BD94062F_技术文档

Datasheet

LED Drivers for LCD Backlights

1ch Buck Type

White LED Driver for Large LCD

BD94062F

General Description

Key Specifications

 Operating Power Supply Voltage Range:

VCC: 10.5V to 35.0V

BD94062F is a high efficiency driver for white LEDs and

designed for large LCDs. BD94062F has a built-in

quasi-resonant(QR) control method DCDC converter and

continuous current mode(CCM) DCDC converter that

can supply appropriate voltage to the light source of

LEDs series array. By external current detection

resistance, it achieves a power supply design with high

flexibility.

 Operating Current:

 Maximum Frequency QR:

3.0mA(Typ)

800kHz(Min)

 Oscillation Frequency CCM(R_RT=100kΩ):150kHz(Typ)

 Operating Temperature Range: -40°C to +105°C

Package

W(Typ) x D(Typ) x H(Max)

10.00mm x 6.20mm x 1.71mm

Features

SOP16

 QR or CCM Selectable(SEL Pin)

 LED Current Compensation Function(for QR)

 Under Voltage Protection(VCC Pin)

 Leading Edge Blanking Function(CS Pin)

 PWM and ADIM Dimming Operating

 Abnormal Detection Signal Output(FAILB Pin)

 LED PWM Dimming Over Duty Protection(ODP)

Applications

 TV, Computer Display

 Other LCD Backlighting

Typical Application Circuit

LED+

V_IN

VCC

LED-

VCC

UVLO

REG90

SEL

FAILB

OUT

CS

RT

DC

ADIM

QRCOMP

PWM

ZT

FB

DUTYON

GND DGND

〇Product structure: Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays

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BD94062F

Pin Configuration

(TOP VIEW)

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

VCC

REG90

CS

UVLO

OUT

GND

DGND

FB

SEL

PWM

QRCOMP

ADIM

FAILB

DUTYON

ZT

RT

Pin Description

Pin No.

Pin Name

Function

1

2

3

4

VCC

UVLO

SEL

IC power supply

Application power supply UVLO detection

QR or CCM select

PWM

PWM dimming signal input

DC output proportional to the OUT pin duty

(When QR is selected)

5

QRCOMP

6

ADIM

FAILB

DUTYON

RT

Analog dimming signal input

Error detection output

7

8

Over duty protection ON/OFF select

9

DCDC drive frequency setting(When CCM is selected)

Zero current detection

10

11

12

13

14

15

16

ZT

FB

Error amp output(When CCM is selected)

Digital GND

DGND

GND

OUT

GND

MOSFET GATE signal output

Inductor current sensing

9.0V output voltage

CS

REG90

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BD94062F

Block Diagram

V_IN

LED+

LED-

V_CC

UVLO

SEL

VCC

UVLO

+

-

SEL_sig

REG90

VCC

UVLO

VREG

1.5V/0.8V

ZT

Comp.

100mV

/200mV

REG90

UVLO

+

-

ZT

4V

OUT

QRCOMP

Low Pass

Filtar

SEL_sig

OSC

(SYSTEM)

PWM

+

-

Over Duty

Protection

REG90

1.5V/0.8V

OUT

DUTYON

Control Logic

DC

+

-

DRIVER

1.5V/0.8V

CS

REG90

Current Limit

Comp.

ADIM

-

Gain

Select

DC

+

SEL_sig

ERROR

AMP

FB

+

-

PWM

COMP

+

-

RT

OSC

REG90

（CCM)

FAILB

FAIL Detect

GND

DGND

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BD94062F

Pin Descriptions

If there is no description, the mentioned values are typical value.

〇Pin 1: VCC

This is the power supply pin of the IC. The input range is 10.5V to 35.0V.

When V_UVLO> V_UVLOTH(3.0V), the IC starts the buck operation and protection become effective after 524ms if VCC >

V_{VCC_UVREL}(9.0V).

When VCC < V_{VCC_UVDET}(8.0V), the IC shut down.

The switching as the driver causes the VCC voltage amplitude. Input in the condition VCC > 11.0V continuously.

〇Pin 2: UVLO

This is the UVLO pin of the application power supply. The IC starts the buck operation if V_UVLO> V_UVLOTH(3.0V) and stops if

V_UVLO< V_UVLOTH(3.0V). Refer to the timing chart in the section UVLO Operation Waveform(1) and UVLO Operation

Waveform(2).

The UVLO pin is high impedance. Even if UVLO function is not used, input appropriate voltage because the open

connection of this pin is not a fixed voltage.

〇Pin 3: SEL

The select pin for QR or CCM. The input range of the L, H level of the SEL pin is the following.

The pull-down resister is 1MΩ inside IC.

State

SEL Pin Voltage

SEL=H(QR)

SEL=L(CCM)

V_{SEL_H}= 1.5V to 35.0V

V_{SEL_L}= -0.3V to +0.8V

〇Pin 4: PWM

This is the input pin of the PWM dimming signal. The dimming is realized by adjusting the input DUTY of the PWM pin.

The input range of the L, H level of the PWM pin is the following.

The pull-down resister is 1MΩ inside IC.

If PWM=L continue for 524ms, the IC resets internal signal(start completion signal). At next PWM=H, the IC restarts.

State

PWM Pin Voltage

V_{PWM_H}= 1.5V to 35.0V

V_{PWM_L}= -0.3V to +0.8V

PWM=H

PWM=L

〇Pin 5: QRCOMP

This is the pin which outputs DC voltage proportional to ON DUTY of the OUT pin at SEL=H and PWM=H. The circuit

connected the QRCOMP pin revise the linearity of the LED current at QR.

The QRCOMP output internal hold voltage at SEL=H and PWM=L. The QRCOMP is the high impedance state at SEL=L.

When the IC detects an abnormality state, it is made pull-down by internal resistance.

To the QRCOMP pin, locate an anti-oscillation ceramic capacitor (0.1μF to 1.0μF) at the position as close as possible

between the QRCOMP-GND pin.

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Pin Descriptions - continued

〇Pin 6: ADIM

This is the input pin for the analog dimming signal. Input appropriate voltage by all means from the outside.

The CS pin detect (feedback) voltage is defined as 0.70 times (at QR selected, (SEL=H)) or 0.35 times(at CCM selected,

(SEL=L)). If V_ADIM> V_CLPADIM2(3.2V) at DUTYON=L, the CS detect (feedback) voltage is clamped to the constant level. It

prevents from flowing large current into LED. If V_ADIM> V_CLPADIM1(1.6V) or more at DUTYON=H, the CS detect(feedback)

voltage is clamped to the constant level. It prevents from flowing large current into LED. In this condition, the input current

of the ADIM pin is caused.

As for the relations of the ADIM pin voltage and current detect(feedback) voltage V_CS(the CS pin voltage), the equation is

the following.

