BM1Q104FJ [ROHM]

准谐振控制器型DC/DC转换器ICBM1Q104FJ为所有带插座的产品提供优良的系统。为准谐振动作，实现了软开关，有助于实现低EMI。外接开关MOSFET及电流检测电阻，可实现自由度高的电源设计。本IC内置启动电路，有助于实现低待机功耗和高速启动。轻负载时内置脉冲串功能且IC消耗电流低，因此待机功耗会变小。此外，为了防止变压器的声响，实施了将常规负载时的低频声抑制到一定水平的控制，且内置瞬时短脉冲群蚊音（6kHz～20kHz）抑制功能。本IC内置软启动功能、脉冲串功能、逐周期过电流限制、过电压保护、过负荷保护、CS开路时保护等各种保护功能，安全性优异。;


型号：	BM1Q104FJ
厂家：	ROHM
描述：	准谐振控制器型DC/DC转换器ICBM1Q104FJ为所有带插座的产品提供优良的系统。为准谐振动作，实现了软开关，有助于实现低EMI。外接开关MOSFET及电流检测电阻，可实现自由度高的电源设计。本IC内置启动电路，有助于实现低待机功耗和高速启动。轻负载时内置脉冲串功能且IC消耗电流低，因此待机功耗会变小。此外，为了防止变压器的声响，实施了将常规负载时的低频声抑制到一定水平的控制，且内置瞬时短脉冲群蚊音（6kHz～20kHz）抑制功能。本IC内置软启动功能、脉冲串功能、逐周期过电流限制、过电压保护、过负荷保护、CS开路时保护等各种保护功能，安全性优异。变压器开关控制器软启动脉冲插座转换器
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中文：	中文翻译
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Datasheet

AC/DC Drivers

Quasi-Resonant Control

DC/DC converter IC

BM1Q104FJ

General

Features

Quasi-resonant method

The quasi-resonant controller typed AC/DC converter IC

“BM1Q104FJ" provides an optimum system for all

products that include an electrical outlet. The

quasi-resonant operation enables soft switching and

helps to keep EMI low. As MOSFET for switching and

current detection resistors are external devices, a higher

degree of design freedom is achieved.

IC builds in HV starter circuit that tolerates high voltage,

it contributes to low consumption power and high speed

start. Because IC consumption current is very low and

burst operation in light load, the stand-by power is very

low.

Built-in 650V tolerate start circuit

Low consumption power in light load

Bottom skip control

Sound of transformer reduction function

Harsh sound prevention of transformer function

VCC pin : under voltage protection

Over-current protection (cycle-by-cycle)

OUT pin : H voltage 12.5V clamp

Soft start

ZT trigger mask function

ZT Over voltage protection

IC controls to switch bottom numbers in response to

loads. And IC builds in harsh sound prevention function of

transformer in burst operation.

FB Over Load protection [Auto-restart]

CS pin open protection [Auto-restart]

Because IC builds-in soft-start, burst mode, over current

limiter which is cycle-by-cycle, over load protection, over

voltage protection, CS open protection and so on, IC

provides safety.

Package

SOP-J8 6.00mm×4.90mm×1.65mm pitch:1.27mm

(Typ)

(Max)

(Typ)

Key Specifications

Operating Power Supply Voltage Range:

VCC：14.0V to 30.0V

VH：

to 600V

Operating Current:

Normal： 0.60mA (Typ)

Burst ： 0.37mA(Typ)

-40 to +85deg

Operate temperature range:

Applications

Printer, Copy machine, AC adapter, etc

Application Circuit

Figure 1. Application Circuit

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays

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Absolute Maximum Ratings (Ta=25℃)

Item

voltage range 1

voltage range 2

voltage range 3

voltage range 4

Symbol

Vmax1

Vmax2

Vmax3

Vmax4

I_OUT

Rating

-0.3 ~ 30

-0.3 ~ 6.5

-0.3 ~ 15

-0.3 ~ 650

±0.50

Unit

Condition

VCC

CS, FB

OUT

OUT pin output peak current

ZT pin current

Allowable dissipation

Operating temperature range

Max junction temperature

Storage temperature range

I_SZT

Topr

Tjmax

Tstr

±3.00

0.68 ^(Note1)

-40 ～ +85

150

^oC

-55 ～ +150

(Note 1) When mounted (on 70 mm × 70 mm, 1.6 mm thick, glass epoxy on single-layer substrate).

Reduce to 5.4 mW/°C when Ta = 25°C or above.

