
7
ZT OVP - continued
7.2
Pulse Detection
The ZT pin voltage > VZTL pulse detects 3 pulses. Switching stops when BM1Q002AFJ-LB is detected for tLATCH
or BM1Q021AFJ-LB is continuously detected for tZTMASK. Figure 21 shows the time chart of the latch mode of ZT
OVP pulse detection, and Figure 22 shows the time chart of the auto restart mode of ZT OVP pulse detection.
OUT
VZTL
ZT Pin
Voltage
ZT OVP
Comparator
tZTMASK
tZTMASK
tZTMASK
tZTMASK
tZTMASK
tZTMASK
1
2
3
ZT OVP
Detect
tLATCH
Latch Stop
D
C
A
B
Figure 21. ZT OVP Pulse Detection (Latch)
A: The OUT pin H→L, ringing occurs in the ZT pin, but ZT OVP is not detected by tZTMASK
.
B: ZT OVP is detected by ZT OVP comparator when the ZT pin voltage > VZTL after tZTMASK has elapsed from A.
C: B is detected consecutively in three occurrences, the timer tLATCH starts operating.
D: Switching is stopped by ZT OVP when it continues tLATCH from C.
tZTOVP
OUT
ZT Pin
Voltage
VZTL
tZTMASK
tZTMASK
tZTMASK
tZTMASK
tMASK
tZTMASK
ZT OVP
Comparator
1
2
3
ZT OVP
Detect
C
A B
D
E
Figure 22. ZT OVP Pulse Detection (Auto Restart)
A: The OUT pin H→L, the ZT pin is ringed, but tZTMASK does not detect any ZT OVP.
B: ZT OVP is detected by ZT OVP comparator when the ZT pin voltage > VZTL after tZTMASK has elapsed from
A.
C: B is detected consecutively in three occurrences, the timer tMASK starts operating.
D: Switching is stopped by ZT OVP when pulsing continues for tMASK
.
E: Switching starts again after tZTOVP has elapsed.
ZT OVP voltage setting procedure is as follows.
푁
푁
ꢒ
ꢒ
푉푂ꢂꢐ = ꢑ푁 ꢓ × 푉푏 = ꢑ푁 ꢓ × {푉푍푇 × (푅푍푇ꢃ ꢎ 푅푍푇ꢔ)/푅푍푇ꢔ ꢎ 푅푍푇ꢃ × ꢄ푍푇}
ꢈ
ꢈ
Where:
푉 is the auxiliary winding voltage
푏
푅푍푇ꢃ is the ZT upper resistor
푅푍푇ꢔ is the ZT lower resistance
ꢅ푏/ꢅ푠 is the transformer winding number ratio (secondary side auxiliary winding)
ꢄ푍푇 is the ZT inflow current
푉푂ꢂꢐ is the voltage for which over voltage protection is to be applied on the secondary side
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BM1Q0xxAFJ-LB Series
7.2
Pulse Detection - continued
Because IZT3 (max) = 28 μA when the ZT pin voltage = 5.35 V, the OVP voltage max is as follows:
푁
ꢒ
푉푂ꢂꢐ (max) = ꢑ푁 ꢓ × {5.3 × (푅푍푇ꢃ ꢎ 푅푍푇ꢔ)/푅푍푇ꢔ ꢎ 푅푍푇ꢃ × 28 µ퐴}
ꢈ
RZT1 setting is determined by the AC voltage compensation function in (5.3). RZT2 setting is calculated by the
following equation.
푁
ꢒ
푅푍푇ꢔ = 푉푍푇푂ꢂꢐ × 푅푍푇ꢃ/{푉푂ꢂꢐ × ꢑ푁 ꢓ − ꢄ푍푇 × 푅푍푇ꢃ − 푉푍푇푂ꢂꢐ
}
ꢈ
8
Overload Protection Function (FB Over Limited Protection)
The overload protection function operates in auto restart mode. This function monitors the overload status of the
secondary side output current with the FB pin and fixes the OUT pin to L in the event of an overload condition. In the
overload condition, no current flows to the photocoupler, and the FB pin voltage rises. If this condition persists for a
tFOLP period, it is judged as an overload condition and the OUT pin is fixed to L. The overload protection timer is reset
when the FB pin voltage exceeds VFOLP1 and then drops below VFOLP2 in tFOLP
.