Current detect voltage V_CSQRat QR selected (SEL=H) and DUTYON=L

(

)

≤ 3.2푉, ꢀ퐸퐿 = 퐻, ꢁ푈푇푌푂푁 = 퐿

퐴퐷퐼푀

푉

= 푉

× 0.7

[V]

푉

퐶푆푄푅

퐴퐷퐼푀

)

푉

퐶푆푄푅

= 2.240

[V]

푉

퐴퐷퐼푀

> 3.2푉, ꢀ퐸퐿 = 퐻, ꢁ푈푇푌푂푁 = 퐿

Current detect voltage V_CSQRat QR selected (SEL=H) and DUTYON=H

(

)

푉

= 푉

× 0.7

[V]

푉

≤ 1.6푉, ꢀ퐸퐿 = 퐻, ꢁ푈푇푌푂푁 = 퐻

퐶푆푄푅

퐴퐷퐼푀

)

> 1.6푉, ꢀ퐸퐿 = 퐻, ꢁ푈푇푌푂푁 = 퐻

퐴퐷퐼푀

푉

퐶푆푄푅

= 1.120

[V]

푉

Current feedback voltage V_CSCCMat CCM selected (SEL=L) and DUTYON=L

(

)

푉

= 푉

× 0.35

[V]

푉

퐴퐷퐼푀

≤ 3.2푉, ꢀ퐸퐿 = 퐿, ꢁ푈푇푌푂푁 = 퐿

> 3.2푉, ꢀ퐸퐿 = 퐿, ꢁ푈푇푌푂푁 = 퐿

퐶푆퐶퐶푀

퐴퐷퐼푀

푉

퐶푆퐶퐶푀

= 1.120

[V]

푉

퐴퐷퐼푀

Current feedback voltage V_CSCCMat CCM selected (SEL=L) and DUTYON=H

(

)

푉

= 푉

× 0.35

[V]

푉

퐴퐷퐼푀

≤ 1.6푉, ꢀ퐸퐿 = 퐿, ꢁ푈푇푌푂푁 = 퐻

> 1.6푉, ꢀ퐸퐿 = 퐿, ꢁ푈푇푌푂푁 = 퐻

퐶푆퐶퐶푀

퐴퐷퐼푀

)

푉

퐶푆퐶퐶푀

= 0.560

[V]

푉

퐴퐷퐼푀

〇Pin 7: FAILB

This is the error detection output pin(OPEN DRAIN). The NMOS is OPEN state during normal operation and ON(500Ω)

during error detection.

〇Pin 8: DUTYON

This is the ON/OFF setting pin of the PWM Over Duty Protection(ODP). PWM ON time is limited at ODP=ON. By the

DUTYON pin input voltage, ON/OFF of the ODP and ADIM clamp voltage are selected.

The pull-down resister is 1MΩ inside IC.

At ODP=ON, don’t set PWM frequency 50Hz or less and PWM DUTY 30% or more.

State

DUTYON Pin Voltage

V_{DTYON_L}= -0.3V to +0.8V

V_{DTYON_H}= 1.5V to 35.0V

ADIM Clamp Voltage

V_CLPADIM2= 3.2V

V_CLPADIM1= 1.6V

ODP = ON

ODP = OFF

〇Pin 9: RT

DCDC oscillation setting resistance connection pin(When CCM is selected). DCDC drive frequency is determined by

connecting the RT resistance.

〇Relation between the Drive Frequency and RT Resistance(ideal)

ꢄꢅꢆꢆꢆ

ꢂ_푅ꢃ

=

[kΩ]

−ꢊ

푓

×ꢄꢆ

ꢇꢈꢇꢇꢉ

However, oscillation setting range is 50kHz to 800kHz.

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Pin Descriptions - continued

〇Pin 10: ZT

The ZT pin controls OFF width(turn on). There are two factors to assert OUT=H at QR selected.

(i) At the timing that the coil current decrease to zero, the drain voltage of the MOSFET drops. The divided voltage by

resistor is input to the ZT pin. When V_ZT< V_ZTDET(100mV) cross, the OUT=H signal is generated. (ONE SHOT

operation)

(ii) The ZT time out function is a function to turn ON MOSFET forcibly, when it does not change to OUT=H even if it

passes for a certain period t_ZTOUT(25μs), after it becomes OUT=L. Refer to the ZT Trigger Time-out Operation

Waveform.

Both factors (i) and (ii) are restricted for ON timing when oscillatory frequency is too fast, by maximum frequency

f_MAXQR=800kHz(Min).

In addition, the MOSFET is not turned on, in the input condition that should be off such as CS > 3.0V.

For prevention of this false detection, it has a built-in blanking function(500ns) that mask ZT detection after MOSFET is

turned OFF from ON state (Leading Edge Blanking function) at QR selected. When the state that V_ZT< V_ZTDET(100mV)

cross in the mask time(ZT LEB term) continues 60μs, it is judged as an abnormal condition. After having stopped

operation between 524ms, the operation is restarted.

The ZT pin monitors the drain voltage of the MOSFET at CCM selected, but the timing of the turn on is fixed by f_CTCCMthat

is decided by R_RT.

〇Pin 11: FB

This is the output pin of the DCDC error amp (When CCM is selected).

FB is 100μA source mode at CCM start state. CCM start state is finished at V_FB> 3.7V or V_CS> V_CSCCM, it becomes the

output pin of the DCDC error amp at OUT=H and the high impedance state at OUT=L.

Error of over boost (FBMAX) is detected when V_FB> V_FBH(4.0V). When state that V_FB> V_FBH(4.0V) continues for a certain

period of time (60μs), MOSFET is turned off forcibly. After 524ms, the IC restarts.

At QR selected, the FB pin is pull-down with internal resister.

〇Pin 12: DGND

This is the digital GND of the IC.

〇Pin 13: GND

This is the GND of the IC.

〇Pin 14: OUT

The gate signal of the MOSFET is output. The output High level is 9V.

〇Pin 15: CS

This pin controls ON width(turn-off) of the switching MOSFET. The current detection(feedback) voltage is set by the DC

voltage of the ADIM pin. Refer to the ADIM pin description.

In the timing of turn ON of the MOSFET, switching noise is generated. Because the CS voltage rises then, the OFF

detecting circuit may do wrong detection. For prevention of this false detection, it has a built-in blanking function(at QR

selected: 250ns, at CCM selected: 500ns) that mask CS detection after MOSFET is turned ON from OFF state (Leading

Edge Blanking function).

This pin has three kinds of protection functions as following.

(i) CS OVP

When V_CS> V_CSOVP, because of flowing larger current than normal dimming operation into current detection resistor,

the state is judged as an abnormal after 15μs and outputs FAILB signal. After having stopped operation for 524ms,

the operation is restarted. Refer to the CS OVP Operation Waveform(1) and CS OVP Operation Waveform(2).