Operating Conditions（Ta=25°C）

Parameter

Symbol

VCC

VZT

TRT

Rating

14.0～30.0

80～600

～7.0

Unit

Conditions

Power supply voltage range 1

Power supply voltage range 2

Power supply voltage range 3

Transformer resonant time

VCC

0.5 ～ 4.0

Electrical Characteristics (Unless otherwise noted, Ta = 25°C, VCC = 15 V)

Specifications

Parameter

Symbol

Unit

Conditions

MIN

TYP

MAX

［Circuit current］

VCC=12V

(VCCUVLO active)

Circuit current (OFF)

Circuit current (ON)1

I_OFF

I_ON1

FB=2.0V

(Switching operation)

600

1000

FB=0.3V

(Switching OFF)

FB:OPEN

In Latch stop state

Circuit current (ON)2

I_ON2

370

250

500

400

Circuit current (LATCH)

ILATCH

［VH pin Starter ］

VH Start current1

VH Start current2

I_START1

I_START2

I_START3

0.40

1.00

0.70

3.00

1.00

6.00

VCC=0V

VCC=10V

Released VCCUVLO

VH pin current

VH OFF current

VH start current switched

voltage

V_SC

0.400

0.800

1.400

VCC pin

［VCC pin protection］

VCC UVLO voltage1

VCC UVLO voltage2

VCC UVLO hysteresis

VCC charge start voltage

VCC charge end voltage

V_UVLO1

V_UVLO2

V_UVLO3

V_CHG1

V_CHG2

12.50

7.20

7.70

12.00

13.50

8.20

5.30

14.50

9.20

9.70

14.00

VCC rise

VCC fall

V_UVLO3=V_UVLO1-V_UVLO2

Starter circuit

Stop voltage from V_CHG1

8.70

13.00

VUVLO2

-0.50

100

Latch released voltage

Latch mask time

[ OUT pin ]

VLATCH

TLATCH

200

OUT pin H voltage

OUT pin L voltage

OUT pin Pull-down resistor

V_OUTH

V_OUTL

R_PDOUT

10.5

12.5

100

14.5

0.30

125

kΩ

IO=-20mA VCC=15V

IO=+20mA

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Electrical Characteristics (Unless otherwise noted, Ta = 25°C, VCC = 15 V)

Specifications

Parameter

Symbol

Unit

Conditions

MIN

TYP

MAX

[ DC/DC converter unit （Turn-off）]

Pull-up resistor of FB pin1

Pull-up resistor of FB pin2

RFB1

22.5

RFB1×

0.783

0.475

0.015

5.40

0.25

3.2

VBURST×

1.20

30.0

RFB1×

0.833

0.500

0.050

6.00

37.5

RFB1×

0.883

0.525

0.085

6.60

kΩ

RFB2

In burst operation

CS over current voltage 1A

CS over current voltage 2A

V_lim1A

V_lim2A

AV_CS1

V_BURST

FOSCB

V/V

FB=3.2V

FB=0.3V

⊿

Voltage gain1（ VFB/ VCS）

FB Burst voltage

0.30

4.0

0.35

4.8

Max burst frequency

FB pull-up resistor changed

voltage

kHz

VBURST× VBURST×

VBSTCH

1.33

1.42

CS Leading Edge Blanking

time

T_LEB

0.25

Turn-off time

Minimum ON width

Maximum ON width

T_OFF

T_min

T_max

0.25

0.50

39.0

When applied pulse

T_LEB＋T_OFF

30.0

50.7

[ DC/DC converter unit （Turn on）]

On – Off time switched Bottom count

On Off time switched bottom12

On Off time switched bottom23

On Off time switched bottom34

On Off time switched bottom45

On Off time switched bottom21

On Off time switched bottom32

On Off time switched bottom43

On Off time switched bottom54

ZT comparator voltage1

ZT comparator voltage2

ZT comparator hysteresis

ZT trigger mask time

ZT Timeout

T1_BTM12

T1_BTM23

T1_BTM34

T1_BTM45

T1_BTM21

T1_BTM32

T1_BTM43

T1_BTM54

V_ZT1

V_ZT2

V_ZTHYS

T_ZTMASK

T_ZTOUT

8.10

7.20

6.13

9.00

8.00

7.00

9.90

8.80

7.88

Bottom 1 →2

Bottom 2 →3

Bottom 3 →4

Bottom 4 →5

Bottom 2 →1

Bottom 3 →2

Bottom 4 →3

Bottom 5 →4

ZT fall

5.25

6.00

6.75

12.60

10.53

9.00

7.74

120

1.0

10.5

14.00

11.70

10.00

8.60

100

200

100

2.0

15.40

12.87

11.00

9.46

140

280

ZT rise

3.0

19.5

OUT H ->L prevent noise

Count from last bottom

15.0

[ DC/DC Protection]

Soft start time

CS pull-up resistor

FB OLP voltage a

T_SS

R_CS

V_FOLP1A

2.80

0.70

3.20

4.00

1.00

3.40

5.20

1.30

3.60

MΩ

FBOLP detect（FB rise）

FBOLP detect（FB fall）

VFOLP1A

×0.94

64.0

512

3.500

FB OLP voltage b

V_FOLP1B

FB OLP delay timer

FBOLP stop timer

ZT OVP voltage

T_FOLP

T_OLPST

V_ZTL

44.8

358

3.325

83.2

666

3.675

*3 Because RFB1 and RFB2 are reacted, RFB1 is always larger than RFB2.

