BD9B306NF-Z (开发中) [ROHM]
BD9B306NF-Z is one of the BD9Bx06NF-Z series of single synchronous buck DC/DC converter with built-in low on-resistance power MOSFETs. It can provide current up to 3A. The output voltage can achieve a high accuracy due to ±1% reference voltage. It features fast transient response due to constant on-time control system. The Light Load Mode control improves efficiency in light-load conditions. It is ideal for reducing standby power consumption of equipment. Power Good function makes it possible for system to control sequence. It achieves the high power density and offer a small footprint on the PCB by employing 6 pins 1.5mm x 1.5mm small package.;
| 型号： | BD9B306NF-Z (开发中) |
| 厂家： | 
ROHM |
| 描述： | BD9B306NF-Z is one of the BD9Bx06NF-Z series of single synchronous buck DC/DC converter with built-in low on-resistance power MOSFETs. It can provide current up to 3A. The output voltage can achieve a high accuracy due to ±1% reference voltage. It features fast transient response due to constant on-time control system. The Light Load Mode control improves efficiency in light-load conditions. It is ideal for reducing standby power consumption of equipment. Power Good function makes it possible for system to control sequence. It achieves the high power density and offer a small footprint on the PCB by employing 6 pins 1.5mm x 1.5mm small package. PC |
| 文件： | 总45页 (文件大小：3918K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
2.7 V to 5.5 V Input, 3.0 A Integrated MOSFET
Single Synchronous Buck DC/DC Converter
BD9B306NF-Z
General Description
Key Specifications
BD9B306NF-Z is one of the BD9Bx06NF-Z series of
single synchronous buck DC/DC converter with built-in
low on-resistance power MOSFETs. It can provide
current up to 3 A. The output voltage can achieve a
high accuracy due to ±1 % reference voltage. It
features fast transient response due to constant
on-time control system. The Light Load Mode control
improves efficiency in light-load conditions. It is ideal
for reducing standby power consumption of
equipment. Power Good function makes it possible for
system to control sequence. It achieves the high
power density and offer a small footprint on the PCB
by employing 6 pins 1.5 mm x 1.5 mm small package.
◼
◼
◼
◼
◼
◼
◼
◼
Input Voltage Range:
Output Voltage Range:
Output Current:
2.7 V to 5.5 V
0.6 V to 4.0 V
3.0 A (Max)
2.2 MHz (Typ)
25 mΩ (Typ)
25 mΩ (Typ)
0 μA (Typ)
Switching Frequency:
High Side FET ON Resistance:
Low Side FET ON Resistance:
Shutdown Current:
Quiescent Current at No Load:
4 μA (Typ)
Package
VFN006V1515A
W (Typ) x D (Typ) x H (Max)
1.5 mm x 1.5 mm x 1.0 mm
Features
◼ Single Synchronous Buck DC/DC Converter
◼ Constant On-time Control
◼ Light Load Mode Control
◼ ±1 % Reference Voltage Accuracy
◼ 100 % Duty Cycle
◼ Power Good Output
Applications
◼ Output Discharge Function
◼
◼
◼
◼
Printer, OA Equipment
Laptop PC / Tablet PC / Server
Storage Device (HDD / SSD)
Step-down Power Supply for SoC, FPGA, and
Microprocessor
Video Surveillance
Distributed Power Supply, Secondary Power
Supply
◼ Over Voltage Protection (OVP)
◼ Over Current Protection (OCP)
◼ Short Circuit Protection (SCP)
◼ Thermal Shutdown Protection (TSD)
◼ Under Voltage Lockout Protection (UVLO)
◼
◼
Typical Application Circuit
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
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Contents
General Description .....................................................................................................................................1
Features.....................................................................................................................................................1
Key Specifications........................................................................................................................................1
Package .....................................................................................................................................................1
Applications................................................................................................................................................1
Typical Application Circuit.............................................................................................................................1
Contents ....................................................................................................................................................2
Pin Configuration.........................................................................................................................................3
Pin Descriptions ..........................................................................................................................................3
Block Diagram.............................................................................................................................................4
Description of Blocks....................................................................................................................................5
Absolute Maximum Ratings...........................................................................................................................6
Thermal Resistance .....................................................................................................................................6
Recommended Operating Conditions..............................................................................................................7
Electrical Characteristics...............................................................................................................................7
Typical Performance Curves..........................................................................................................................8
Function Explanations ................................................................................................................................12
Application Examples.................................................................................................................................18
Application Characteristic Data....................................................................................................................22
PCB Layout Design ....................................................................................................................................34
Thermal Design.........................................................................................................................................36
I/O Equivalence Circuits .............................................................................................................................37
Operational Notes......................................................................................................................................38
Ordering Information.................................................................................................................................40
Marking Diagram.......................................................................................................................................40
Physical Dimension and Packing Information.................................................................................................41
Revision History ........................................................................................................................................42
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Pin Configuration
(TOP VIEW)
Pin Descriptions
Pin No.
Pin Name
Function
Enable pin. The device starts up with setting VEN to 1.00 V or more. The device enters the
shutdown mode with setting VEN to 0.40 V or less. This pin must not be left open.
1
EN
Power Good pin. This pin is an open drain output that requires a pull-up resistor. See Function
Explanations 1. Basic Operation (5) Power Good Output for setting the resistance. If not
used, this pin can be left floating or connected to the ground.
2
3
4
5
6
PGD
FB
Output voltage feedback pin. See Application Examples 3. Output Voltage Setting for how to
calculate the resistances of the output voltage setting.
GND
SW
Ground pin.
