BD93F10MWV [ROHM]
BD93F10MWV is a full function USB Type-C Power Delivery (PD) Controller that supports USB PD using base-band communication. It is compatible with USB Type-C specification and Power Delivery specification. BD93F10MWV includes support for the PD policy engine and communicates with an Embedded Controller or the SoC via host interface.;
| 型号： | BD93F10MWV |
| 厂家： | 
ROHM |
| 描述： | BD93F10MWV is a full function USB Type-C Power Delivery (PD) Controller that supports USB PD using base-band communication. It is compatible with USB Type-C specification and Power Delivery specification. BD93F10MWV includes support for the PD policy engine and communicates with an Embedded Controller or the SoC via host interface. 光电二极管 |
| 文件： | 总21页 (文件大小：1061K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
USB Type-C Power Delivery
High Voltage Protection of CC Pins
USB Type-C Power Delivery Controller
BD93F10MWV
General Description
Key Specifications
BD93F10MWV is a full function USB Type-C Power
Delivery (PD) Controller that supports USB PD using
base-band communication. It is compatible with USB
Type-C Specification and Power Delivery specification.
BD93F10MWV includes support for the PD policy engine
and communicates with an Embedded Controller or the
SoC via host interface.
VBUS Voltage Range:
VSVR Voltage Range:
Operating Temperature Range: -30 °C to +85 °C
Protection Voltage of CC Pins: 28 V
3.67 V to 22 V
3.1 V to 5.5 V
FW Revision
Rev.7525(1D65h)
Features
Applications
32 Bit ARM® Cortex®-M0 Processor Embedded
USB Type-C Specification Ver.1.3 Compatible
USB PD Specification Ver.3.0 Compatible
Integrated VBUS N-ch MOSFET Switch Gate Driver
Integrated VBUS Discharge Switch
Printers
Projectors
Mobile Batteries
POS
Drone
Protection Voltage of CC Pins is 28 V
Supports Dead Battery operation
I2C Interface for Host Communication
Smart Speaker
LAN Device
Set Top Box
Package
UQFN040V5050
W (Typ) x D (Typ) x H (Max)
5.0 mm x 5.0 mm x 1.0 mm
Typical Application Circuits
Q10
Q11
Power Source
Power Sink
Q20
Q21
VBUS
CS1S
1.0 μF
RDSCHG
CVB
CS2S
120 Ω
10 μF
1.0 μF
VSVR
3.3V / 5.0V
39
20
VCCIN
VCONNIN
XCLPOFF1
CC1
VDDIO
9
7
RSDA RSCL
3.3 kΩ 3.3 kΩ
(open)
8
10
11
18
19
21
22
23
26
30
25
29
CC1
SDA0
SCL0
USB
CC2
CC2
BD93F10MWV
GPIO0
GPIO1
GPIO2
GPIO5
GPIO9
GPIO4
GPIO8
(open)
(open)
HOST I/F
Type-C PD
Receptacle
(open)
XCLPOFF2
(Package: UQFN040V5050)
5.0 mm x 5.0 mm x 1.0 mm
ADCVREF
ADCVREF
U1
ADCVREF
RVU1 RVU2 RPU
5
RTHU
RVD1
RVD2
RPD
24
27
28
22 kΩ
GPIO3
GPIO6
GPIO7
14
15
16
ADCIN
IDSEL
ATST1
40
RTHD
t°
XRST
D+/D-
RX1+/RX1-
RX2+/RX2-
TX1+/TX1-
TX2+/TX2-
USB
PHY
RAT1
100 kΩ
RIDD
100 kΩ
CV38
CVCC
CV15
CS 0.1 μF
0.1 μF
4.7 μF
1.0 μF
GND
GND
RS 10 mΩ
GND
“ARM® Cortex® “is a registered trademark of Arm Limited.
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
www.rohm.com
TSZ02201-0Q3Q0H507800-1-2
02.Apr.2020 Rev.001
© 2020 ROHM Co., Ltd. All rights reserved.