*4 Because VBURST and VBSTCH are reacted, VBURST is always smaller than VBSTCH.

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Pin Layout

Table 1 input-output PIN function

Function

ESD Diode

GND

NO.

Pin Name

I/O

VCC

GND

OUT

VCC

N.C.

Zero current detect pin

Feedback signal input pin

Primary current sensing pin

GND pin

External MOS drive pin

Power supply pin

○

I/O

Non Connection

Starter circuit pin

○

4 . 9 ±0 . 2

MAX 5.25 ( include BURR)

External Dimensions

1Q001

1Q104

Lot No.

0 . 2 ±0 . 1

1.27

1 . 2 7

0 . 4 2 ±0 . 1

(Unit:mm)

Figure 2. SOP-J8 External Dimensions

I/O Equivalent Circuit Diagram

Figure 3. I/O Equivalent Circuit Diagram

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Block Diagram

FUSE

Diode

Bridge

Filter

Starter

12 V Clamp

Circuit

When NOUT=H,

turn ON

4.0 V Regulator

13.0V/8.7V

13.5V/8.2V

Internal regulator(4V)

SystemEN

LATCH

LOGIC

100us

filter

BTM1

Bottom

number

control

BTM2

BTM3

BTM4

3.5V

BTM5

decoder

Bottom

Number

counter

NOUT

AND

ERROR

AMP

SystemEN

CNTUP CNTDN

ONOFF

time

BTM1

BTM2

BTM3

BTM4

BTM5

100mV

/200mV

1shot

AND

PGATE

PRE

Driver

comparator

ZT trigger

mask time

ZT timeout

15us

NGATE

NOUT

FBOLP_OH

MAXON_OH

30k/25k

Max ON

time

AND

Burst

NOUT

Counter

4kHz

SystemEN

CSLIM

OSC

LOGIC

0.30V

Stop

Timer

(512ms)

Delay

Timer

(64ms)

1MΩ

OSC(65kHz)

FBOLP_OH

OSC

3.4 V /3.2V

OSC

300kΩ

1/6＊FB

60kΩ

⊿ CS / ⊿ FB Gain setting

TOTAL : 1/6 Normal

1/10softstart

0.50V

Leading Edge

Blanking

SS4ms

Soft Start

System_ EN

Figure 4. Block Diagram

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Description of Each Blocks

1.Starter circuit VH pin（8pin）

IC builds in Start circuit (tolerates 650V) to VH pin (8pin). It enables to be low standby power and high speed start.

After starting IC, consumption current is decided by idling current I_START3（typ=10uA） only from VH pin(8pin).

The start time is changed by capacitor value of VCC pin(6pin).

Reference values of start time are shown in Figure 7.

Figure 5. Starter Block

VCC Capacitor value – startup time

VCC Capacitor value [uF]

Figure 6. Start Up Current – VCC voltage

*Start up current is flowed from VH pin (8Pin).

Figure 7. Start Up Time（example）

ex) power consumption of starter circuit only

Vac=100V Power＝100V*√2*10uA=1.41mW

Vac=240V Power＝240V*√2*10uA=3.38mW

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2. Start sequence （Soft start、light load operation、Auto recovery of over load protection）

IC start sequences are shown in Figure 8. About each detail, explain in each section.

VH(8pin)

13.0V

13.5V

VCC(6pin)

VCC=8.7V

Internal REF

Pull Up

64ms

512ms

64ms

3.4V

FB(2pin)

Vout

Over Load

NormalLoad

Light LOAD

Burst mode

Iout

Switching

Soft

Start

B C

GH I

Figure 8. Start sequence time chart

A: Input voltage from AC voltage is supplied to VH pin(8pin).

B: VCC （6pin） voltage is rise. When VCC＞V_UVLO1（typ=13.5V）, IC starts to operate.In case of protection function is no

active,IC starts to switching operation.

Then, VCC pin voltage is dropped in cause of VCC (6pin) consumption current.In case of VCC< V_CHG1（typ=8.7V）, starter

circuit operates, IC starts to charge VCC pin.

After starting of charge, IC continues to charge until VCC > V_CHG1（typ=13.0V）.

C: There is a soft start function that regulates the CS peak voltage level at to prevent a rise in voltage and current

redundantly.

D: When the switching operation starts, “VOUT” which is secondary output voltage rises.

After start switching operation, the output voltage is necessary to set to be stable within the T_FOLP(typ=64ms) period

E: The burst operation is operated to keep power consumption down in light load,.

F: When it is heavy load, FB pin voltage(2pin) is larger than V_FOLP1A(typ=3.4V), because output voltage is down.

