BD88400FJ_技术文档

Datasheet

80-mW Coupling Capacitorless

Stereo Headphone Amplifiers

BD88400FJ

General Description

Package

W(Typ) x D(Typ) x H(Max)

BD88400FJ is an output coupling capacitorless

headphone amplifier. This IC has a built-in regulated

negative voltage generator type that generates the direct

regulated negative voltage from the supply voltage. It is

possible to drive headphones in a ground standard with

both voltage of the positive voltage (+2.4V) and the

negative voltage (-2.4V). Therefore a large capacitance

output coupling capacitor becomes needless and can

reduce cost, board area and height of the part.

In addition, there is no signal degradation at the low

range caused by the output coupling capacitor and

output load impedance, thus a rich low tone can be

outputted.

SOP-J14

8.65mm x 6.00mm x 1.65mm

Features

No Bulky DC-Blocking Capacitors Required

No Degradation of Low-Frequency Response Due

to Output Capacitors

Ground-Referenced Outputs

Gain setting: Variable Gain with External Resistors

Low THD+N

Low Supply Current

Integrated Negative Power Supply

Integrated Short-Circuit and Thermal-Overload

Protection

Applications

Home Audio, TVs, Portable Audio Players, PCs, Digital

Cameras, Electronic Dictionaries, Voice Recorders,

Bluetooth Headsets, etc.

Key Specifications and Lineup

Supply Voltage [V]

+2.4 to +5.5

Supply Current [mA]

Gain [V/V]

2.0 (No Signal)

Variable Gain with External Resistor

80

Maximum Output Power [mW]

(V_DD=3.3V,R_L=16Ω, THD+N≤1%,f=1kHz)

0.006

THD+N [%]

(V_DD=3.3V,R_L=16Ω,Po=10mW,f=1kHz)

Noise Voltage [µVrms]

PSRR [dB]

10

-80

(f=217Hz)

○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays

.www.rohm.com

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

1/27

TSZ22111・14・001

Daattaasshheeeett

BD88400FJ

Typical Application Circuit

SHUTDOWN

Control

Lch Input

Cil

1.0μF

Ri

10kΩ

Rf

10kΩ

3.3V

1

4

14

SVDD

12

SVDD

3.3V

PVDD

Csvdd

1.0μF

5

6

SVDD

Part

CF

Function

Value

2.2µF

Remarks

Temp. Characteristic：

Class-B

14kΩ

Cpvdd

1.0μF

OUTL

-

11

Flying

Capacitor

C1P

+

SVSS

SVDD

SGND

SHDNRB

SVDD

Hold

Capacitor

Temp. Characteristic：

Class-B

PGND

CH

CPVDD

CSVDD

Cil

2.2µF

1.0µF

CHARGE

PUMP

CF

2.2μF

UVLO/

SHUTDOWN

CONTROL

7

SHORT

PROTECTION

TSD

CH

2.2μF

C1N

Bypass

Capacitor

Temp. Characteristic：

Class-B

SGND

SVDD

PVDD

CHARGE

PUMP

CONTROL

8

9

SVSS

OUTR

13

+

CLOCK

GENERATOR

Bypass

Capacitor

Temp. Characteristic：

Class-B

14kΩ

PVSS

-

SVDD

Coupling

Capacitor

Temp. Characteristic：

Class-B

SVSS

10

SVSS

SGND

2

3

Coupling

Capacitor

Temp. Characteristic：

Class-B

MCR006YZPJ103

(ROHM)

MCR006YZPJ103

(ROHM)

Rf

10kΩ

Cir

Ri

10kΩ

Cir

Input

1.0μF

Ri

Rf

10kΩ

Resistor

Feedback

Resistor

Rch Input

In BD88400FJ, the Pass Gain follows formula (4). The Pass Gain and the resistor Rf is limited by table.1.

R_f

Gain =

(4)

R_i

Table 1. Pass Gain and Resistor Limit

Item

Min

Typ

Max

Unit

Pass Gain

0.5

1.0

-

1.0

10

2.0

V/V

kΩ

Rf

Ri

-

Ri is not limited. But, if this resistor Ri is very small, the signal degradation happens at the low frequency (Refer to formula

(2)).

www.rohm.com

TSZ22111・15・001

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

2/27

Daattaasshheeeett

BD88400FJ

Pin Configuration

(Top View)

1

2

3

4

5

6

7

SHDNRB

INL 14

OUTR 13

SVDD 12

OUTL 11

SVSS 10

INR

SGND

BD88400FJ

SHDNLB

PVDD

C1P

PVSS

C1N

9

8

PGND

Pin Descriptions

No.