Switch pin. This pin is connected to the source of the High Side FET and the drain of the Low
Side FET. Connect an inductor considering the direct current superimposition characteristic.
Power supply pin. Connecting 4.7 µF (Typ) ceramic capacitors is recommended. The detail of
a selection is described in Application Examples 2. Input Capacitor.
VIN
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Block Diagram
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Description of Blocks
1. VREF
The VREF block generates the internal reference voltage.
2. Soft Start
The Soft Start circuit slows down the rise of output voltage during start-up and controls the current, which
allows the prevention of output voltage overshoot and inrush current. The soft start time is fixed 1.25 ms (Typ).
3. Error Amplifier
The Error Amplifier adjusts the Main Comparator input voltage to make the internal reference voltage equal to
FB voltage.
4. Main Comparator
The Main Comparator compares the Error Amplifier output voltage and FB voltage (VFB). When VFB becomes
lower than the Error Amplifier output voltage, the output turns high and reports to the On Time block that the
output voltage has dropped below the control voltage.
5. On Time
This block generates On Time. The designed On Time is generated after the Main Comparator output turns high.
The On Time is adjusted to control the frequency to be fixed even with input / output voltage is changed.
6. PGOOD
The PGOOD block is for power good function.
7. UVLO
The UVLO block is for under voltage lockout protection. The device is shutdown when input voltage VIN falls to
2.200 V (Typ) or less. The threshold voltage has the 400 mV (Typ) hysteresis.
8. TSD
The TSD block is for thermal protection. The device is shutdown when the junction temperature Tj reaches to
175 °C (Typ) or more. The device is automatically restored to normal operation with a hysteresis of 25 °C (Typ)
when the Tj goes down.
9. OVP
The OVP block is for output over voltage protection. When the FB voltage (VFB) exceeds 110 % (Typ) or more of
FB threshold voltage VFBTH, the output MOSFETs are turned off. After VFB falls 105 % (Typ) or less of VFBTH, the
output MOSFETs are returned to normal operation condition.
10. OCP
The OCP block is for over current protection. This function operates by limiting the current that flows through
the High Side FET and the Low Side FET at each cycle of the switching frequency.
11. SCP
The SCP is for short circuit protection. When 256 times OCP are counted on the condition where the device
completes the soft start and the output voltage falls below 92 % (Typ) of the setting voltage, the device is
shutdown for 130 ms (Typ). After 130 ms shutdown, the device restarts. (HICCUP operation)
12. ZXCMP
The ZXCMP is a comparator that monitors the inductor current. When inductor current falls below 0 A (Typ)
while the Low Side FET is on, it turns the FET off.
13. Control Logic
The Control Logic controls the switching operation and protection function operation.
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
Input Voltage
EN Voltage
PGD Voltage
FB Voltage
VIN
VEN
-0.3 to +6
-0.3 to +VIN
-0.3 to +6
-0.3 to +VIN
-0.3 to VIN + 0.3
-2.5 to +7
125
V
V
VPGD
VFB
V
V
SW Voltage (DC)
VSW
V
SW Voltage (AC, less than 10 ns)
Maximum Junction Temperature (Note 1)
Storage Temperature Range
VSWAC
Tjmax
Tstg
V
°C
°C
-55 to +125
Caution 1:
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an
open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a
fuse, in case the IC is operated over the absolute maximum ratings.
Caution 2:
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken
into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) The lifetime and reliability of the device is reduced if the device operates continually at the maximum junction temperature.
Thermal Resistance(Note 2)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s (Note 4)
2s2p
(Note 5)
VFN006V1515A
Junction to Ambient
θJA
219.9
21.6
113.3
15.0
°C/W
°C/W
(Note 3)
Junction to Top Characterization Parameter
(Note 2) Based on JESD51-2A (Still-Air).
ΨJT
(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the
outside surface of the component package.
(Note 4) Using a PCB board based on JESD51-3.
(Note 5) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Layer Number of
Measurement Board
Material
Board Size
4 Layers
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
Top
Copper Pattern
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
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Recommended Operating Conditions
Parameter
Input Voltage
Symbol
Min
Typ
Max
Unit
VIN
Tj
2.7
-40
0
-
-
-
-
5.5
+125
3.0
V
°C
A
Operating Junction Temperature
Output Current (Note 1)
IOUT
Output Voltage Setting
VOUT
0.6
4.0
V
(Note 1) Tj must be lower than 125 °C under the actual operating environment.
