BD9524MUV_10_技术文档

Hi-performance Regulator IC Series for PCs

Main Power Supply IC

for Note PC (Linear Regulator Integrated)

No.10030ECT06

BD9524MUV

●Description

BD9524MUV is a switching regulator controller with high output current which can achieve low output voltage (2.0V～5.5V)

from a wide input voltage range (7V~25V). High efficiency for the switching regulator can be realized by utilizing an external

N-MOSFET power transistor. A new technology called H³Reg^TMis a Rohm proprietary control method to realize ultra high

transient response against load change. SLLM (Simple Light Load Mode) technology is also integrated to improve efficiency

in light load mode, providing high efficiency over a wide load range. For protection and ease of use, the soft start function,

variable frequency function, short circuit protection function with timer latch, over voltage protection with timer latch, and

Power good function are all built in. This switching regulator is specially designed for Main Power Supply.

●Features

1) 2ch H³Reg^TMSwitching Regulator Controller

2) Adjustable Simple Light Load Mode (SLLM), Quiet Light Load Mode (QLLM) and Forced continuous Mode

3) Thermal Shut Down (TSD), Under Voltage Lock Out (UVLO), Over Current Protection (OCP),

Over Voltage Protection (OVP), Short circuit protection with timer-latch (SCP)

4) Soft start function to minimize rush current during startup

5) Switching Frequency Variable (f=200KHz～500KHz)

6) Power good circuit

7) 2ch Linear regulator

8) VQFN032V5050 package

●Applications

Laptop PC, Desktop PC, LCD-TV, Digital Components

●Maximum Absolute Ratings (Ta=25℃)

Parameter

Symbol

Limits

30 ^*1*2

7^*1*2

Unit

V

VIN, CTL

EXTVCC, PGOOD1, PGOOD2FB1, FB2, Is+1, Is+2, MCTL

V

FS1, FS2, REF1, REF2, SS1, SS2, LG1, LG2

REG1+0.3^*1*2

35^*1*2

V

BOOT1, BOOT2

V

Terminal voltage

BOOT1-SW1, BOOT2-SW2, HG1-SW1, HG2-SW2

7^*1*2

V

HG1

BOOT1+0.3^*1*2

BOOT2+0.3 ^*1*2

6 *1*2

V

HG2

V

EN1, EN2

V

DGND, PGND1, PGND2

AGND±0.3 ^*1*2

0.38 ^*3

V

Power dissipation 1

Pd1

Pd2

W

℃

Power dissipation 2

0.88 ^*4

Power dissipation 3

Pd3

2.06 ^*5

4.56 ^*6

Power dissipation 4

Pd4

Operating temperature range

Storage temperature range

Topr

Tstg

Tjmax

-10 ~ +100

-55 ~ +150

+150

Junction Temperature

*1 Do not however exceed Pd.

*2 Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle.

*3 Reduced by 3.0mW for each increase in Ta of 1℃ over 25℃ (when don’t mounted on a heat radiation board )

*4 Reduced by 7.0mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB

which has 1 layer. (Copper foil area : 0mm²))

*5 Reduced by 16.5mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB

which has 4 layers. (1^stand 4^thcopper foil area : 20.2mm², 2^ndand 3^rdcopper foil area : 5505mm²))

*6 Reduced by 36.5mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB

which has 4 layers. (All copper foil area : 5505mm²))

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2010.03 - Rev.C

1/20

Technical Note

BD9524MUV

●Operating Conditions (Ta=25℃)

Parameter

Symbol

MIN.

7

MAX.

25

Unit

V

VIN

EXTVCC

CTL

4.5

-0.3

4.5

-0.3

0.09

1

5.5

25

5.5

30

5.5

1.25

2.75

5.6

V

EN1, EN2

BOOT1, BOOT2

BOOT1-SW1, BOOT2-SW2, HG1-SW1, HG2-SW2

PGOOD1, PGOOD2

FS1, FS2

Terminal voltage

REF1, REF2

Is+1, Is+ 2, FB1, FB2

1.9

-0.3

V

MCTL

REG1+0.3

*This product should not be used in a radioactive environment.

●Electrical characteristics

(unless otherwise noted, Ta=25℃ VIN=12V, CTL=5V, EN1=EN2=5V, REF1=2.5V, REF2=1.65V, FS1=FS2=0.582V)

Standard Value

Unit Conditions

Parameter

Symbol

MIN.

70

0

TYP.

MAX.

250

130

10

VIN standby current

VIN bias current

ISTB

IIN

150

μA CTL=5V, EN1=EN2=0V

45

0

-

μA EXTVCC=5V

Shut down mode current

CTL Low voltage

ISHD

VCTLL

VCTLH

ICTL

-10

-0.3

2.3

-

μA CTL=0V

0.8

25

V

CTL High voltage

CTL bias current

-

V

1

-

3

μA VCTL=5V

EN Low voltage

VENL

VENH

IEN

-0.3

2.3

-

0.8

5.5

3

V

EN High voltage

-

V

EN bias current

1

μA VEN=3V

[5V linear regulator]

REG1 output voltage

Maximum current

Line Regulation

VREG1

IREG1

REG1I

REG1L

4.90

5.00

-

5.10

-

V

IREG1=1mA

200

mA IREG2=0mA

-

90

30

180

50

mV VIN=7.5 to 25V

mV IREG1=0 to 30mA

Load Regulation

[3.3V linear regulator]