Pin Name

Function

Symbol

E

Headphone Amplifier (Rch) Shutdown Control

(H:active, L:shutdown)

1

SHDNRB

2

3

INR

Headphone Amplifier (Rch) input

Ground for Headphone Amplifier

C

-

SGND

Headphone Amplifier (Lch) Shutdown Control

(H:active, L:shutdown)

4

SHDNLB

E

5

6

PVDD

C1P

Positive Power Supply for Charge Pump

Flying Capacitor Positive

-

A

-

7

PGND

C1N

Ground for Charge Pump

8

Flying Capacitor Negative

B

F

-

9

PVSS

SVSS

OUTL

SVDD

OUTR

INL

Negative Supply Voltage output

Negative Supply Voltage for Signal

Headphone Amplifier (Lch) output

Ground for Headphone Amplifier

Headphone Amplifier (Rch) output

Headphone Amplifier (Lch) input

10

11

12

13

14

D

-

D

C

www.rohm.com

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

3/27

TSZ22111・15・001

Daattaasshheeeett

BD88400FJ

Block Diagram

1

4

14

SVDD

12

SVDD

PVDD

5

6

SVDD

-

14kΩ

OUTL

11

C1P

+

SVSS

SVDD

SGND

SHDNRB

SVDD

PGND

CHARGE

PUMP

UVLO/

SHUTDOWN

CONTROL

7

SHORT

PROTECTION

TSD

C1N

SGND

SVSS

SVDD

PVDD

CHARGE

PUMP

8

9

OUTR

13

+

-

CLOCK

GENERATOR

CONTROL

14kΩ

PVSS

SVDD

SVSS

10

SVSS

SGND

2

3

www.rohm.com

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

4/27

TSZ22111・15・001

Daattaasshheeeett

BD88400FJ

Absolute Maximum Ratings

Parameter

Symbol

V_GG

V_DD

Rating

0.0

Unit

V

SGND to PGND Voltage

SVDD to PVDD Voltage

-0.3 to +0.3

V

SVSS to PVSS Voltage

V_SS

0.0

V

SGND or PGND to SVDD, PVDD Voltage ^{(Note 1)}

SVSS, PVSS to SGND Or PGND Voltage

SGND to IN_- Voltage

V_DG

V_SG

-0.3 to +6.0

V

-3.5 to +0.3

V

V_IN

(SVSS-0.3) to 2.8

(PGND-0.3) to (PVDD+0.3)

(PVSS-0.3) to (PGND+0.3)

(SGND-0.3) to (SVDD+0.3)

-10 to +10

V

SGND to OUT_- Voltage

PGND to C1P- Voltage

V_OUT

V_C1P

V_C1N

V_SH

V

PGND to C1N- Voltage

V

SGND to SHDN_B- Voltage

Input Current

V

I_IN

mA

W

°C

Power Dissipation ^{(Note 2)}

Pd

1.02

Storage Temperature Range

Tstg

Tjmax

-55 to +150

+150

Maximum Junction Temperature

(Note 1) Pd must not be exceeded.

(Note 2) When mounted on 70mm×70mm×1.6mm FR4, 1-layer glass epoxy board. Derate by 8.19mW/°C when operating above Ta=25°C

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over

the absolute maximum ratings.

Recommended Operating Conditions

Rating

Parameter

Supply Voltage Range

Operating Temperature Range

Symbol

Unit

Min

Typ

Max

V_SVDD,V_PVDD

T_OPR

2.4

-

5.5

V

-40

-

+85

°C

www.rohm.com

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

5/27

TSZ22111・15・001

Daattaasshheeeett

BD88400FJ

Electrical Characteristics

Unless otherwise specified, T Ta=25°C, SVDD=PVDD=3.3V, SGND=PGND=0V, SHDNLB=SHDNRB=SVDD, CF=CH=2.2µF,

