BD54123F-E2 [ROHM]
EARTH LEAKAGE CURRENT DETECTOR IC; 漏电保护器IC
| 型号： | BD54123F-E2 |
| 厂家： | 
ROHM |
| 描述： | EARTH LEAKAGE CURRENT DETECTOR IC |
| 文件： | 总14页 (文件大小：555K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
EARTH LEAKAGE CURRENT DETECTOR
EARTH LEAKAGE
CURRENT DETECTOR IC
BD54123F
●General Description
●Key Specifications
■ Operating supply voltage range：
BD54123F integrates leakage detector and amplifier.
Especially, it is suitable for high sensitivity and a high-
speed operation use, and since the operating temperature
range is wide, it can be used for various uses.
12V to 22V
－40°C to ＋85°C
330μA(typ.)
■ Operating temperature range：
■ Supply current：
■ Trip voltage：
4.92mV to 11.06mV
■ Output current ability(Ta=－40℃)： －200μA～(min.)
●Features
●Packages
W(Typ.) x D(Typ.) x H(Max.)
5.00mm x 6.20mm x 1.71mm
■ Small temperature fluctuation and high input
sensitivity
SOP8
■ Wide operating temperature range
●Applications
■ Earth leakage circuit breaker
■ Earth leakage circuit relay
●Typical Application Circuit Example
SCR
RVS
COS
VZ
8
7
6
5
CVS
VS
OS
NR
SC
C1
VR
IN
GND
OD
1
2
3
4
Trip
Coil
CIN
CVR
RIN
COD
ZCT:Zero current transformer
TEST SW&R
○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.
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BD54123F
●Pin Configurations
●Block Diagrams
SOP8
(TOP VIEW)
8
7
6
5
VS
OS
NR
SC
8 7 6 5
1 2 3 4
VR
IN
GND
OD
1
2
3
4
●Pin Descriptions
Pin No.
Symbol
Function
Reference voltage
1
2
3
4
5
6
7
8
VR
IN
Input
GND
OD
SC
NR
OS
VS
Ground
Output of input comparator
Input of latch circuit
Noise absorption
Output
Power supply
●Absolute Maximum Ratings
(Ta=25℃)
Parameter
Symbol
IS
Rating
8
Unit
mA
mA
mA
mA
mA
V
*1
Supply current
IIN-VR
IVR
±250
30
IN-VR current
VR pin current
IIN
30
IN terminal current
SC terminal current
Power Supply voltage
Input terminal voltage
OD/SC/NR/OS terminal voltage
Power dissipation
ISC
5
VS
36
VVR/IN
17
V
VOD/SC/NR/OS
8
V
Pd
680 *2
mW
Tstg
－55 to ＋150
℃
Storage temperature
*1 The power-supply voltage is limited by the internal clamping circuit.
*2 To use at temperature above Ta＝25[℃] reduce 5.5mW/℃. Mounted on a glass epoxy PCB (70mm×70mm×1.6mm)
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BD54123F
●Recommended Operating Ratings
Parameter
Supply voltage
Symbol
Limits
12 to 22
－40 to ＋85
1≦
Unit
V
VS
Topr
CVS
COS
℃
Operating temperature
External capacitor
between VS and GND
μF
μF
External capacitor
between OS and GND
≦1
●Electrical Characteristics
(Unless otherwise specified, VS=12V, GND=0V, Ta=25℃)
Limits
Typ.
Temperature
Parameter
Symbol
Unit
Conditions
range
Min.
-
Max.
520
-40℃
-
330
-
IS1
25℃
85℃
μA
ΔVIN=VVR-VIN=30mV
Supply current
-
500
460
11.06
-14.0
35.3
-
-
Trip voltage
VT
-40℃ to +85℃
25℃
4.92
-27.2
16.7
-200
-100
-75
7.50
-20.6
26.0
-
mV VT=ΔVIN=VVR-VIN
ΔVIN=VVR-VIN=30mV,
VOD=1.2V
OD Source current
OD Sink current
IODSO
IODSI
μA
VOD=0.8V,
μA
25℃
ΔVIN=VVR-VIN=0mV
-40℃
μA
OS Source current
IOSSO
25℃
-
-
VSC=2.0V, VOS=0.8V
VSC=0.2V, VOS=0.2V
85℃
-
-
IOSSI
VSCON
VIC
-40℃ to +85℃
25℃
OS Sink current
SC ON voltage
200
1.00
4.2
-
-
μA
V
1.24
5.5
1.0
29
-
1.48
6.7
1.4
32
Input clamp voltage
-40℃ to +85℃
-40℃ to +85℃
25℃
V
IIC=20mA
IIDC=100mA
IS=7mA
Differential input clamp
voltage
VIDC
VSM
0.6
V
Maximum current voltage
26
V
IS=900μA,VSC=2.0V
VOS=0.8V
1
＊
Supply current 2
IOS2
-40℃ to +85℃
25℃
-100
0.5
-
μA
V
Latch OFF Supply Voltage
VSOFF
tON
-
-
2
＊
Operating time
25℃
1.8
2.9
4.0
ms
*1 Supply current 2 is OS source current value when the power supply current(Is=900μA) is given.