G: When the FB pin(2pin) voltage keeps V_FOLP1A(typ=3.4V) or above for T _FOLP(64ms typ), the switching operation is

stopped by the over load protection for T_OLPST(typ=512ms).

When the FB pin(2pin) voltage does not keep V_FOLP1B(typ=3.2V) or above for T

T_FOLP(typ=64ms) is reset.

(64ms typ), the timer of

FOLP

H: When VCC voltage（6pin） is less V_CHG1（typ=8.7V）, starter circuit starts to charge VCC pin(6pin) to operate starter circuit.

I: When VCC voltage (6pin) is above V_CHG2（typ =13.0V）,starter circuit stops to charge VCC pin(6pin).

J: The same as F.

K: The same as G.

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3. VCC pin (6pin) protection function

IC is built in VCC UVLO（Under Voltage Protection） function and VCC charge function.

VCC UVLO function is the protection when VCC (6pin) voltage is low.

VCC UVLO function is for preventing MOSFET for switching from destroying when VCC pin voltage is low.

VCC charge function is for settling secondary output voltage in VCC pin voltage low, as starter circuit charge VCC pin from

VH line.

(1) VCC UVLO

VCC UVLO is auto recovery typed protection that has voltage hysteresis,

In Figure 9, it is shown the operation.

VCCuvlo1=13.5Vtyp

VCCchg2=13.0Vtyp

VCCchg1=8.7Vtyp

VCCuvlo2= 8.2Vtyp

OFF

Figure 9. VCC UVLO Timing chart

A: VH (8pin) pin voltage is applied, VCC (6pin) voltage starts rising.

B: When VCC pin (6pin) voltage >VUVLO1, the VCC UVLO function is released and DC/DC operation starts.

C: VCC (6pin) voltage < V_CHG1,VCC charge function operates and the VCC (6pin) voltage rises.

D: VCC (6pin) voltage> V_CHG2,VCC charge function stops.

E: The same as C.

F: The same as D.

G: The same as C.

H: High voltage line “VH” is down.

I: VCC < V_UVLO2,VCC UVLO function is operated.

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(2)VCC charge function

Once VCC (6pin) pin voltage > V_UVLO1,IC start to operate. After that, when VCC pin voltage < V_CHG1, VCC charge

function is active. Then starter circuit operates charge from VH line to VCC (6pin). A malfunction for start-up does not

occur. The operation is shown to Figure 10.

Figure 10. VCC pin charge operation

A: As VH pin voltage（8pin）is rising, IC is started to charge to VCC(6pin) by VCC charge function.

B: When VCC pin （6pin） voltage > V_UVLO1,VCC UVLO function is released, VCC charge function is stopped,

DC/DC operation starts.

C: VCC (6pin) voltage drops on starting because OUTPUT voltage is low.

D: VCC （6pin） voltage < V_CHG1,VCC pin(6pin) voltage rises to start by VH charge.

E: VCC （6pin） voltage > V_CHG2,VCC charge stops.

F: VCC （6pin） voltage < V_CHG1,VCC pin (6pin) voltage rises to restart by VH charge.

G: VCC （6pin） voltage > V_CHG2,VCC charge function stops.

H: OUTPUT voltage is stable. Then, VCC pin (6pin) voltage is stable for charging from the auxiliary coil to VCC

pin(6pin).

Care) As VCC pin voltage range must be set over VCHG2(Max=14.0V), the auxiliary winding is set.

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4. DC/DC driver

BM1Q104FJ operates on PFM (Pulse Frequency Modulation) mode method.

By monitoring FB pin(2pin) and ZT pin (1pin), CS pin(3pin), the IC supply optimum system for quasi-resonant operation.

The IC controls ON width (Turn Off) of external MOSFET by FB pin(2pin) and CS pin(3pin). The IC controls OFF width

(Turn ON) of external MOSFET by ZT pin（1pin）. The detail is shown below.（Refer to Figure 11.）

Figure 11. DC/DC Operation Block

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(1) Determination of ON width（Turn OFF）

The ON width is controlled by FB pin(2pin), CS pin(3pin).

As FB voltage divided by AV_CS1(typ=6) and CS pin voltage are compared, the IC decides ON width.

CS comparator level is changed lineally to be shown in Figure 12.

CS (3pin) is built in over current limiter circuit per pulse. IC set over current limiter level by FB (2pin) voltage.

・FB voltage < 0.3V : Burst operation.

・0.3V < FB voltage < 3.4V : ⊿CS/FB gain = 1/AVCS1(typ=6) =1/6 operation

・3.4V < FB voltage : Over load operation（To detect over load state, IC is stopped switching）

Figure 12. FB pin voltage - over current limiter characteristics

[gain=1/6 setting]

When soft-start operation is done, CS over current protection voltage is adjusted over current detection level.

Vlim1 on soft-start are changed to show below.