1/18
TSZ22111 • 14 • 001
BD93F10MWV
Contents
General Description........................................................................................................................................................................1
Features..........................................................................................................................................................................................1
Key Specifications ..........................................................................................................................................................................1
FW Revision ...................................................................................................................................................................................1
Applications ....................................................................................................................................................................................1
Package..........................................................................................................................................................................................1
Typical Application Circuits .............................................................................................................................................................1
Contents .........................................................................................................................................................................................2
Pin Configuration ............................................................................................................................................................................3
Pin Description................................................................................................................................................................................4
Block Diagram ................................................................................................................................................................................5
Description of Block........................................................................................................................................................................6
Absolute Maximum Ratings ............................................................................................................................................................7
Thermal Resistance........................................................................................................................................................................7
Recommended Operating Conditions.............................................................................................................................................8
Internal Memory Cell Characteristic................................................................................................................................................8
Electrical Characteristic ..................................................................................................................................................................8
Timing Chart .................................................................................................................................................................................10
I/O Equivalence Circuits................................................................................................................................................................12
Operational Notes.........................................................................................................................................................................14
1.
2.
3.
4.
5.
6.
7.
8.
Reverse Connection of Power Supply............................................................................................................................14
Power Supply Lines........................................................................................................................................................14
Ground Voltage...............................................................................................................................................................14
Ground Wiring Pattern....................................................................................................................................................14
Recommended Operating Conditions.............................................................................................................................14
Inrush Current.................................................................................................................................................................14
Testing on Application Boards ........................................................................................................................................14
Inter-pin Short and Mounting Errors ...............................................................................................................................14
Unused Input Pins ..........................................................................................................................................................14
Regarding the Input Pin of the IC ...................................................................................................................................15
Ceramic Capacitor..........................................................................................................................................................15
Thermal Shutdown Circuit (TSD)....................................................................................................................................15
Over Current Protection Circuit (OCP) ...........................................................................................................................15
9.
10.
11.
12.
13.
Ordering Information.....................................................................................................................................................................16
Marking Diagram ..........................................................................................................................................................................16
Physical Dimension and Packing Information...............................................................................................................................17
Revision History............................................................................................................................................................................18
www.rohm.com
TSZ02201-0Q3Q0H507800-1-2
02.Apr.2020 Rev.001
© 2020 ROHM Co., Ltd. All rights reserved.
2/18
TSZ22111 • 15 • 001
BD93F10MWV
Pin Configuration
(TOP VIEW)
30
29
28
27
26
25
24
23
22
21
VS 31
20 VDDIO
19 SCL0
18 SDA0
17 GND
S1_DRV 32
S1_SRC 33
S2_DRV 34
S2_SRC 35
DISCHG 36
VB 37
16 ATST1
15 IDSEL
14 ADCIN
13 CSP
GND 38
EXP-PAD
VSVR 39
XRST 40
12 CSN
Pin 1 mark
11 XCLPOFF2
1
2
3
4
5
6
7
8
9
10
www.rohm.com
TSZ02201-0Q3Q0H507800-1-2
02.Apr.2020 Rev.001
© 2020 ROHM Co., Ltd. All rights reserved.
3/18
TSZ22111 • 15 • 001
BD93F10MWV
Pin Description
Pin No.
Pin Name
LDO38
VCCIN
GND
Function
1
Internal LDO 3.8 V
2
Internal power supply (for internal use only)
3
Ground
4
LDO15
ADCVREF
ATST2
XCLPOFF1
CC1
Internal LDO 1.5 V
5
Reference voltage for ADC
6
Analog test pin. Short to GND.
7
Disable clamper of CC1 L: Dead-battery not support, Open: Dead-battery support
8
Configuration channel 1 for Type-C
9
VCONNIN
CC2
Input power for VCONN
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
Configuration channel 2 for Type-C
XCLPOFF2
CSN
Disable clamper of CC2 L: Dead-battery not support, Open: Dead-battery support
Current sensing negative input
Current sensing positive input
Input voltage to ADC
I2C Device ID Select
Analog test pin. Short to GND.