(ii) CS LOW

When CS=L and PWM=H continue 60μs without inputting normal voltage into the CS pin, the state is judged as an

abnormal condition. After having stopped operation for 524ms, the operation is restarted. Refer to the CS LOW

Operation Waveform(1) and CS LOW Operation Waveform(2).

(iii) CS LEB DET

When the state that V_CS> V_CSOVPcontinues 60μs at the time of the mask time(CS LEB term) completion, the state is

judged as an abnormal condition and outputs FAILB signal. After having stopped operation for 524ms, the operation is

restarted. Refer to the CS LED BET Operation Waveform(1) and CS LED BET Operation Waveform(2).

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Pin Descriptions - continued

〇Pin 16: REG90

10

8

This is the 9.0V output pin. Available current is 15mA(Min).

The characteristic of VCC line regulation at REG90 is shown as the

right figure. VCC must be used in 10.5V or more for stable 9V

output.

Place the ceramic capacitor connected to REG90 pin(1.0μF to

10μF) closest to the REG90-GND pin.

6

4

2

0

5

10 15 20 25 30 35

VCC[V]

Figure 1. REG90 Line Regulation

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BD94062F

Absolute Maximum Ratings(Ta=25°C)

Parameter

Symbol

VCC

Rating

Unit

V

Power Supply Voltage

-0.3 to +36

UVLO, SEL, PWM,

ADIM, DUTYON Pin Voltage

RT, FB, QRCOMP Pin Voltage

V_UVLO, V_SEL, V_PWM, V_ADIM, V_DUTYON

-0.3 to +36

V

V_RT, V_FB, V_QRCOMP

-0.3 to +7.0

-0.3 to +6.5

-1.0 to +10.5

-0.3 to +15.0

-0.3 to +13.0

-0.3 to +22.0

±4

V

CS Pin Voltage

V_CS

V_ZT

ZT Pin Voltage

V

OUT Pin Voltage

V_OUT

V_REG90

V_FAILB

I_ZT

V

REG90 Pin Voltage

FAILB Pin Voltage

ZT Pin Current

V

mA

°C

Maximum Junction Temperature

Tjmax

150

Storage Temperature Range

Tstg

-55 to +150

°C

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

Thermal Resistance^{(Note 1)}

Thermal Resistance(Typ)

Parameter

Symbol

Unit

1s^{(Note 3)}

2s2p^{(Note 4)}

SOP16

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

169.7

21

115.4

20

°C/W

Ψ_JT

(Note 1) Based on JESD51-2A(Still-Air).

(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 3) Using a PCB board based on JESD51-3.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70μm

(Note 4) Using a PCB board based on JESD51-7.

Layer Number of

Material

Board Size

114.3mm x 76.2mm x 1.6mmt

2 Internal Layers

Measurement Board

4 Layers

FR-4

Top

Bottom

Copper Pattern

74.2mm x 74.2mm

Copper Pattern

Thickness

Copper Pattern

Thickness

Footprints and Traces

70μm

74.2mm x 74.2mm

35μm

70μm

Recommended Operating Conditions

Parameter

Symbol

Topr

Min

-40

Typ

+25

12.0

1.00

2.2

Max

+105

35.0

1.50

3.00

10.0

1.00

300

Unit

°C

V

Operating Temperature

Power Supply Voltage

VCC

10.5

0.45

1.0

ADIM Input Voltage 1(V_DUTYON=3.0V) ^{(Note 5)}

ADIM Input Voltage 2(V_DUTYON=0.0V) ^{(Note 5)}

REG90 Pin Connection Capacitance^{(Note 6)}

QRCOMP Pin Connection Capacitance ^{(Note 6)}

RT Pin Connection Resistance^{(Note 5)}

V_ADIM1

V_ADIM2

C_REG90

V

µF

kΩ

C_QRCOMP

0.10

0.22

R_RT

18.75

100

(Note 5) It is recommended not to exceed Maximum Frequency QR(f_MAXQR) and OUT Pin Maximum ON Width(t_MAXON).

(Note 6) There are the characteristic parts that effective capacitance value largely becomes small when the DC voltage is applied, and be careful because output

voltage may oscillate.

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Electrical Characteristics(Unless otherwise specified VCC=12V, Ta=25°C)

Parameter

Symbol

Min

Typ

Max

Unit

mA

Conditions

Circuit Current

V_PWM=0.0V,

V_DUTYON=3.0V

Circuit Current(ON)