REG2 output voltage

Maximum current

Line regulation

VREG2

IREG2

REG2I

REG2L

3.27

3.30

3.33

-

V

IREG2=1mA

100

-

mA

-

20

30

mV VIN=7.5 to 25V

Load regulation

mV IREG2=0 to 100mA

[5V switch block]

EXTVCC input threshold voltage

EXTVCC input delay time

Switch Resistance

VCC_UVLO

TVCC

4.2

2

4.4

4

4.6

8

V

ms

Ω

EXTVCC: Sweep up

RVCC

1.0

2.0

[Under voltage lock out block for DC/DC]

REG1 threshold voltage

REG2 threshold voltage

Hysteresis voltage

REG1_UVLO

4.0

2.45

50

4.2

2.65

100

4.4

2.85

200

V

REG1: Sweep up

REG2: Sweep up

REG2_UVLO

dV_UVLO

mV REG1, REG2: Sweep down

[Error amplifier block]

REF1×2

-25m

20

REF1×2

+25m

90

Feedback voltage 1

VFB1

REF1×2

V

FB1 bias current

IFB1

45

1

μA FB1=5V

kΩ

Output discharge resistance 1

RDISOUT1

0.5

REF2×2

-25m

3

REF2×2

+25m

60

Feedback voltage 2

VFB2

REF2×2

V

FB2 bias current

IFB2

10

30

1

μA FB2=3.3V

Output discharge resistance 2

REF1, REF2 bias current

RDISOUT2

IREF1, IREF2

0.5

-10

3

kΩ

μA

-

10

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2010.03 - Rev.C

2/20

Technical Note

BD9524MUV

●Electrical characteristics

-

Continued

(unless otherwise noted, Ta=25℃ VIN=12V, CTL=5V, EN1=EN2=5V, REF1=2.5V, REF2=1.65V, FS1=FS2=0.582V)

Standard Value

TYP.

Unit

Conditions

Parameter

[H³Reg^TMblock]

Symbol

MIN.

MAX.

On Time 1

TON1

TON2

0.810

0.520

3.5

0.960

0.670

7

1.110

0.820

14

μs REF=2.5V

On Time 2

μs REF=1.65V

Maximum On Time

TONMAX

TOFFMIN

IFS

μs

μA

Minimum Off Time

-

0.2

0

0.4

FS1, FS2 bias current

[FET driver block]

-10

10

HG higher side ON resistor

HG lower side ON resistor

LG higher side ON resistor

LG lower side ON resistor

[Over Voltage Protection block]

HGHON

HGLON

LGHON

LGLON

-

3.0

2.0

0.5

6.0

4.0

1.0

Ω

REF×2

×1.15

REF×2

×1.175

REF×2

×1.20

Latch Type OVP Threshold voltage

VLOVP

TLOVP

V

Latch Type OVP delay time

50

150

300

μs

[Short circuit protection block]

REF×2× REF×2

REF×2

×0.74

2

SCP Threshold voltage

VSCP

TSCP

V

0.66

×0.7

Delay time

0.5

1

ms

[Current limit protection block]

Maximum offset voltage

Is+1 bias current

dVSMAX

IISP1

50

-

65

2.5

80

10

mV

μA

Is+2 bias current

IISP2

-

[Power good block]

REF×2

×0.87

REF×2

×1.07

-

REF×2

×0.90

REF×2

×1.10

0.1

REF×2

×0.93

REF×2

×1.13

0.2

Power good low threshold

Power good high threshold

VPGTHL

VPGTHH

V

Power good low voltage

Power good leakage current

[Soft Start block]

VPGL

V

IPGOOD=1mA

ILEAKPG

-2

0

2

μA VPGOOD=5V

Charge current

ISS

1.8

-

2.5

-

3.2

50

μA

Standby voltage

VSS_STB

mV

[SLLM mode control block]

MCTL terminal voltage 1

VCONT

VQLLM

-0.3

1.5

-

0.3

3.0

V

Continuous mode

QL²M mode

MCTL terminal voltage 2

(Maximum LG off time : 50μs)

SL²M mode

MCTL terminal voltage 3

MCTL float level

VSLLM

VMCTL

4.5

1.5

-

REG1+0.3

3.0

V

(Maximum LG off time : ∞)

●Output condition table

Input

Output

CTL

Low

High

EN1

Low

High

Low

High

EN2

Low

High

Low

High

Low

High

Low

High

REG1(5V)

OFF

ON

REG2(3.3V)

OFF

ON

DC/DC1

OFF

ON

DC/DC2

OFF

ON

OFF

ON

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2010.03 - Rev.C

3/20

Technical Note

BD9524MUV

●Block Diagram, Application circuit

2

24

3

1

31

32

26

25

22

23

REG1

AGND

13

7

DGND

FS1

CL2

SCP2

CL1

SCP1

Overlap

Protection

Circuit

Overlap

Protection

Circuit

FS2

11

14

MCTL2

FS2

SL²M^TM

Block

SL²M^TM

Block

MCTL1

FS1

H³Reg^TM

Controller

Block

H³Reg^TM

Controller

Block

EN1

EN2

FB1

FB2

10

15

REF1

REF2

17

REG2

8

Thermal

Protection

5

20

PGOOD2

REG2

PGOOD1

Is+1

5V

Reg

3.3V

Reg

Is+2

16

9

VIN

Reference

Block

EN1

21

EN2

4

6

18

12

27

30

29

28

19

*Apply the supply voltage EXTVCC pin after REG1 pin is operated.