Ground
CSP
ADCIN
IDSEL
ATST1
GND
SDA0
SMBus slave data
SMBus slave clock
GPIO H level voltage input
GPIO
SCL0
VDDIO
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
VS
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
Source voltage monitor input
Power path FET gate control
Power path FET BG/SRC voltage
Power path FET gate control
Power path FET BG/SRC voltage
Discharge NMOS drain (Max 28 V)
Power supply from VBUS
Ground
S1_DRV
S1_SRC
S2_DRV
S2_SRC
DISCHG
VB
GND
VSVR
Power supply from 3.3 V / 5 V system voltage rail
System reset signal input
XRST
EXP-PAD connects with substrate of IC. On the board, this PAD shall be shorted to
Ground or be open condition.
-
EXP-PAD
www.rohm.com
TSZ02201-0Q3Q0H507800-1-2
© 2020 ROHM Co., Ltd. All rights reserved.
4/18
TSZ22111 • 15 • 001
02.Apr.2020 Rev.001
BD93F10MWV
Block Diagram
VS
S1_DRV
S1_SRC
S2_DRV
S2_SRC
DSCHG
VB
GPIOs
VDDIO
SCL0
OSC
SDA0
GND
Device Policy Manager
Protocol Layer
POWCNT
ATST1
IDSEL
ADCIN
CSP
Policy Engine
ADC
GND
VSVR
CSN
VREF
BB_PHY
CC_PHY
XRST
XCLPOFF2
www.rohm.com
TSZ02201-0Q3Q0H507800-1-2
02.Apr.2020 Rev.001
© 2020 ROHM Co., Ltd. All rights reserved.
5/18
TSZ22111 • 15 • 001
BD93F10MWV
Description of Block
(VREF)
VREF block is internal power source circuit of this LSI with the UVLO (Under Voltage Lock Out) function.
The main power input is VSVR. And for supporting dead battery operation, VB can become power source of this LSI when
VSVR does not exist.
VREF block monitors VSVR and VB, and chooses an appropriate power supply by detecting normal condition or dead
battery condition. From the voltage it chose, it generates VCCIN and LDO15 for internal circuits.
(OSC)
OSC block is reference clock circuit of this LSI. This LSI does not need another external clock source.
(I/F Bus)
I/F Bus block have I2C Slave for Host Control. The I2C Slave is intended to communicate with HOST MCU such as the EC.
(Device Policy Manager)
Device Policy Manager manages USB Type-C Power Delivery operation. It is constructed in internal MCU and program
memory. It is accessible using Host IF Bus from external host MCU. And the writing access to program memory is possible
from Host IF Bus.
(Policy Engine / Protocol Layer)
Policy Engine and Protocol Layer carry out USB Power Delivery operation. These blocks are constructed in internal MCU
and the program memory in the same way as Device Policy Manager.
(CC_PHY)
CC_PHY block is a physical layer of USB Type-C. It supports the following function
Pull-down Resistor for Up Facing Port (UFP)
the CC1 pin and the CC2 pin clamper for dead battery
VBUS Detecting
(BB_PHY)
BB_PHY block is a physical layer of USB Power Delivery. By control from Protocol Layer, it performs coding,
decoding and judgment of CRC and communicates Base Band PD signal.
(POWCONT)
POWCONT block is power path control circuit of VBUS. It has two gate drivers for Nch MOSFET switch, high withstand
discharge switch for VBUS and over voltage protection (OVP).
(ADC)
ADC block is a general-purpose ADC. It is used for the monitoring of various operating states. Monitoring object is external
input voltage for thermistor circuit, VBUS voltage, system Voltage, die temperature and source current
www.rohm.com
TSZ02201-0Q3Q0H507800-1-2
02.Apr.2020 Rev.001
© 2020 ROHM Co., Ltd. All rights reserved.