I_ON

-

3.0

6.0

UVLO

VCC UVLO Release Voltage

VCC UVLO Detection Voltage

UVLO Threshold Voltage

UVLO Pin Leak Current

V_{VCC_UVREL}

V_{VCC_UVDET}

V_UVLOTH

8.5

7.5

9.0

8.0

9.5

8.5

V

VCC: Sweep Up

VCC: Sweep Down

V_UVLO: Sweep Down

V_UVLO=4.0V

2.889

-2

3.000

0

3.111

+2

V

I_{UVLO_LK}

μA

DC/DC Converter

ZT Comparator Detection Voltage

ZT Comparator Release Voltage

ZT Comparator Hysteresis

ZT Trigger Time-out Time QR

OUT Pin High-side ON Resistance

OUT Pin Low-side ON Resistance

Oscillation Frequency CCM

V_ZTDET

V_ZTREL

60

100

200

100

25

140

280

-

mV

μs

V_ZT: Sweep Down

V_ZT: Sweep Up

120

V_ZTHYS

-

V_ZTHYS=V_ZTREL-V_ZTDET

V_CS=0.0V, V_SEL=3.0V

t_ZTOUT

20

30

R_{OUT_SRC}

R_{OUT_SINK}

f_CTCCM

-

5.0

10.0

8.0

Ω

4.0

Ω

142.5

150.0

157.5

kHz

R_RT=100kΩ, V_SEL=0.0V

V_ADIM=1.0V, V_SEL=3.0V,

V_DUTYON=3.0V

V_ADIM=1.5V, V_SEL=3.0V,

V_DUTYON=3.0V

V_ADIM=4.0V, V_SEL=3.0V,

V_DUTYON=3.0V

V_ADIM=4.0V, V_SEL=3.0V,

V_DUTYON=0.0V

V_ADIM=1.0V, V_SEL=0.0V,

V_DUTYON=0.0V

V_ADIM=1.5V, V_SEL=0.0V,

V_DUTYON=0.0V

V_ADIM=4.0V, V_SEL=0.0V,

V_DUTYON=3.0V

V_ADIM=4.0V, V_SEL=0.0V,

V_DUTYON=0.0V

Current Detection Voltage QR 1

Current Detection Voltage QR 2

Current Detection Clamp Voltage QR 1

Current Detection Clamp Voltage QR 2

Current Feedback Voltage CCM 1

Current Feedback Voltage CCM 2

V_CSQR1

V_CSQR2

0.686

1.034

1.073

2.175

0.340

0.512

0.534

1.085

0.700

1.050

1.120

2.240

0.350

0.525

0.560

1.120

0.714

1.066

1.167

2.305

0.360

0.538

0.586

1.155

V

V_CLPQR1

V_CLPQR2

V_CSCCM1

V_CSCCM2

V_CLPCCM1

V_CLPCCM2

Current Feedback Clamp Voltage

CCM 1

Current Feedback Clamp Voltage

CCM 2

Maximum Frequency QR

f_MAXQR

t_CSLEBQR

t_CSLEBCCM

t_MAXON

800

-

kHz

μs

V_SEL=3.0V

V_SEL=0.0V

CS Leading Edge Blank Time QR

CS Leading Edge Blank Time CCM

OUT Pin Maximum ON Width

-

0.25

0.50

20

-

μs

15

25

μs

R_RT=100kΩ, V_SEL=0.0V,

V_FB=3.5V

V_CS=0.15V, V_ADIM=1.5V,

V_FB=1.0V, V_SEL=0.0V

V_CS=1.0V, V_ADIM=1.5V,

V_FB=1.0V, V_SEL=0.0V

OUT Pin Maximum Duty CCM

FB Source Current CCM

FB Sink Current CCM

D_MAXCCM

I_{FB_SO}

90

-115

85

95

99

-85

115

%

-100

100

μA

I_{FB_SI}

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BD94062F

Electrical Characteristics(Unless otherwise specified VCC=12V, Ta=25°C) - continued

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

DC/DC Protection

CS OVP Voltage 1

CS OVP Voltage 2

CS OVP Voltage 3

CS OVP Mask Time

V_CSOVP1

V_CSOVP2

V_CSOVP3

t_SURMSK

0.686

1.034

2.175

10

0.700

1.050

2.240

15

0.714

1.066

2.305

20

V

V_ADIM=1.0V, V_DUTYON=3.0V

V_ADIM=1.5V, V_DUTYON=3.0V

V_ADIM=4.0V, V_DUTYON=0.0V

V

μs

V_ADIM=1.0V, V_DUTYON=3.0V,

V_SEL=3.0V

V_ADIM=1.5V, V_DUTYON=3.0V,

V_SEL=3.0V

CS LOW Voltage QR1

CS LOW Voltage QR2

V_CSLQR1

V_CSLQR2

0.686

1.034

0.700

1.050

0.714

1.066

V

V_ADIM=4.0V, V_DUTYON=0.0V,

V_SEL=3.0V

CS LOW Voltage QR3

V_CSLQR3

V_CSLCCM

V_RTL

2.175

0.05

-0.3

2.240

0.10

-

2.305

0.15

V

CS LOW Voltage CCM

V_SEL=0.0V

V_RT

x 90%

RT Short Circuit Protection Range

V_RT: Sweep Down

V_FB: Sweep Up

Over Boost Detection Voltage

REG90

V_FBH

3.84

4.00

4.16

REG90 Output Voltage 1

REG90 Output Voltage 2

REG90 Max Source Current

REG90_UVLO Detect Voltage

DUTYON

V_{REG90_1}

V_{REG90_2}

I_{REG90_SOMAX}

V_{REG90_UVDET}

8.910

8.865

15

9.000

-

9.090

9.135

-

V

I_REG90=0mA

I_REG90=-15mA

mA

V

5.22

6.00

6.78

V_REG90: Sweep Down

DUTYON Pin HIGH Voltage

DUTYON Pin LOW Voltage

V_{DTYON_H}

V_{DTYON_L}

R_DTYON

1.5

-

35

V

V_DUTYON: Sweep Up

-0.3

+0.8

V_DUTYON: Sweep Down

DUTYON Pin

Pull-Down Resistance

600

30

1000

1400

-

kΩ V_DUTYON=3.0V

Over Duty Protection

PWM ODP Protection Detection

Duty

D_ODP

-

%

f_PWM=50Hz, D_PWM=50%

QR, CCM Selection

SEL Pin HIGH Voltage

SEL Pin LOW Voltage

SEL Pin Pull-Down Resistance

Dimming Control

V_{SEL_H}

V_{SEL_L}

R_SEL

1.5

-0.3

600

-

35

V

V_SEL: Sweep Up

+0.8

1400

V_SEL: Sweep Down

1000

kΩ V_SEL=3.0V

PWM Pin HIGH Voltage

PWM Pin LOW Voltage

PWM Pin Pull-Down Resistance

ADIM Pin Leak Current

QRCOMP

V_{PWM_H}

V_{PWM_L}

R_PWM

1.5

-0.3

600

-2

-

35

+0.8

1400

+2

V

V_PWM: Sweep Up

V_PWM: Sweep Down

-

1000

0

kΩ V_PWM=3.0V

μA V_ADIM=1.0V

I_{ADIM_LK}

QRCOMP Pin Duty Range

D_QRCOMP

V_QRCOMP

10

-

90

%

V

V_SEL=3.0V

f_OUT=100kHz,

D_OUT=50.0%, V_SEL=3.0V

V_QRCOMP=2.0V,

V_PWM=3.0V, V_SEL=3.0V

V_QRCOMP=2.0V,

QRCOMP Pin Output Voltage

QRCOMP Max Output Current

QRCOMP Pin Leak Current

1.94

2.0

2.06

| I_{QRC_MAX}

I_{QRC_LK}

|

400

-2

-

μA

0

+2

V_PWM=3.0V, V_SEL=0.0V

FAILB

FAILB Pin Pull-Down Resistance

R_FAILBL

250

500

1000

Ω

I_FAILB=1.0mA

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BD94062F

The List of the Protection Function Condition and Operation

If there is no description, the mentioned values are typical value.

The operation of each protection is shown in Table 1.

Refer to Starting Up Waveform(1), Starting Up Waveform(2), Starting Up Waveform(3) and Starting Up Waveform(4) for the

start completion condition.

When it is contained in plural protection detection conditions, the high-priority thing is carried out.

For example, when the IC becomes both protection detection conditions of VCC UVLO(Priority:[2]) and CS OVP(Priority:[3]),

VCC UVLO(Priority:[2]) is given priority to and the IC doesn’t output FAILB=L.

