BD8906F-E2 [ROHM]
Interface Circuit, PDSO28, ROHS COMPLIANT, SOP-28;
| 型号： | BD8906F-E2 |
| 厂家： | 
ROHM |
| 描述： | Interface Circuit, PDSO28, ROHS COMPLIANT, SOP-28 光电二极管 接口集成电路 |
| 文件： | 总16页 (文件大小：590K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IC Card Interface ICs
IC card interface ICs
with Built-in DC / DC Converter
BD8904F, BD8904FV, BD8905F, BD8906F, BD8906FV, BD8907F
No.09056EAT02
●Overview
BD8904F, BD8904FV, BD8905F, BD8906F, BD8906FV and BD8907F are an interface IC for a 3V or 5V smart card.
It works as a bidirectional signal buffer between a smart card and a controller. Also, it supplies 3V or 5V power to a smart
card. With electrostatic breakdown voltage of more than HBM: ±6000V, it protects the card contact pins.
●Features
1) 3 half duplex bidirectional buffers
2) Protection against short-circuit for all the card contact pins
3) Card power source (VREG) of 3V or 5V
4) Overcurrent protection for card power source
5) Built-in thermal shutdown circuit
6) Built-in supply voltage detector
7) Automatic start-up/shutdown sequence function for card contact pin
Start-up sequence: driven by a signal from controller (CMDVCCB↓)
Shutdown sequence: driven by a signal from controller (CMDVCCB↑) and fault detection (card removal,
short circuit of card power, IC overheat detection, VDD or VDDP drop)
8) Card contact pin ESD voltage ≧ ±6000V
9) 2MHz - 26MHz integrated crystal oscillator
10) Programmable for clock division of output signal by 1, 1/2, 1/4, and 1/8
11) RST output control by RSTIN input signal (positive output)
12) One multiplexed card status output by OFFB signal
●Line up matrix
Input Voltage
Resistor to set VDD
voltage detector
Operating
temperature
Part No.
Package
VDD
VDDP
BD8904F
BD8904FV
BD8905F
BD8906F
BD8906FV
BD8907F
External
External
External
Built-in
2.7V - 5.5V
2.7V - 5.5V
2.7V - 5.5V
3.0V - 5.5V
3.0V - 5.5V
3.0V - 5.5V
3.0V - 5.5V
3.0V - 5.5V
3.0V - 5.5V
3.0V - 5.5V
3.0V - 5.5V
3.0V - 5.5V
-40°C - +85°C
-40°C - +85°C
-25°C - +85°C
-25°C - +85°C
-25°C - +85°C
-40°C - +85°C
SOP28
SSOP-B28
SOP28
SOP28
Built-in
SSOP-B28
SOP28
Built-in
●Application
Interface for smart cards
Interface for B-CAS cards
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© 2009 ROHM Co., Ltd. All rights reserved.
2009.07 - Rev.A
1/15
Technical Note
BD8904F, BD8904FV, BD8905F, BD8906F, BD8906FV, BD8907F
●Absolute maximum ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
Note
VDD Input Voltage
VDDP Input Voltage
VDD
VDDP
VIN
VOUT
VREG
Vn
-0.3 - 6.5
-0.3 - 6.5
V
V
Pin : XTAL1, XTAL2, VSEL, RSTIN, AUX1C, AUX2C, IOC,
CLKDIV1, CLKDIV2, CMDVCCB, OFFB, PORADJ, S2
Pin : PRES, PRESB, CLK, RST, IO, AUX1, AUX2
Pin : VCH, S1
I/O Pin Voltage
-0.3 - +6.5
V
Card Contact Pin Voltage
Charge Pump Pin Voltage
Junction Temperature
Storage Temperature
BD8904F
-0.3 - +6.5
-0.3 - +14.0
+150
V
V
°C
°C
Tjmax
Tstg
-55 - +150
Ta=-40 - +85°C
Ta=-25 - +85°C
Ta=-25 - +85°C
Ta=-40 - +85°C
Ta=-40 - +85°C
BD8905F
750
BD8906F
BD8907F
BD8904FV
Power
Dissipation
* Refer to the following package power
dissipation
Ptot
mW
1060
BD8906FV
Ta=-25 - +85°C
•This product is not designed to be radiation tolerant.
•Absolute maximum ratings are not meant for guarantee of operation.