RL=No load, Ri=Rf=10kΩ

Limit

Parameter

Supply Current

Symbol

Unit

Conditions

Min

Typ

Max

Shutdown Supply Current

I_ST

-

0.1

1.3

2.0

2

-

µA

mA

SHDNLB=SHDNRB=L

(SHDNLB,SHDNRB)=(H,L) or (L,H),

No Signal

I_DD1

I_DD2

Quiescent Supply Current

SHDNLB=SHDNRB=H,

No Signal

7.4

SHDN_B Terminal

H Level Input Voltage

V_IH

V_IL

1.95

-

V

L Level Input Voltage

-

0.70

±1

Input Leak Current

I_LEAK

µA

Headphone Amplifier

Shutdown to Full Operation

t_SON

V_IS

-

80

±0.5

60

-

µs

mV

mW

%

SHDNLB=SHDNRB=L to H

Offset Voltage

-

±6.0

R_L=32Ω, THD+N≤-40dB, f=1kHz,

20kHz LPF, for Single Channel

30

-

Maximum Output Power

P_OUT

R_L=16Ω, THD+N≤-40dB, f=1kHz,

20kHz LPF, for Single Channel

40

80

-

R_L=32Ω, P_OUT=10mW, f=1 kHz,

20kHz LPF

-

0.008

0.006

-1.00

1

0.056

Total Harmonic Distortion

+ Noise

THD+N

R_L=16Ω, P_OUT=10mW, f= kHz,

20kHz LPF

-

0.100

%

Gain Is variable by the external resistor

of Ri and Rf.

Gain

A_V

ΔA_V

V_N

-

V/V

%

Gain Match

Noise

-

10

-

µVrms 20kHz LPF + JIS-A

Slew Rate

SR

-

0.15

200

-90

-

V/µs

pF

Maximum Capacitive Load

Crosstalk

CL

-

R_L=32Ω, f=1kHz, V_OUT=200mV_P-P

,

CT

-

dB

kHz

°C

1kHz BPF

Power Supply

Rejection Ratio

f=217Hz, 100mV_P-P‐ripple,

217Hz BPF

PSRR

f_OSC

TSD

T_HYS

-

-80

-

Charge-Pump

Oscillator Frequency

200

300

145

5

430

Thermal-Shutdown Threshold

Thermal-Shutdown Hysteresis

-

°C

www.rohm.com

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

6/27

TSZ22111・15・001

Daattaasshheeeett

BD88400FJ

Typical Performance Curves

General Items

Unless otherwise specified, Ta=25°C, SGND=PGND=0V, SHDNLB=SHDNRB=SVDD, CF=CH=2.2µF,

Input coupling capacitor=1µF, R_L=No Load

(Note) In BD88400FJ the input resistor (Ri)=10kΩ, feedback resistor(Rf)=10kΩ.

4.0

3.0

2.0

1.0

0.0

1u

100n

10n

1n

SHDNLB=0V

SHDNRB=0V

SHDNLB=0V

SHDNRB=0V

SHDNLB=VDD

SHDNLB=V_DD

SHDNRB=0V

(Note) This

* This caracteristics has

characteristics has

hysteresis (40mV typ) by

UVLO.

0.1n

0.0

1.0

2.0

Supply Voltage [V]

Figure 2. Monaural Operating Current vs Supply Voltage

3.0

4.0

5.0

6.0

0.0

1.0

2.0

Supply Voltage [V]

Figure 1. Standby Current vs Supply Voltage

3.0

4.0

5.0

6.0

4.0

3.0

2.0

1.0

0

SHDNLB=VDD

SHDNLB=V_DD

SHDNLB=VDD

SHDNLB=V_DD

SHDNRB=V_DD

SHDNRB=VDD

-0.5

-1

SHDNRB=V_DD

SHDNRB=VDD

No Load

(Note) This

* This caracteristics has

No Load

characteristics has

hysteresis (40mV typ) by

hysteresis (40mV typ)

UVLO.

by UVLO.

-1.5

-2

-2.5

-3

0.0

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Supply Voltage [V]

1.0

2.0

Supply Voltage [V]

Figure 3. Stereo Operating Current vs Supply Voltage

3.0

4.0

5.0

6.0

Figure 4. Negative Voltage vs Supply Voltage

www.rohm.com

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

7/27

TSZ22111・15・001

Daattaasshheeeett

BD88400FJ

Typical Performance Curves – continued

General Items

200

100

90

80

70

60

50

40

30

20

10

0

R =16Ω, in phase

RL=16 , in phase

L

Ω

SHDNLB=SHDNRB

180

160

140

120

100

80

R =16Ω, out of phase

RL=16 , out of phase

L

Ω

=L->H

V_SS90% Setup time

VSS 90% Setup time

No Load

RL=32 , in phase

R =32Ω, in phase

L

Ω

RL=32 , out of phase

R =32Ω, out of phase

Ω

L

60

THD+N -40dB

≦

THD+N ≤-40dB

40

20kHz LPF

20

Stereo

0

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Supply Voltage [V]