Electrical Characteristics
(Unless otherwise specified Tj = -40 to +125 °C, VIN = 5 V, VEN = 5 V, Typical values are at Tj = +25 °C)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Input Supply
Shutdown Current
ISDN
IQ
-
-
0
4
1.5
12
µA
µA
VEN = 0 V, Tj = 25 °C
IOUT = 0 A, Tj = 25 °C
No switching
Quiescent Current at No Load
UVLO Detection Threshold Voltage
UVLO Hysteresis Voltage
Enable
VUVLO1
2.125
2.200
400
2.275
V
VIN falling
VUVLOHYS
-
-
mV
EN Input Voltage High
EN Input Voltage Low
EN Input Current
VENH
VENL
IEN
1.0
GND
-
-
-
VIN
0.4
1
V
V
VEN rising
VEN falling
0
µA
VEN = 5 V, Tj = 25 °C
Reference Voltage, Error Amplifier, Soft Start
FB Threshold Voltage
FB Input Current
Soft Start Time
On Time
VFBTH
IFB
0.594
0.600
-
0.606
V
VIN = 5 V, PWM mode
VFB = 0.6 V, Tj = 25 °C
-
-
50
nA
ms
tSS
1.25
-
VIN = 3.3V, VOUT = 1.8 V,
PWM mode, Tj = 25 °C
On Time
tON
185
248
310
ns
SW (MOSFET)
High Side FET ON Resistance
Low Side FET ON Resistance
High Side FET Leakage Current
Low Side FET Leakage Current
High Side FET Current Limit (Note 3)
Low Side FET Current Limit (Note 3)
SW Discharge Resistance
Power Good
RONH
RONL
ILKH
-
-
25
25
0
36
36
10
10
6.6
4.6
-
mΩ VIN = 5 V, Tj = 25 °C
mΩ VIN = 5 V, Tj = 25 °C
-
µA
µA
A
No switching, Tj = 25 °C
No switching, Tj = 25 °C
ILKL
-
0
IHOCP
ILOCP
RDIS
4.0
3.4
-
5.3
4.0
5
A
Ω
VEN = 0 V, VSW = 0.3 V
VFB rising,
VPGDRG = VFB / VFBTH x 100
VFB falling,
VPGDFF = VFB / VFBTH x 100
VFB falling,
VPGDFG = VFB / VFBTH x 100
VFB rising,
PGD Rising (Good) Voltage
PGD Falling (Fault) Voltage
PGD Falling (Good) Voltage
PGD Rising (Fault) Voltage
VPGDRG
VPGDFF
VPGDFG
VPGDRF
94
90
96
92
98
94
%
%
%
%
103
108
105
110
107
112
VPGDRF = VFB / VFBTH x 100
PGD Output Leakage Current
PGD Output Low Level Voltage
ILKPGD
VPGDL
-
-
0
5
µA
V
VPGD = 5 V, Tj = 25 °C
0.125
0.4
IPGD = 1 mA
(Note 3) This is design value. Not production tested.
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Typical Performance Curves
Figure 1. Shutdown Current vs Temperature
Figure 2. Quiescent Current at No Load vs Temperature
Figure 3. UVLO Threshold Voltage vs Temperature
Figure 4. EN Input Voltage vs Temperature
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Typical Performance Curves – continued
Figure 5. EN Input Current vs Temperature
Figure 6. FB Threshold Voltage vs Temperature
Figure 7. FB Input Current vs Temperature
Figure 8. Soft Start Time vs Temperature
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Typical Performance Curves – continued
Figure 9. On Time vs Temperature
Figure 10. High Side FET ON Resistance vs Temperature
(VIN = 3.3 V, VOUT = 1.8 V, PWM Mode)
Figure 11. Low Side FET ON Resistance vs Temperature
Figure 12. High Side FET Current Limit vs Temperature
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Typical Performance Curves – continued
Figure 13. Low Side FET Current Limit vs Temperature
Figure 14. SW Discharge Resistance vs Temperature
Figure 15. PGD Threshold Voltage vs Temperature
Figure 16. PGD Output Low Level Voltage vs Temperature
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Function Explanations
1. Basic Operation
(1) DC/DC Converter Operation
BD9B306NF-Z is a synchronous buck DC/DC converter that achieves faster load transient response due to
constant on-time control. The device performs switching operation in Pulse Width Modulation (PWM) Mode
control at heavy load. It operates in Light Load Mode (LLM) control at lighter load to improve efficiency. In
PWM mode, the device normally operates at a switching frequency of 2.2 MHz (Typ). At low and high duty
cycles, the switching frequency is reduced as necessary to always ensure a proper regulation
Figure 17. Efficiency Image between Light Load Mode Control and PWM Mode Control
(2) 100 % Duty Operation
The device operates in 100 % Duty mode when the input voltage VIN and output voltage VOUT levels are close.
In this mode, the High Side FET is constantly ON and the Low Side FET is OFF. The difference between VIN and
VOUT is determined by the voltage drop across the on resistance of the High Side FET and the DC resistance
(DCR) of the inductor, as shown in the formula below.
(
)
푉푂푈푇 = 푉 − ꢀ푂푈푇 × 푅푂푁퐻 + 푅퐷퐶ꢁ [V]
퐼푁
where:
푅푂푁퐻 is the High Side FET ON Resistance
푅퐷퐶ꢁ is the inductor DCR
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1. Basic Operation - continued
(3) Enable Control
The start-up and shutdown can be controlled by the EN voltage (VEN). When VEN becomes 0.9 V (Typ) or more,
the internal circuit is activated and the device starts up. When VEN becomes 0.7 V (Typ) or less, the device is
shutdown. In this shutdown mode, the High Side FET and the Low Side FET are turned off and the SW pin is
connected to GND through an internal resistor 5 Ω (Typ) to discharge the output. The start-up with VEN must
be at the same time of the input voltage VIN (VIN = VEN) or after supplying VIN.
Figure 18. Start-up and Shutdown with Enable Control Timing Chart
(4) Soft Start
When VEN goes high, soft start function operates and output voltage gradually rises. This soft start function
can prevent overshoot of the output voltage and excessive inrush current. The soft start time tSS is fixed 1.25
ms (Typ).
Figure 19. Soft Start Timing Chart
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1. Basic Operation - continued
(5) Power Good Output
The Power Good function monitors the FB pin voltage (VFB). When VFB reaches 96 % (Typ) or more of the FB
threshold voltage VFBTH 0.6 V (Typ) and the condition continues for 120 μs (Typ), the built-in open drain Nch
MOSFET connected to the PGD pin is turned off, and the PGD pin goes Hi-Z (High impedance). When VFB
becomes 92 % (Typ) or less of VFBTH 0.6 V (Typ) and remains for 20 μs (Typ), the open drain Nch MOSFET is
turned on and PGD pin is pulled down with 125 Ω (Typ).