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2010.03 - Rev.C

4/20

Technical Note

BD9524MUV

●Pin Configuration

24 23 22 21

17

20 19 18

PGND1

LG1

Is+1

FB1

25

26

27

28

29

16

15

14

13

EXTVCC

REG2

FS1

AGND

FIN

REG1

12 MCTL

VIN 30

11

10

9

FS2

LG2

31

32

FB2

Is+2

PGND2

1

2

3

4

5

6

7

8

●Pin Function Table

PIN No.

1

PIN name

SW2

PIN Function

Highside FET source pin 2

Highside FET gate drive pin 2

HG Driver power supply pin 2

2

HG2

3

BOOT2

EN2

4

Vo2 ON/OFF pin (High=ON, Low=OFF)

Vo2 Power Good Open Drain Output pin

Vo2 soft start pin

5

PGOOD2

SS2

6

7

DGND

REF2

Is+2

Ground

8

Vo2 output voltage setting pin

Current sense pin +2

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

Reverse

FB2

Vo2 output voltage sense pin, current sense pin -2

Input pin for setting Vo2 frequency

FS2

MCTL

AGND

FS1

Mode shift pin (Low=continuous, Middle=QLLM, High=SLLM)

Input pin Ground

Input pin for setting Vo1 frequency

Vo2 output voltage sense pin, current sense pin -1

Current sense pin +1

FB1

Is+1

REF1

CTL

Vo1 output voltage setting pin

Linear regulator ON/OFF pin (High=ON, Low=OFF)

Vo1 soft start pin

SS1

PGOOD1

EN1

Vo1 Power Good Open Drain Output pin

Vo1 ON/OFF pin (High=ON, Low=OFF)

HG Driver power supply pin 1

Highside FET gate drive pin 1

Highside FET source pin 1

BOOT1

HG1

SW1

PGND1

LG1

Lowside FET source pin 1

Lowside FET gate drive pin 1

Outside power supply input pin

3.3V linear regulator output pin

5V linear regulator output pin

Power supply input pin

EXTVCC

REG2

REG1

VIN

LG2

Lowside FET gate drive pin 2

Lowside FET source pin 2

PGND2

FIN

Exposed Pad, Connect to GND

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2010.03 - Rev.C

5/20

Technical Note

BD9524MUV

●Reference data

EN

5V/div

CTL

PGOOD

5V/div

PGOOD

5V/div

10V/div

REG1

2V/div

SS

1V/div

Vo

SS

1V/div

Vo

REG2

2V/div

Fig.1 wake up (Vo=5.0V)

Fig.2 wake up (Vo=3.3V)

Fig.3 wake up (REG1, REG2)

Vo

20mV/div

IL

2A/div

SW

5V/div

LG

SW

5V/div

LG

SW

5V/div

LG

5V/div

Fig.4 CONT Mode (Io=0A)

Fig.5 CONT Mode (Io=0.4A)

Fig.6 CONT Mode (Io=1.4A)

Vo

20mV/div

IL

2A/div

SW

5V/div

LG

SW

5V/div

LG

SW

5V/div

LG

5V/div

Fig.7 QLLM (Io=0A)

Fig.8 QLLM (Io=0.4A)

Fig.9 QLLM (Io=1.4A)

Vo

20mV/div

IL

2A/div

SW

5V/div

LG

SW

5V/div

LG

SW

5V/div

LG

5V/div

Fig.10 SLLM (Io=0A)

Fig.11 SLLM (Io=0.4A)

Fig.12 SLLM (Io=1.4A)

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2010.03 - Rev.C

6/20

Technical Note

BD9524MUV

●Reference data

500

450

400

350

300

250

200

150

100

50

CONT Mode (VIN=19)

CONT Mode (VIN=12)

CONT Mode (VIN=7)

1.5

1200

1000

800

600

400

200

0

VIN=12V, Vo=5.0V

1.0

0.5

0.0

QLLM,SLLM (VIN=19)

QLLM,SLLM (VIN=12)

QLLM,SLLM (VIN=7)

Vo=5.0V

Vo=3.3V

QLLM

(VIN=7, 12, 19V)

CONT Mode (5.0V)

CONT Mode (3.3V)

QLLM, SLLM (3.3V)

SLLM

0

0.00

0.40

0.80

FS[V]

1.20

1.60

0.001

0.01

0.1

Io [A]

1

10

0.00

0.40

0.80

FS[V]

1.20

1.60

Fig.15 Io-frequency (Vo1=5.0V)

Fig.13 FS-ON TIME

Fig.14 FS-frequency

100

10

1

100

90

80

70

60

50

40

30

20

10

0

SLLM

CONT Mode

QLLM

CONT Mode

SLLM

0.1

7

10

13

16

VIN [V]

19

22

25

1

10

100

Io [mA]

1000

10000

Fig.16 Io-efficiency (VIN=12V, Vo1=5.0V)

Fig.17 VIN-IVIN (Io=0A, Vo1=5.0V)

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2010.03 - Rev.C

7/20

Technical Note

BD9524MUV

●Pin Descriptions

・VIN

This is the main power supply pin. The input supply voltage range is 7V to 25V. The duty cycle of BD9524MUV is determined by

input voltage and control output voltage. Therefore, when VIN voltage fluctuated, the output voltage also becomes unstable.

Since VIN line is also the input voltage of switching regulator, stability depends on the impedance of the voltage supply. It is

recommended to establish bypass capacitor and CR filter suitable for the actual application.

・CTL

When CTL pin voltage is at least 2.3V the status of the linear regulator output becomes active (REG1=5V, REG2=3.3V).