●Operating Conditions
Limits
MIN TYP MAX
Parameter
Operating temperature
VDD Input Voltage
Symbol
Topr
Unit
Note
-40
-25
2.7
3.0
4.5
3.0
3.1
3.0
3.0
-
-
-
+85
°C BD8904F, BD8904FV, BD8907F
°C BD8905F,BD8906F, BD8906FV
+85
5.5
5.5
5.5
4.5
4.5
3.1
5.5
V
V
V
V
V
V
V
BD8904F, BD8904FV, BD8905F
BD8906F,BD8906FV, BD8907F
VDD
-
5.0
-
-
-
VREG=5V; Ivreg ≤ 60mA
VREG=5V; Ivreg ≤ 20mA, Except BD8904FV
VREG=5V; Ivreg ≤ 25mA, Application to BD8904FV
VREG=5V; Ivreg ≤ 20mA, Application to BD8904FV
VREG=3V; Ivreg ≤ 60mA
VDDP Input Voltage
VDDP
5.0
●Package Power Dissipation
The power dissipation of the package will be as follows in case that ROHM standard PCB is used.
Use of this device beyond the following the power dissipation may cause permanent damage.
BD8904F, BD8905F, BD8906F, BD8907F: Pd=750mW;
BD8904FV, BD8906FV : Pd=1060mW; however, reduce
however, reduce 6mW per 1°C when used Ta≥25°C.
8.5mW per 1°C when used Ta≥25°C.
ROHM standard PCB: Size: 70×70×1.6 (mm3), Material: FR4 glass epoxy board (copper plate area of 3% or less)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-40
-20
0
20
40
60
80
100 120 140 160
-40
-20
0
20
40
60
80
100 120 140 160
Ta [℃]
Ta [℃]
Fig. 1 Power Dissipation of
BD8904F, BD8905F, BD8906F, BD8907F
Fig. 2 Power Dissipation
of BD8904FV, BD8906FV
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© 2009 ROHM Co., Ltd. All rights reserved.
2009.07 - Rev.A
2/15
Technical Note
BD8904F, BD8904FV, BD8905F, BD8906F, BD8906FV, BD8907F
●Block Diagram
2.7V - 5.5V
3.0V - 5.5V
VDDP
VDD
REF
CHGPUMP
S1
VREF
VREF
VDD
S2
CHARGE PUMP
doubler
DETREF
R1
VDD
PGND
PORADJ
VDET
R2
VCH
VDD
VDD
2.7MHz
OSC
TSD
LVS
TSD
ALARM
EN1
VSEL
VDD
VREG
OFFB
3V/5V
EN2
CARD REG
RST BUF
RSTIN
CGND
SEQUENCER
VCC
ALARM
CMDVCCB
EN5
EN4
RST
EN
CLKDIV1
CLKDIV2
CLK
DIV
CLK
CLK BUF
CLK
VDD
VDD
PRES
PRESB
VDD
XTAL1
XTAL2
XT OSC
2MHz - 26MHz
MAX 1MHz
VDD
VREG
VREG
VREG
AUX1C
AUX2C
IOC
AUX1
AUX2
IO
IO TRANS
IO TRANS
IO TRANS
VDD
VDD
MAX 1MHz
MAX 1MHz
GND
Fig. 3
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2009.07 - Rev.A
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© 2009 ROHM Co., Ltd. All rights reserved.
Technical Note
BD8904F, BD8904FV, BD8905F, BD8906F, BD8906FV, BD8907F
●Pin Description
Pin No.
Pin Name
CLKDIV1
I/O Signal Level
Pin Function
Clock frequency selection input 1
1
I
I
VDD
VDD
VDD
GND
-
2
3
4
5
6
7
CLKDIV2
VSEL
PGND
S2
Clock frequency selection input 2
I
Card supply voltage selection input; “H”: VREG=5V, “L”: VREG=3V
GND for charge pump
S
Capacitor connection for charge pump
(between S1/S2): C = 100nF (ESR < 100mΩ)
I/O
S
VDDP
S1
VDDP
-
Power supply for charge pump
Capacitor connection for charge pump
(between S1/S2): C = 100nF (ESR < 100mΩ)
Charge pump output: Decoupling capacitor;
Connect C = 100nF (ESR < 100mΩ) between VCH and PGND
Card presence contact input (active “L”)
When PRES or PRESB is active, the card is considered ‘present’ and a
built-in debounce feature of 8ms (typ.) is activated.