6/18
TSZ22111 • 15 • 001
BD93F10MWV
Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
Supply Voltage [VSVR]
VSVR
VB
-0.3 to +6.0
-0.3 to +28
V
V
VBUS Voltage [VB]
I/O Voltage [VDDIO]
VDDIO
Tjmax
Tstg
VSRC
VDRV
VHV
-0.3 to VSVR (or VB)
+150
V
Maximum Junction Temperature
Storage Temperature Range
S1_SRC, S2_SRC Voltage
S1_DRV, S2_DRV Voltage
DSCHG, CC1, CC2, VS Voltage
LDO15, ADCVREF, ADCIN Voltage
°C
°C
V
-55 to +150
-0.3 to +22
-0.3 to (VSRC+6.0)
-0.3 to +28
V
V
VLV
-0.3 to +2.1
V
Differential Voltage Between CSN and
CSP
VCS
-0.2 to +0.2
-0.3 to +6.0
V
V
All Other Pins
VOTH
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance (Note 1)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s (Note 3)
2s2p (Note 4)
UQFN040V5050
Junction to Ambient
Junction to Top Characterization Parameter (Note 2)
θJA
113.6
8
24.5
3
°C/W
°C/W
ΨJT
(Note 1) Based on JESD51-2A (Still-Air).
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Thermal Via (Note 5)
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
Pitch
Diameter
4 Layers
1.20 mm
Φ0.30 mm
Top
Copper Pattern
Bottom
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
(Note 5) This thermal via connects with the copper pattern of all layers.
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0Q3Q0H507800-1-2
02.Apr.2020 Rev.001
7/18
BD93F10MWV
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Operating Temperature
Supply Voltage
Topr
VSVR
VB
-30
3.1
+25
3.3
-
+85
5.5
22
°C
V
VBUS Voltage
3.67
1.7
V
VDDIO Voltage
VDDIO
3.3
5.5
V
Internal Memory Cell Characteristic (Unless otherwise specified VSVR = VDDIO = 3.3 V, VB = 5.0 V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Memory Data rewrite cycles (Note 6)
Memory Data retention life (Note 7)
Mrw
Mrl
100
20
-
-
-
-
cycles Ta = -30 °C to 85 °C
years Ta = -30 °C to 85 °C
(Note 6) BD93F10MWV cannot rewrite FW. ROHM cannot guarantee if FW is rewriting.
(Note 7) Not 100% Tested
Electrical Characteristic (Unless otherwise specified VSVR = VDDIO = 3.3 V, VB = 5.0 V, Ta = 25 °C)
Parameter
Current Consumption
Shutdown Current
Symbol
Min
Typ
Max
Unit
Conditions
XRST=” L”
VSVR Current
ISD
ISP
IST
-
-
-
30
150
2
70
-
μA
μA
USB-C Un-Attached
VSVR Current
The option function stops.
USB-C Attached, PD Standby
VSVR Current
Stop Current
Standby Current
-
mA
VREF
VCCIN Voltage
VCCIN
V38
-
-
3.3
3.8
-
-
V
V
Standby
Standby
VB = 5 V
LDO38 Output Voltage
LDO15 Output Voltage
VSVR UVLO release
VB UVLO release
V15D
-
-
-
-
1.5
-
-
V
V
V
V
Standby
VDBSVR
VBUSDET
VDBDDIO
3.10
3.67
1.7
-
VDDIO UVLO release
1.0
Digital DC Characteristics (GPIOx: x = 2 to 9)
0.8 x
VDDIO
VDDIO
0.3
+
Input “H” Voltage 1
VIH1
-
V
0.2 x
VDDIO
Input “L” Voltage 1
Input Leak Current 1
Output “H” Voltage 1
VIL1
IIL1
-0.3
-
0
-
V
μA
V
-5
+5
0.85 x
VDDIO
VOH1
VOL1
-
IL = +1 mA
IL = -1 mA
Output “L” Voltage 1
Digital DC Characteristics (SDA0,SCL1)
Output “L” Voltage 2
SCL Frequency
-
-
0.3
V
VOL3
fSCL
-
-
-
0.4
V
IL = -3 mA
0
400
kHz
CC_PHY
Pull-Down Resistor
RRD
4.6
5.1
5.6
kΩ
www.rohm.com
TSZ02201-0Q3Q0H507800-1-2
02.Apr.2020 Rev.001
© 2020 ROHM Co., Ltd. All rights reserved.