Conversely, the status switches off when CTL pin voltage goes lower than 0.8V. The switching regulator doesn’t become active

when the status of CTL pin is low, if the status of EN pin is high.

・EN

When EN pin voltage is at least 2.3V, the status of the switching regulator becomes active. Conversely, the status switches off

when EN pin voltage goes lower than 0.8V.

・REG1

This is the output pin for 5V linear regulator and also active in power supply for driver and control circuit of the inside. The

standby function for REG1 is determined by CTL pin. The voltage is 5V, with 100mA current ability. It is recommended that a

10uF capacitor (X5R or X7R) be established between REG1 and GND.

・REG2

This is the output pin for 3.3V linear regulator. The standby function for REG2 is determined by CTL. The voltage is 3.3V, with

100mA current ability. It is recommended that a 10uF capacitor (X5R or X7R) be established between REG2 and GND. It is

available to set REF and SS by the resistance division value from REG2 in case REF are not set from an external power supply.

・EXTVCC

This is the external input pin to REG1. When EXTVCC is beyond 4.4V, it supplies REG1 as EXTVCC is the power supply.

・REF

This is the setting pin for output voltage of switching regulator. It is so convenient to be synchronized to outside power supply.

This IC controls the voltage in the status of 2×REF≒FB.

・FB

This is the feedback pin from the output of switching regulator. This IC controls the voltage in the status of 2×REF≒FB.

・SS

This is the setting pin for soft start. The rising time is determined by the capacitor connected between SS and GND, and the fixed

current inside IC after it is the status of low in standby mode. It controls the output voltage till SS voltage catch up the REF pin to

become the double of the SS terminal voltage.

・FS

This is the input pin for setting the frequency. It is available to set it in frequency range is 200KHz to 500kHz.

・Is+

This is the sense pin for output current. In case it is connected to side of the coil resistance for sense current and the voltage is

set 65mV(typ) or more higher than FB pin voltage, the switching operation turns OFF.

・PGOOD

This is the open drain pin for deciding the output of switching regulator.

・MCTL

This is the switching shift pin for SLLM (Simple Light Load Mode). The efficiency in SLLM mode improves in setting MCTL pin to

1.5V or more. In case MCTL terminal voltage range is from 1.5 to 3.0V, LG maximum OFF time is 40usec, from 4.5V to

REG1+0.3V, LG maximum OFF time is to infinity. It is in continuous mode that MCTL pin voltage is set 0.3V or less.

・AGND,DGND

This is the ground pin.

・BOOT

This is the power supply pin for high side FET driver. The maximum voltage range to GND pin is to 35V, to SW pin is to 7V. In

switching operations, the voltage swings from (VIN+REG1) to REG1 by BOOT pin operation.

・HG

This is the highside FET gate drive pin. It is operated in switching between BOOT to SW. In case the output MOS is 3ohm /the

status of Hi, 2ohm/the status of Low, it is operated hi-side FET gate in high speed.

・SW

This is the ground pin for high side FET drive. The maximum voltage range to GND pin is to 30V. Switching operation swings

from the status of BOOT to the status of GND.

・LG

This is the lowside FET gate drive pin. It is operated in switching between REG1 to PGND. In case the output MOS is 2ohm /the

status of Hi, 0.5ohm/the status of Low, it is operated low-side FET gate in high speed.

・PGND

This is the ground pin for low side FET drive.

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2010.03 - Rev.C

8/20

Technical Note

BD9524MUV

● Explanation of Operation

The BD9524MUV is a 2ch synchronous buck regulator controller incorporating ROHM’s proprietary H³Reg^TMCONTROLLA

control system. When VOUT drops due to a rapid load change, the system quickly restores VOUT by extending the TON

time interval. Thus, it serves to improve the regulator’s transient response. Activating the Light Load Mode will also exercise

Simple Light Load Mode (SLLM) control when the load is light, to further increase efficiency.

H³Reg^TMcontrol

(Normal operation)

When VOUT falls to a reference voltage (2×REF), the drop

VOUT

is detected, activating the H³Reg^TMCONTROLLA system.

2×REF

1

f

tON=

×

[sec]・・・(1)

HG

LG

VIN

HG output is determined by the formula above.

(VOUT drops due to a rapid load change)

VOUT

When VOUT drops due to a rapid load change, and the

voltage remains below reference voltage after the

programmed tON time interval has elapsed, the system

quickly restores VOUT by extending the tON time, improving

the transient response.

Io

tON+α

HG

LG

Light Load Control

(SLLM)

VOUT

In SLLM (MCTL=”High voltage”), when the status of LG is

OFF and the coil current is within 0A (it flows to SW from

VOUT.), SLLM function is operated to prevent output next

HG. The status of HG is ON, when VOUT falls below

reference voltage again.

2×REF

HG

LG

0A

(QLLM)

VOUT

In QLLM (MCTL=”Hiz or Middle voltage”), when the status

of LG is OFF and the coil current is within 0A (it flows to

SW from VOUT.), QLLM function is operated to prevent

output next HG.

2×REF

HG

Then, VOUT falls below the output programmed voltage

within the programmed time (typ=40μs), the status of HG

is ON. In case VOUT doesn’t fall in the programmed time,

the status of LG is ON forcedly and VOUT falls. As a result,

he status of next HG is ON.

LG

0A

*Attention: H³Reg^TMCONTROLLA monitors the supplying current

from capacitor to load, using the ESR of output capacitor,

and realize the rapid response. Bypass capacitor used at

each load (Ex. Ceramic capacitor) exercise the effect

with connecting to each load side. Do not put a ceramic

capacitor on C_OUTside of power supply.

