BD5413EFV [ROHM]
Analog Input / BTL Output Class-D Speaker Amplifier; 模拟量输入/输出BTL D类扬声器放大器型号: | BD5413EFV |
厂家: | ROHM |
描述: | Analog Input / BTL Output Class-D Speaker Amplifier |
文件: | 总15页 (文件大小:572K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Middle Power Class-D Speaker Amplifiers
Analog Input / BTL Output
Class-D Speaker Amplifier
BD5413EFV
No.10075EBT01
●Description
BD5413EFV is a 5W + 5W stereo class-D power amplifier specifically developed for low power consumption and low heat
generation applications like powered speakers. BD5413EFV employs the state-of-the-art BCD (Bipolar, CMOS and DMOS)
process technology to eliminate a turn-on resistance in the output power stage and an internal loss due to a wiring
resistance as much as possible, achieving a high performance of 80% (4W + 4W output with a load resistance of 8Ω). In
addition, BD5413EFV employs a compact power package which dissipates heat via the rear to achieve low power
consumption and low heat generation so that the need for connecting an external heat radiator can be eliminated up to a
total output of 12.8W. This product meets the needs for compact, thin sound generation systems and powerful, high-quality
sound reproduction.
●Features
1) Small output noise voltage capable of achieving a high S/N set
Input conversion noise voltage = 2.8μVrms
A bipolar differential is used for input amplifier to eliminate 1/f noise.
2) Support of power supply voltage ranging from 6V to 10.5V
A supply voltage range is supported that matches an AC adaptor or battery cell driven set.
When a set is battery driven, its operating time can be extended by means of a high performance class-D amplifier.
3) Support of low current consumption mode
A circuit current in shut-down mode is 1μA or less.
4) Built-in soft muting function for reducing pop at shut-down ON or OFF
When a signal is present, its smooth envelope waveform is realized owing to this function.
In addition, when no signal is present, pop generation is eliminated.
A transit time can be adjusted easily through the use of an external capacitor.
5) Realization of high efficiency and low heat generation
Efficiency = 80% (4W+4W (Vcc=9V, RL=8Ω) output can be made without using an external heat radiator.)
A compact power package HTSSOP-B24 (7.8mm x 7.6mm) is employed.
6) Built-in function for reducing pop generation at disconnection from the outlet
7) Support of function for sampling frequency selection
An internal PWM sampling frequency can be selected from three frequencies (200kHz, 250kHz and 300kHz).
Countermeasures against interference (beat noise) due to a switching power source can be taken as needed.
8) Realization of high reliability
Countermeasures against short-circuits due to output terminals shorted to VCC or ground can be taken
(support of automatic recovery).
A temperature protection circuit is incorporated (support of automatic recovery).
9) Support of ERROR pin
ERROR output takes place as a warning which indicates an error.
(short-circuits due to output terminals shorted to VCC or ground, or IC high temperature abnormality).
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.05 - Rev.B
1/14
Technical Note
BD5413EFV
●Absolute maximum ratings
A circuit must be designed and evaluated not to exceed absolute maximum rating in any cases and even momentarily, to
prevent reduction in functional performances and thermal destruction of a semiconductor product and secure useful life and
reliability.
The following values assume Ta =25℃. For latest values, refer to delivery specifications.
Parameter
Supply voltage
Symbol
VCC
Ratings
Unit
Conditions
+15
1.1
V
W
W
V
Pin 3, 5, 10, 12, 16, 21 (Note 1,2)
(Note 3)
Power dissipation
Pd
2.8
(Note 4)
Input voltage for signal pin
Input voltage for control pin
Operating temperature range
Storage temperature range
Maximum junction temperature
VIN
VCONT
Topr
-0.2 to Vcc+0.2
-0.2 to Vcc+0.2
-40 to +85
-55 to +150
+150
Pin 23, 24 (Note 1)
Pin 14, 15 (Note 1)
V
℃
℃
℃
Tstg
Tjmax
(Note 1) A voltage that can be applied with reference to GND (pins 1, 7, 8, 13, 18 and 19)
(Note 2) Pd and Tjmax=150℃ must not be exceeded.
(Note 3) 70mm × 70mm × 1.6mm FR4 One-sided glass epoxy board (Back copper foil 0%) installed.
If used under Ta=25℃ or higher, reduce 8.8 mW for increase of every 1℃. The board is provided with thermal via.
(Note 4) 70mm × 70mm × 1.6mm FR4 Both-sided glass epoxy board (Back copper foil 100%) installed.
If used under Ta=25℃ or higher, reduce 22.4 mW for increase of every 1℃. The board is provided with thermal via.