Table2 Over current detection voltage Detail

Softstart

start ～4ms

4ms～

Vlim1

0.300V(60%)

0.500V(100%)

(2) LEB（Leading Edge Blanking） function

When a MOSFET for switching is turned ON, surge current occurs in cause of capacitance or rush current.

Therefore, CS (3pin) voltage rises temporarily, and over current limiter circuit may miss detections.

To prevent miss detections, the IC builds in Leading edge blanking function which mask CS detection for

T_LEB（typ=250ns） from switching OUT pin(5pin) from L to H. This blanking function enables to reduce noise filter

of CS pin(3pin).

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(3) Determination of OFF width（Turn on）

OFF width is controlled at the ZT pin.

When switching is OFF, the power stored in the primary-side winding is supplied to the secondary-side output capacitor.

When the power had supplied, there is no more current flowing to the secondary side output capacitor, the drain pin

voltage of switching MOSFET drops. After that, resonant operation starts. Consequently, the voltage on the auxiliary

winding also starts it.

ZT pin voltage was applied the voltage resistance-divided by Rzt1 and Rzt2.

When ZT pin voltage level drops to V_ZT1(typ=100mV) or below, IC detects it as the bottom of resonant. When bottom

count is up to certain count, MOSFET is turned ON by the ZT comparator. Since zero current detection time is adjusted at

Czt, Rzt1 and Rzt2 of the ZT pin in Figure 4.

Additionally, a ZT trigger mask function (described in section 4-6) and a ZT timeout function (described in section 4-7) are

built in ZT pin. It shows about certain bottom count below.

It explains below about constant bottom numbers.

The IC changes a bottom number in response of loads. The bottom number is decided by a charge and discharge time.

The charge and discharge waveform is shown in Figure 13. The charge and discharge time – bottom numbers are shown

in table-3. The bottom number for charge and discharge time and switching example for loads are shown in Figure 14.

Switching frequency = 1/ { charge and discharge time + (Bottom count -1) ×resonant time + 1/2 * resonant time}

Resonant time

= 2×π×√(Lp×Cds)

* Lp : primary inductance value, Cds : Capacitance of MOSFET between drain and source.

Figure 13. charge/discharge time of transformer- Bottom time

Table 3-1 Bottom count – ON OFF width table

(Load increasing)

Table 3-2

Bottom count – ON OFF width table

(Load decreasing)

Bottom

Charge/discharge time[us]

～ 9.0

Bottom

Charge/discharge time[us]

～ 8.6

8.0 ～ 9.0

8.6 ～ 10.0

10.0 ～ 11.7

11.7 ～ 14.0

14.0 ～

7.0 ～ 8.0

6.0 ～ 7.0

～ 6.0

Bottom

number

160

140

120

100

Load increases

負荷増加時

Load decreases

負荷減少時

0.0

20.0

40.0

60.0

出力電力Po[W]

80.0

100.0

Charge/dis-

charge time [us]

OUTPUT power Po[W]

Figure 14-1. Output power–Switching frequency

Figure 14-2. Charge/discharge time–bottom number

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(4) A harsh sound reduction function in burst operation

When FB pin voltage(2pin) is lower than VBURST(typ=0.3V), IC stops switching for burst operation.

IC built in a harsh sound reduction function to reduce harsh sound of transformer (10kHz ～20kHz) in burst operation.

The burst frequency is not operated ranged from 10kHz to 20kHz.The operation is shown in Figure 15.

By the function, the base frequency spectrum is not from 10kHz to 20kHz.For that, harsh sound is reduced.

The operation is shown in Figure 15. about burst frequency.

Figure 15. Switching waveform in burst operation

A: Because the output load is light, FB pin voltage drops. When FB pin voltage < VBURST(typ=0.3V),

IC stops switching operation.

B: IC starts switching because the FB pin voltage > VBURST(typ=0.3V) after 250us(4kHz) from start switching.

C: When FB pin voltage < VBURST(typ=0.3V), IC stops switching.

D: FB pin voltage > VBURST(typ=0.3V). Because it does not pass 250us(F=4kHz) from B period, IC does not operate

switching.

E: Because it passes 250us from previous burst-start, IC starts switching.

F: When FB pin voltage < VBURST(typ=0.3V), IC stops switching.

G: When FB pin voltage < VBURST(typ=0.3V), IC stops switching.

H: After it past 250us from previous switching start, FB pin voltage rises VBURST(typ=0.3V), IC starts switching.

I: IC stops switching because FB <VBURST(typ=0.3V).

J: Though it past 250us from H, IC does not operate switching for FB voltage < VBURST(typ=0.3V).

K: IC starts switching operation to be FB pin voltage > VBURST(typ=0.3V).

L: IC stops switching operation to be FB pin voltage < VBURST(typ=0.3V).

M: Though it past 250us from K, IC does not operate switching for FB voltage < VBURST(typ=0.3V).

N: IC starts switching operation because FB pin > VBURST(typ=0.3V).