At startup, the FB pin voltage is pulled up by a resistor to the internal voltage, so it operates from a voltage equal to or
higher than VFOLP1. Therefore, the FB pin must be designed to be less than or equal to VFOLP2 within tFOLP. In other words,
the start time of the secondary output voltage should be set within tFOLP after the IC is activated.
After the overload is detected, tOLPST is stopped, and then auto restart is performed. In this case, perform a soft start.
When stopped, the VCC pin voltage drops, but the VCC pin voltage is charged by starter circuit so that the VCC pin
voltage > VUVLO2 is kept.
VFOLP1
FB Pin
Voltage
VCC Charge
tFOLP
tFOLP
Switching
tOLPST
tOLPST
VUVLO1
VCHG2
VCHG1
VUVLO2
VCC Pin
Voltage
ON
OFF
FB OLP
C
G
H
A
B
D
E
F
Figure 23. Overload Protection Auto Restart
A: FB OLP comparator detects an overload because the FB pin voltage > VFOLP1
.
B: If the status of A lasts for tFOLP period, switching is stopped by overload protection.
C: When switching is stopped due to overload protection, if the VCC pin voltage drops to the VCC pin voltage < VCHG1
the VCC charge function operates and the VCC pin voltage rises.
,
D: The VCC charge function stops when the VCC pin voltage > VCHG2 due to the VCC charge function.
E: When tOLPST elapses from B, switching starts with a soft start operation.
F: If the overload condition persists, the FB pin voltage > VFOLP1 status continues and switching is stopped after tFOLP
period from E.
G: When switching is stopped and the VCC pin voltage drops to the VCC pin voltage < VCHG1, the VCC charge function
operates and the VCC pin voltage rises.
H: The VCC charge function stops when the VCC pin voltage > VCHG2 due to the VCC charge function.
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BM1Q0xxAFJ-LB Series
Description of Blocks - continued
9
The CS Pin Open Protection
When the CS pin is turned open, a CS pin open circuit is built-in to prevent the OUT pin from malfunctioning due to
noises. This function stops switching the OUT pin when the CS pin is open. (Auto restart protection)
VCC OVP
POUT
S
R
Q
PRE
Driver
OUT
FBOLP_OH AND
5
NOUT
VREF
Pulse OFF
1MΩ
+
-
CURRENT SENSE
(V-V Change)
Normal : ×1.0
CS
Leading Edge
Blanking
3
RS
Figure 24. CS Open Protection Circuit
10
The OUT Pin Clamping Function
Clamps the H level of the OUT pin to VOUTH to protect the external MOSFET. This function prevents MOSFET gate
breakage due to increasing the VCC pin voltages. This is shown in Figure 25. The OUT pin has a RPDOUT pull down
internally.
VCC
6
Clamp
Circuit
POUT
OUT
CS
PRE
Driver
5
3
NOUT
RS
Figure 25. OUT Pin Clamp Circuit
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BM1Q0xxAFJ-LB Series
Operation Mode of the Protection Function
Table 2 shows the operation modes of the protective functions.
Table 2. Operation Modes of Protection Circuit
Protective Operation Mode
Parameter
VCC UVLO
VCC OVP
FB OLP
CS Open Protection
ZT OVP
VCC Charge Function
BM1Q002AFJ-LB
Auto Restart
Latch
BM1Q021AFJ-LB
Auto Restart
Auto Restart
Auto Restart
Auto Restart
Auto Restart
Auto Restart
Auto Restart
Auto Restart
Latch
Auto Restart
Thermal Dissipation
Operate under the following conditions in thermal design.