8/18
TSZ22111 • 15 • 001
BD93F10MWV
Electrical Characteristic - continued
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Voltage Measurement
ADVREF Voltage
VADC
VRV
1.45
0
1.5
-
1.55
28
V
V
VB/VS Voltage Measurement Range
External Input Voltage Measurement
Range
VRIN
0
-
1.5
V
POWCNT
Output Voltage between
S1_DRV and S1_SRC or
S2_DRV and S2_SRC
VOSW
4.4
5.5
6.6
V
Sx_SRC = 5.0 V (x = 1 or 2)
Discharge Switch on Resistance
OVP Detecting Voltage Accuracy
RDSC
-
2.0
-
-
Ω
DSCHG = 0.2 V
ACOVP
-5
+5
%
OVP Detecting Voltage = 6.0 V
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0Q3Q0H507800-1-2
02.Apr.2020 Rev.001
9/18
BD93F10MWV
Timing Chart
(Normal Wakeup)
3.3V
VSVR
VB
0V
0V
0V
0V
0V
0V
5V
t1
VDDIO
VCONNIN
LDO38
(Internal)
1.5V
LDO15
(Internal)
CC1 or CC2
(Pull Down)
Hi-Z
Pull Down Enable
LSI Operation Shutdown
HW Standby
Initialization
Active(Type-C)
t2
According to USB Type-C Specification
Timing Characteristic (Ta = 25 °C)
Parameter
Symbol
Min
Typ
Max
-
Unit
Conditions
VDDIO Input Timing from VSVR
Input
t1
t2
0
-
-
-
ms
ms
Not emergency operating.
I2C (slave) is disable.
LSI Wakeup Time
100
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0Q3Q0H507800-1-2
02.Apr.2020 Rev.001
10/18
BD93F10MWV
Timing Chart - Continued
(Normal Shutdown)
t3
3.3V
VSVR
0.5V
0V
5V
VB
3.3V
t4
VDDIO
0.5V
0V
VCONNIN
0V
LDO38
(Internal)
0V
1.5V
LDO15
(Internal)
0V
CC1 or CC2
(Pull Down)
Pull Down Enable
Hi-Z
Timing Characteristic (Ta = 25 °C)
Parameter
Symbol
t3
Min
-
Typ
-
Max
400
Unit
ms
Conditions
VSVR Falling Time
As for the timing of t4, it is arbitrary. But LSI may not maintain action of USB Type-C PD when it is lost during LSI action.
www.rohm.com
TSZ02201-0Q3Q0H507800-1-2
02.Apr.2020 Rev.001
© 2020 ROHM Co., Ltd. All rights reserved.
11/18
TSZ22111 • 15 • 001
BD93F10MWV
I/O Equivalence Circuits
PIN
Pin Name
Equivalent Circuit Diagram
No.
VB
Pin
1
LDO38
GND
GND
GND
VCCIN
Pin
4
5
LDO15
ADCVREF
GND
GND
GND
Pin
7
11
XLCPOFF1
XCLPOFF2
GND
Pin
8
10
CC1
CC2
GND
GND
GND
VCCIN
Pin
12
13
CSN
CSP
GND
GND
GND
Pin
ADCVREF
14
ADCIN
GND
www.rohm.com
TSZ02201-0Q3Q0H507800-1-2
02.Apr.2020 Rev.001
© 2020 ROHM Co., Ltd. All rights reserved.
12/18
TSZ22111 • 15 • 001
BD93F10MWV
I/O Equivalence Circuits - Continued
Pin
Pin Name
No.