Figure 5. Setup Time vs Supply Voltage

Figure 6. Maximum Output Power vs Supply Voltage

0

VDD=2.4V

VDD=3.3V

V_DD=2.4V

V_DD=3.3V

-10

-20

-30

-40

-50

-60

-70

-80

-90

-100

Ripple=100mVp-p

Ripple = 100mVp-p

-20

-30

-40

-50

-60

-70

-80

-90

-100

BPF

10

100

1k

10k

100k

10

100

1k

10k

100k

Frequency [Hz]

Figure 7. PSRR vs Frequency

(V_DD=2.4V)

Figure 8. PSRR vs Frequency

(V_DD=3.3V)

www.rohm.com

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

8/27

TSZ22111・15・001

Daattaasshheeeett

BD88400FJ

Typical Performance Curves – continued

General Items

0

-10

-20

-30

-40

-50

-60

-70

-80

-90

-100

VDD=5.5V

VDD=2.4V

V_DD=5.5V

-10

-20

-30

-40

-50

-60

-70

-80

-90

-100

V_DD=2.4V

Ripple = 100mVp-p

Ripple=100mVp-p

V

=200mVp-p

VOUT = 200mVp-p

OUT

BPF

R_L=32Ω

BPF

RL=32

Ω

BPF

LtoR

RtoL

10

100

1k

10k

100k

10

100

1k

10k

100k

Frequency [Hz]

Figure 10. Crosstalk vs Frequency

(V_DD=2.4V)

Figure 9. PSRR vs Frequency

(V_DD=5.5V)

0

-10

-20

-30

-40

-50

-60

-70

-80

-90

-100

VDD=3.3V

VDD=5.5V

V_DD=3.3V

V_OUT=200mVp-p

V_DD=3.3V

-10

-20

-30

-40

-50

-60

-70

-80

-90

-100

V_OUT=200mVp-p

VOUT = 200mVp-p

R_L=32Ω

RL=32

BPF

RL=32

BPF

Ω

BPF

LtoR

RtoL

LtoR

RtoL

10

100

1k

10k

100k

10

100

1k

10k

100k

Frequency [Hz]

Figure 12.Crosstalk vs Frequency

(V_DD=5.5V)

Figure 11. Crosstalk vs Frequency

(V_DD=3.3V)

www.rohm.com

TSZ22111・15・001

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

9/27

Daattaasshheeeett

BD88400FJ

Typical Performance Curves – continued

BD88400FJ

10

8

VDD=3.3V

0

V_DD=3.3V

f=1kHz

RL=32

Ω

VDD=3.3V, Po=10mW

R_L=32Ω

V_DD=3.3V, Po=10mW

R_I=10kΩ, Input coupling

f=1kHz

Ri=10k , Input coupling

Ω

20kHz-LPF

6

capacitor=1.0µF

-20 BPF

BPF

capacitor = 1.0uF

4

R_L=16Ω

RL=16

Ω

-40

-60

-80

2

RL=16

Ω

R_L=16Ω

0

-2

-4

-6

-8

-10

RL=32

R =32Ω

Ω

L

-100

-120

-120 -100 -80

-60

-40

-20

0

10

100

1k

Frequency [Hz]

10k

100k

Input Voltage [dBV]

Figure 13. Output Voltage vs Input Voltage

(V_DD=3.3V)

Figure 14. Gain vs Frequency

(V_DD=3.3V)

100

10

100

10

1

In phase

1

In phase

0.1

V

=3.3V

VDD=3.3V

DD

VDD=3.3V

V_DD=3.3V

20kHz-LPF

f=1kHz

20kHz-LPF

f=1kHz

Stereo

f=1kHz

Stereo

0.01

0.001

0.01

0.001

R_L=32Ω

Stereo

RL=32

Stereo

R_L=16Ω

Out of phase

Ω

RL=16

Ω

1n

100n

10u

1m

100m

1n

100n

10u

1m

100m

Output Power [W]

Figure 16. THD+N vs Output Power

Figure 15. THD+N vs Output Power

(V_DD=3.3V, R_L=32Ω)

(V_DD=3.3V, R_L=16Ω)

www.rohm.com

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

10/27

TSZ22111・15・001

Daattaasshheeeett

BD88400FJ

Typical Performance Curves – continued

BD88400FJ

100

10

V_DD=3.3V

VDD=3.3V

V

=3.3V

VDD=3.3V

DD

R_L=16Ω

R_L=32Ω

RL=16Ω

RL=32Ω

20kHz-LPF

10

1

20kHz-LPF

Stereo (in phase)