(The following temperatures are guaranteed temperatures. Be sure to consider such as a margin.)
1. The ambient temperature Ta must be 105 °C or below.
2. The power dissipation of the IC is below or equal to the power dissipation Pd.
Thermal derating characteristics are shown in Figure 26.
(At mounting on a glass epoxy single layer PCB which size is 74.2 mm x 74.2 mm x 1.6 mm)
1.0
0.8
0.6
0.4
0.2
0.0
0
25
50
75
100
125
150
Ta [ºC]
Figure 26. SOP-J7S Thermal Dissipation Characteristics
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BM1Q0xxAFJ-LB Series
Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
Conditions
Maximum Applied Voltage 1
Maximum Applied Voltage 2
Maximum Applied Voltage 3
Maximum Applied Voltage 4
Power Dissipation
OUT Pin Out Peak Current1
OUT Pin Out Peak Current2
ZT Pin Maximum Current
Maximum Junction Temperature
Storage Temperature Range
VMAX1
VMAX2
VMAX3
VMAX4
Pd
IOH
IOL
ISZT
Tjmax
Tstg
-0.3 to +32.0
-0.3 to +6.5
-0.3 to +15.0
-0.3 to +650
0.67
V
V
V
V
W
A
VCC pin
CS pin, FB pin
OUT pin
VH pin
(Note 1)
-0.5
1.0
±3.0
150
A
mA
°C
°C
-55 to +150
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between
pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the
absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties
of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing board size and
copper area so as not to exceed the maximum junction temperature rating.
(Note 1)
At mounted on a glass epoxy single layer PCB (74.2 mm x 74.2 mm x 1.6 mm). Derate by 5.4 mW/°C if the IC is used in the ambient temperature 25 °C or
above.
Recommended Operating Conditions
Parameter
Symbol
Min
8.9
Typ
-
Max
26.0
Unit
V
Conditions
VCC pin voltage
VH pin voltage
Operating Power Supply
Voltage Range 1
Operating Power Supply
Voltage Range 2
VCC
VH
-0.3
-40
-
-
+650
+105
V
Operating Temperature
Topr
°C
Electrical Characteristics (VCC = 15 V, Ta = 25 °C, Unless Otherwise Specified)
Parameter
[Circuit Current]
Symbol
Min
Typ
Max
Unit
Conditions
FB pin voltage = 2.0 V
(At switching operation)
FB pin voltage = 0.5 V
(At switching operation OFF)
VCC pin voltage = 12 V,
VH open
Current at Switching Operation
Current at Burst Operation
ION1
ION2
-
-
600
350
1000
450
µA
µA
Circuit Current (OFF)
IOFF
-
-
25
µA
VCC UVLO = disable
[VH Pin Starter Circuit]
VH Start Current 1
VH Start Current 2
ISTART1
ISTART2
0.4
1.0
0.7
3.0
1.0
6.0
mA
mA
VCC pin voltage = 0 V
VCC pin voltage = 10 V
After releasing VCC UVLO
VH pin inrush current
VH OFF Current
ISTART3
VSC
-
10
20