*2 Operating time is time until output voltage reaches 0.8V after detecting the leakage signal.
Conditions : Capacitor(0.047μF) is connected between OD(OS) and GND.
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BD54123F
●Test circuits
1.IS1
2.VT
3.IODSO
VR IN GND OD SC NR OS VS
VR IN GND OD SC NR OS VS
VR IN GND OD SC NR OS VS
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
VS
A
VS
IS
+
A
V
VOD
IOD
+
VS
ΔVIN
ΔVIN
VOD
ΔVIN
4.IODSI
5.IOSSO/IOSSI
6.VSCON
VR IN GND OD SC NR OS VS
VR IN GND OD SC NR OS VS
VR IN GND OD SC NR OS VS
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
VSC
VS
VS
VSC
A
IOD
VOD
A
+
V
IOS
VOS
Vos
+
7.VIC
8.VIDC
9.VSM
VR IN GND OD SC NR OS VS
VR IN GND OD SC NR OS VS
VR IN GND OD SC NR OS VS
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
VS
V
VSM
IS
IIDC
V
V
VIC
C
VIDC
10.IOS2
11.VSOFF
12.tON
VR IN GND OD SC NR OS VS
VR IN GND OD SC NR OS VS
VR IN GND OD SC NR OS VS
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
VS
VSC
VS
IS
V
0.047
μF
0.047
μF
VOS
V
A
0.047
μF
IOS
VOS
+
ΔVIN
●Timing Chart
Input voltage
between IN and VR
VT
ΔVIN(IN-VR)
VSCON
OD/SC terminal voltage
VOD/VSC
OS terminal voltage
VOS
0.8V
tON
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BD54123F
●Typical Performance Curves(reference data)
800
700
600
500
400
300
200
100
0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
105℃
－60℃
25℃
0.0
85
0
5
10
15
20
25
30
0
25
50
75
100
125
150
Power Supply VS [V]
Ambient Temperature Ta [℃]
Figure 1
Figure 2
Derating curve
Circuit current - Supply voltage
40
30
0
-100
-200
-300
-400
-500
20
RIN=300
105℃
25℃
10
0
-10
-20
-30
-40
RIN=1kΩ
－60℃
-60
-40
-20
0
20
40
60
80
100 120
0
5
10
15
20
25
Ambient Temperature Ta [℃]
Power Supply VS [V]
Figure 3
Figure 4
Trip voltage fluctuation rate
- Ambient temperature
OS terminal source current - Supply voltage
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BD54123F
10
8
5
4
3
2
1
6
4
－60℃
25℃
2
105℃
0
0
0
1
2
3
4
5
6
7
8
9
10
-60
-40
-20
0
20
40
60
80
100 120
Power Supply VS [V]
Ambient Temperature Ta [℃]
Figure 5
Figure 6
Operating time - Ambient temperature
Latch OFF supply voltage - Ambient temperature
10
8
10
8
6
6
105℃
25℃
－60℃
4
2
0
4
－60℃
25℃
2
105℃
0
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0
1
2
3
4
5
6
7
8
9
10
SC terminal input voltage VSCON [V]
Power Supply VS [V]
Figure 7
Figure 8
SC ON voltage - Ambient temperature
Latch ON supply voltage - Ambient temperature
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BD54123F
●Power Dissipation
Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature).IC is heated
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal
resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead
frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called
thermal resistance, represented by the symbol θja℃/W.The temperature of IC inside the package can be estimated by this
thermal resistance. Fig.9(a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient
temperature Ta, junction temperature Tj, and power dissipation Pd can be calculated by the equation below
θja = (Tj - Ta) / Pd
℃/W
・・・・・ (Ⅰ)
Derating curve in Fig.9(b) indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal
resistance θja. Thermal resistance θja depends on chip size, power consumption, package, ambient temperature, package
condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value
measured at a specified condition. Fig.10(a) show a derating curve for an example of BD54123F.
