BD8876FV-E2 [ROHM]
Output Coupling Capacitor-less Line Amplifier;
| 型号： | BD8876FV-E2 |
| 厂家： | 
ROHM |
| 描述： | Output Coupling Capacitor-less Line Amplifier |
| 文件： | 总24页 (文件大小：1111K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Output Coupling Capacitor-less
Line Amplifier
BD8876FV, BD8878FV
Key Specifications
Power Supply voltage:
THD+N:
Description
BD8876FV, BD8878FV are output coupling
3V to 5.5V
0.003% (Typ)
(VCC=5V, RL=10kΩ, Vo=2Vrms, 20kHz LPF)
capacitor-less line amplifiers. These IC have a negative
voltage generator built-in and generate the negative
voltage from the supply voltage. It is possible to drive in a
ground reference with both voltage of the supply voltage
and the negative voltage. Therefore, these line
amplifiers have wide output range, and they can output
2Vrms(5.65VP-P) with the single-supply 5V.
Maximum Output Voltage: 2Vrms (Min)@VCC=5V
Output Noise:
Circuit Current (Active):
Operating Temperature Range:
10μVrms (Typ)
3.2mA (Typ)
-40°C to +85°C
Features
Possible to output 2Vrms with single-supply 5V
Output Coupling Capacitor-less
Variable Gain（+6dB / +9dB Typ.） [BD8876FV]
Fixed Gain（+6.7dB Typ.）[BD8878FV]
Integrated Negative Power Supply
Package
SSOP-B14
W(Typ) x D(Typ) x H(Max)
5.00mm x 6.40mm x 1.35mm
Ground-Referenced Outputs
Integrated Short-Circuit and Thermal Protection
Applications
Video game console, Projector, Set Top Box, Blu-ray
player etc.
SSOP-B14
Typical Application Circuit
VDD
VDD
SVDD
PVDD
INL
OUTL
BD8876FV
BD8878FV
Inverting
amplifier
Non-inverting
amplifier
Amplifier type
Gain
INR
OUTR
+6.0dB / +9.0dB
(Changed by GAIN pin)
+6.7dB
SDB
CP
CN
Package
SSOP-B14
GAIN (*1)
PVSS
(*1) GAIN pin : BD8876FV
Figure 1. Typical Application Circuit
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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2015.10.30 Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
1/20
TSZ22111・14・001
BD8876FV, BD8878FV
Pin Configurations
(TOP VIEW)
1
2
3
4
5
6
7
OUTL
INL
14
13
12
11
10
9
1
2
3
4
5
6
7
O U T L
14
13
12
11
10
9
OUTR
INR
OUTR
INR
BD8876FV
BD8878FV
INL
SVDD
S V D D
SVSS
PVSS
CN
SVSS
PVSS
CN
SGND
SDB
S G N D
S D B
NC
GAIN
PVDD
PGND
CP
PGND
CP
8
PVDD
8
Figure 2. Pin Configurations
Pin Description/Function
Equivalence Circuit
PVDD PVDD
PGND PGND
PIN
No.