Pulled up to VDD with a 2MΩ resistor.
I/O
8
9
VCH
I/O
I
-
PRESB
VDD
Card presence contact input (active “H”)
When PRES or PRESB is active, the card is considered ‘present’ and a
built-in debounce feature of 8ms (typ.) is activated.
Pulled down to GND with a 2MΩresistor.
10
PRES
I
VDD
11
12
13
14
15
16
17
IO
I/O
I/O
I/O
S
VREG
VREG
VREG
GND
Card contact I/O data line; Pulled up to VREG with a 11kΩ resistor
AUX2
AUX1
CGND
CLK
Card contact I/O data line; Pulled up to VREG with a 11kΩ resistor
Card contact I/O data line; Pulled up to VREG with a 11kΩ resistor
GND
O
VREG
VREG
VREG
Card clock output
Card reset output
RST
O
Card supply voltage; Connect a capacitor (ESR < 100mΩ) of 100nF -
220nF between VREG and CGND
VREG
O
18
(BD8904F)
(BD8904FV)
(BD8905F)
18
(BD8906F)
(BD8906FV)
(BD8907F)
Power-on reset threshold adjustment voltage input ; set with an external
resistor bridge
PORADJ
TEST
I
-
Normally used OPEN. Input voltage range: 0V - VDD voltage
Can also be used at VDD or GND potential.
Activation sequence command input; The activation sequence starts by
signal input (H→L) from the host
19
20
21
22
23
24
25
26
27
28
CMDVCCB
RSTIN
VDD
I
I
VDD
VDD
VDD
GND
VDD
VDD
VDD
VDD
VDD
VDD
Card reset signal input
Input power source pin
GND
S
GND
S
Alarm output pin (active “L”)
NMOS output pulled up to VDD with a 20kΩ resistor
OFFB
O
I
XTAL1
XTAL2
IOC
Crystal connection or input for external clock
O
I/O
I/O
I/O
Crystal connection (leave open pin when external clock source is used)
Host data I/O line; Pulled up to VDD with a 11kΩ resistor
Host data I/O line; Pulled up to VDD with a 11kΩ resistor
Host data I/O line; Pulled up to VDD with a 11kΩ resistor
AUX1C
AUX2C
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2009.07 - Rev.A
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© 2009 ROHM Co., Ltd. All rights reserved.
Technical Note
BD8904F, BD8904FV, BD8905F, BD8906F, BD8906FV, BD8907F
●Pin Function Diagram
Pin
No.
Pin
No.
Pin Name
Pin Function Diagram
Pin Name
Pin Function Diagram
1
2
CLKDIV1
CLKDIV2
10
PRES
3
4
VSEL
PGND
--------------------------
11
12
IO
5
S2
AUX2
13
14
AUX1
6
7
VDDP
S1
--------------------------
CGND
--------------------------
15
CLK
8
VCH
9
PRESB
16
RST
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© 2009 ROHM Co., Ltd. All rights reserved.
2009.07 - Rev.A
5/15
Technical Note
BD8904F, BD8904FV, BD8905F, BD8906F, BD8906FV, BD8907F
Pin
No.
Pin
No.
Pin
Pin Name
Pin Function Diagram
Pin Function Diagram
Name
17
VREG
23
OFFB
PORADJ
24
25
XTAL1
XTAL2
18
TEST
26
27
28
IOC
CMDVCC
B
19
20
AUX1C
AUX2C
RSTIN
--------------------------
--------------------------
21
22
VDD
GND
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© 2009 ROHM Co., Ltd. All rights reserved.
2009.07 - Rev.A
6/15
Technical Note
BD8904F, BD8904FV, BD8905F, BD8906F, BD8906FV, BD8907F
●Package
For “XX” in the product name below, substitute 04 for BD8904, 05 for BD8905, 06 for BD8906 and 07 for BD8907.
Package Name: SOP28
(Max. dimension including burr:
)
18.85
BD89XXF
Lot No
1PIN MARK
(UNIT : mm)
Fig. 4 SOP28 Package Outer Dimension
Package Name: SSOP-B28
(Max. dimension including burr: 10.35)
BD89XXFV
Fig. 5 SSOP-B28 Package Outer Dimension
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© 2009 ROHM Co., Ltd. All rights reserved.