When harsh sound reduction function operates, the burst frequency is operated in Figure 16.

Figure 16. Burst frequency operation

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(5) Gain up function in burst operation

When FB pin is lower than VBURST(typ=0.3V), IC stops switching operation by burst function. IC builds in gain up

function for preventing harsh sound of transformer and reducing output voltage ripple. The function operates that FB pin

pull-up resistor is switched between RFB1(typ=30kΩ) and RFB2(typ=25kΩ).

Because IC is changed the DC/DC gain, when DC/DC application oscillates in burst operation released, FB pin

capacitor may be larger. By the function, FB voltage speed is faster near load of burst operation. When FB pin voltage is

larger than VBSTCH(typ=0.4V), the gain up function is released. Figure 17. shows the operation.

Figure 17. Gain up function in burst operation waveform

A: The load is light. When FB pin voltage is lower than VBURST(typ=0.3V), IC stops switching operation.

Then FB pin pull-up resistor changes from RFB1(typ=30kΩ) to RFB2(typ=25kΩ).

B: Because the output voltage is lower than regulation voltage, FB pin voltage rises.

C: When FB voltage is larger than VBSTCH(typ=0.4V), FB pull-up resistor changes from RFB2(typ=25kΩ) to RFB1(typ=30k

Ω),the gain up function is released.

D: After harsh sound reduction function is released, IC starts switching operation.

E: The load is light. When FB pin voltage is lower than VBURST(typ=0.3V), IC stops switching operation.

Then FB pin pull-up resistor changes from RFB1(typ=30kΩ) to RFB2(typ=25kΩ).

F: When FB voltage is larger than VBSTCH(typ=0.4V), FB pull-up resistor changes from RFB2(typ=25kΩ) to RFB1(typ=30k

Ω),the gain up function is released.

(6) ZT trigger mask function（Figure 18.）

When MOSFET turns from ON to OFF, turn off noise may occur at the ZT pin.

Then, the ZT comparator and ZTOVP comparator are masked for the T_ZTMASK(typ=2.0us) time to prevent ZT

comparator miss-detectection.

Figure 18. ZT trigger mask function waveform

A: DCDC OFF=> ON

B: DCDC ON=> OFF

C: IC masks ZT pin action for TZTMASK(typ=2.0us) to occur the noise at ZT pin.

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(7) ZT timeout function （Figure 19.）

After ZT comparator detects bottom, when ZT pin does not detect next bottom within T_ZTOUT（typ =15us）,

IC turns on MOSFET by force.

When secondary output voltage is low such as start-up, the voltage on the auxiliary winding “VA” is also low.

Then ZT pin (1pin) voltage is low than V_ZT2(typ =200mV).In that case, the function is operated.

Figure 19. ZT timeout function

A: ZT ＜ V_ZT1,IC turns ON operation to detect bottom.

B: DC/DC ON=>OFF. For the state of ZT > V_ZT2(typ=200mV), the timeout function is no operation.

C: Because the surge noise occurs to ZT pin, IC does not have no operation ZT comparator for T_ZTMASKtime.

D: ZT ＜ V_ZT1,IC turns ON to detect bottom.

E: DC/DC ON=>OFF. Then ZT < VZT2.

F: For ZT < VZT2, the timeout function starts to operate at the time.

G: The timeout operation continues for ZT < VZT2.

H: Since ZT pin voltage is lower than VZT1 for T_ZTOUT, IC turns ON by force by timeout function.

5.Soft start sequence

Normally, when AC voltage is applied, a large current flows. Then secondary output voltage and current is occurred

overshoot.

For preventing it, IC built in soft-start function.

When VCC pin(6pin) voltage is lower than V_UVLO2（typ =8.2V）, IC is reset. After that, when AC voltage is applied, IC

operates soft-start.

The soft start operation is shown below: （ Please refer to (4-1) turn off item.）

・start ～ 4.0ms

・4.0ms～

=> Set CS limiter to 60% of normal operation.

=> normal operation.

6.ZT pin (1pin) OVP (Over Voltage Protection)

OVP function is built at ZT pin(1pin). The protection method is latched type.

IC built in TLATCH(typ=100us) timer to prevent ZT OVP from miss-detecting at noise.

７.CS (3pin) open protection

IC builds in CS pin(3pin) open protection to prevent OUT pin from changing to H by noise when CS pin（3pin） is OPEN.

When CS pin(3pin) is open, IC stops switching operation by the function. （This is auto-recovery）

Figure 20. CS open protection

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8.OUTPUT Over Load protection（FB OLP comparator）

When secondary output is over load, IC detects it at FB pin(2pin), and IC stops switching operation.

Because secondary photo-coupler is not flown current in OLP state, FB (2pin) voltage is up in Figure 4. circuit.