Pin
name
Equivalence
Circuit
Function
1
OUTL
Line amplifier (Lch) output
D
PAD
PAD
C1
(BD8876FV)
C2
(BD8878FV)
2
INL
Line amplifier (Lch) input
PGND PGND
PVSS PVSS
A
B
3
4
SVDD
SGND
Line amplifier supply voltage
Line amplifier ground
-
-
SVDD
Shutdown control
(H: active, L: shutdown)
Gain control
5
SDB
E
E
-
PAD
GAIN
(BD8876FV) (H: 9.0dB, L:6.0dB)
6
NC
No Connection
(BD8878FV)
C1
SVSS
7
8
PVDD
CP
Charge pump supply voltage
-
Flying capacitor positive terminal
Charge pump ground
A
-
SVDD
SVDD
9
PGND
CN
PAD
PAD
10
11
12
Flying capacitor negative terminal
Charge pump output voltage
Line amplifier negative supply input
B
F
F
PVSS
SVSS
SVSS
SVSS
C2
D
C1
(BD8876FV)
C2
(BD8878FV)
13
14
INR
Line amplifier (Rch) input
Line amplifier (Rch) output
PGND PGND
SVDD
OUTR
D
PAD
PAD
SGND
E
F
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TSZ02201-0C1C0EZ00280-1-2
2015.10.30 Rev.001
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2/20
TSZ22111・15・001
BD8876FV, BD8878FV
Block Diagrams
BD8876FV
BD8878FV
SHORT CIRCUIT
PROTECTION
SHORT CIRCUIT
PROTECTION
OUTL
INL
14 OUTR
1
2
3
OUTR
INR
OUTL
INL
1
2
14
13
42.3k/38.2k
42.3k/38.2k
SVSS
SVSS
SVDD
SVDD
SVSS
22.5k
6.8k
22.5k
6.8k
SVDD
SVDD
SVSS
13
INR
SGND
SGND
15k/19.1k
15k/19.1k
SVDD
SGND
SVDD
3
4
5
6
SGND
SGND
SVDD
SGND
SVSS
SVSS
SVDD
15k
15k
12
11
SVSS
PVSS
12
11
SVSS
PVSS
15k
15k
SVDD
SGND
SVDD
SGND
SGND
SGND 4
UVLO /
SHUTDOWN
CONTROL
UVLO /
SHUTDOWN
CONTROL
5
6
SDB
SDB
NC
10 CN
10 CN
CHARGE
PUMP
CHARGE
PUMP
OPEN
GAIN
9
8
PGND
CP
9
8
PGND
SGND
SGND
PVDD
PVDD
PVDD
CP
PVDD 7
7
Figure 3. Block Diagrams
Symbol
Absolute Maximum Ratings (Ta = 25°C)
Parameter
Rating
Unit
SVDD-PVDD Voltage
SGND-PGND Voltage
SVSS-PVSS Voltage
VDD
VGG
VSS
0
V
V
0
0
V
SVDD, PVDD-SGND or PGND Voltage
SVSS, PVSS-SGND or PGND Voltage
IN_-SGND Voltage
VDG
VSG
VIN
-0.3～6.0
-6.0～0.3
V
V
(SVSS-0.3)～(SVDD+0.3)
(SVSS-0.3)～(SVDD+0.3)
(PGND-0.3)～(PVDD+0.3)
(PVSS-0.3)～(PGND+0.3)
(SGND-0.3)～(SVDD+0.3)
(SGND-0.3)～(SVDD+0.3)
-10～10
V
OUT_-SGND Voltage
VOUT
VCP
VCN
VSH
VGA
IIN
V
CP-PGND Voltage
V
CN-PGND Voltage
V
SDB-SGND Voltage
V
GAIN-SGND Voltage
V
Input current
Power Dissipation (NOTE 1)
mA
W
°C
PD
0.87
Storage Temperature Range
TSTG
-55～+150
(Note 1) Derate by 6.96mW/°C when operating above 25°C when mounted on 70mm x 70mm x 1.6mm, FR4.1-layer glass
epoxy board.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection
measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings.