2009.07 - Rev.A
7/15
Technical Note
BD8904F, BD8904FV, BD8905F, BD8906F, BD8906FV, BD8907F
●Function
1) Power Supply
Power supply pins are VDD and VDDP. Set VDD at the same voltage as the signal from the system controller.
VDDP and PGND are the power source and GND for the charge pump circuit, respectively, and the power source for the card.
The VSEL pin setting determines the supply voltage of 3V (VSEL: L) or 5V (VSEL: H) from the VREG pin to the card.
2) VDD input voltage detector
By connecting the resistance bridge (R1, R2: Fig. 3) to the PORADJ pin, you can set the VDD supply voltage detector
(VDETR, VDETF: Fig.5). Approximately 16ms (BD8904F/FV, BD8905F) or 8ms (BD8906F/FV, BD8907F) after VDD voltage
becomes higher than VDETR (internal reset), power-on reset (alarm) will be cancelled and the IC will go into sleep mode
until the CMDVCCB signal turns from H to L.
The IC will initiate the shutdown sequence toward the card contact pin if VDD voltage is decreased below VDETF
.
◆
Calculating resistance bridge R1 and R2 for supply voltage detector
(Applicable to BD8904F, BD8904FV and BD8905F; excludes BD8906F, BD8906FV and BD8907F)
The following equations can be used to calculate the alarm reset voltage (VDETR) and low voltage detection voltage (VDETF):
Please ensure that VDETF is set at over 2.3V.
PORADJ pin voltage at VDD startup:
VDDTHR
PORADJ pin voltage at VDD shutdown: VDDTHF
R1
R1
R2
VDETR
1 VDD
VDETF
1 VDD
THR
THF
R2
Vth2+Vhys2
Vth2
VDD
ALARM
(internal signal)
tW
tW
Power ON
Input power drop
Power OFF
tw = (BD8904F/FV, BD8905F): 16ms, (BD8906F/FV, BD8907F): 8ms
Fig. 6 VDD Input Voltage Detection
3) Operation sequence
3-1) Wait mode
When VDD voltage becomes higher than VDTER, power-on reset (alarm) is released and the IC will be in wait mode until
the CMDVCCB signal turns from H to L.
In this mode, the VDD supply voltage detector (VDET), thermal shutdown circuit (TSD), reference circuit (VREF),
crystal oscillation circuit (XT OSC) and internal oscillator circuit (OSC) are activated.
IOC, AUX1C and AUX2C are pulled up to VDD with an 11kΩ resistor and all the card contact pins are at Lo level.
3-2) Card insertion
Card presence is detected by PRES pin or PRESB pin. When either of the PRES pin or PRESB pin is active, a card is
assumed to be present.
Table 1
PRES
“High” active
“Lo” active
PRESB
When a card is present in sleep mode, either one of the card presence identification pins, PRES (“H” active) or
PRESB (“L” active) becomes active. OFFB will become “H” after approximately 8ms (debounce time).
If a card is present before the VDD power source is applied and the internal reset is released, it is internally reset and
OFFB becomes “H” after the debounce time.
The PRES pin is pulled down to GND with a 2MΩ resistor and the PRESB pin is pulled up to VDD with a 2MΩ resistor.
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© 2009 ROHM Co., Ltd. All rights reserved.
2009.07 - Rev.A
8/15
Technical Note
BD8904F, BD8904FV, BD8905F, BD8906F, BD8906FV, BD8907F
3-3) Activation sequence
When OFFB is in the “High” state and the CMDVCCB signal from the controller turns from H to L, the activation
sequence starts to activate each functional block in the following order:
The RST outputs signals based on the RSTIN input, being reset approximately 200μsec after the CMDVCCB signal
turns from H to L. The RSTIN input becomes effective approximately 300ns after I/O TRANS turns ON. If RSTIN
becomes Lo after RSTIN becomes effective and before RST output is released, the CLK signal is output. If RSTIN is
High when the RST output is released, the CLK signal is output as soon as the RST output is released. (Refer to Fig.