1

Po=0.1mW

Po=1mW

0.1

0.01

0.001

0.01

0.001

Po=10mW

10

100

1k

10k

100k

10

100

1k

Frequency [Hz]

10k

100k

Frequency [Hz]

Figure 18. THD+N vs Frequency

Figure 17. THD+N vs Frequency

(V_DD=3.3V, R_L=32Ω)

(V_DD=3.3V, R_L=16Ω)

0

-20

VDD=3.3V

V_DD=3.3V

Input connect

to the ground

with 1.0µF

-40

with 1.0uF

-60

-80

-100

-120

-140

10

100

1k

Frequency [Hz]

10k

100k

Figure 19. Noise Spectrum vs Frequency

(V_DD=3.3V)

www.rohm.com

TSZ22111・15・001

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

11/27

Daattaasshheeeett

BD88400FJ

Timing Chart

(Usually Operation)

PVDD,SVDD

SHDNLB

SHDNRB

PVSS,SVSS

INL,INR

Amp enable

OUTL

OUTR

Shutdow n Setup

Signal output

Shutdow n

Figure 20. Usually Operation

(UVLO Operation)

PVDD,SVDD

SHDNLB,

SHDNRB

PVSS,SVSS

OUTL

OUTR

Signal output

UVLO

Setup Signal output

Figure 21. UVLO Operation

(TSD Operation)

Hy steresis =5℃

Ta

PV DD,SV DD

SHDNLB,

SHDNRB

PVSS,SVSS

OUTL

OUTR

Signal output

TSD

Signal output

Figure 22. TSD Operation

www.rohm.com

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

12/27

TSZ22111・15・001

Daattaasshheeeett

BD88400FJ

Application Information

1. Functional Descriptions

Figure 23 shows the conventional headphone amplifier circuit. In this circuit, the signal is outputted using the middle

point bias circuit based on the middle point bias. Therefore, the output coupling capacitor that removes the DC voltage

difference and does the AC coupling is necessary. This coupling capacitor and the impedance of the headphone

compose the high-pass filter. Therefore, the signal degradation in the low frequency region is experienced. The output

coupling capacitor should be of large capacitance because the cutoff frequency of this high-pass filter follows formula

(1).

1

(1)

2πR_LC_C

f_c=

(Note) Cc is the coupling capacitor, and R_Lis the impedance of the headphone.

Moreover, POP noise by the middle point bias start-up is generated and the degradation of PSRR is experienced.

OUT

Vout

Vhp

V_HP

VDD

Input

VDD

-

Cc

VDD/2

+

0

time[s]

GND

MiddlePoint

BiasCircuit

Figure 23. Conventional Headphone Amplifier Circuit

Figure 24 shows the BD88400FJ series circuit. In this circuit, the signal is outputted using a negative voltage based on

the ground level. Therefore, the amplifier output can be connected directly to the headphone, making the output

coupling capacitor unnecessary. In addition, the signal degradation in the low frequency region with the coupling

capacitor is not generated, thus a deep bass is achieved.

Moreover, POP noise is not controlled by the middle point bias start-up. Thus, the degradation of PSRR doesn't occur

since it is based on the ground.

OUT

Vout

V

Vh^Hp^P

Input

VDD

HPVDD

-

+

0

CF : Flying

Capacitor

time [s]

VSS

Charge

Pump

CH : Hold

Capacitor

0

time [s]

Figure 24.BD88400FJ Series Circuit

www.rohm.com

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

13/27

TSZ22111・15・001

Daattaasshheeeett

BD88400FJ

(1) CHARGE PUMP / CHARGE PUMP CONTROL

The negative power supply circuit is composed of the regulated charge-pump. This circuit outputs the regulated

negative voltage (PVSS) directly from power-supply voltage (PVDD). Therefore, it doesn't depend on the power-supply

voltage and a constant voltage is outputted (PVSS=-2.4V_@Typ, refer to Figure 4). Moreover, there is no power supply

swinging caused by the output current of the headphone amplifier. Also, it doesn't influence the headphone amplifier

characteristic.

VSS Voltage vs Load Current

VSS Voltage vs. Supply Voltage

[Ta=25°C, V^,_D^V_D^D=3⁼³.3^.3V, CF=CH=2.2µF]

[Ta=25℃ D V, CF=CH=2.2uF]

0

-0.5

-1

-1.5

-2

-2.5

-3

0

20

40

60

80

100

120

Load Current [mA]

Figure 25. PVSS Load Current Regulation Characteristics (Reference Data)

(a) Power Control

The power control is a logical sum of SHDNLB and SHDNRB. The negative power supply circuit starts when H level

is inputted to either SHDNLB or SHDNRB, and power down when SHDNLB=SHDNRB=L level.