Recommended Operating Conditions
Limit
Typ
-
Parameter
Symbol
Unit
Min
3.0
Max
5.5
+85
-
Supply Voltage Range
Operating Temperature Range
Minimum Load Impedance
VSVDD, VPVDD
V
°C
Ω
TOPR
ZL
-40
550
-
-
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TSZ02201-0C1C0EZ00280-1-2
2015.10.30 Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
3/20
TSZ22111・15・001
BD8876FV, BD8878FV
Electrical Characteristics
(Unless otherwise specified, Ta=25°C, SVDD=PVDD=5V, SGND=PGND=0V, SDB=H, GAIN=L [BD8876FV], C1=C2=1µF,
RL=10kΩ, Input coupling capacitor=1µF)
Limit
Parameter
Symbol
BD8876FV
Typ
BD8878FV
Typ
Unit
Remarks
Min
Max
Min
Max
Circuit current
Circuit Current
(Shutdown)
Circuit Current
(Active)
IST
-
-
0.1
3.2
2
-
-
0.1
3.2
2
µA
SDB=L
SDB=H, No signal,
RL=No load
IDD
8.2
10.5
mA
SDB pin/GAIN pin
0.7 x
SVDD
0.7 x
SVDD
H Level Input Voltage
VIH
-
-
-
-
V
0.3 x
SVDD
0.3 x
L Level Input Voltage
VIL
-
-
-
-
-
-
-
-
V
SVDD
Input Leak Current
Line amplifier
ILEAK
±1
±1
µA
SDB=L→H
Start up time
tSON
VIS
-
-
470
-
-
-
470
±1
-
µsec
mV
Offset Voltage
±0.5
±5
±10
Maximum Output
Voltage
f=1kHz , THD+N≦-40dB,
20kHz LPF
VOUT
2.5
-
3.5
-
2.05
-
3.0
-
Vrms
%
f=1kHz, VOUT=2Vrms,
20kHz LPF
THD+N
THD+N
0.003 0.032
0.003 0.032
*1
ZIN1
12
10
5.0
8.0
-
19
15
6.0
9.0
1
26
20
*1 GAIN=L (6dB mode)
*2 GAIN=H (9dB mode)
Input Impedance
Gain
20
30
40
kΩ
*2
ZIN2
*1
AV1
7.0
10.0
-
*1 GAIN=L (6dB mode)
*2 GAIN=H (9dB mode)
5.7
6.7
7.7
dB
*2
AV2
Gain mismatch
Output Noise
Slew Rate
ΔAV
VN
-
-
-
-
1
10
3.0
-
-
%
20kHz LPF+A-Weight filter,
Rg=0ohm
-
-
-
8
3.0
-
-
-
-
-
µVrms
V/µsec
SR
CL
Maximum Capacitive
Load
250
250
pF
dB
f=1kHz, VOUT=200mVP-P
,
Crosstalk
CT
PSRR
fOSC
-
-
-80
-65
300
-
-
-
-
-65
-65
300
-
-
1kHz BPF
Power Supply
Rejection Ratio
Charge-Pump
f=1kHz, Vripple=100mVP-P
,
dB
1kHz BPF
150
450
150
450
kHz
Oscillator Frequency
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TSZ02201-0C1C0EZ00280-1-2
2015.10.30 Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
4/20
TSZ22111・15・001
BD8876FV, BD8878FV
(Unless otherwise specified, Ta=25°C, SVDD=PVDD=5V, SGND=PGND=0V, SDB=H, GAIN=L [BD8876FV], C1=C2=1µF,
RL=10kΩ, Input coupling capacitor=1µF) * SVDD, PVDD shows as ”VDD” in the following graphs.
BD8876FV
BD8878FV
BD8876FV
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
8
7
6
5
4
3
2
1
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Supply Voltage [V]
Supply Voltage [V]
Figure 4.
Circuit Current (Shutdown)
vs. Supply Voltage
Figure 5.
Circuit Current (Active)
vs. Supply Voltage
BD8876FV
BD8878FV
10m
1m
10m
1m
VDD=5V
RL=10kΩ
GAIN=6dB
22kHz LPF+A-weight Filter
VDD=5V
RL=10kΩ
22kHz LPF+A-weight Filter
100u
10u
1u
100u
10u
1u
VN=10.6µVrms
VN=7.8µVrms
0.1u
0.1u
10
100
1k
10k
100k
10
100
1k
10k
100k
Frequency [Hz]
Frequency [Hz]
Figure 7.
Noise Level (BDD8878FV)
Figure 6.