µA
V
VH Start Current Switched
Voltage
0.40
0.80
1.40
VCC pin
[VCC Pin Protective Function]
VCC UVLO Voltage 1
VCC UVLO Voltage 2
VCC UVLO Hysteresis
VUVLO1
VUVLO2
VUVLO3
12.50
7.50
-
13.50
8.20
5.30
14.50
8.90
-
V
V
V
At VCC pin rising
At VCC pin falling
VUVLO3 = VUVLO1 - VUVLO2
Starter circuit operating
voltage
VCC Recharge Start Voltage
VCHG1
7.70
8.70
9.70
V
VCC Recharge End Voltage
VCC OVP Voltage 1
VCHG2
VOVP1
12.00
26.00
13.00
27.50
14.00
29.00
V
V
Stop voltage from VCHG1
At VCC pin voltage rising
At VCC pin voltage falling
(BM1Q021AFJ-LB only)
VCC OVP Voltage 2
VOVP2
VOVP3
-
-
23.50
4.00
-
-
V
V
VCC OVP Hysteresis
[OUT Pin]
(BM1Q021AFJ-LB only)
IO = -20 mA,
VCC pin voltage = 15 V
OUT Pin H Voltage
VOUTH
10.5
12.5
14.5
V
OUT Pin L Voltage
OUT Pin Pull Down Resistor
VOUTL
RPDOUT
-
75
-
0.30
125
V
kΩ
IO = +20 mA
-
100
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BM1Q0xxAFJ-LB Series
Electrical Characteristics (VCC = 15 V, Ta = 25 °C, Unless Otherwise Specified) - continued
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
[DC/DC Converter Unit (Turn OFF)]
FB Pin Pull Up Resistor
CS Over Current Detection
Voltage 1A
CS Over Current Detection
Voltage 1B
RFB
22.5
30.0
37.5
kΩ
V
-
FB pin voltage = 2.2 V
(ACSNS = L) (Note 1)
FB pin voltage = 2.2 V
(ACSNS = H)
FB pin voltage = 0.5 V
(ACSNS = L)
VLIM1A
0.475
0.500
0.525
VLIM1B
VLIM2A
0.310
0.100
0.350
0.125
0.390
0.150
V
V
CS Over Current Detection
Voltage 2A
CS Over Current Detection
Voltage 2B
FB pin voltage = 0.5 V
(ACSNS = H)
ACSNS = L
VLIM2B
AVCS1
AVCS2
0.062
3.40
4.86
0.088
4.00
5.71
0.113
4.60
6.57
V
V/V
V/V
Voltage Gain 1 (⊿VFB/⊿VCS)
ACSNS = H
Voltage Gain 2 (⊿VFB/⊿VCS)
CS Switched ZT Current 1
CS Switched ZT Current 2
CS Switched ZT Current
Hysteresis
CS Leading Edge Blanking
Times
IZT1
IZT2
0.93
0.82
1.00
0.90
1.07
0.98
mA
mA
-
-
-
IZTHYS
tLEB
-
-
-
0.10
0.25
0.15
-
-
-
mA
µs
-
At PULSE is applied to the
Turn OFF Time
tOFF
µs
CS pin
tLEB + tOFF
-
Minimum ON Width
Maximum ON Width
tMIN
tMAX
-
0.40
39.0
-
µs
µs
30.0
50.7
[DC/DC Converter Unit (Turn ON)]
OUT pin voltage = L
ZT pin voltage = 4.65 V
OUT pin voltage = L
ZT pin voltage = 5.00 V
OUT pin voltage = L
ZT pin voltage = 5.35 V
ZT Inrush Current 1
ZT Inrush Current 2
ZT Inrush Current 3
IZT1
IZT2
4
6
14
16
24
26
µA
µA
µA
kHz
kHz
V
IZT3
8
18
28
Maximum Operating Frequency
1
Maximum Operating Frequency
2
Frequency Reduction Start FB
Voltage
fSW1
108
21
120
30
132
39
FB pin voltage = 2.0 V
fSW2
FB pin voltage = 0.5 V
-
VFBSW1
VFBSW2
1.10
0.42