COUT

Load

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2010.03 - Rev.C

9/20

Technical Note

BD9524MUV

● Timing Chart

• Soft Start Function

Soft start is exercised with the EN pin set high. Current

control takes effect at startup, enabling a moderate output

voltage “ramping start.” Soft start timing and incoming

current are calculated with formulas (2) and (3) below.

EN

TSS

Soft start time

SS

VOUT

IIN

REF×Css

・・・(2)

Tss=

[sec]

[A]

2μA(typ)

Incoming current

Co×VOUT

・・・(3)

IIN=

Tss

(Css: Soft start capacitor; Co: Output capacitor)

・Timer Latch Type Short Circuit Protection

REF

×

1.4

Short protection kicks in when output falls to or below

REF × 1.4 (setting voltage × 0.7).

VOUT

When the programmed time period elapses, output is

latched OFF to prevent destruction of the IC. Output

voltage can be restored either by reconnecting the EN pin

or disabling UVLO.

SCP

EN / UVLO

・Over Voltage Protection

150μs(typ)

When output rise to or above REF×2.35

or less

or more

(output setting voltage ×1.175), output over voltage

protection is exercised, and low side FET goes up

maximum for reducing output（. LG=High, HG=Low）. When

output falls within the programmed time (typ=150μs), it

returns to the standard mode. When the programmed time

period elapses, output is latched OFF to prevent

destruction of the IC. Output voltage can be restored either

by reconnecting the EN pin or disabling UVLO.

REF×2.35

VOUT

150μs(typ)

Latch

OVP

EN / UVLO

・Over current protection circuit

During the normal operation, when VOUT becomes less

than reference voltage, HG becomes High during the

time tON . However, when inductor current exceeds

ILIMIT threshold, HG becomes OFF.

After 2.5μsec(typ), HG becomes ON again if the output

voltage is lower than the specific voltage level and IL is

lower than ILIMIT level.

tON

2.5usec

HG

LG

ILIMIT

IL

Vo

2×REF

increase Io

www.rohm.com

2010.03 - Rev.C

10/20

Technical Note

BD9524MUV

● External Component Selection

1. Inductor (L) selection

The inductor value is a major influence on the output ripple

current. As formula (4) below indicates, the greater the inductor or

the switching frequency, the lower the ripple current.

(VIN-VOUT)×VOUT

ΔIL

[A]・・・(4)

VIN

ΔIL=

L×VIN×f

The proper output ripple current setting is about 30% of maximum

output current.

IL

L

ΔIL=0.3×IOUTmax. [A]・・・(5)

VOUT

(VIN-VOUT)×VOUT

[H]・・・(6)

L=

Co

ΔIL×VIN×f

(ΔIL: output ripple current; f: switch frequency)

Output ripple current

※Passing a current larger than the inductor’s rated current will cause magnetic saturation in the inductor and decrease

system efficiency. In selecting the inductor, be sure to allow enough margin to assure that peak current does not exceed

the inductor rated current value.

※To minimize possible inductor damage and maximize efficiency, choose a inductor with a low (DCR, ACR) resistance.

2.Output Capacitor (CO) Selection

VIN

When determining the proper output capacitor, be sure to factor in the equivalent

series resistance required to smooth out ripple volume and maintain a stable

output voltage range.

VOUT

Output ripple voltage is determined as in formula (7) below.

L

ΔVOUT=ΔIL×ESR [V]・・・(7)

ESR

Co

Load

(ΔIL: Output ripple current; ESR: CO equivalent series resistance)

CEXT

※ In selecting a capacitor, make sure the capacitor rating allows sufficient

margin relative to output voltage. Note that a lower ESR can minimize output

ripple voltage.

Output Capacitor

Please give due consideration to the conditions in formula (8) below for output capacity, bear in mind that output rise time

must be established within the soft start time frame.

Tss: Soft start time

Limit: Over current detection 2A(Typ)

TSS×(Limit-IOUT)

Co+CEXT≦

・・・(8)

VOUT

Note: Improper capacitor may cause startup malfunctions.

3. Input Capacitor (Cin) Selection

The input capacitor selected must have low enough ESR resistance to fully

support large ripple output, in order to prevent extreme over current. The

formula for ripple current IRMS is given in (9) below.

VIN

Cin

√

VOUT

VIN(VIN-VOUT)

IRMS=IOUT×

[A]・・・(9)

L

VIN

Co

IOUT

2

Where VIN=2×VOUT, IRMS=

Input Capacitor

A low ESR capacitor is recommended to reduce ESR loss and maximize efficiency.

www.rohm.com

2010.03 - Rev.C

11/20

Technical Note

BD9524MUV

4. MOSFET Selection

Loss on the main MOSFET

Pmain=PRON+PGATE+PTRAN

VIN

main switch

VOUT

VIN²×Crss×IOUT×f

2

×RON×IOUT +Ciss×f×VDD+

=

・・・(10)

VIN

IDRIVE

VOUT

L

(Ron: On-resistance of FET; Ciss: FET gate capacitance;

f: Switching frequency Crss: FET inverse transfer function;

I_DRIVE: Gate peak current)

Co

synchronous switch

Loss on the synchronous MOSFET

Psyn=PRON+PGATE

VIN-VOUT

2

・・・(11)

×RON×IOUT +Ciss×f×VDD

=

VIN

5. Setting Detection Resistance (Detect ILIMIT at the peak current)

(A) High accuracy current detective circuit (use the low resistance)

VIN

The over current protection function detects the output ripple

current peak value. This parameter (setting value) is

determined as in formula (13) below.