Noise Level (BD8876FV)
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TSZ02201-0C1C0EZ00280-1-2
2015.10.30 Rev.001
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5/20
TSZ22111・15・001
BD8876FV, BD8878FV
(Unless otherwise specified, Ta=25°C, SVDD=PVDD=5V, SGND=PGND=0V, SDB=H, GAIN=L [BD8876FV], C1=C2=1µF,
RL=10kΩ, Input coupling capacitor=1µF) * SVDD, PVDD shows as ”VDD” in the following graphs.
BD8876FV
BD8876FV
6
5
4
3
2
1
0
6
5
4
3
2
1
0
f=1kHz
RL=10kΩ
Gain=6dB
f=1kHz
RL=10kΩ
Gain=9dB
VDD=5.5V
VDD=5.5V
VDD=5V
VDD=5V
VDD=3V
VDD=3V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Input Voltage [Vrms]
Input Voltage [Vrms]
Figure 8.
Figure 9.
Output Voltage vs. Input Voltage
(BD8876FV, 6dB)
Output Voltage vs. Input Voltage
(BD8876FV, 9dB)
BD8878FV
BD8876FV
12
11
10
9
6
VOUT=2Vrms
RL=10kΩ
Gain=6dB
VDD=5.5V
f=1kHz
RL=10kΩ
5
4
3
2
1
0
VDD=3V
VDD=5V
VDD=5.5V
8
VDD=5V
7
6
5
VDD=3V
4
3
2
0.0
0.5
1.0
1.5
2.0
2.5
3.0
200k
100k
100
1k
10k
Input Voltage [Vrms]
Frequency [Hz]
Figure 10.
Output Voltage vs. Input Voltage
(BD8878FV)
Figure 11.
Gain vs. Frequency
(BD8876FV, 6dB)
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TSZ02201-0C1C0EZ00280-1-2
2015.10.30 Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
6/20
TSZ22111・15・001
BD8876FV, BD8878FV
(Unless otherwise specified, Ta=25°C, SVDD=PVDD=5V, SGND=PGND=0V, SDB=H, GAIN=L [BD8876FV], C1=C2=1µF,
RL=10kΩ, Input coupling capacitor=1µF) * SVDD, PVDD shows as ”VDD” in the following graphs.
BD8876FV
BD8878FV
12
11
10
9
12
11
10
9
VDD=3V
VDD=5V
VDD=5.5V
8
8
7
7
VDD=3V
VDD=5V
VDD=5.5V
6
6
VOUT=2Vrms
RL=10kΩ
Gain=9dB
VOUT=2Vrms
RL=10kΩ
5
5
4
4
3
3
2
2
200k
100
1k
10k
100k
100
1k
10k
100k 200k
Frequency [Hz]
Frequency [Hz]
Figure 12.
Gain vs. Frequency
(BD8876FV, 9dB)
Figure 13.
Gain vs. Frequency
(BD8878FV)
BD8876FV
BD8876FV
10
1
10
1
VDD=3V
Gain=6dB
RL=10kΩ
VDD=5V
Gain=6dB
RL=10kΩ
20kHz LPF
20kHz LPF
0.1
0.1
0.01
0.01
0.001
0.001
0.01
0.1
1
10
0.01
0.1
1
10
Output Voltage [Vrms]
Output Voltage [Vrms]
Figure 15.
THD+N vs. Output Voltage
(BD8876FV, 5V)
Figure 14.
THD+N vs. Output Voltage
(BD8876FV, 3V)
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TSZ02201-0C1C0EZ00280-1-2
2015.10.30 Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
7/20
TSZ22111・15・001
BD8876FV, BD8878FV
(Unless otherwise specified, Ta=25°C, SVDD=PVDD=5V, SGND=PGND=0V, SDB=H, GAIN=L [BD8876FV], C1=C2=1µF,
RL=10kΩ, Input coupling capacitor=1µF) * SVDD, PVDD shows as ”VDD” in the following graphs.