1.25
0.50
1.40
0.58
Frequency Reduction End FB
Voltage
-
V
ZT Comparator Voltage 1
ZT Comparator Voltage 2
VZT1
VZT2
60
120
100
200
140
280
mV
mV
At ZT pin voltage falling
At ZT pin voltage rising
OUT pin voltage H→L,
Prevent noise
ZT Trigger Mask Time
tZTMASK
-
0.6
-
µs
Operation without bottom
detection
Count from final bottom
ZT Trigger Timeout Time 1
tZTOUT1
tZTOUT2
10.5
3.5
15.0
5.0
19.5
6.5
µs
µs
ZT Trigger Timeout Time 2
[DC/DC Protective Function]
Soft Start Time 1
Soft Start Time 2
Soft Start Time 3
tSS1
tSS2
tSS3
tSS4
VBURST
0.35
0.70
1.40
2.80
0.42
0.50
1.00
2.00
4.00
0.50
0.65
1.30
2.60
5.20
0.58
ms
ms
ms
ms
V
-
-
-
Soft Start Time 4
FB Burst Voltage
-
Burst ON
FB OLP detection
(At FB pin voltage rising)
FB OLP detection
(At FB pin voltage falling)
-
FB OLP Voltage 1
FB OLP Voltage 2
VFOLP1
VFOLP2
2.6
-
2.8
2.6
3.0
-
V
V
FB OLP Detection Timer
FB OLP Stop Timer
Latching Release Voltage
(VCC Pin Voltage)
Latch Mask Time
ZT OVP Voltage
tFOLP
tOLPST
44.8
358
64.0
512
VUVLO2
0.50
100
83.2
666
ms
ms
-
–
VLATCH
-
-
V
BM1Q002AFJ-LB only
BM1Q002AFJ-LB only
tLATCH
VZTL
tZTOVP
50
4.65
358
200
5.35
666
µs
V
ms
5.00
512
ZT OVP Stopping Timer
BM1Q021AFJ-LB only
(Note 1) ACSNS is defined. (L: ZT pin current < IZT1, H: ZT pin current > IZT1
)
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BM1Q0xxAFJ-LB Series
Typical Performance Curves (Reference Data)
1,000
900
800
700
600
500
400
300
200
450
430
410
390
370
350
330
310
290
270
250
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
Figure 27. Current at Switching Operation vs Temperature
Figure 28. Current at Burst Operation vs Temperature
15.00
14.50
14.00
13.50
13.00
12.50
12.00
9.20
9.00
8.80
8.60
8.40
8.20
8.00
7.80
7.60
7.40
7.20
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
Figure 29. VCC UVLO Voltage 1 vs Temperature
Figure 30. VCC UVLO Voltage 2 vs Temperature
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BM1Q0xxAFJ-LB Series
Typical Performance Curves - continued
(Reference Data)
14.00
13.80
13.60
13.40
13.20
13.00
12.80
12.60
12.40
12.20
12.00
9.70
9.50
9.30
9.10
8.90
8.70
8.50
8.30
8.10
7.90
7.70
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
Figure 32. VCC Recharge End Voltage vs Temperature
Figure 31. VCC Recharge Start Voltage vs Temperature
24.0
23.9
23.8
23.7
23.6
23.5
23.4
23.3
23.2
23.1
23.0
29.0
28.5
28.0
27.5
27.0
26.5
26.0
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
Figure 34. VCC OVP Voltage 2 vs Temperature
Figure 33. VCC OVP Voltage 1 vs Temperature
.