6-1, Fig. 6-2 and Fig. 6-3)
CHARGE PUMP ON (VCH voltage output)
↓
CARDREG ON
↓
(VREG output)
I/O TRANS ON
(All I/O Bus: Pull-up)
↓________________________________________________
↓
↓ When RSTIN remains High until RST is released
↓ (RSTIN≠Always High)
↓(RSTIN=Always High)
↓
↓
CLK BUF ON (CLK output)
CLK, RST BUF ON (CLK output, RST release)
↓
RST BUF ON (RST release)
[Activation sequence under different RSTIN input timings]
CMDVCCB
VCH
CMDVCCB
VCH
VREFG
VREFG
I/O
ART
ART
I/O
CLK
CLK
Min:200ns
RSTIN
RSTIN
RST
RST
IOUC
IOUC
t5= tact
t0 t1 t2
t3 t4
t0t1 t2
t3
t4 t5= tact
Fig. 7 Activation sequence 1
Fig.8 Activation sequence 2
CMDVCCB
VCH
t1: VCH startup time
t2: VREG startup time
t3: I/O ON time
= typ 21.4μs, (max. 30μs)
= typ 57μs, (max. 80μs)
= typ 116.2μs, (max. 150μs)
VREFG
I/O
ART
CLK
RSTIN
t4: CLK output release time (t4-t3)= Min 200ns, (max. 450μs)
RST
t5: RST release time
(activation time)
= typ 187.4μs, (max. 240μs)
IOUC
t0 t1 t2
t3 t4
t5= tact
Fig.9 Activation sequence 3 (not supported by ISO7816-3)
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© 2009 ROHM Co., Ltd. All rights reserved.
2009.07 - Rev.A
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Technical Note
BD8904F, BD8904FV, BD8905F, BD8906F, BD8906FV, BD8907F
3-4) Deactivation sequence
When the CMDVCCB input turns from L to H or the alarm signal (described later) is detected, the following
deactivation sequence is initiated in the following order transitioning to the wait mode.
RST BUF OFF
(RST: Lo)
(CLK: Lo)
↓
CLK BUF OFF
↓
I/O TRANS OFF
(I/O Bus on the controller side: Pull-up)
(I/O Bus on the card side: Lo)
↓
↓
CARDREG OFF
(VREG: Lo)
↓
CHARGE PUMP OFF
CMDVCCB
RST
t11: CLK OFF time
= typ. 11.9μs
= typ. 23.7μs
= typ. 35.6μs
= typ. 118.5μs
t12: I/O OFF time
CLK
I/O
t13: Start time of VREG fall
t14: Start time of VCH fall
VREG
tde: Operational sequence completion time= Max. 100μs
VCH
t11
t12
t13
tde
t10
t14
Fig.10 Deactivation sequence
4) CHARGE PUMP
The charge pump circuit is the power supply for CARD REG output. It activates when the CMDVCCB input turns from H to
L. It functions as a voltage doubler or voltage follower by the VDDP voltage.
The VCH output becomes a power source for the CARDREG circuit.
As the charge pump circuit takes a high charge current, place two capacitors (one between S1-S2, and the other between
VCH-PGND) as close as possible to the IC so that the ESR becomes less than 100mΩ. Also, place a capacitor between
VDDP and PGND as close as possible to the IC so that the ESR becomes less than 100mΩ.
5) CARD REG
CARD REG supplies power to the IC card through the VREG pin.
The VREG output voltage can be switched between 3V and 5V by the VSEL pin setting.
Table 2 VSEL pin setting
VSEL
0
VREG output voltage
3V
VDDP Input Voltage
3.0V ≤ VDDP ≤ 5.5V
3.0V ≤ VDDP < 4.5V
3.0V ≤ VDDP < 3.1V
3.1V ≤ VDDP < 4.5V
4.5V ≤ VDDP ≤ 5.5V
MAX current
60mA
Remark
20mA
Except BD8904FV
20mA
1
5V
Application to BD8904FV
25mA
60mA
This regulator has an over-current limiter circuit. It generates an internal alarm with a load current of approximately 140mA
or more and enters into the deactivation sequence. Also, the output voltage is regarded as abnormal if it becomes less
than 0.6V in the case where VREG is 3V or becomes less than 1V in the case where VREG is 5V, and the output current is
shut off. At this point, an internal alarm signal is generated and the deactivation sequence is initiated.
Connect a capacitor of 100nF, 220nF or 330nF between VREG and CGND as close as possible to the VREG pin, in order
to reduce the output voltage variation as much as possible. Also, ensure that ESR is kept at less than 100mΩ.
CARD REG output is also a power source for the CLK and RST output. Therefore, the CLK and RST output level is the
same as the VREG output level.