BD8876FV
BD8878FV
10
1
10
1
VDD=5.5V
Gain=6dB
RL=10kΩ
VDD=3V
RL=10kΩ
20kHz LPF
20kHz LPF
0.1
0.1
0.01
0.01
0.001
0.001
0.01
0.1
1
10
0.01
0.1
1
10
Output Voltage [Vrms]
Output Voltage [Vrms]
Figure 17.
THD+N vs. Output Voltage
(BD8878FV, 3V)
Figure 16.
THD+N vs. Output Voltage
(BD8876FV, 5.5V)
BD8878FV
BD8878FV
10
1
10
1
VDD=5V
RL=10kΩ
20kHz LPF
VDD=5.5V
RL=10kΩ
20kHz LPF
0.1
0.1
0.01
0.001
0.01
0.001
0.01
0.1
1
10
0.01
0.1
1
10
Output Voltage [Vrms]
Output Voltage [Vrms]
Figure 19.
THD+N vs. Output Voltage
(BD8878FV, 5.5V)
Figure 18.
THD+N vs. Output Voltage
(BD8878FV, 5V)
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TSZ02201-0C1C0EZ00280-1-2
2015.10.30 Rev.001
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8/20
TSZ22111・15・001
BD8876FV, BD8878FV
(Unless otherwise specified, Ta=25°C, SVDD=PVDD=5V, SGND=PGND=0V, SDB=H, GAIN=L [BD8876FV], C1=C2=1µF,
RL=10kΩ, Input coupling capacitor=1µF) * SVDD, PVDD shows as ”VDD” in the following graphs.
BD8876FV
BD8878FV
10
1
10
1
VDD=5V
VDD=5V
Gain=6dB
Vo=2Vrms
RL=10kΩ
20kHz LPF
Vo=2Vrms
RL=10kΩ
20kHz LPF
0.1
0.1
0.01
0.001
0.0001
0.01
0.001
0.0001
100
1k
10k 20k
100
1k
10k
20k
Frequency [Hz]
Frequency [Hz]
Figure 20.
THD+N vs. Frequency
(BD8876FV)
Figure 21.
THD+N vs. Frequency
(BD8878FV)
BD8878FV
BD8876FV
0
-10
-20
-30
-40
-50
-60
-70
-80
0
-10
-20
-30
-40
-50
-60
-70
-80
VDD=5V
Gain=6dB
Vripple=100mVP-P
RL=10kΩ
Band Pass Filter
VDD=5V
Vripple=100mVP-P
RL=10kΩ
Band Pass Filter
20k
10
100
1k
10k
20k
10
100
1k
10k
Frequency [Hz]
Frequency [Hz]
Figure 22.
PSRR vs. Frequency
(BD8876FV)
Figure 23.
PSRR vs. Frequency
(BD8878FV)
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TSZ02201-0C1C0EZ00280-1-2
2015.10.30 Rev.001
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9/20
TSZ22111・15・001
BD8876FV, BD8878FV
(Unless otherwise specified, Ta=25°C, SVDD=PVDD=5V, SGND=PGND=0V, SDB=H, GAIN=L [BD8876FV], C1=C2=1µF,
RL=10kΩ, Input coupling capacitor=1µF) * SVDD, PVDD shows as ”VDD” in the following graphs.
BD8876FV
BD8876FV
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
0
-10
VDD=5V
Lch to Rch, Rch to Lch
Gain=6dB
Vo=200mVP-P
RL=10kΩ
20kHz LPF
VDD=5V
Lch to Rch, Rch to Lch
Gain=6dB
Vo=2Vrms
RL=10kΩ
-20
-30
20kHz LPF
-40
-50
-60
-70
-80
-90
-100
-110
-120
10
100
1k
10k
20k
10
100
1k
10k
20k
Frequency [Hz]
Frequency [Hz]
Figure 25.
Crosstalk vs. Frequency
(BD8876FV, 2Vrms)
Figure 24.