Table 1. The Operation Mode of the Protection

Operation at Detection

Protection Detection

Detection

Condition

Release

Condition

Detection Protection

Timer Type

Pri-

ority

O

U

T

Auto-Restart

Timer

Name

FAILB

REG90

UVLO

Immedi- Immediately

V_REG90

<

V_REG90>

V_{REG90_UVREL}(6.6V)

REG90

L

Normal

Immediately [1]

Immediately [2]

ately

Auto-Restart

V_{REG90_UVDET}(6.0V)

VCC >

V_{VCC_UVREL}(9.0V)

for 524ms

VCC

UVLO

Immedi- Immediately

VCC <

V_{VCC_UVDET}(8.0V)

VCC

L

Normal

ately

Auto-Restart

Immedi-

ately

V_UVLO

V_UVLOTH(3.0V)

V_RT

<

UVLO

V_UVLO> V_UVLOTH(3.0V)

Auto-Restart L

Normal

524ms

[2]

>

V_RT

<

Immedi- Immediately

ately

Immedi- Immediately

ately

RT HIGH

RT LOW

RT

L

Immediately [2]

V_RTH(5.5V(Max))

V_RT< V_RTL(V_{RT_NM}

90%(Min))

V_RTH(5.5V(Max))

V_RT> V_RTL(V_{RT_NM}

90%(Min))

Auto-Restart

x

Normal

L

Auto-Restart

CS OVP

CS

V_CS> V_CSOVP

V_CS< V_CSOVP

15μs

Auto-Restart L after timer

operation

524ms

[3]

Start Completion

and

V_CS< V_CSLQR

and

PWM=H

Start Completion

and

V_CS< V_CSLCCM(0.1V)

and

PWM=H

Start Completion

and

V_CS> V_CSLQR

or

PWM=L

CS LOW

(QR)

60μs

Auto-Restart L

Normal

V_CS> V_CSLCCM(0.1V)

CS LOW

(CCM)

CS

or

524ms

[3]

PWM=L

V_CS< V_CSOVP

at t_CSLEBQR(0.25μs)

Completion

or

CS LEB

DET

(QR)

L

V_CS> V_CSOVP

60μs

Auto-Restart L after timer

operation

at t_CSLEBQR(0.25μs)

Completion

and

PWM=H

Start Completion

and

PWM=L

V_CS< V_CSOVP

at t_CSLEBCCM(0.50μs)

Completion or

PWM=L

CS LEB

DET

(CCM)

L

Auto-Restart L after timer

operation

V_CS> V_CSOVP

CS

524ms

[3]

at t_CSLEBCCM(0.50μs)

Completion

and

PWM=H

SEL=H

and

SEL=L

or

V_ZT< V_ZTDET(0.1V)

Edge No Detection

in t_ZTLEB(0.50μs)

Start Completion

and

ZT LEB

DET

ZT

FB

60μs

Auto-Restart L

Normal

524ms

[3]

V_ZT< V_ZTDET(0.1V)

Edge Detection

in t_ZTLEB(0.50μs)

Start Completion

and

FB MAX

V_FB< V_FBH(4.0V)

V_FB> V_FBH(4.0V)

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BD94062F

Parts Setting Example(QR)

V_IN

If there is no description, the mentioned values are typical value.

Following symbol are shown in the right diagram.

C_IN

R_UVLO1

V_LED

D

[1]…During M1=ON, as the coil(L) voltage of its both side can approximate

V_IN-V_LED, the slope of I_L; Slope_{IL_ON}is

R_UVLO2

V_OUT

푉 ꢎ 푉

퐼ꢍ

ꢋꢏ퐷

L

I_L

ꢀ푙표푝푒_{퐼ꢋ_ꢌꢍ}

=

퐿

VCC

UVLO

SW

[2]…During M1=OFF, as the coil(L) voltage of its both side can approximate

PWM

ADIM

OUT

Rg

CS

M1

V_LED, the slope of I_L; Slope_{IL_OFF}is

C1

Rcs

푉

ꢋꢏ퐷

+

-

R1

ꢀ푙표푝푒_{퐼ꢋ_ꢌ퐹퐹}

=

퐿

ZT

-

+

R2

The equation can be expressed above.

GND

It is necessary for V_IN, V_LEDand L to meet the following condition.

(a) Maximum ON time of the MOSFET(M1)(t_MAXON) is 20μs.

Figure 2. Application Circuits

푡_{ꢌꢐꢃ_ꢌꢍ}< 푡_{푀퐴푋ꢌꢍ}

(b) Maximum frequency of the resonance frequency(f_MAXQR) is 800kHz(Min).

1

< ꢑ_{푀퐴푋푄푅}

푡_{ꢌꢐꢃ_ꢌꢍ}+ 푡_{ꢌꢐꢃ_ꢌ퐹퐹}

Refer the Maximum Frequency Operation Waveform and Maximum On Time Operation Waveform.

[3]…When the MOSFET M1 is turned off, ZT increases by the SW bounce.

[4]…After that, the ZT pin gradually decreases, the slope is decided by C1, R1 and R2.

[5]…At the timing of I_L=0mA, SW suddenly decreases, and ZT decreases suddenly too. The ZT slope is decided by C1, R1

and R2. The delay exists from the timing I_L=0mA to reach the detection level 100mV of ZT.

C_OUTsmoothies an LED current. Ripple current of the LED becomes large with small C_OUT. When large C_OUTis used, the

response of an LED current is slow at PWM dimming. Rg can set the switching response speed of M1.

[2]

[1]

I_L

Detect Level

CS

[3]

[4]

[5]

ZT

t_{OUT_ON}

t_{OUT_OFF}

OUT

Figure 3. Dimming Waveform

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BD94062F

LED Current Setting(QR)

If there is no description, the mentioned values are typical value.

t_DLY1

I_LED

I_LI_L’

0A

t_DLY2

t_{OUT_ON}

t_{OUT_OFF}

Figure 4. Coil Current and LED Current

The LED current(I_LED) is expressed as follows.

〇LED Current(I_LED) Setting Equation(Rough Estimate)

ꢕ

ꢄ

ꢕ

ꢙꢚ

ꢛꢕ

ꢋ

^ꢜꢝꢞ× 푡_퐷ꢋꢟꢄꢎ ^ꢕ× 푡_퐷ꢋꢟꢓꢠ × 10^ꢡ

[mA]

ꢇꢖꢗꢘ

ꢜꢝꢞ

ꢒ_ꢋꢏ퐷= × ꢔ

+

ꢓ

푅

ꢋ

ꢇꢖ

where

푡_퐷ꢋꢟꢄis the turn-off delay time of the MOSFET(M1).

푡_퐷ꢋꢟꢓis the turn-on delay time of the MOSFET(M1).

(

)

푉

= 푉

× 0.7

[V]

푉 ≤ 1.6푉, ꢀ퐸퐿 = 퐻, ꢁ푈푇푌푂푁 = 퐻

퐴퐷퐼푀

퐶푆푄푅

퐴퐷퐼푀

)

> 1.6푉, ꢀ퐸퐿 = 퐻, ꢁ푈푇푌푂푁 = 퐻

퐴퐷퐼푀

푉

퐶푆푄푅

= 1.120

[V]

푉

[Setting Example]

If V_IN=100V, V_LED=60V, V_CSQR=0.7V, R_CS=1.4Ω, L=0.20mH, t_DLY1=0.20μs and t_DLY2=0.40μs,

ꢄ

ꢆ.ꢢ

ꢄ.ꢣ

ꢄꢆꢆꢛꢤꢆ

ꢤꢆ

ꢒ_ꢋꢏ퐷= × ꢔ

+

_−ꢊ× 0.20 × 10^ꢛꢤꢎ _{ꢆ.ꢓ×ꢄꢆ}_−ꢊ× 0.40 × 10^ꢛꢤꢠ × 10^ꢡ= 210

[mA]

ꢓ

ꢆ.ꢓ×ꢄꢆ

[The LED Current’s error by t_DLY1and t_DLY2

]

The LED current is shifted by the fluctuation of t_DLY1and t_DLY2. t_DLY1and t_DLY2, which are decided by the inductance(L),

the MOSFET(M1), the Diode(D) and the ZT capacitance(C1), affects the LED current.