The Power Good function also operates when the output over voltage is detected. When VFB reaches 110 %
(Typ) or more of the VFBTH 0.6 V (Typ) and the condition continues for 120 μs (Typ), the open drain Nch
MOSFET is turned on and PGD pin is pulled down with 125 Ω (Typ). When VFB becomes 105 % (Typ) or less
of VFBTH 0.6 V (Typ) and remains for 20 μs (Typ), the built-in open drain Nch MOSFET connected to the PGD
pin is turned off, and the PGD pin goes Hi-Z (High impedance).
It is recommended to connect a pull-up resistor of 10 kΩ to 100 kΩ to the the power supply less than 5.5 V.
If the power good function is not used, this pin can be left floating or connected to the ground.
Table 1. PGD Output
State
Before Supply Input
Voltage
Condition
PGD Output
VIN < 0.7 V (Typ)
Hi-Z
Shutdown
Enable
VEN ≤ 0.7 V (Typ)
96 % (Typ) ≤ VFB / VFBTH ≤ 105 % (Typ)
VFB / VFBTH ≤ 92 % (Typ) or 110 % (Typ) ≤ VFB / VFBTH
0.7 V (Typ) < VIN ≤ 2.2 V (Typ)
Tj ≥ 175 °C (Typ)
Low (Pull-down)
Hi-Z
VEN ≥ 0.9 V (Typ)
UVLO
Low (Pull-down)
Low (Pull-down)
Low (Pull-down)
TSD
Complete Soft Start
SCP
VFB / VFBTH ≤ 92 % (Typ)
Low (Pull-down)
OCP 256 counts
Figure 20. Power Good Timing Chart
(Connecting a pull-up resistor to the PGD pin)
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1. Basic Operation - continued
(6) Output Discharge Function
When even one of the following conditions is satisfied, output is discharged with 5 Ω (Typ) resistor through the
SW pin.
• Shutdown: VEN ≤ 0.7 V (Typ)
• UVLO: VIN ≤ 2.2 V (Typ)
• TSD: Tj ≥ 175 °C (Typ)
• SCP: Complete Soft Start, VFB / VFBTH ≤ 92 % (Typ), and OCP 256 counts
When all of the above conditions are released, output discharge is stopped.
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Function Explanations – continued
2. Protection
(1) Over Current Protection (OCP) / Short Circuit Protection (SCP)
Over Current Protection (OCP) restricts the flowing current through the Low Side FET and the High Side FET
for every switching period. If the inductor current exceeds the Low Side FET Current Limit (ILOCP) while the
Low Side FET is on, the Low Side FET remains on even with FB voltage VFB falls to VFBTH = 0.6 V (Typ) or lower.
If the inductor current becomes lower than ILOCP, the High Side FET is able to be turned on. When the inductor
current becomes the High Side Current Limit (IHOCP) while the High Side FET is on, the High Side FET is turned
off. Output voltage may decrease by changing frequency and duty due to the OCP operation.
Short Circuit Protection (SCP) function is a Hiccup mode. When Low Side OCP or High Side OCP operates 256
cycles while VFB is VFBTH x 92 % or less (VPGD = Low), the device stops the switching operation for 130 ms (Typ).
After the 130 ms (Typ), the device restarts. SCP does not operate during the soft start even if the device is in
the SCP conditions. This protection circuit is effective in preventing damage due to sudden and unexpected
incidents. However, the device should not be used in applications characterized by continuous operation of the
protection circuit (e.g. when a load that significantly exceeds the output current capability of the chip is
connected at all times).
Table 2. The Operating Condition of OCP and SCP
VEN
VFB
Start-up
OCP
SCP
≤ VFBTH x 92 % (Typ)
> VFBTH x 92 % (Typ)
≤ VFBTH x 92 % (Typ)
-
During Soft Start
Enable
Enable
Enable
Disable
Disable
Disable
Enable
Disable
≥ 0.9 V (Typ)
≤ 0.7 V (Typ)
Complete Soft Start
Shutdown
Figure 21. OCP and SCP Timing Chart
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2. Protection - continued
(2) Under Voltage Lockout Protection (UVLO)
When input voltage VIN falls to 2.2 V (Typ) or lower, the device is shutdown. When VIN becomes 2.6 V (Typ)
or more, the device starts up. The hysteresis is 400 mV (Typ).
Figure 22. UVLO Timing Chart
(3) Thermal Shutdown Protection (TSD)
Thermal shutdown circuit prevents heat damage to the IC. The device should always operate within the IC’s
maximum junction temperature rating. However, if it continues exceeding the rating and the junction
temperature Tj rises to 175 °C (Typ), the TSD circuit is activated and it turns the output MOSFETs off. When
the Tj falls below the TSD threshold, the device is automatically restored to normal operation. The TSD
threshold has a hysteresis of 25 °C (Typ). Note that the TSD circuit operates in a situation that exceeds the
absolute maximum ratings. Therefore, under no circumstances, should the TSD circuit be used in a set design
or for any purpose other than protecting the IC from heat damage.
(4) Over Voltage Protection (OVP)
When the FB voltage VFB exceeds VFBTH x 110 % (Typ) or more, the output MOSFETs are turned off to prevent
the increase in the output voltage. After the VFB falls VFBTH x 105 % (Typ) or less, the output MOSFETs are
returned to normal operation condition. Switching operation will restart after VFB falls below VFBTH
.
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Application Examples
1. Typical Application
For the power supply design, the necessary parameters are as follows.