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2009.07 - Rev.A
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Technical Note
BD8904F, BD8904FV, BD8905F, BD8906F, BD8906FV, BD8907F
6) I/O data transitions
Three data lines, IOC - IO, AUX1C - AUX1 and AUX2C - AUX2 transmit two-way data independently of each other.
Pins for the controller side, IOC, AUX1C and AUX2C are pulled up with an 11kΩ resistor to High (VDD voltage) and card
contact pins, IO, AUX1 and AUX2 are set to Lo until I/O TRANS becomes ON during the activation sequence.
When I/O TRANS becomes On, IC becomes idle mode and all the I/O pins are pulled up with an 11kΩ. The IOC, AUX1C
and AUX2C pins keep VDD voltage (High) and the IO, AUX1 and AUX2 pins go to’ VREG voltage (High).
The pin which turns from H to L first becomes the master and the other output side becomes the slave between the pins on
the controller side and card contact pins. Then the data are transferred from the master side to the slave side.
When both signal levels become High, they become idle.
When the signal transits from L to H and it passes over a threshold, an active pull-up (100 ns or less) works to drive the
data High at high speed. After the active pull-up is completed, the pin is pulled up with an 11kΩ resistor. This function
enables signal transmission up to 1MHz. Also, an over-current limiter of 15mA works in the card contact pins, IO, AUX1
and AUX2.
7) Card clock supply
Card clock is supplied from the CLK pin divides the input frequency of XTAL1 pin by 1, 1/2, 1/4 and 1/8 with the CLKDIV1
and CLKDIV2 pin setting. The clock division switching time is within the 8 clocks of the XTAL1 signal (refer to Table 3).
The input signal to the XTAL1 pin is made by a crystal oscillator (2MHz - 26MHz) between the XTAL1 pin and XTAL2 pin or
external pulse signal.
To ensure the duty factor of 45% - 55% at the CLK pin, the duty of the XTAL1 pin should be 48% - 52% and the transition
time should be within 5% of the frequency.
To guarantee a 45% - 55% duty, use it with a clock division of 1/2, 1/4 or 1/8 depending on the wiring layout on the PCB.
Table 3 Clock frequency selection
(fXTAL: Frequency of XTAL1)
fclk
CLKDIV1
CLKDIV2
fXTAL
8
0
0
1
1
0
fXTAL
4
0
1
fXTAL
2
fXTAL
1
1
8) RSTIN input, RST output
The RSTIN input becomes effective after the CMDVCCB signal input turns from H to L, activation sequence is initiated and
approximately 300ns after I/O TRANS turns ON. The RST output is released in approximately 200μsec after the
CMDVCCB signal turns from H to L to output signal based on the RSTIN input.
9) Fault detection
When the following fault state is detected, the circuit enters the wait mode after it generates an internal alarm signal and is
deactivated.
If a card is not present, it remains in the wait mode.
•
•
•
•
•
When the VREG pin becomes less than 1V (VSEL=H) or 0.6V (VSEL=L), or is loaded high current(TYP: 150mA)
When the VDD voltage is less than the threshold voltage (detected by supply voltage detector)
When an overheating is detected by the thermal shutdown circuit
When VCH pin voltage drops to an abnormal level
When the card is removed during operation or the card is not present from the beginning (PRES=L and PRESB=H)
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© 2009 ROHM Co., Ltd. All rights reserved.
Technical Note
BD8904F, BD8904FV, BD8905F, BD8906F, BD8906FV, BD8907F
10) OFFB output
The OFFB output pin indicates that the IC is ready to operate. It is pulled up to VDD with a 20kΩ resistor.
When the IC is in ready state, OFFB is High.
The OFFB outputs OFF state (Lo) when a fault state is detected.
When a card is present, the fault state is released and CMDVCCB becomes High, the internal alarm is released and the
OFFB output becomes High.
PRES
OFFB
CMDVCCB
tdebounce
tdebounce
tdebounce = typ 8ms
VREG
Shutdown by card removal
Shutdown by short-circuiting of pins
Fig. 11 OFFB, CMDVCCB, PRES, VREG operation
●An example of software control
Start
No (card not inserted)
OFFB=H ?
Yes(carddetected)
Error message 1
“Insert a card”
Set CMDVCCB HL
End
Initiate Activation
DC/DC On (VCH)
Regulator ON (VREG)
OFFB=L ?