Table.2 Charge Pump Control

SHDNLB

SHDNRB

Control

Power down

Power ON

L

H

L

H

(b) Operating Frequency

The operating frequency of the negative power supply charge pump is designed to minimize temperature and

voltage dependency. Figure 26 shows the reference data (measurements). Please note the frequency interference

in the application board.

400

380

360

340

320

300

280

260

240

220

200

400

380

360

340

320

300

280

260

240

220

200

V

=3.3V

Ta=25°C

Ta=25

Measure : C1P

CF=CH=2.2µF

CF=CH=2.2uF

VDD=3.3V

DD

℃

Measure: C1P

Measure : C1P

CF=CH=2.2µF

CF=CH=2.2uF

2.0

3.0

4.0

5.0

6.0

-50.0

0.0

50.0

100.0

Temperature : Ta [°C]

Supply Voltage [V]

Supply Voltage[V]

Ta [℃]

Figure 26. Temperature Characteristic and Voltage Characteristic of Operating Frequency (Reference Data)

(c) The Flying Capacitor and the Hold Capacitor

The flying capacitor (CF) and the hold capacitor (CH) greatly influence the characteristic of the charge pump.

Therefore, please connect 2.2µF capacitor with an excellent temperature characteristic and voltage characteristic

as near as possible to the IC.

www.rohm.com

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

14/27

TSZ22111・15・001

Daattaasshheeeett

BD88400FJ

(2) HEADPHONE AMP

The headphone amplifier is driven by the internal positive voltage (+2.4V) and negative voltage (SVSS, -2.4V) based

on ground (SGND). Therefore, the headphone can be connected without the output coupling capacitor. As a result, it

brings improvement to low-frequency characteristic compared with the conventional coupling capacitor headphone

type.

(a) Power Control

L channel and R channel of the headphone amplifier can be independently controlled by SHDNLB and SHDNRB

logic. When the SVSS voltage is -1.1V_@Typor more, the headphone amplifier does not operate to protect from

illegal operation. In addition, the over-current protection circuit is built in. The amplifier shutdowns when the

over-current occurs because of the output short-circuit etc., thus IC is protected from being destroyed.

Table.3 Control of the headphone amplifier

SHDNLB

SHDNRB

L Channel

Power down

Power ON

R Channel

Power down

Power ON

Power down

Power ON

L

H

L

H

[V]

SHDNxB

VDD

0

[time]

[V]

0

-1.1V

SVSS

Amprilier

Disable

Amplifier

Enable

Figure 27. Area of Headphone Amplifier can Operate

SVSS does not have internal connection with PVSS. Please connect SVSS with PVSS on the application board.

(b) Input Coupling Capacitor

Input DC level of BD88400FJ is 0V (SGND). The input coupling capacitor is necessary for the connection with the

signal source device. The signal degradation happens in the low frequency because of the high-pass filter

composed by this input coupling capacitor and the input impedance of BD88400FJ.

The input impedance of BD88400FJ is external resistance Ri. The cutoff frequency of this high-pass filter follows

formula (2).

1

(2)

f_c=

2πR_INC_IN

Where:

C_INis the input coupling capacitor. R_IN=Ri

9.0

Rin=14k

R_IN=14kΩΩ

6.0

3.0

Cin=10uF

C_IN=10µF

0.0

-3.0

-6.0

-9.0

CCin==44.7.7µuFF

IN

-12.0

-15.0

-18.0

-21.0

C =2.2µF

Cin=2.2uF

IN

C =1µF

Cin=1uF

IN

1

10

Frequency [Hz]

100

Frequency [Hz]

Figure 28. Input Coupling Capacitor Frequency Response (Reference Data)

www.rohm.com

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

15/27

TSZ22111・15・001

Daattaasshheeeett

BD88400FJ

The degradation of THD+N happens because of the input coupling capacitor. Therefore, please consider these when

selecting components.