L

R

VOUT

65mV(typ)

IL

ILMIT=

[A]・・・(12)

Co

R

(R: Detection resistance)

OCP

65mV

Current limit

(B) Low loss current detective circuit (use the DCR value of inductor)

VIN

When the over current protection is detected by DCR of inductor L,

this parameter (setting value) is determined as in formula (13)

below.

IL

(Application circuit:P18)

L

r

RL

C

VOUT

r×C

ILMIT=65mV(typ)×

[A]・・・(13)

Co

L

)

(RL=

r×C

(RL: the DCR value of inductor)

OCP

65mV

Current limit

(C) Low loss current detective circuit (the DCR value of inductor : high)

VIN

65mV(typ)

ILIMIT=

[A]・・・(14)

k×RL

IL

L

(1-k)RL kRL

L

,

R2

R1+R2

VOUT

( k=

= kR1C )

RL

R1

R2

C

Co

(RL: the DCR value of inductor)

65mV

Current limit

www.rohm.com

2010.03 - Rev.C

12/20

Technical Note

BD9524MUV

6. Setting standard voltage (REF)

VIN

It is available to set the reference voltage (REF)

with outside supply voltage ×2 [V] by using

outside power supply voltage.

H³Reg^TM

R

S

Q

REF

CONTROLLA

Outside

voltage

FB

R0

REG2(3.3V)

REF

It is available to set the reference voltage (REF)

by the resistance division value from REG2 in

case REF is not set from an external power

supply.

VIN

R1

R2

H³Reg^TM

R

S

Q

R2

CONTROLLA

REF=

×REG2 [V]・・・(15)

R1+R2

FB

R0

7. Setting output voltage

This IC is operated that output voltage is REF×2≒FB.

And it is operated that output voltage is feed back to FB pin.

VIN

H³Reg^TM

SLLM

Output

voltage

R

S

Q

REF

CONTROLLA

Driver

Circuit

SLLM

FB

R0

www.rohm.com

2010.03 - Rev.C

13/20

Technical Note

BD9524MUV

●I/O Equivalent Circuit

1, 24pin (SW2, SW1)

BOOT

2, 23pin (HG2, HG1)

3, 22pin (BOOT2, BOOT1)

BOOT

HG

SW

4, 21pin (EN2, EN1)

5, 20pin (PGOOD2, PGOOD1)

9, 16pin (Is+2, Is+1)

12pin (MCTL)

6, 19pin (SS2, SS1)

REG1

8, 17pin (REF2, REF1)

10, 15pin (FB2, FB1)

REG1

11, 14pin (FS2, FS1)

18pin (CTL)

www.rohm.com

2010.03 - Rev.C

14/20

Technical Note

BD9524MUV

●I/O Equivalent Circuit

26, 31pin (LG1, LG2)

27pin (EXTVCC)

28pin (REG2)

REG1

29pin (REG1)

30pin (VIN)

VIN

●Evaluation Board Circuit (Vo1=5V f1=300kHz Vo2=3.3V f2=400kHz)

REG1

VIN

12V

VIN VIN

BD9524MUV

VIN

R1

30

18

21

D3

R50

C27

CTL

VIN

REG1

C1

22

BOOT1

R2

C25

C26

CTL

EN1

C24

CTL

EN1

R49

R47

Q2

23

24

EN1

EN2

VO1

HG1

SW1

R3

R4

L1

R48

R44

C21 C22

C33 C32 C20

D1

EN2

R43

4

R46

EN2

Q1

26

25

LG1

C23

R45 C34

REG1

TPQ6

R57

29

5V

REG1

R10

C2

C3

C4

PGND1

Is+1

R56

REG2

3.3V

Q5

R40

28

27

REG2

16

15

R55

EXTVCC

Vo1

C19

R39

R5

FB1

EXTVCC

REG1

REG2

R6

VIN VIN

R8

D4

C17

R35

R34

17

3

REF1

BOOT2

C14

R7

R9

C5

C6

C15

C16

2

1

Q4

HG2

SW2

VO2

SW2

L2

R33

R32

8

REF2

SS1

19

C11 C12 C29 C30 C10

R30

Q3

VIN

REG2

R29

D2

31

32

LG2

R54

SS2

6

R28

C13

R31 C36

FS1

PGND2

TPQ5

R63

R58

R13

R16

C8

C7

R15

14

FS1

R25

Q6

C18

9

Is+2

FB2

R17

FS2

REG2

R24

C9

REG1

R20

REG1

R52

10

R12

PGOOD1

11

12

FS2

C31

R14

R37

20

5

MCTL

PGOOD1

PGOOD2

MCTL

DGND

AGND

7

R36

C28

R21

13

www.rohm.com

2010.03 - Rev.C

15/20

Technical Note

BD9524MUV

DESIGNATION RATING

PART No.

COMPANY

ROHM

-

DESIGNATION

R58

R63

C1

RATING

1MΩ

PART No.