Crosstalk vs. Frequency
(BD8876FV, 200mVP-P
)
BD8878FV
BD8878FV
0
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
VDD=5V
Lch to Rch, Rch to Lch
Vo=20mVP-P
RL=10kΩ
20kHz LPF
VDD=5V
Lch to Rch, Rch to Lch
Vo=2Vrms
RL=10kΩ
20kHz LPF
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
10
100
1k
10k
20k
10
100
1k
10k
20k
Frequency [Hz]
Frequency [Hz]
Figure 26.
Crosstalk vs. Frequency
(BD8878FV, 200mVP-P
Figure 27.
Crosstalk vs. Frequency
(BD8878FV, 2Vrms)
)
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2015.10.30 Rev.001
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10/20
TSZ22111・15・001
BD8876FV, BD8878FV
Application Examples
SHORT CIRCUIT
PROTECTION
OUTR
OUTL
14
13
12
11
10
1
RL>550Ω
INL
RR>550Ω
42.3k/38.2k
INR
42.3k/38.2k
SVSS
SVDD
SVDD
SVSS
2
3
Lch Input
Rch Input
CCL=1.0µF
5.0V
CCR=1.0µF
15k/19.1k
15k/19.1k
SVDD
SVDD
SGND
SVSS
SGND
SGND
SVSS
CBPS=1.0µF
SVDD
SGND
SDB
PVSS
4
5
6
UVLO /
SHUTDOWN
CONTROL
SHUTDOWN
CONTROL
CN
C2=1.0µF
CHARGE
PUMP
GAIN
GAIN
CONTROL
PGND
CP
C1=1.0µF
9
8
5.0V
PVDD
SGND
PVDD
7
CBPP=1.0µF
Figure 28. BD8876FV Application circuit example
SHORT CIRCUIT
PROTECTION
OUTR
OUTL
14
13
12
11
10
1
RL>550Ω
INL
RR>550Ω
INR
SVSS
SVDD
SVDD
SVSS
22.5k
6.8k
22.5k
6.8k
2
3
Rch Input
Lch Input
CCL=1.0µF
5.0V
CCR=1.0µF
SGN
D
SGN
D
SVDD
SVSS
SVSS
SVDD
15k
15k
15k
15k
CBPS=1.0µF
SVDD
SGND
SGND
SGND
SDB
SGND
PVSS
4
5
6
SHUTDOWN
CONTROL
UVLO /
SHUTDOWN
CONTROL
CN
C2=1.0µF
CHARGE
PUMP
OPEN
PGND
NC
C1=1.0µF
9
8
5.0V
PVDD
SGND
PVDD
CP
7
CBPP=1.0µF
Figure 29. BD8878FV Application circuit example
* PVSS and SVSS are connected each other inside IC. But, please connect PVSS and SVSS outside IC, also.
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Timing Chart
< Sequence of start-up / power-down>
PVDD, SVDD
SDB
PVSS, SVSS
INL, INR
OUTL
OUTR
Setup
(Charge pump
Start-up)
Active
-> Shutdown
Active
(Line Amp enable)
Shutdown
Shutdown
ON -> OFF
VDD
OFF -> ON
Signal input
Available
Figure 30. Sequence of start-up / power-down
①
The term from “PVDD, SVDD : ON” to “shutdown ON->OFF”
When power supply (PVDD, SVDD) is applied, it is started that charging input coupling capacitors. Therefore, the input
terminal voltage ”Vin” is changed as following Figure 31. Time constant “τ” of charging input coupling capacitor is decided by
input coupling capacitor Cin and Internal input impedance Rin (See formula (1)). Internal impedance Rin in term of
shutdown is 7.5kΩ(typ) for making time constant τ shorten. If “SDB” is changed “L” to “H” (shutdown ON -> OFF) during
input DC voltage (Vin) is changing, pop noise may occur. It is recommended that shutdown ON -> OFF (“SDB” : L -> H) after
5τ ~ 6τ.