0

BD88415GUL

-10

-20

-30

-40

-50

-60

-70

-80

-90

-100

V_DD=3.3V

VDD=3.3V

Po=10mW

Cin=1.0uF

C_IN=1.0µF

R_L=16Ω

RL=16

20kHz LPF

Ω

20kHz LPF

Cin=0.47uF

C_IN=0.47µ

C =0.22µ

Ci_In_N=0.22uF

C =2.2µF

Cin=2.2uF

IN

10

100

1k

10k

100k

Frequency [Hz]

(Note) Capacitor size: 1608

Figure 29. THD+N by the Input Coupling Capacitor (Reference Data)

(c) Terminal State during Power Down

The power control of the headphone amplifier changes the state of the terminal. When in shutdown, the input

impedance of the input terminal becomes 7.1kΩ_@Typ(In BD88400FJ, become RI + 7.1kΩ). The time constant can

be reduced when the input coupling capacitor is charged.

The input voltage changes while charging up the input coupling capacitor. Therefore, do not operate the

headphone amplifier while charging.

R_IN=7.1kΩ

Rin=7.1kΩ

Output

Bias

Vout

OUT

VS

V s

IN

Vin

Audio

Source

Cin

C_IN

VDD

-

0

time[s]

+

Output

Bias

VSS

time[s]

Figure 30. Input voltage transition with input coupling capacitor

Charge time constant follows formula (3) by using the input coupling capacitor and the input impedance. The

calculation of the convergence value to wait time is indicated in Figure 31.

(3)

τ = R_INC_IN

(Note) R_IN=7.1kΩ_@_TypIn BD88400FJ, R_IN=Ri+7.1kΩ

100

90

80

70

60

50

40

30

20

10

0

0τ

1τ

2τ

3τ

4τ

5τ

6τ

7τ

8τ

Wait time [s]

Wait Time [s]

Figure 31. Convergence vs Wait Time (Reference)

www.rohm.com

TSZ22111・15・001

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

16/27

Daattaasshheeeett

BD88400FJ

(3) UVLO / SHUTDOWN CONTROL

BD88400FJ has low voltage protection function (UVLO: Under Voltage Lock Out). This protects the IC from the illegal

operation during a low power supply voltage.

The detection voltage is 2.13V_@Typ, so it does not influence recommended operation voltage of 2.4V. UVLO controls the

whole IC, and also both the negative power supply charge pump and the headphone amplifier during power down.

(4) TSD

BD88400FJ has overheating protection function (TSD: Thermal Shutdown). The headphone amplifier shutdowns when

overheating occurs due to headphone amplifier illegal operation. (The detection temp. 145°C_@Typ

)

www.rohm.com

TSZ22111・15・001

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

17/27

Daattaasshheeeett

BD88400FJ

2. Evaluation Board

BD88400FJ evaluation Board loads and operates with the necessary parts only. It uses RCA Connector for input

terminal and Headphone jack (φ=3.5mm) for output terminal. Therefore it can easily connect between Audio equipment.

Also, it can operate using a single supply (2.4V to 5.5V). The switch on the board (SDB) can control shutdown.

(Spec.)

Item

Limit

Unit

Supply Voltage Range (VDD)

Maximum Supply Current

Operating Temperature Range

Input Voltage Range

2.4 to 5.5

1.0

V

A

-40 to +85

-2.5 to +2.5

15

°C

V

Output Voltage Range

V

Minimum Load Impedance

Ω

(Schematic)

Figure 32. Evaluation Board Schematic (BD88400FJ)

www.rohm.com

TSZ22111・15・001

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

18/27

Daattaasshheeeett

BD88400FJ

(Parts List)

Parts Name

Type

Value

Size

U1

C3, C5

SOP-J14pin

Chip Ceramic capacitor

Tantalum capacitor

Chip Resistor

BD88400FJ

2.2µF

1.0µF

10µF

8.65mm x 6.00mm

1608

3216

1608

-

C1,C2,C4,C6

C7

R2,R3,R5,R6

R7, R8

10kΩ

Open

-

Chip Resistor

CN3

Headphone jack

φ=3.5mm

(Operation procedure)

①

②

③

④

⑤

⑥

Turn OFF the switch (SHNDLB/SHDNRB) on evaluation board.

Connect the positive terminal of the power supply to the VDD pin and ground terminal to the GND pin.

Connect the left output of the audio source to the INL and connect the right output to the INR.

Turn ON the power supply.

Turn ON the switch (SHDNLB/SHDNRB) on the evaluation board. (H)

Input the audio source.

www.rohm.com

TSZ22111・15・001

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

19/27

Daattaasshheeeett

BD88400FJ

(Board Layout)

(TOP LAYER - TOP VIEW)

(BOTTOM LAYER – TOP VIEW)

Figure 33. ROHM Application Board Layout (BD88400FJ)

www.rohm.com

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

20/27

TSZ22111・15・001

Daattaasshheeeett

BD88400FJ

Power Dissipation

Figure 34 shows the reference value of the thermal derating curve.