COMPANY

R1

0Ω

15kΩ

47kΩ

30kΩ

-

MCR03EZHJ000

MCR03PZHZF1004

-

ROHM

R2

MCR03EZHJ000

-

R3

MCR03EZHJ000

10uF(25V)

10uF(6.3V)

CM32X7R106M25A

GRM21BB10J106KD

KYOCERA

R4

MCR03EZHJ000

C2

MURATA

R5

MCR03EZHJ000

C3

MURATA

R6

MCR03PZHZF1502

C4

MURATA

R7

MCR03PZHZF4702

C5

0.01uF(50V) GRM188B11H103KD

1000pF(50 V) GRM188B11H102KD

1000pF(50V) GRM188B11H102KD

MURATA

R8

MCR03PZHZF3002

C6

MURATA

R9

MCR03PZHZF3002

C7

MURATA

R10 *

R11 *

R12

R13

R14

R15 *

R16

R17

R18 *

R19 *

R20

R21

R22 *

R24

R25

R26 *

R27 *

R28

R29

R30

R31 *

R32

R33

R34

R35

R36

R37

R39

R40

R41 *

R42 *

R43

R44

R45 *

-

C8

MURATA

-

C9

-

C10

C11

C12

C13 *

C14

C15

C16

C17

C18

C19

C20

C21

C22

C23 *

C24

C25

C26

C27

C28

C29

C30

C31

C32

C33

C34 *

C35 *

C36 *

C37 *

D1

-

1MΩ

51kΩ

-

MCR03PZHZF1004

ROHM

-

220uF

6TPE220MI

SANYO

MCR03PZHZF5102

-

0.47uF(10V) GRM188B11A474KD

MURATA

36kΩ

-

MCR03PZHZF3602

ROHM

-

10uF(25V)

CM32XR7106M25A

KYOCERA

-

10uF(25V)

CM32XR7106M25A

KYOCERA

-

10uF(6.3V)

GRM21BB10J106KD

MURATA

100kΩ MCR03PZHZF1003

ROHM

-

0Ω

-

MCR03EZHJ000

-

0Ω

-

MCR03EZHJ000

-

ROHM

-

220uF

6TPE220MI

SANYO

-

0.47uF(10V) GRM188B11A474KD

MURATA

0Ω

-

MCR03EZHJ000

-

ROHM

-

10uF(25V)

CM32XR7106M25A

KYOCERA

10uF(25V)

CM32XR7106M25A

KYOCERA

10uF(6.3V)

GRM21BB10J106KD

MURATA

-

0Ω

5mΩ

0Ω

MCR03EZHJ000

PMR100HZPFU5L00

MCR03EZHJ000

ROHM

-

100kΩ MCR03PZHZF1003

-

0Ω

-

MCR03EZHJ000

-

MCR03EZHJ000

-

MCR03EZHJ000

-

Diode

RSX501L-20

RB520S-30

ROHM

0Ω

-

MCR03EZHJ000

-

ROHM

-

D2

D3

D4

RB520S-30

CDEP105NP-2R5MC-

R46

R47

0Ω

MCR03EZHJ000

ROHM

L1

L2

2.5uH

Sumida

32

CDEP105NP-2R5MC-

32

R48

R49

R50

R52

R54

R55

R56

R57

5mΩ

PMR100HZPFU5L00

ROHM

Q1

Q2

Q3

Q4

Q5

Q6

U1

FET

-

uPA2702

NEC

-

0Ω

MCR03EZHJ000

ROHM

uPA2702

0Ω

MCR03EZHJ000

ROHM

uPA2702

-

uPA2702

-

BD9524MUV

ROHM

* Patterns for over current detection used DCR.

www.rohm.com

2010.03 - Rev.C

16/20

Technical Note

BD9524MUV

●Handling method of unused pin during using only 1ch DC/DC.

If using only 1ch DC/DC and 2ch pin is set to be off at all times, please manage the unused pin as diagram below.

PIN No,

PIN Name

Management

1

2

SW2

GND

HG2

OPEN

GND

3

BOOT2

EN2

4

GND

5

PGOOD2

SS2

GND

6

GND

8

REF2

Is+2

GND

9

GND

10

11

31

FB2

GND

FS2

GND

LG2

OPEN

REG1

VIN

12V

VIN VIN

BD9524MUV

R1

30

D3

R50

VO1

VIN

C27

VIN

CTL

C1

22

BOOT1

C25

C26

R2

CTL

18

C24

CTL

R49

R47

Q2

23

24

REG1

EN1

R51

R60

VO1

HG1

SW1

R3

L1

R48

R44

21

EN1

C21 C22

C33 C32 C20

D1

R43

4

R46

EN2

Q1

26

25

LG1

C23

R10

R45 C34

REG1

TPQ6

R57

29

5V

REG1

C2

C3

C4

PGND1

Is+1

R56

REG2

3.3V

Q5

R40

28

REG2

16

15

R55

EXTVCC

Vo1

C19

R39

R5

27

FB1

EXTVCC

REG2

R6

17

3

REF1

BOOT2

R7

C5

2

1

HG2

SW2

8

REF2

19

SS1

VIN

REG2

31

32

C7

LG2

SS2

6

FS1

PGND2

R58

R16

14

FS1

C18

9

Is+2

FB2

R17

10

REG1

R20

PGOOD1

11

FS2

R21

MCTL

20

5

PGOOD1

PGOOD2

12

MCTL

7

C28

DGND

13

AGND

www.rohm.com

2010.03 - Rev.C

17/20

Technical Note

BD9524MUV

●Notes for use

1. This integrated circuit is a monolithic IC, which (as shown in the figure below), has P isolation in the P substrate and

between the various pins. A P-N junction is formed from this P layer and N layer of each pin, with the type of junction

depending on the relation between each potential, as follows:



When GND> element A> element B, the P-N junction is a diode.