When the fluctuation of the t_DLY1is +10% from the setting example(in other words, t_DLY1=0.22μs), I_LED’ is calculated as

follows.

ꢄ

ꢓ

ꢄꢆꢆꢛꢤꢆ

ꢤꢆ

ꢒ_ꢋꢏ퐷′ = × ꢔ^ꢆ_ꢄ^._.ꢣ^ꢢ

+

_−ꢊ× 0.22 × 10^ꢛꢤꢎ _{ꢆ.ꢓ×ꢄꢆ}_−ꢊ× 0.40 × 10^ꢛꢤꢠ × 10^ꢡ= 212

[mA]

ꢆ.ꢓ×ꢄꢆ

Thus, the ratio of difference is

ꢥꢛ퐼

퐼

^{ꢓꢄꢓꢛꢓꢄꢆ}× 100 = +0.95

[%]

ꢜꢝꢞ

∆ꢒ_ꢋꢏ퐷

=

퐼ꢋꢏ퐷

ꢓꢄꢆ

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BD94062F

Timing Chart(QR)

If there is no description, the mentioned values are typical value.

1. Starting Up(1)

V_IN

9.0V

VCC

3.0V

UVLO

PWM

I_L

Detect Level

CS

t_CSLEBQR

ZT

OUT

V_OUT

(Note 5)

(Note 1)

(Note 2)

(Note 3)

(Note 6)

(Note 7)

(Note 4)

Figure 5. Starting Up Waveform(1)

(Note 1)…It is recommended that V_INturns on firstly and turns off lastly on the input sequence.

(Note 2)…The IC starts when VCC > 9.0V.

(Note 3)…After 524ms when VCC > 9.0V, OUT pin switching is enabled with PWM=H.

In the figure, the PWM duty is 100%. The IC becomes the start completion when it becomes OUT=H, and all

protection becomes detectable.

(Note 4)…When the CS pin reaches the detection level, it outputs OUT=L.

(Note 5)…When the coil current decreases to zero(I_L=0mA), ZT suddenly decreases. When ZT reaches the detection

level, it outputs OUT=H.

(Note 6)…The CS switching noise is masked during Leading Edge Blank time t_CSLEBQR(0.25μs), which counts from

OUT=H. During this term, the MOSFET is not turned off, even if CS voltage become detection level or more.

(Note 7)…After C_OUTis charged and V_OUTdecreases, LED current flows.

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BD94062F

Timing Chart(QR) - continued

2. Starting Up(2)

V_IN

9.0V

VCC

3.0V

UVLO

PWM

I_L

Detect Level

CS

ZT

OUT

V_OUT

(Note 1) (Note 2) (Note 3) (Note 4)

(Note 5)

Figure 6. Starting Up Waveform(2)

(Note 1)… It is recommended that V_INturns on firstly and turns off lastly on the input sequence.

(Note 2)…The IC starts when VCC > 9.0V.

(Note 3)…With the dimming signal input to PWM, after 524ms when VCC > 9.0V, OUT pin switching is enabled with

PWM=H. The IC becomes the start completion when it becomes OUT=H, and all protection becomes

detectable.

(Note 4)…PWM=L stops the switching operation.

(Note 5)…After C_OUTis charged and V_OUTdecreases, LED current flows.

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BD94062F

Timing Chart(QR) - continued

3. Maximum Frequency Operation

As for the resonance frequency, the IC works maximum frequency QR(f_MAXQR) 800kHz(Min) or less.

It prevents from increasing temperature because of the fast switching frequency.

In this operation, the LED current is lower than the setting value, because the interval of I_L=0mA is longer than expected.

I_L

Detect Level

CS

ZT

t_{OUT_ON}t_{OUT_OFF}

OUT

(Note 1)

(Note 3)

(Note 2)

Figure 7. Maximum Frequency Operation Waveform

(Note 1)…CS reached the detection level. It outputs OUT=L.

(Note 2)…ZT reached the detection level, but cannot become next OUT=H when the operational frequency is too fast.

(Note 3)…After the certain interval, it outputs OUT=H. In this case,

1

= ꢑ_{푀퐴푋푄푅}

푡_{ꢌꢐꢃ_ꢌꢍ}+ 푡_{ꢌꢐꢃ_ꢌ퐹퐹}

Here, f_MAXQR=800kHz(Min).

4. Maximum On Time Operation

As for the ON time(t_{OUT_ON}), the IC works t_{OUT_ON}< t_MAXON(20μs). It limits the current increasing speed of MOSFET and

others at abnormal state.

I_L

Detect Level

CS

ZT

t_{OUT_ON}=t_MAXON

t_{OUT_OFF}

OUT

(Note 1) (Note 2)

Figure 8. Maximum On Time Operation Waveform

(Note 1)…CS does not reach the detection level, but it outputs OUT=L because of t_{OUT_ON}=t_MAXON

.

(Note 2)…ZT reached the detection level, it outputs OUT=H.

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BD94062F

Timing Chart(QR) - continued

5. ZT Trigger Time-out Operation

When the operation is out of its resonance, for example, ZT always keeps L because of the abnormality of the external

parts around IC, this function turns on MOS with the constant interval t_ZTOUT(25μs).

I_L

Detect Level

CS

ZT

t_{OUT_OFF}

t_ZTOUT

t_{OUT_ON}

OUT

t_ZTOUT

(Note 1)(Note 2)(Note 3)

Figure 9. ZT Trigger Time-out Operation Waveform

(Note 1)…CS reached the detection level, it outputs OUT=L.

(Note 2)…Because ZT is always L, it cannot be output next OUT=H.

(Note 3)…It outputs OUT=H forcibly, when it does not change to OUT=H even if it passes for a certain period

t_ZTOUT(25μs), after it becomes OUT=L. The time measurement of t_ZTOUTis no relation to the PWM logic.

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BD94062F

Timing Chart(QR) - continued

6. CS OVP

This is the protection function which stops once and restarts after 524ms, when the high voltage input into the CS pin

because of the abnormality of the external parts around IC.