Alarm detected
IO Enabled (IO)
Card removed
Overcurrent detected
No alarm
Supply voltage drop
Initiate card
Increased temperature
communication
Set RSTIN LH
Error message 2
“Error during communication”
Completed
Turn CMDVCCB LH
Initiate deactivation
IO disabled (IO)
Initiate deactivation
Regulator OFF (VREG)
IO disabled (IO)
DC/DC OFF (VCH)
Regulator OFF (VREG)
DC/DC OFF (VCH)
* Ensure to set CMDVCCB LH to
an alarm at the host side
SetCMDVCCBLH
End
enable confirmation that LSI can detect
End
Fig. 12 An example of software control
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© 2009 ROHM Co., Ltd. All rights reserved.
2009.07 - Rev.A
12/15
Technical Note
BD8904F, BD8904FV, BD8905F, BD8906F, BD8906FV, BD8907F
●Application examples
+3.3V
CLKDIV1
CLKDIV2
VSEL
PGND
S2
AUX2C
AUX1C
IOC
1
28
27
26
25
24
23
22
21
20
19
18
17
16
15
2
15pF
15pF
3
220Ω
100nF
XTAL2
XTAL1
OFFB
4
CONTROLLER
+5.0V
5
VDDP
S1
100nF
6
GND
7
VCH
VDD 100nF
RSTIN
8
PRESB
PRES
IO
+3.3V
9
100nF
CMDVCCB
10
11
12
13
14
PORADJ
VREG
RST
(TEST: BD8906F/FV, BD8907F)
VDD
AUX2
AUX1
CGND
CLK
58.1KΩ
100nF
41.9KΩ
CARD
CONNECTION
0.22uF
C5
C6
C7
C8
C1
C2
C3
C4
VDD
* Pin 18 on BD8906F/FV, BD8907F is
normally open. When PORADJ is not used
with BD8904F/FV,BD8905F, pull it up to
VDD.
100KΩ
K1
K2
Fig. 13
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© 2009 ROHM Co., Ltd. All rights reserved.
2009.07 - Rev.A
13/15
Technical Note
BD8904F, BD8904FV, BD8905F, BD8906F, BD8906FV, BD8907F
●Function of pin 18 on different devices
The function of pin 18 (PORADJ/TEST) for BD8904F/FV and BD8905F is different from BD8906F/FV and BD8907F;
switched as indicated in the following diagram but the common chip is used.
Internal resistance bridge for
BD8906F/FV,BD8907F
Switches to PORADJ pin connection for BD8904F/FV,
BD8905F , and to internal resistance bridge connection for
BD8906F/FV and BD8907F.
Detector signal
Pin18: PORADJ
or
TEST
External resistance bridge for
BD8904F/FV, BD8905F
Switched to
GND or VDD
by a wire inside IC
Fig. 14
●Notes for use
1) Two capacitors for a charge pump should be placed as close as possible to the IC between S1 and S2 and between VCH
and PGND so that the ESR becomes less than 100mΩ.
2) The capacitor for the VREG pin should be placed as close as possible to the IC between VREG and CGND so that the
ESR becomes less than 100mΩ.
3) Connect capacitors of over 10μF+0.1μF between VDD and GND and between VDDP and GND as close as possible to the
IC so that the ESR becomes less than 100mΩ to reduce the power line noise. We recommend the use of capacitors with
the largest possible capacitance.
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© 2009 ROHM Co., Ltd. All rights reserved.
2009.07 - Rev.A
14/15
Technical Note
BD8904F, BD8904FV, BD8905F, BD8906F, BD8906FV, BD8907F
●Ordering part number
B
D
8
9
0
4
F
V
-
E
2
Part No.
Part No.
8904,8905
8906,8907
Package
F : SOP28
FV : SSOP-B28
Packaging and forming specification
E2: Embossed tape and reel
SOP28
<Tape and Reel information>
18.5 0.2
(MAX 18.85 include BURR)
Tape
Embossed carrier tape
1500pcs
Quantity
28
15
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
14
0.15 0.1
0.1
0.4 0.1
1.27
Direction of feed
1pin
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
SSOP-B28
<Tape and Reel information>
10 0.2
(MAX 10.35 include BURR)
Tape
Embossed carrier tape
28
15
Quantity
2000pcs
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
14
0.15 0.1
0.1
0.65
0.22 0.1
Direction of feed
1pin
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
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© 2009 ROHM Co., Ltd. All rights reserved.
2009.07 - Rev.A
15/15
Notice
N o t e s
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
nication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
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Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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