When the state continues for T_FOLP（typ=64ms）, IC detects over load state, IC stops switching operation. After FB（2pin）

voltage is over V_FOLP1A（typ=3.4V）, when FB pin(2pin) voltage is lower than V_FOLP1B（typ=3.2V） within T_FOLP（typ =64ms）,

over load protection timer is reset. Then IC does not stop switching operation.

In start-up, because FB pin(2pin) is connected to a pull-up resistor to internal voltage, FB (2pin) voltage starts to operate in

the state which is more than V_FOLP1A（typ =3.4V）.

For that, secondary output voltage has to be set within T_FOLP（typ =64ms） from starts–up.

When detecting over load, IC stops switching operation for T_OLPST（typ =512ms）. After that, IC is auto-recovery operation.

In stopping switching operation, though VCC (6pin) voltage is not charged from auxiliary coil side, IC operates re-charge

function from starter circuit. For that, VCC (6pin) voltage keeps VCC pin voltage > V_UVLO2

V_FOLP1A

VH charge

charge

512ms

charge

64ms

Switching

512ms

V_UVLO1

V_CHG2

V_CHG1

VCC

V_UVLO2

G H

Figure 21. Over load protection : Auto-recovery

A: When FB voltage is over V_FOLP1A(typ=3.4V), FBOLP comparator detects over load.

B: When the state A continues for T_FOLP（typ=64ms）, IC stops switching by over load protection.

C: During stopping switching by over load protection, VCC (6pin) voltage drops. When VCC（6pin） voltage is lower than

V_CHG1,VCC re-charge function operates. Then VCC (6pin) voltage is up.

D: When VCC (6pin) voltage is higher than V_CHG2by re-charge function, VCC recharge function is stopped.

E: When it takes for T_OLPST（typ =512ms） from B, IC starts switching with soft-start.

F: When over load state continues, FB (2pin) voltage is over V_FOLP1A. When it passes for T_FOLP（typ=64ms） from E, IC stops

switching by over load protection.

G: During stopping switching by over load protection, VCC (6pin) voltage drops. When VCC（6pin） voltage is lower than

V_CHG1,VCC re-charge function operate, VCC (6pin) voltage is up.

H: When VCC (6pin) voltage is higher than V_CHG2by re-charge function, VCC recharge function is stopped.

9. OUT（5pin） clamp function

H level of OUT （5pin） is clamped to V_OUTH（typ=12.5V ）by the purpose which protects external MOSFET

It prevents gate destruction of MOSFET of rising VCC （6pin） voltage. （It refers to Figure 22.）

OUT pin（5pin） is connected to pull-down R_PDOUT(typ=100kΩ).

12V Clamp

Circuit

POUT

PRE

Driver

NOUT

Figure 22. OUT（5pin）construction

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Operation mode of protection circuit

Operation mode of protection functions are shown in table-4.

Table-4 Operation mode of protection circuit

Item

protection mode

Self-restart

VCC Under Voltage Locked Out

FB Over Load Protection

CS Open Protection

Self-restart(64ms delay, 512ms stop)

Self-restart

ZT Over Voltage Protection

VCC Charge Protection

Latch stop(With 100us timer)

ꢀ

Self-restart

Thermal loss

The thermal design should set operation for the following conditions.

(Since the temperature shown in Figure-23 is the guaranteed temperature, be sure to take a margin into account.)

1. The ambient temperature “Ta” must be 85℃ or less.

2. The IC’s loss must be within the allowable dissipation Pd.

The thermal abatement characteristics are as follows.

(PCB: 70 mm × 70 mm × 1.6 mm, mounted on glass epoxy substrate)

1000

900

800

700

600

500

400

300

200

100

125

150

Ta[℃]

Figure 23. SOP-J8 Thermal Abatement Characteristics

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●Reference Data （This is a reference data. For that, it is not guaranteed.）

550

500

450

400

350

300

250

200

150

100

‐40

‐20

‐40

‐20

Temperature [℃]

Figure 24 Circuit current(OFF) vs Temperature

Figure 25 Circuit current(ON)2 vs Temperature

1.10

1.00

0.90

0.80

0.70

0.60

0.50

0.40

0.30

6.50

5.50

4.50

3.50

2.50

1.50

0.50

‐40

‐20

‐40

‐20

Temperature [℃]

Figure 26 VH start current1 vs Temperature

Figure 27 VH start current2 vs Temperature

1.50

1.30

1.10

0.90

0.70

0.50

0.30

25.0

20.0

15.0

10.0

5.0

0.0

‐40

‐20

‐40

‐20

Temperature [℃]

Figure 28 VH OFF current vs Temperature

Figure 29 VH start switched voltage vs Temperature

9.50

9.00

8.50

8.00

7.50

7.00

15.0

14.5

14.0

13.5

13.0

12.5

12.0

‐40

‐20

‐40

‐20

Temperature [℃]

Figure 30 VCC UVLO voltage1 vs Temperature

Figure 31 VCC UVLO voltage 2 vs Temperature

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●Reference Data （This is a reference data. For that, it is not guaranteed.）