I_L

Detect Level

15μs

CS

Short

Open

OUT

Input Level

FAILB

524ms

IC

Normal

STATE

Abnormal

Normal

Judge

(Note 3)

Judge

(Note 4)

(Note 1) (Note 2)

Figure 10. CS OVP Operation Waveform(1)

(Note 1)…It is the example of the IC around parts short circuit which occurred by the high voltage being input into CS pin.

If CS exceeds the current detection voltage(V_CSOVP) , it outputs OUT=L.

(Note 2)…If V_CS> V_CSOVPcontinues 15μs or more nevertheless OUT=L, the state is judged as abnormal and the

operation is stopped for 524ms.

(Note 3)…After 524ms, it is judge again. In the figure, because of V_CS> V_CSOVP, the abnormality still keeps and stops the

operation.

(Note 4)…As a result of judgment again, an abnormal state is released because of V_CS< V_CSOVPin this figure. The

operation is restarted.

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BD94062F

Timing Chart(QR) - continued

7. CS LOW

This is the protection function which stops once and restarts after 524ms, when the CS pin does not reach the detect

level, because of the abnormality of the external parts around IC.

I_L

Detect Level

CS

60μs

Open

Short

ZT

t_MAXON

OUT

FAILB

Input Level

524ms

IC

STATE

Normal

Abnormal

Normal

Judge

(Note 1) (Note 2) (Note 3)

Judge

(Note 4)

Figure 11. CS LOW Operation Waveform(1)

(Note 1)…It is the example of the short circuit of the around IC parts when the CS pin does not increase.

(Note 2)…When CS does not reach the current detection voltage(V_CSOVP) during maximum ON width t_MAXON(20μs) from

OUT=H, it outputs OUT=L.

(Note 3)…The state which CS does not reach the current detection voltage(V_CSOVP) continues 60μs or more, the state is

judged as abnormal and the operation is stopped for 524ms.

(Note 4)…It is judged again. The operation is restarted.

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BD94062F

Timing Chart(QR) - continued

8. CS LEB DET

This is the protection function which stops once and restarts after 524ms, when the state that the CS pin rises rapidly

continues, because of the abnormality of the external parts around IC.

I_L

Detect Level

CS

60μs

Short

Open

ZT

OUT

FAILB

t_CSLEBQR

Input Level

524ms

Abnormal

IC

STATE

Normal

Judge

(Note 2)

Judge

(Note 1)

(Note 3)

Figure 12. CS LEB DET Operation Waveform(1)

(Note 1)…It is the example of the short circuit of the around IC parts when the on-time of the MOSFET is

t_CSLEBQR(0.25μs) by the rapid rise of CS pin. The on-time of the MOSFET is not shorter than t_CSLEBQR

.

(Note 2)…The state which(Note 1) continues 60μs, the state is judged as abnormal and the operation is stopped for

524ms.

(Note 3)…It is judged again. The operation is restarted.

9. UVLO

This is the protection function which stops once and restarts after 524ms, when the state that low V_INvoltage continues.

V_IN

UVLO

3V

OUT

Input Level

FAILB

524ms

Abnormal

IC

STATE

Normal

Judge

(Note 2)

Judge

(Note 1)

Figure 13. UVLO Operation Waveform(1)

(Note 1)…If V_UVLO< 3V is detected, the state is judged as abnormal and the operation is stopped for 524ms.

(Note 2)…It is judged again. The operation is restarted.

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BD94062F

Parts Setting Example(CCM)

If there is no description, the mentioned values are typical value.

Following symbol are shown in the right diagram.

V_IN

C_IN

The IC operates with constant frequency and average current control at CCM

selected(SEL=L).

R_UVLO1

V_LED

The frequency(f_CTCCM) is set by resistance(R_RT) connected to the RT pin.

D

R_UVLO2

[1]…During M1=ON, as the coil(L) voltage of its both side can approximate

V_OUT

V_IN-V_LED, the slope of I_L; Slope_{IL_ON}is

L

I_L

푉 ꢎ 푉

퐼ꢍ

ꢋꢏ퐷

VCC

UVLO

ꢀ푙표푝푒_{퐼ꢋ_ꢌꢍ}

=

SW

퐿

PWM

OUT

Rg

CS

M1

[2]…During M1=OFF, as the coil(L) voltage of its both side can approximate

V_LED, the slope of I_L; Slope_{IL_OFF}is

CFB

Rcs

RFB

-

+

ADIM

푉

ꢋꢏ퐷

RRT

RT

ꢀ푙표푝푒_{퐼ꢋ_ꢌ퐹퐹}

=

퐿

GND

The equation can be expressed above.

Figure 14. Application Circuits

[3]…OUT=H is output by the set frequency(f_CTCCM).

On Time(t_{OUT_ON(CCM)}) and Off Time(t_{OUT_OFF(CCM)}) can be roughly estimated with

1

푉

1

푉

푡_{ꢌꢐꢃ_ꢌꢍ 퐶퐶푀}

=

×

^ꢋꢏ퐷, 푡_{ꢌꢐꢃ_ꢌ퐹퐹 퐶퐶푀}

=

× ꢦ1 ꢎ ^ꢋꢏ퐷ꢧ

(

)

(

)

ꢑ

푉

퐼ꢍ

퐶ꢃ퐶퐶푀

퐼ꢍ

퐶ꢃ퐶퐶푀

C_OUTsmoothies an LED current. Ripple current of the LED becomes large with small C_OUT. When large C_OUTis used,

the response of an LED current is slow at PWM dimming. Rg can set the switching response speed of M1.

[2]

[1]

I_L

Feedback Level

CS

[3]

t_{OUT_ON(CCM)}t_{OUT_OFF(CCM)}

OUT

1/f_CTCCM

Figure 15. Dimming Waveform

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BD94062F

LED Current Setting(CCM)

If there is no description, the mentioned values are typical value.

The LED current(I_LED) is expressed as follows.

ꢕ

ꢇꢖꢇꢇꢉ

ꢒ_ꢋꢏ퐷

=

[mA]

푅

ꢇꢖ

where:

(

)

≤ 1.6푉, ꢀ퐸퐿 = 퐿, ꢁ푈푇푌푂푁 = 퐻

퐴퐷퐼푀

푉

= 푉

× 0.35

[V]

푉

퐶푆퐶퐶푀

퐴퐷퐼푀

)

푉 > 1.6푉, ꢀ퐸퐿 = 퐿, ꢁ푈푇푌푂푁 = 퐻

퐴퐷퐼푀

푉

퐶푆퐶퐶푀

= 0.560

[V]

Timing Chart(CCM)

If there is no description, the mentioned values are typical value.

1. Starting Up(1)

V_IN

9.0V

VCC

3.0V

UVLO

PWM

I_L

Feedback Level

CS

OUT

V_OUT

(Note 1) (Note 2) (Note 3)

(Note 4)

Figure 16. Starting Up Waveform(3)

(Note 1)…It is recommended that V_INturns on firstly and turns off lastly on the input sequence.

(Note 2)…The IC starts when VCC > 9.0V.