(Conditions)

This value is for mounted on the ROHM standard board

Board size: 70mm x 70mm x 1.6mm (FR4, 1-Layer PCB)

1.2

1

0.8

0.6

0.4

0.2

0

25

50

75

100

125

150

^TempT^era^at[^ure]^{: Ta [°C]}

℃

Figure 34. Thermal Derating Curve

www.rohm.com

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

21/27

TSZ22111・15・001

Daattaasshheeeett

BD88400FJ

I/O Equivalent Circuits

PGND PGND

PVDD PVDD

SVDD

ꢀ ꢀ ꢀ ꢀ

PAD

-

PAD

ꢀ ꢀ ꢀ ꢀ

+

ꢀ ꢀ ꢀ ꢀ

PVSS PVSS

PGND PGND

B

SVSS

A

C

PIN6

PIN8

PIN2,14

SVDD

PGND PGND

ꢀ ꢀ ꢀ ꢀ

-

ꢀꢀꢀꢀ

ꢀ

PAD

+

ꢀ ꢀ

ꢀ ꢀ ꢀ

SVSS

D

SGND

F

E

PIN11,13

PIN1,4

PIN9

www.rohm.com

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

22/27

TSZ22111・15・001

Daattaasshheeeett

BD88400FJ

Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage

Except for pins the output of which were designed to go below ground, ensure that no pins are at a voltage below that of

the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on

the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the

IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,

increase the board size and copper area to prevent exceeding the Pd rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing

of connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned OFF completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

www.rohm.com

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

23/27

TSZ22111・15・001

Daattaasshheeeett

BD88400FJ

Operational Notes – continued

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power

supply or ground line.

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Figure 35. Example of Monolithic IC Structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe

Operation (ASO).

15. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be

within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the

TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat

damage.

16. Over-Current Protection Circuit (OCP)

This IC has a built-in overcurrent protection circuit that activates when the output is accidentally shorted. However, it is

strongly advised not to subject the IC to prolonged shorting of the output.

www.rohm.com

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

24/27

TSZ22111・15・001

Daattaasshheeeett

BD88400FJ

Ordering Information

B D

8

4

0

F

J

-

GE 2

Package

Packaging and forming specification

GE2: Embossed tape and reel

Part Number

FJ: SOP-J14

Marking Diagram

SOP-J14 (TOP VIEW)

Part Number Marking

LOT Number

BD88400FJ

1PIN MARK

www.rohm.com

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

25/27

TSZ22111・15・001

Daattaasshheeeett

BD88400FJ

Physical Dimension, Tape and Reel Information

Package Name

SOP-J14

Tape

Embossed carrier tape

2500pcs

Quantity

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

www.rohm.com

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

26/27

TSZ22111・15・001

Daattaasshheeeett

BD88400FJ

Revision History

Date

Revision

001

Changes

26.May.2014

New Release.

p.6 Electrical Characteristics

Limit : Offset Voltage Max ±5.0mV -> ±6.0mV

07.Aug.2014

002

www.rohm.com

TSZ02201-0C1C0EA00160-1-2

07.Aug.2014 Rev.002

27/27

TSZ22111・15・001

Daattaasshheeeett

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice – GE

Rev.002

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice – GE

Rev.002

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001


型号：	BD88400FJ
厂家：	ROHM
描述：	BD88400FJ是无需输出耦合电容器的耳机放大器。本IC内置有稳压电荷泵型负电源发生电路，可从电源电压直接生成稳定的-2.4V负电压。通过采用+2.4V的正电压与该负电压的两种电压来驱动耳机放大器，以ground level为基准进行输出。因此，无需大容量的输出耦合电容器，可直接连接耳机。由此，可降低成本，缩减电路板面积，降低部件的高度。此外，没有因输出耦合电容器与输出负载阻抗引起的低音区域的信号衰减，可输出丰富的低音。放大器驱动泵电容器
文件：	总30页 (文件大小：969K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD88400FJ [ROHM]

相关型号：

BD88400GUL

BD88400GUL-E2

BD88410GUL

BD88410GUL-E2

BD88415GUL

BD88415GUL-E2

BD88420GUL

BD88420GUL-E2

BD8876FV

BD8876FV-E2

BD8878FV

BD8878FV-E2