Table 3. Example of Application Specification
Parameter
Input Voltage
Symbol
VIN
Example Value
5.0 V (Typ)
1.8 V (Typ)
3.0 A
Output Voltage
VOUT
Maximum Output Current
IOUTMAX
Figure 23. Application Circuit
2. Input Capacitor
Use ceramic type capacitor for the input capacitor CIN. The input capacitor is used to reduce the input ripple noise
and it is effective by being placed as close as possible to the VIN pin. Set the capacitor value so that it does not
fall to 2.5 μF considering the capacitor value variances, temperature characteristics, DC bias characteristics,
aging characteristics, and etc. Use the capacitor which has the comparatively same characteristics with the
components (C1) in “Application Characteristic Data (Reference Data)”. Input ripple noise can be further reduced
by using an input capacitor with a larger capacitance value. In addition, high frequency noise may be reduced by
placing an additional capacitor of 0.1 μF or less as close as possible to the VIN and GND pins. The PCB layout and
the position of the capacitor may lead to IC malfunction. Refer to “PCB Layout Design”.
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Application Examples - continued
3. Output Voltage Setting
The output voltage can be set by the feedback resistance ratio connected to the FB pin. By connecting R1 and R2
resistors in series as the upper resistor RUP (RUP = R1 + R2), the output voltage value can be finely adjusted. For
stable operation, the parallel resistance of feedback resistors RUP and RDW should be set to 20 kΩ or more.
The output voltage VOUT can be calculated as
ꢁ
ꢃꢁ
ꢂ푃
푉푂푈푇
=
ꢄ푊 × 0.6 [V]
ꢁ
ꢄ푊
푅푈ꢅ = 푅1 + 푅2
푅퐷ꢆ = 푅3
1
1
ꢇ⁄(ꢁ
+
) ≥ ꢈ0 [kΩ]
ꢁ
ꢂ푃
ꢄ푊
Figure 24. Feedback Resistor Circuit
The Constant On-time Control required the sufficient ripple voltage on FB voltage for the operation stability. This
device is designed to correspond to low ESR output capacitors without a feedforward capacitor CFB by injecting
the ripple voltage to FB voltage inside the IC. However, it is recommended to connect CFB in order to improve the
load transient response and operating stability. The FB capacitor CFB should be set within the range.
ꢑ
ꢌ
15×(1ꢋꢌ
)× 퐿 퐶
√
ꢏꢐ ꢒ ꢍꢂꢎ
ꢍꢂꢎ
ꢉ푝푒푛 < ꢊ퐹퐵
<
[F]
ꢁ
ꢂ푃
Load transient response and the loop stability depends on L1, COUT, RUP, RDW, and CFB. Actually, these
characteristics may change depending on PCB layout, wiring, the type of components, and the conditions
(temperature, etc.). Be sure to check them on the actual application.
Refer to Table 4 as recommended values for each output voltage setting.
Table 4. Recommended Feedback Resistances and CFB Capacitance
RDW
CFB
RUP
入力電圧
出力電圧
VIN
VOUT
R3
C7
R1
R2
0 Ω
5.0 V
5.0 V
5.0 V
5.0 V
5.0 V
5.0 V
5.0 V
5.0 V
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
0.6 V
0.9 V
1.0 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.6 V
0.9 V
1.0 V
1.2 V
1.5 V
1.8 V
100 kΩ
100 kΩ
100 kΩ
150 kΩ
150 kΩ
200 kΩ
270 kΩ
200 kΩ
100 kΩ
100 kΩ
100 kΩ
150 kΩ
150 kΩ
200 kΩ
Open
120 pF
120 pF
120 pF
120 pF
120 pF
120 pF
47 pF
0 Ω
200 kΩ
150 kΩ
150 kΩ
100 kΩ
100 kΩ
100 kΩ
47 kΩ
Open
0 Ω
0 Ω
0 Ω
0 Ω
47 kΩ
12 kΩ
0 Ω
33 pF
120 pF
120 pF
120 pF
120 pF
120 pF
68 pF
0 Ω
200 kΩ
150 kΩ
150 kΩ
100 kΩ
100 kΩ
0 Ω
0 Ω
0 Ω
0 Ω
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Application Examples - continued
4. Output LC Filter
In order to supply a continuous current to the load, the DC/DC converter requires an LC filter for smoothing the
output voltage. Use the inductance value of 0.47 μH.
VIN
IL
Inductor saturation current > IOUTMAX + ∆IL/2
L1
VOUT
Driver
∆IL
Maximum Output Current IOUTMAX
COUT
t
Figure 25. Waveform of Inductor Current
Figure 26. Output LC Filter Circuit
For example, given that VIN = 5 V, VOUT = 1.8 V, L1 = 0.47 μH, and the switching frequency fSW = 2.2 MHz,
Inductor current ΔIL can be represented by the following equation.
1
(
)
×
∆ꢀ퐿 = 푉푂푈푇 × 푉 − 푉푂푈푇
= ꢇ.ꢇꢇ [A]
퐼푁
ꢌ
ꢏꢐ
×푓 ×퐿
푆푊
ꢒ
The rated current of the inductor (Inductor saturation current) must be larger than the sum of the maximum
output current IOUTMAX and 1/2 of the inductor ripple current ΔIL. Table 5 is the list of recommended inductors.