Equivalent Circuit Diagram
VCCIN
Pin
15
IDSEL
GND
GND
VDDIO
18
19
21
22
23
24
25
26
27
28
29
30
SDA0
SCL0
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
Pin
GND
GND
Pin
32
34
S1_DRV
S2_DRV
Sx_SRC
Sx_DRV
Pin
33
35
S1_SRC
S2_SRC
GND
Pin
31
36
VS
DSCHG
GND
VCCIN
Pin
40
XRST
GND
www.rohm.com
TSZ02201-0Q3Q0H507800-1-2
02.Apr.2020 Rev.001
© 2020 ROHM Co., Ltd. All rights reserved.
13/18
TSZ22111 • 15 • 001
BD93F10MWV
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
www.rohm.com
TSZ02201-0Q3Q0H507800-1-2
02.Apr.2020 Rev.001
© 2020 ROHM Co., Ltd. All rights reserved.
14/18
TSZ22111 • 15 • 001
BD93F10MWV
Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 1. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
www.rohm.com
TSZ02201-0Q3Q0H507800-1-2
02.Apr.2020 Rev.001
© 2020 ROHM Co., Ltd. All rights reserved.
15/18
TSZ22111 • 15 • 001
BD93F10MWV
Ordering Information
B D 9 3 F 1 0 M W V -
E 2
Part Number
Package
MWV: UQFN040V5050
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
UQFN040V5050 (TOP VIEW)
Part Number Marking
D 9 3 F 1 0
LOT Number
Pin 1 Mark
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0Q3Q0H507800-1-2
02.Apr.2020 Rev.001
16/18
BD93F10MWV
Physical Dimension and Packing Information
Package Name
UQFN040V5050
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0Q3Q0H507800-1-2
02.Apr.2020 Rev.001
17/18
BD93F10MWV
Revision History
Date
Revision
001
Changes
02, Apr.2020
New Release
www.rohm.com
TSZ02201-0Q3Q0H507800-1-2
02.Apr.2020 Rev.001
© 2020 ROHM Co., Ltd. All rights reserved.
18/18
TSZ22111 • 15 • 001
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
相关型号：
BD93F50MWV
BD93F50MWV is a full function USB Type-C Power Delivery (PD) Controller that supports USB PD using base-band communication. It is compatible with USB Type-C Specification and Power Delivery specification. BD93F50MWV includes support for the PD policy engine and communicates with an Embedded Controller or the SoC via host interface.
ROHM
BD9400BFP-E2
Switching Regulator, Voltage-mode, 2A, 500kHz Switching Freq-Max, PDSO25, ROHS COMPLIANT, HSOP-25
ROHM
BD94062F
BD94062F是白色LED用高效率驱动器，适用于大屏幕液晶驱动器。BD94062F 内置了准谐振方式(quasi-resonant: QR)DCDC转换器和电流连续方式(continuous current mode: CCM)DCDC转换器，可为LED串联阵列的可向光源提供适当电压。外接电流检测电阻，可实现高自由度的电源设计。
ROHM
BD9408FV
BD9408FV是白色LED用高效率驱动器，适用于大屏幕液晶驱动器。BD9408FV内置了可向光源(LED串联连接的阵列)提供适当电压的DC/DC转换器。BD9408FV中内置了应对异常状态的几种保护功能。过电压保护(OVP: over voltage protection)、过电流检测(OCP: over current limit protection of DC/DC)、LED过流保护(LED OCP: LED Over Current Protection)、过升压保护(FBMAX)等。因此，可在更宽的电压条件及负载条件下使用。
ROHM
BD9409F
BD9409F是白色LED用高效率驱动器，适用于大屏幕液晶驱动器。BD9409F内置了可向光源（LED串联连接的阵列）提供适当电压的DCDC转换器。BD9409F中内置了应对异常状态的几种保护功能。过电压保护(OVP: over voltage protection), 过电流检测(OCP: over current limit protection of DCDC), LED 过电流保护(LEDOCP: LED over current protection), 过升压保护(FBMAX: over boost protection)等。因此，可在更宽的输出电压条件及负载条件下使用。
ROHM
©2020 ICPDF网 联系我们和版权申明