Rin
Vs
Vin =7.5k
Vout
7.5k
42.3k
Audio
Bias
Source
Cin
VDD
0
time [s]
-
+
Bias
VSS
0
time [s]
Figure 31. Fluctuation of input terminal voltage when charging input coupling capacitor
100
τ = Rin x Cin (1)
90
80
70
60
50
40
30
20
10
0
(e.g.) in case of Cin =1.0µF,
τ = Rin x Cin
=7.5kΩ x 1.0µF
= 7.5 msec(typ)
6τ = 6 x 7.5msec
= 45 msec (typ)
0τ
1τ
2τ
3τ
4τ
5τ
6τ
7τ
8τ
Wait time [s]
Figure 32. Wait time vs. convergence
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②
The term from shutdown OFF to line amplifier start-up
When shutdown is ON -> OFF, charge pump starts up. Line amplifier is stopped during “tSON (start-up time of charge pump,
470µsec typ.)” for preventing irregular output. Please input audio signal after “tSON”.
[V]
VDD
SDB
0
[time]
[V]
[time]
0
PVSS
SVSS
470µsec(typ.)
Line Amplifier
shutdown
wait(=tSON)
active
Figure 33. Wait time for Line amplifier from “shutdown ON -> OFF”
Functional Descriptions / Application Information
The composition of conventional line amplifier is shown in Figure 34. Output signal swings in reference to Middle DC bias
(e.g. VDD/2). Therefore, Output dynamic range of line amplifier limits until “VDD”.
Vout
Input
VDD
VDD
-
Output range
+
VDD/2
≈ VDD
GND
0
time [s]
Middle DC Bias (ex. VDD/2)
Figure 34. The composition of conventional line amplifier
The composition of BD8876FV/BD8878FV is shown to Figure 35. Output signal swings in reference to ground level. Line
amplifier can output between from VSS (-VDD) to VDD. Therefore, Output dynamic range of line amplifier expands
“2 x VDD”. And, it is possible to drive 2Vrms (5.65VP-P) with single supply voltage 5V.
BD8876FV
BD8878FV
VDD
Vout
Vout
Input
VDD
-
VDD
-
Input
Output range
+
+
C1 : Flying
Capacitor
≈ 2 x VDD
VSS
VSS
0
time [s]
VSS
Charge
Pump
Charge
Pump
C2 : Hold
Capacitor
Figure 35. The composition of BD8876FV/BD8878FV
13/20
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￭ CHARGE PUMP
The negative power supply circuit is composed of the regulated charge-pump. This circuit outputs the negative
voltage (PVSS) from positive power-supply voltage (PVDD).
The negative power supply circuit starts when “SDB=H”, and power is downed when “SDB=L”(See Table 1).
Table 1. Control of the charge pump circuit
SDB
L
H
Control
Power down
Power on
＜The flying capacitor and the hold capacitor＞
The flying capacitor (Figure 35. C1) and the hold capacitor (Figure 35. C2) have great influences on the characteristic
of the charge pump. Please select capacitors that have low ESR characteristic and low voltage coefficient, low
temperature coefficient for C1, C2. And, please connect these capacitors as near as possible to IC.
＜Over-current Protection＞
The charge pump has the over-current protection function. If the terminals of charge pump (CP, CN, PVSS, SVSS) are
under the abnormal connecting conditions (e.g. shorting to ground), this function shutdown IC and protect it from the
damage.
￭Line Amplifier
The line amplifier is driven by power-supply voltage (SVDD) and negative voltage (SVSS) based on ground (SGND).
Therefore, the amplifier can output 2Vrms for RL=10kohm with the single supply voltage 5V. And BD8876FV can
change the gain 6dB and 9dB. The gain of BD8878FV is 6.7dB (fixed).
The both of Lch and Rch of the line amplifier are simultaneously controlled by SDB logic (See Table 2).
In addition, the over-current protection circuit is built in. The amplifier is shutdown, when the over-current occurs
because of the output short-circuit etc., and IC is protected from being destroyed.