Table 5. Recommended Inductors
Inductance
[μH]
DCR
[mΩ]
23
Current Rating
L x W x H
[mm]
2.5 x 2.0 x 1.2
Part Name
Manufacturer
[A]
6.7
DFE252012F-R47M
DFE201610E-R47M
LBENA2520MKTR47M0NK
LSEUC2016KKTR47M
TFM201610ALM-R47MTAA
XGL4015-471ME
Murata
Murata
32
20
4.8
5.9
6.3
5.1
10.5
6.6
8.0
2.0 x 1.6 x 1.0
2.5 x 2.0 x 1.2
2.0 x 1.6 x 1.0
2.0 x 1.6 x 1.0
4.0 x 4.0 x 1.5
4.0 x 4.0 x 1.6
3.5 x 3.2 x 2.0
TAIYO YUDEN
TAIYO YUDEN
TDK
26
0.47
34
7.5
Coilcraft
8.36
10.85
XFL4015-471ME
Coilcraft
XEL3520-471ME
Coilcraft
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4. Output LC Filter - continued
Use ceramic type capacitor for the output capacitor COUT. COUT affects the output ripple voltage. Select COUT so
that it must satisfy the required ripple voltage characteristics.
The output ripple voltage can be estimated by the following equation.
ꢇ
∆VRPL = ∆IL × ( RESR
+
) [V]
8 × COUT × fSW
where:
푅퐸ꢓꢁ is the Equivalent Series Resistance (ESR) of the output capacitor.
For example, given that COUT = 10 x 2 μF and RESR = 3 mΩ, ΔVRPL can be calculated as below.
ꢇ
∆VRPL = ꢇ.ꢇꢇ A × ( ꢔ mΩ +
) = 6.ꢕ [mV]
8 × ꢇ0 × ꢈ μF × ꢈ.ꢈ MHz
The COUT capacitance of 20 μF (Typ) is recommended. Set the capacitor value so that it does not fall to 10 μF
considering the capacitor value variances, temperature characteristics, DC bias characteristics, aging
characteristics, and etc. Use the capacitor which has the comparatively same characteristics with the
components (C3, C4, C6) in “Application Characteristic Data (Reference Data)”.
In addition, the total capacitance connected to VOUT needs to satisfy the value obtained by the following
equation.
ꢖ.5 푚
∆퐼
ꢗ
ꢊ푂푈푇푀퐴푋
<
× ( ꢇ −
)
[F]
ꢌ
ꢍꢂꢎ
2
For example, given that VIN = 5 V, VOUT = 1.8 V, L1 = 0.47 µH, fSW = 2.2 MHz (Typ), COUTMAX can be calculated
as below.
ꢖ.5 푚
ꢊ푂푈푇푀퐴푋
<
× ꢙ ꢇ − 1.11 퐴 ꢚ = ꢇꢈꢔ [µF]
1.ꢘ ꢌ
2
If the total capacitance connected to VOUT is larger than COUTMAX, over current protection may be activated by the
inrush current at start-up and prevented to turn on the output. Confirm this on the actual application.
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Application Characteristic Data (Reference Data)
Figure 27. Application Measurement Schematic
Table 6. List of Components (Reference Example)
Part
No.
Size Code
(mm)
Value
Part Name
Type
Manufacturer
L1
0.47 μH
XGL4015-471ME
Inductor
4040
Coilcraft
C1
C2
C3
4.7 μF (6.3V, X7R)
JMK107BB7475MA
Ceramic Capacitor
1608
-
TAIYO YUDEN
-
-
-
-
10 μF (10 V, X7R)
GRM188Z71A106MA73 Ceramic Capacitor
GRM188Z71A106MA73 Ceramic Capacitor
1608
1608
-
Murata
Murata
-
C4
(Note 1)
10 μF (10 V, X7R)
C5
-
-
-
-
C6
C7
-
-
-
-
(Note 2)
Depending on VOUT
Depending on VOUT
GRM1555C2A Series
Ceramic Capacitor
1005
Murata
(Note 2)
R1
R2
R3
MCR01MZPF Series
MCR01MZPF Series
MCR01MZPF Series
Chip Resistor
Chip Resistor
Chip Resistor
1005
1005
1005
ROHM
ROHM
ROHM
(1 %, 1/16 W)
(Note 2)
Depending on VOUT
(1 %, 1/16 W)
(Note 2)
Depending on VOUT
(1 %, 1/16 W)
R4
R5
100 kΩ (1 %, 1/16 W)
MCR01MZPF1003
Chip Resistor
1005
ROHM
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R6
(Note 3)
R0
Short
(Note 1) C5 is for an additional input capacitor option. This capacitor is not required for proper operation but can be used to reduce the input voltage
ripple.
(Note 2) For the part value of output voltage setting, see “Table 4. Recommended feedback resistances, CFB capacitance”.
(Note 3) R0 is an option, used for feedback’s frequency characteristics measurement. By inserting a resistor at R0, it is possible to measure the frequency
characteristics (phase margin) using a FRA. However, the resistor will not be used in actual application, use this resistor pattern in short-circuit
mode.
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Application Characteristic Data (Reference Data) – continued
The parts list of Table 6 is used.
Figure 28. Efficiency vs Output Current
(VOUT = 0.6 V)
Figure 29. Efficiency vs Output Current
(VOUT = 0.9 V)
Figure 30. Efficiency vs Output Current
(VOUT = 1.2 V)
Figure 31. Efficiency vs Output Current
(VOUT = 1.8 V)
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Application Characteristic Data (Reference Data) – continued
The parts list of Table 6 is used.
Figure 32. Efficiency vs Output Current
Figure 33. Efficiency vs Output Current
(VOUT = 2.5 V)
(VOUT = 3.3 V)
Figure 34. Output Voltage vs Output Current
(Load Regulation)
Figure 35. Output Voltage vs Output Current
(Load Regulation)
(VOUT = 0.6 V)
(VOUT = 0.9 V)
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Application Characteristic Data (Reference Data) – continued
The parts list of Table 6 is used.