10.00

9.50

9.00

8.50

8.00

7.50

7.00

14.5

14.0

13.5

13.0

12.5

12.0

11.5

‐40

‐20

‐40

‐20

Temperature [℃]

Figure 32 VCC charge start voltage vs Temperature

Figure 33 VCC charge end voltage vs Temperature

0.35

0.30

0.25

0.20

0.15

0.10

0.05

0.00

15.0

14.5

14.0

13.5

13.0

12.5

12.0

11.5

11.0

10.5

10.0

‐40

‐20

‐40

‐20

Temperature [℃]

Figure 34 OUT H voltage vs Temperature

Figure 35 OUT L voltage vs Temperature

0.530

0.525

0.520

0.515

0.510

0.505

0.500

0.495

0.490

0.485

0.480

0.475

0.470

38.0

36.0

34.0

32.0

30.0

28.0

26.0

24.0

22.0

‐40

‐20

‐40

‐20

Temperature [℃]

Figure 36 Pull-up resistor of FB pin 1 vs Temperature

Figure 37 CS over current voltage1A vs Temperature

0.37

0.35

0.33

0.31

0.29

0.27

0.25

0.23

5.00

4.50

4.00

3.50

3.00

‐40

‐20

‐40

‐20

Temperature [℃]

Figure 38 FB Burst voltage vs Temperature

Figure 39 Max burst frequency vs Temperature

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●Reference Data （This is a reference data. For that, it is not guaranteed.）

9.00

8.50

8.00

7.50

7.00

10.00

9.50

9.00

8.50

8.00

‐40

‐20

‐40

‐20

Temperature [℃]

Figure 40 ONOFF time switched bottom 12

vs Temperature

Figure 41 ONOFF time switched bottom 23

vs Temperature

7.00

6.50

6.00

5.50

5.00

8.00

7.50

7.00

6.50

6.00

‐40

‐20

‐40

‐20

Temperature [℃]

Figure 42 ONOFF time switched bottom 34

vs Temperature

Figure 43 ONOFF time switched bottom 45

vs Temperature

16.0

13.0

12.5

12.0

11.5

11.0

10.5

10.0

15.5

15.0

14.5

14.0

13.5

13.0

12.5

12.0

‐40

‐20

‐40

‐20

Temperature [℃]

Figure 44 ONOFF time switched bottom 21

vs Temperature

Figure 45 ONOFF time switched bottom 32

vs Temperature

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●Reference Data （This is a reference data. For that, it is not guaranteed.）

11.5

11.0

10.5

10.0

9.5

10.0

9.5

9.0

8.5

8.0

7.5

7.0

9.0

8.5

‐40

‐20

‐40

‐20

Temperature [℃]

Figure 46 ONOFF time switched bottom 43

vs Temperature

Figure 47 ONOFF time switched bottom 54

vs Temperature

3.70

3.65

3.60

3.55

3.50

3.45

3.40

3.35

3.30

20.0

19.0

18.0

17.0

16.0

15.0

14.0

13.0

12.0

11.0

10.0

‐40

‐20

‐40

‐20

Temperature [℃]

Figure 48 ZT timeout vs Temperature

Figure 49 ZT OVP voltage vs Temperature

700

600

500

400

300

‐40

‐20

‐40

‐20

Temperature [℃]

Figure 50 FBOLP delay timer vs Temperature

Figure 51 FBOLP stop timer vs Temperature

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

terminals.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,

increase the board size and copper area to prevent exceeding the Pd rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

7. Rush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush

current may flow instantaneously due to the internal powering sequence and delays, especially if the IC

has more than one power supply. Therefore, give special consideration to power coupling capacitance,

power wiring, width of ground wiring, and routing of connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

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Operational Notes – continued

11. Unused Input Terminals

Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance

and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to

the power supply or ground line.

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Figure 52. Example of monolithic IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe

Operation (ASO).

15. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below

the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

16. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

Status of this document

The Japanese version of this document is formal specification. A customer may use this translation version only for a reference

to help reading the formal version.

If there are any differences in translation version of this document formal version takes priority

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Ordering Information

B M 1 Q 1 0 4

E 2

Part Number

Package

FJ:SOP-J8

Packaging and forming specification

E2: Embossed tape and reel

Marking Diagrams

1PIN MARK

Line-up

形名(BM1Q10XFJ)

BM1Q104FJ

1Q104

LOT No.

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Physical Dimension, Tape and Reel Information

Package Name

SOP-J8

Tape

Embossed carrier tape

2500pcs

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

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Revision History

Date

Revision

Changes

001

002

New preparation

New registration

2014.3.31

2014.5.20

2017.7.5

P-1, P-2 Change recommended VCC voltage range, P-9 And add note.

Electrical Characteristics Add Icc(OFF),

2017.7.13

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

BM1Q104FJ [ROHM]

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