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BM1Q0xxAFJ-LB Series
Typical Performance Curves - continued
(Reference Data)
4.6
4.4
4.2
4.0
3.8
3.6
3.4
0.525
0.515
0.505
0.495
0.485
0.475
-40 -20
0
20
40
60
80 100 120
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
Temperature: Ta [°C]
Figure 35. CS Over Current Detection Voltage 1A vs
Temperature
Figure 36. Voltage Gain 1 (⊿VFB/⊿VCS) vs Temperature
6.46
6.26
6.06
5.86
5.66
5.46
5.26
5.06
4.86
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
-40 -20
0
20
40
60
80 100 120
Temperature: Ta [°C]
Figure 38. Minimum ON Width vs Temperature
Figure 37. Voltage Gain 2 (⊿VFB/⊿VCS) vs Temperature
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BM1Q0xxAFJ-LB Series
Typical Performance Curves - continued
(Reference Data)
50
48
46
44
42
40
38
36
34
32
30
128
126
124
122
120
118
116
114
112
110
108
-40 -20
0
20
40
60
80 100 120
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
Temperature: Ta [°C]
Figure 40. Maximum Operating Frequency 1 vs Temperature
Figure 39. Maximum ON Width vs Temperature
40
140
130
120
110
100
90
38
36
34
32
30
28
26
24
22
20
80
70
60
-40 -20
0
20
40
60
80 100 120
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
Temperature: Ta [°C]
Figure 42. ZT Comparator Voltage 1 vs Temperature
Figure 41. Maximum Operating Frequency 2 vs Temperature
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BM1Q0xxAFJ-LB Series
Typical Performance Curves - continued
(Reference Data)
280
260
240
220
200
180
160
140
120
20
19
18
17
16
15
14
13
12
11
10
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
-40 -20
0
20
40
60
80 100 120
Temperature: Ta [°C]
Figure 44. ZT Trigger Timeout Time 1 vs Temperature
Figure 43. ZT Comparator Voltage 2 vs Temperature
6.5
6.0
5.5
5.0
4.5
4.0
3.5
0.65
0.60
0.55
0.50
0.45
0.40
0.35
-40 -20
0
20
40
60
80 100 120
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
Temperature: Ta [°C]
Figure 46. Soft Start Time 1 vs Temperature
Figure 45. ZT Trigger Timeout Time 2 vs Temperature
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BM1Q0xxAFJ-LB Series
Typical Performance Curves - continued
(Reference Data)
0.58
0.56
0.54
0.52
0.50
0.48
0.46
0.44
0.42
3.0
2.95
2.9
2.85
2.8
2.75
2.7
2.65
2.6
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
Figure 48. FB OLP Voltage 1 vs Temperature
Figure 47. FB Burst Voltage vs Temperature
3.1
84
3.0
2.9
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
79
74
69
64
59
54
49
44
-40 -20
0
20
40
60
80 100 120
-40 -20
0
20
40
60
80 100 120
Temperature: Ta [°C]
Temperature: Ta [°C]
Figure 50. FB OLP Detection Timer vs Temperature
Figure 49. FB OLP Voltage 2 vs Temperature
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BM1Q0xxAFJ-LB Series
Typical Performance Curves - continued
(Reference Data)
700
650
600
550
500
450
400
350
300
5.35
5.25
5.15
5.05
4.95
4.85
4.75
4.65
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
-40 -20
0
20 40 60 80 100 120
Temperature: Ta [°C]
Figure 52. ZT OVP Voltage vs Temperature
Figure 51. FB OLP Stop Timer vs Temperature
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BM1Q0xxAFJ-LB Series
I/O Equivalence Circuit
1
ZT
2
FB
3
CS
4
GND
Internal
Reg
VCC
VCC
GND
FB
CS
ZT
5
OUT
6
VCC
-
-
7
VH
VCC
VH
VCC
OUT
-
Internal
Block
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BM1Q0xxAFJ-LB Series
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Line
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
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BM1Q0xxAFJ-LB Series
Operational Notes - continued
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
10. Regarding the Input Pin of the IC
This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 53. Example of IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated over current protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BM1Q0xxAFJ-LB Series
Ordering Information
x x A F
J
B M 1 Q 0
-
L B E 2
(VCC OVP)
02: Latch
21: Auto Restart
(ZT OVP)
Latch
Auto Restart
Package
FJ: SOP-J7S
Product Rank
LB: for Industrial Equipment
Packaging and forming specification
E2: Embossed tape and reel
Lineup
Orderable Part Number
BM1Q002AFJ-LBE2
BM1Q021AFJ-LBE2
VCC OVP
Latch
Auto Restart
ZT OVP
Latch
Auto Restart
Package
SOP-J7S
Part Number Marking
1Q02A
1Q21A
Marking Diagram
SOP-J7S (TOP VIEW)
Part Number Marking
LOT Number
Pin 1 Mark
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BM1Q0xxAFJ-LB Series
Physical Dimension and Packing Information
Package Name
SOP-J7S
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BM1Q0xxAFJ-LB Series
Revision History
Date
Revision
001
Changes
New Release
09.Feb.2023
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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