Figure 36. Output Voltage vs Output Current
(Load Regulation)
Figure 37. Output Voltage vs Output Current
(Load Regulation)
(VOUT = 1.2 V)
(VOUT = 1.8 V)
Figure 38. Output Voltage vs Output Current
(Load Regulation)
Figure 39. Output Voltage vs Output Current
(Load Regulation)
(VOUT = 2.5 V)
(VOUT = 3.3 V)
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Application Characteristic Data (Reference Data) – continued
The parts list of Table 6 is used.
Figure 40. Switching Frequency vs Output Current
Figure 41. Switching Frequency vs Output Current
(VIN = 3.3 V)
(VIN = 5.0 V)
Figure 42. Output Voltage vs Input Voltage
(Line Regulation)
Figure 43. Output Voltage vs Input Voltage
(Line Regulation)
(VOUT = 1.2 V, IOUT = 1.0 A)
(VOUT = 1.8 V, IOUT = 1.0 A)
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Application Characteristic Data (Reference Data) – continued
The parts list of Table 6 is used.
Figure 44. Output Voltage vs Input Voltage
(Line Regulation)
Figure 45. Switching Frequency vs Input Voltage
(IOUT = 1.0 A)
(VOUT = 3.3 V, IOUT = 1.0 A)
Figure 46. Output Ripple Voltage
Figure 47. Output Ripple Voltage
(VIN = 3.3 V, VOUT = 0.9 V, IOUT = 0.1 A)
(VIN = 3.3 V, VOUT = 0.9 V, IOUT = 1.0 A)
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Application Characteristic Data (Reference Data) – continued
The parts list of Table 6 is used.
Figure 48. Output Ripple Voltage
Figure 49. Output Ripple Voltage
(VIN = 5.0 V, VOUT = 1.8 V, IOUT = 0.1 A)
(VIN = 5.0 V, VOUT = 1.8 V, IOUT = 1.0 A)
Figure 50. Frequency Characteristics
Figure 51. Frequency Characteristics
(VIN = 3.3 V, VOUT = 0.9 V, IOUT = 1.0 A)
(VIN = 5.0 V, VOUT = 1.8 V, IOUT = 1.0 A)
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Application Characteristic Data (Reference Data) – continued
The parts list of Table 6 is used.
Figure 52. Load Transient Response
Figure 53. Load Transient Response
(VIN = 3.3 V, VOUT = 0.9 V, IOUT = 0.05 A to 1.0 A: 1 A/μs) (VIN = 3.3 V, VOUT = 0.9 V, IOUT = 1.0 A to 2.0 A: 1 A/μs)
Figure 54. Load Transient Response
Figure 55. Load Transient Response
(VIN = 5.0 V, VOUT = 1.8 V, IOUT = 0.05 A to 1.0 A: 1 A/μs) (VIN = 5.0 V, VOUT = 1.8 V, IOUT = 1.0 A to 2.0 A: 1 A/μs)
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Application Characteristic Data (Reference Data) – continued
The parts list of Table 6 is used.
Figure 56. EN Start-up at No Load
Figure 57. EN Shutdown at No Load
(VIN = 5.0 V, VOUT = 1.8 V, VEN = 0 V to 5 V)
(VIN = 5.0 V, VOUT = 1.8 V, VEN = 5 V to 0 V)
Figure 58. EN Start-up at RLoad = 0.6 Ω
(VIN = 5.0 V, VOUT = 1.8 V, VEN = 0 V to 5 V)
Figure 59. EN Shutdown at RLoad = 0.6 Ω
(VIN = 5.0 V, VOUT = 1.8 V, VEN = 5 V to 0 V)
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Application Characteristic Data (Reference Data) – continued
The parts list of Table 6 is used.
Figure 60. VIN Start-up at No Load
Figure 61. VIN Shutdown at No Load
(VIN = VEN = 0 V to 5 V, VOUT = 1.8 V)
(VIN = VEN = 5 V to 0 V, VOUT = 1.8 V)
Figure 62. VIN Start-up at RLoad = 0.6 Ω
(VIN = VEN = 0 V to 5 V, VOUT = 1.8 V)
Figure 63. VIN Shutdown at RLoad = 0.6 Ω
(VIN = VEN = 5 V to 0 V, VOUT = 1.8 V)
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Application Characteristic Data (Reference Data) – continued
The parts list of Table 6 is used.
Figure 64. OCP Operation
Figure 65. SCP Operation
(VIN = 3.3 V, VOUT = 0.9 V to 0 V)
(VIN = 3.3 V, VOUT = 0.9 V to 0 V)
Figure 66. Thermal Derating
(VOUT = 0.9 V)
Figure 67. Thermal Derating
(VOUT = 1.2 V)
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Application Characteristic Data (Reference Data) – continued
The parts list of Table 6 is used.
Figure 68. Thermal Derating
(VOUT = 1.8 V)
Figure 69. Thermal Derating
(VOUT = 3.3 V)
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PCB Layout Design
PCB layout design for DC/DC converter is very important. Appropriate layout can avoid various problems concerning
power supply circuit. Figure 70-a to Figure 70-c show the current path in a buck DC/DC converter circuit. The Loop
1 in Figure 70-a is a current path when High side switch is ON and Low side switch is OFF, the Loop 2 in Figure 70-b
is when High side switch is OFF and Low side switch is ON. The thick line in Figure 70-c shows the difference
between Loop1 and Loop2. The current in thick line change sharply each time the switching element High side and
Low side switch change from OFF to ON, and vice versa. These sharp changes induce a waveform with harmonics
in this loop. Therefore, the loop area of thick line that is consisted by input capacitor and IC should be as small as
possible to minimize noise. For more details, refer to application note of switching regulator series “PCB Layout
Techniques of Buck Converter”.