Table 2. Control of the Line amplifier circuit
SDB
L
Lch/Rch amplifier control
Power down
H
Power on
＜Input coupling capacitor＞
Input DC voltage level of BD8876FV/BD8878FV is 0V (SGND). Therefore, input coupling capacitor is needed.
Gain is decreased in low frequency because of composing the high-pass filter by input coupling capacitor Cin and
internal input impedance Rin of BD8876FV/BD8878FV.
Input impedance Rin of BD8876FV is 15kΩ (Typ, Gain=+9dB), and Rin of BD8878FV is 30kΩ (Typ).
Cut-off frequency of the high-pass filter is shown to the following formula (2).
9.0
Rin=15kΩ
6.0
3.0
Cin=10.0μ F
0.0
-3.0
1
fc
(2)
-6.0
-9.0
2RinCin
Cin=4.7μ F
Cin=2.2μ F
Cin=1.0μ F
-12.0
-15.0
-18.0
-21.0
1
10
100
Frequency [Hz]
Figure 36. Frequency response by the input coupling capacitor (Reference data: Calculated value)
The degradation of THD happens because of the input coupling capacitor. Therefore, please consider the applied
voltage dependence and the temperature characteristic of the capacitor when selecting parts.
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￭ UVLO / SHUTDOWN CONTROL
BD8876FV/BD8878FV has low voltage protection function (UVLO: Under Voltage Lock Out).
UVLO function protects from abnormal operation under lower power supply voltage than the recommended supply voltage
range. The detection voltage is 2.8V (Typ). It does not influence the recommended operation voltage (3.0V (Min)). The power
control by UVLO works for the whole of IC, and power down the both of the negative power supply charge pump and the line
amplifier. If power supply voltage recovers over recommended range (3.0V), all function also recover automatically.
Power Dissipation
SSOP-B14
1
0.87W
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
25
50
75
100
125
150
Ta (℃)
Figure 37. Power Dissipation Curve
Measurement Condition: Mounted on ROHM standard board, glass-epoxy
Board size: 74.2mm×74.2mm×1.6mm (1-layer)
Material: FR4
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on
the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the
IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has
more than one power supply. Therefore, give special consideration to power coupling capacitance, power
wiring, width of ground wiring, and routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Terminals
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the
power supply or ground line.
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Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 38. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the
TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
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BD8876FV, BD8878FV
Ordering Information
6 F V
8 F V
B D 8
B D 8
8
8
7
7
-
-
E 2
E 2
Package
FV: SSOP-B14
Packaging and forming specification
E2: Embossed tape and reel
Part Number
Line-up
BD8876FV
BD8878FV
Amplifier type
Inverting amplifier
Non-inverting amplifier
+6dB / +9dB
(Changed by Gain pin)
Gain
+6.7dB
Package
SSOP-B14
Marking Diagram
SSOP-B14 (TOP VIEW)
SSOP-B14 (TOP VIEW)
Part Number Marking
Part Number Marking
D8878
LOT Number
D8876
LOT Number
1PIN MARK
1PIN MARK
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Physical Dimension, Tape and Reel Information
Package Name
SSOP-B14
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BD8876FV, BD8878FV
Revision History
Date
Revision
001
Changes
2015/10/30
First version
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Daattaasshheeeett
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.002
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General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Datasheet
Buy
BD8876FV - Web Page
Distribution Inventory
Part Number
Package
Unit Quantity
BD8876FV
SSOP-B14
2500
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
2500
Taping
inquiry
Yes
相关型号：
BD8878FV
BD8878FV是无需输出耦合电容器的线路放大器。内置负电源发生电路。通过采用正电压与负电压的两种电压来驱动线路放大器，以ground level为基准进行输出。因此，具有广阔的输出动态范围，可利用5V的单电源输出2Vrms的信号。由此，可减少高电压输出的稳压器。此外，因为是以ground为基准进行输出，无需输出耦合电容器即可连接其他元器件。
ROHM
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