(Note 3)…After 524ms when VCC > 9.0V, charge of the FB pin starts and switching operation becomes possible with

PWM=H. In the figure, then it is PWM=100%.

(Note 4)…The IC becomes the start completion when the CS pin voltage reaches Feedback Level(or V_FB> 3.7V), and

all protection becomes detectable.

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BD94062F

Timing Chart(CCM) - continued

2. Starting Up(2)

V_IN

9.0V

VCC

3.0V

UVLO

PWM

I_L

Feedback Level

CS

OUT

V_OUT

(Note 1) (Note 2)(Note 3)

(Note 4) (Note 5)

Figure 17. Starting Up Waveform(4)

(Note 1)…It is recommended that V_INturns on firstly and turns off lastly on the input sequence.

(Note 2)…The IC starts when VCC > 9.0V.

(Note 3)…With the dimming signal input to PWM, after 524ms when VCC > 9.0V, switching operation becomes possible

with PWM=H.

(Note 4)…Switching operation stops when PWM=L.

(Note 5)…The IC becomes the start completion when the CS pin voltage reaches Feedback Level(or V_FB> 3.7V), and

all protection becomes detectable.

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BD94062F

Timing Chart(CCM) - continued

3. CS OVP

This is the protection function which stops once and restarts after 524ms, when the high voltage was input into the CS

pin because of the abnormality of the external parts around IC.

I_L

Detect Level

15μs

CS

Short

Open

OUT

Input Level

FAILB

524ms

IC

STATE

Normal

Abnormal

Normal

Judge

(Note 1) (Note 2)

Judge

(Note 3)

Judge

(Note 4)

Figure 18. CS OVP Operation Waveform(2)

(Note 1)…It is the example of the IC around parts short circuit which occurred by the high voltage being input into CS pin.

If CS exceeds the current detection voltage(V_CSOVP), it outputs OUT=L.

(Note 2)…If V_CS> V_CSOVPcontinues 15μs or more nevertheless OUT=L, the state is judged as abnormal and the

operation is stopped for 524ms.

(Note 3)…After 524ms, it is judged again. In the figure, considering V_CS> V_CSOVP, the abnormality still keeps and stops

the operation.

(Note 4)…As a result of judgment again, an abnormal state is released because of V_CS< V_CSOVPin this figure. The

operation is restarted.

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BD94062F

Timing Chart(CCM) - continued

4. CS LOW

This is the protection function which stops once and restarts after 524ms, when the CS pin does not reach the detect

level, because of the abnormality of the external parts around IC.

I_L

60μs

0.1V

CS

Short

Open

OUT

Input Level

FAILB

524ms

IC

STATE

Normal

Abnormal

Normal

Judge

(Note 1) (Note 2) (Note 3)

Judge

(Note 4)

Figure 19. CS LOW Operation Waveform(2)

(Note 1)…It is the example of the short circuit of the around IC parts when the CS pin does not increase.

(Note 2)…OUT=H lasts up to OUT Pin Maximum Duty CCM(D_MAXCCM) or MAX ON width(t_MAXON) and becomes OUT=L.

(Note 3)…The state which CS does not reach the CS LOW(CCM) voltage 0.1V continues 60μs or more, the state is

judged as abnormal and the operation is stopped for 524ms.

(Note 4)…It is judged again. The operation is restarted.

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BD94062F

Timing Chart(CCM) - continued

5. CS LEB DET

This is the protection function which stops once and restarts after 524ms, when the state that the CS pin rises rapidly

continues, because of the abnormality of the external parts around IC.

I_L

Detect Level

CS

60μs

Short

t_CSLEBCCM

Open

OUT

Input Level

FAILB

524ms

Abnormal

IC

STATE

Normal

Judge

(Note 1) (Note 2)

Judge

(Note 3)

Figure 20. LEB DET Operation Waveform(2)

(Note 1)…It is the example of the short circuit of the around IC parts when the on-time of the MOSFET is

t_CSLEBCCM(0.50μs) by the rapid rise of CS pin. The on-time of the MOSFET is not shorter than t_CSLEBCCM

.

(Note 2)…The state which(Note 1) continues 60μs, the state is judged as abnormal and the operation is stopped for

524ms.

(Note 3)…It is judged again. The operation is restarted.

6. UVLO

This is the protection function which stops once and restarts after 524ms, when the state that low V_INvoltage continues.

V_IN

UVLO

3V

OUT

Input Level

FAILB

524ms

Abnormal

IC

STATE

Normal

Judge

(Note 2)

Judge

(Note 1)

Figure 21. UVLO Operation Waveform(2)

(Note 1)…If V_UVLO< 3V is detected, the state is judged as abnormal and the operation is stopped for 524ms.

(Note 2)…It is judged again. The operation is restarted.

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BD94062F

I/O Equivalent Circuits

Pin1: VCC, Pin12: DGND, Pin13: GND

Pin2: UVLO

Pin3: SEL

VCC

Internal

Block

UVLO

SEL

GND

DGND

Pin4: PWM

Pin5: QRCOMP

Pin6: ADIM

PWM

ADIM

QRCOMP

Pin7: FAILB

Pin8: DUTYON

Pin9: RT

FAILB

RT

DUTYON

Pin10: ZT

Pin11: FB

Pin14: OUT, Pin16: REG90

REG90

ZT

OUT

FB

Pin15: CS

CS

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BD94062F

Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and

routing of connections.

7. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

8. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

9. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

10. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

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BD94062F

Operational Notes - continued

11. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 22. Example of monolithic IC Structure

12. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

13. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within

the Area of Safe Operation (ASO).

14. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj

falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

15. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

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BD94062F

Ordering Information

B D 9

4

0

6

2

F

-

E 2

Packaging and forming specification

E2: Embossed tape and reel

Part Number

Package

F: SOP16

Marking Diagrams

SOP16(TOP VIEW)

Part Number Marking

LOT Number

B D 9 4 0 6 2 F

Pin 1 Mark

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BD94062F

Physical Dimension and Packing Information

Package Name

SOP16

(Max 10.35 (include. BURR))

(UNIT: mm)

PKG: SOP16

Drawing No.: EX114-5001

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BD94062F

Revision History

Date

Rev.

001

Changes

26.Dec.2017

15.May.2018

New Release

Correction QRCOMP Pin Connection Capacitance

The value of TYP is corrected.

002

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003


型号：	BD94062F
厂家：	ROHM
描述：	BD94062F是白色LED用高效率驱动器，适用于大屏幕液晶驱动器。BD94062F 内置了准谐振方式(quasi-resonant: QR)DCDC转换器和电流连续方式(continuous current mode: CCM)DCDC转换器，可为LED串联阵列的可向光源提供适当电压。外接电流检测电阻，可实现高自由度的电源设计。驱动 CD 驱动器转换器
文件：	总35页 (文件大小：2286K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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