Figure 70-a. Current Path when High Side Switch = ON, Low Side Switch = OFF
Figure 70-b. Current Path when High Side Switch = OFF, Low Side Switch = ON
Figure 70-c. Difference of Current and Critical Area in Layout
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PCB Layout Design – continued
When designing the PCB layout, pay attention to the following points:
• Connect the input capacitor CIN as close as possible to the VIN pin and GND pin on the same plane as the IC.
• Switching nodes such as SW are susceptible to noise due to AC coupling with other nodes. Route the inductor
pattern L1 as thick and as short as possible.
• RUP and RDW shall be located as close as possible to the FB pin and the wiring to the FB pin shall be as short as
possible.
• Feedback line connected to the FB pin far from the SW nodes.
• R0 is provided for the measurement of feedback frequency characteristics (optional). By inserting a resistor
into R0, it is possible to measure the frequency characteristics of feedback (phase margin) using FRA etc. R0
is short-circuited for normal use.
Figure 71. Example of PCB Layout
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Thermal Design
For thermal design, be sure to operate at the chip junction temperature Tj of 125 °C or less.
(Be sure to take margins into account.)
The chip junction temperature Tj can be considered in the following two patterns:
1. To obtain Tj from the package surface center temperature Tt in actual use
ꢛ푗 = ꢛ푡 + 휓퐽푇 × ꢜ [°C]
2. To obtain Tj from the ambient temperature Ta
ꢛ푗 = ꢛ푎 + 휃퐽퐴 × ꢜ [°C]
Where:
휓퐽푇
휃퐽퐴
is junction to top characterization parameter (Thermal Resistance)
is junction to ambient (Thermal Resistance)
The heat loss W of the IC can be obtained by the formula shown below:
푉푂푈푇
푉푂푈푇
2
ꢜ = 푅푂푁퐻 × ꢀ푂푈푇
×
+ 푅푂푁퐿 × ꢀ푂푈푇2 × ꢝꢇ −
ꢞ
푉
퐼푁
푉
퐼푁
1
(
)
+푉 × ꢀ퐶퐶 + × 푡푟 + 푡ꢟ × 푉 × ꢀ푂푈푇 × ꢟ [W]
퐼푁
퐼푁
ꢓꢆ
2
Where:
푅푂푁퐻
푅푂푁퐿
ꢀ푂푈푇
is the High Side FET ON Resistance (Electrical Characteristics) [Ω]
is the Low Side FET ON Resistance (Electrical Characteristics) [Ω]
is the Output Current [A]
푉푂푈푇
is the Output Voltage [V]
푉
퐼푁
is the Input Voltage [V]
ꢀ퐶퐶
푡푟
푡ꢟ
is the Circuit Current [A] (Typ: 450 µA)
is the Switching Rise Time [s] (Typ: 2 ns)
is the Switching Fall Time [s] (Typ: 2 ns)
is the Switching Frequency [Hz] (Typ: 2.2 MHz)
ꢟ
ꢓꢆ
tr
tf
(2 ns)
(2 ns)
VIN
2
1. 푅푂푁퐻 × ꢀ푂푈푇
1
2
VSW
2. 푅푂푁퐿 × ꢀ푂푈푇
3. 1 × (푡푟 + 푡ꢟ) × 푉 × ꢀ푂푈푇 × ꢟ
퐼푁
ꢓꢆ
2
GND
3
2
1
fsw
Figure 72. SW Waveform
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I/O Equivalence Circuits
1. EN
2. PGD
3. FB
5. SW
(Note) Resistor values are typical.
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BD9B306NF-Z
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity
when connecting the power supply, such as mounting an external diode between the power supply and the IC’s
power supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to
ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when
using electrolytic capacitors.
3. 3Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go
below ground due to back EMF or electromotive force. In such cases, the user should make sure that such
voltages going below ground will not cause the IC and the system to malfunction by examining carefully all
relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and PCB
wiring to name a few.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed
separately but connected to a single ground at the reference point of the application board to avoid fluctuations
in the small-signal ground caused by large currents. Also ensure that the ground traces of external components
do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce
line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the
electrical characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current
may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than
one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of
ground wiring, and routing of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power
supply should always be turned off completely before connecting or removing it from the test setup during the
inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar
precautions during transport and storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may
result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and
output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid
environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The
small charge acquired in this way is enough to produce a significant effect on the conduction through the
transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be
connected to the power supply or ground line.
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BD9B306NF-Z
Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep
them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements,
creating a parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these
diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P
substrate) should be avoided.
Figure 73. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should
always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a
continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF
power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal
operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore,
under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting
the IC from heat damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC
should not be used in applications characterized by continuous operation or transitioning of the protection
circuit.
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BD9B306NF-Z
Ordering Information
B D 9 B 3 0 6 N F
-
Z T R
Output
Current
3.0 A
Package
NF: VFN006V1515A
Packaging and forming specification
Z: Outsourced package
TR: Embossed tape and reel
Marking Diagram
A B
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BD9B306NF-Z
Physical Dimension and Packing Information
Package Name
VFN006V1515A
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Revision History
Date
Revision
001
Changes
01.Mar.2023
New Release
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
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