[W]
Power dissipation of LSI
Pd (max)
θja=(Tj-Ta)/P ℃/W
P2
P1
θja2 < θja1
θ' ja2
Ta [ ]
℃
Ambient tempe
ra
tu
re
θ ja2
Tj ' (max) Tj (max)
θ' ja1
θ ja1
Chip surface temperature
Tj [
℃
]
0
25
50
75
100
Ta [
125
150
Ambient temperature
Power dissipation Pd[W]
]
℃
(b) Derating curve
(a) Thermal resistance
Figure 9. Thermal resistance and derating
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
85
0
25
50
75
100
125
150
Ambient Temperature Ta [℃]
(a) BD54123F
Derating curve slope
5.5
UNIT
BD54123F
mW/℃
When using the unit above Ta=25℃, subtract the value above per degree℃
Permissible dissipation is a value when FR4 glass epoxy board 70mm×70mm×1.6mm
(cooper foil area below 3%) is mounted.
Figure 10. Derating curve
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BD54123F
●I/O equivalence circuit
VCC
VCC
VS
300O
Pin 1
[VR]
Pin 5
[SC]
100kO
ESD
PRO
TECT
Pin 2
VCC
VCC
VCC
VS
Pin 1
300O
Pin 2
[IN]
Pin 6
[NR]
100kO
Pin 7
VCC
VCC
Pin 6
Pin 3
[GND]
Pin 7
[OS]
VCC
VCC
VCC line
(Internal Power Supply Line)
Pin 4
[OD]
Pin 8
[VS]
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BD54123F
●Operational Notes
1) Absolute maximum ratings
Absolute maximum ratings are the values which indicate the limits, within which the given voltage range can be safely
charged to the terminal. However, it does not guarantee the circuit operation.
2) Power dissipation Pd
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a rise in
chip temperature, including reduced current capability. Therefore, please take into consideration the power dissipation
(Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating
curves for more information.
3) Terminal short-circuits
When the output and power supply terminals are shorted, excessive output current may flow, resulting in undue heat
generation and, subsequently, destruction.
4) Ground terminal voltage
All time, Ground terminal voltage should keep lowest voltage.
In addition, please confirm whether there is not really a terminal becoming the voltage that is lower than GND including a
transitional phenomenon.
5) Operation in a strong electromagnetic field
Operation in a strong electromagnetic field may cause malfunctions.
6) Short-circuit between pins and erroneous mounting
Incorrect mounting may damage the IC. In addition, the presence of foreign particles between the outputs, the output and
the power supply, or the output and GND may result in IC destruction.
7) IC handing
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical
characteristics due to piezo resistance effects.
8) Board inspection
Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every
process is recommended. In addition, when attaching and detaching the jig during the inspection phase, ensure that the
power is turned off before inspection and removal. Furthermore, please take measures against ESD in the assembly
process as well as during transportation and storage.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
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BD54123F
●Ordering Information
B D 5
4
1
2
3
F
E 2
Part Number
Packaging and forming specification
E2: Embossed tape and reel
(SOP8)
Package
F: SOP8
●Physical Dimension Tape and Reel Information
SOP8
<Tape and Reel information>
5.0 0.2
(MAX 5.35 include BURR)
Tape
Embossed carrier tape
2500pcs
+
−
6
°
4°
4
°
Quantity
8
1
7
6
5
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
2
3
4
0.595
+0.1
0.17
-
0.05
S
0.1
S
1.27
Direction of feed
1pin
0.42 0.1
Reel
Order quantity needs to be multiple of the minimum quantity.
(Unit : mm)
∗
●Marking Diagrams
SOP8
(TOP VIEW)
5
4
1
2
3
LOT Number
１PIN MARK
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BD54123F
●Revision History
Date
Revision
001
Changes
New Release
2012.10.29
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Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3) Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4) The Products are not subject to radiation-proof design.
5) Please verify and confirm characteristics of the final or mounted products in using the Products.
6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8) Confirm that operation temperature is within the specified range described in the product specification.
9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.004
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●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2) You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
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information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
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concerning such information.
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4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5) The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
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