When element B>GND element A, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, as well as operating malfunctions and physical damage. Therefore, be careful to avoid

methods by which parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an

input pin.

Resistor

Transistor (NPN)

B

Pin A

Pin B

C

E

Pin A

B

C

E

N

P⁺

N

P

Parasitic

element

N

Parasitic

element

P substrate

GND

Parasitic element

Other adjacent elements

2. In some modes of operation, power supply voltage and pin voltage are reversed, giving rise to possible internal circuit

damage. For example, when the external capacitor is charged, the electric charge can cause a VCC short circuit to the

GND. In order to avoid these problems, inserting a VCC series countercurrent prevention diode or bypass diode between

the various pins and the VCC is recommended.

Bypass diode

Countercurrent

VCC

3. Absolute maximum rating

Although the quality of this IC is rigorously controlled, the IC may be destroyed when applied voltage or operating

temperature exceeds its absolute maximum rating. Because short mode or open mode cannot be specified when the IC is

destroyed, it is important to take physical safety measures such as fusing if a special mode in excess of absolute rating

limits is to be implemented.

4.GND potential

Make sure the potential for the GND pin is always kept lower than the potentials of all other pins, regardless of the

operating mode.

5. Thermal design

In order to build sufficient margin into the thermal design, give proper consideration to the allowable loss (Power

Dissipation) in actual operation.

6. Short-circuits between pins and incorrect mounting position

When mounting the IC onto the circuit board, be extremely careful about the orientation and position of the IC. The IC may

be destroyed if it is incorrectly positioned for mounting. Do not short-circuit between any output pin and supply pin or

ground, or between the output pins themselves. Accidental attachment of small objects on these pins will cause shorts and

may damage the IC.

www.rohm.com

2010.03 - Rev.C

18/20

Technical Note

BD9524MUV

7. Operation in strong electromagnetic fields

Use in strong electromagnetic fields may cause malfunctions. Use extreme caution with electromagnetic fields.

8. Thermal shutdown circuit

This IC is provided with a built-in thermal shutdown (TSD) circuit, which is activated when the operating temperature

reaches 175℃ (standard value), and has a hysteresis range of 15℃ (standard). When the IC chip temperature rises to

the threshold, all the inputs automatically turn OFF. Note that the TSD circuit is provided for the exclusive purpose shutting

down the IC in the presence of extreme heat, and is not designed to protect the IC per se or guarantee performance when

or after extreme heat conditions occur. Therefore, do not operate the IC with the expectation of continued use or

subsequent operation once the TSD is activated.

9. Capacitor between output and GND

When a larger capacitor is connected between the output and GND, Vcc or VIN shorted with the GND or 0V line – for any

reason – may cause the charged capacitor current to flow to the output, possibly destroying the IC. Do not connect a

capacitor larger than 1000uF between the output and GND.

10. Precautions for board inspection

Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be

certain to use proper discharge procedure before each process of the operation. To prevent electrostatic accumulation and

discharge in the assembly process, thoroughly ground yourself and any equipment that could sustain ESD damage, and

continue observing ESD-prevention procedures in all handling, transfer and storage operations. Before attempting to

connect components to the test setup, make certain that the power supply is OFF. Likewise, be sure the power supply is

OFF before removing any component connected to the test setup.

11. GND wiring pattern

When both a small-signal GND and high current GND are present, single-point grounding (at the set standard point) is

recommended, in order to separate the small-signal and high current patterns, and to be sure the voltage change

stemming from the wiring resistance and high current does not cause any voltage change in the small-signal GND. In the

same way, care must be taken to avoid wiring pattern fluctuations in any connected external component GND.

●Power Dissipation

[mW]

1000

70mm×70mm×1.6mm Glass-epoxy PCB

θj-a=142.0℃/W

880mW

800

600

With no heat sink θj-a=328.9℃/W

400

200

380mW

0

25

50

75

100

125

150 [℃]

Ambient Temperature [Ta]

www.rohm.com

2010.03 - Rev.C

19/20

Technical Note

BD9524MUV

●Ordering part number

B

D

9

5

2

4

M U V

-

E

2

Part No.

Package

Packaging and forming specification

MUV : VQFN032V5050 E2: Embossed tape and reel

VQFN032V5050

5.0 0.1

Tape

Embossed carrier tape

2500pcs

Quantity

E2

Direction

of feed

1PIN MARK

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

S

(

)

0.08

S

3.4 0.1

C0.2

1

8

9

32

16

25

24

17

0.75

Direction of feed

1pin

+0.05

0.04

0.25

0.5

-

Reel

Order quantity needs to be multiple of the minimum quantity.

(Unit : mm)

∗

www.rohm.com

2010.03 - Rev.C

20/20

Notice

N o t e s

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content speciﬁed herein is subject to change for improvement without notice.

The content speciﬁed herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the speciﬁcations,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information speciﬁed in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information speciﬁed herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products speciﬁed in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, ofﬁce-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products speciﬁed in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, ﬁre or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, ﬁre control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-

controller or other safety device). ROHM shall bear no responsibility in any way for use of any

of the Products for the above special purposes. If a Product is intended to be used for any

such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology speciﬁed herein that may

be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

www.rohm.com

R1010

A


型号：	BD9524MUV_10
厂家：	ROHM
描述：	Main Power Supply IC for Note PC (Linear Regulator Integrated) 主电源IC，适用于笔记电脑（线性稳压器集成）稳压器电脑 PC
文件：	总21页 (文件大小：606K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD9524MUV_10 [ROHM]

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