●Operating conditions
The temperature (Ta) is 25℃. For the latest temperature, refer to the delivery specifications.
Parameter
Supply voltage
Symbol
Ratings
Unit
Conditions
VCC
RL
+6 to +10.5
6 to 16
V
Pin 3, 5, 10, 12, 16, 21
(Note 5)
Load resistance
Ω
(Note 5) This value must not exceed Pd.
●Electrical characteristics
Unless otherwise stated, Ta=25℃, Vcc=9V, fIN=1kHz, Rg=0Ω, RL=8Ω, SDX="H" and FC="M (OPEN)"
are assumed. For the latest values, refer to the delivery specifications.
Parameter
Symbol
Limits
Unit
Conditions
Whole circuit
Circuit current 1 (sampling mode)
Circuit current 2 (mute mode)
Control
ICC1
ICC2
12
1
mA
µA
No signal, no load
SDX = “L”
Input voltage with SDX pin set to "H"
Input voltage with SDX pin set to "L"
Input voltage with FC pin set to "H"
Input voltage with FC pin set to "M"
Input voltage with FC pin set to "L"
Audio output
VIHSDX
VILSDX
VIHFC
VIMFC
VILFC
2.5 to 9
0 to 0.5
8.2 to 9
3.8 to 5.2
0 to 0.8
V
V
V
V
V
Sampling state
Shut-down state
Setting of Fs=300kHz
Setting of Fs=250kHz
Setting of Fs=200kHz
Voltage gain
GV
PO1
PO2
THD
CT
30
4
dB
W
PO = 1W
Maximum output power 1 (Note 6)
Maximum output power 2 (Note 6)
Total harmonic distortion ratio (Note 6)
Crosstalk
THD+N = 10%, RL = 8Ω
THD+N = 10%, RL = 6Ω
PO = 1W, BW=20Hz to 20kHz
PO = 1W, Rg = 0Ω, BW = IHF-A
5
W
0.2
65
90
1
%
dB
Output noise voltage (sampling mode)
Residual noise voltage (mute mode)
VNO
VNOM
µVrms Rg = 0Ω, BW = IHF-A
µVrms Rg = 0Ω, BW = IHF-A, MUTEX = “L”
200
250
300
FC = L
FC = M(OPEN)
FC = H
Internal sampling clock frequency
FS
kHz
(Note 6) The rated values of items above indicate average performances of the device, which largely depend on circuit layouts, components,
and power supplies. The reference values are those applicable to the device and components directly installed on a board specified by us.
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.05 - Rev.B
2/14
Technical Note
BD5413EFV
●Electrical characteristic curves (Ta=25℃) (Reference data)
(1) Under Stereo Operation (RL=8Ω)
100
100
10
Vcc=9V
RL=8Ω
Vcc=9V
RL=8Ω
BW=20~20kHz
10
Po=1W
BW=20~20kHz
1
1
6kHz
1kHz
0.1
0.1
0.01
100Hz
0.01
0.001
0.01
0.1
1
10
10
100
1000
10000
100000
OUTPUT POWER (W)
FREQUENCY (Hz)
Fig. 1 THD+N - Output Power
Fig. 2 THD+N - Frequency
0
-20
40
35
30
25
20
15
10
5
Vcc=9V
RL=8Ω
Po=1W
BW=20~20kHz
-40
Vcc=9V
RL=8Ω
-60
Po=1W
L=33µH
C=0.47µF
Cg=0.1µF
-80
-100
0
10
100
1000
10000
100000
10
100
1000
10000
100000
FREQUENCY (Hz)
FREQUENCY (Hz)
Fig. 3 Voltage Gain - Frequency
Fig. 4
Crosstalk - Frequency
0
14
Vcc=12V
RL=8Ω
RL=8Ω
12
10
8
fin=1kHz
-20
-40
fin=1kHz
BW=20~20kHz
THD=10%
6
-60
THD=1%
4
-80
2
-100
0
0.001
0.01
0.1
1
10
4
5
6
7
8
9
10
11
12
OUTPUT POWER (W)
VCC (V)
Fig. 5 Crosstalk - Output Power
Fig. 6 Output Power - Supply Voltage
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.05 - Rev.B
3/14
Technical Note
BD5413EFV
●Electrical characteristic curves (Reference data) – Continued
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
Vcc=9V
RL=8Ω
fin=1kHz
Vcc=6V
20
RL=8Ω
fin=1kHz
10
0
0
2
4
6
0
2
4
6
OUTPUT POWER (W/ch)
OUTPUT POWER (W/ch)
Fig. 7 Efficiency - Output Power
Fig. 8 Efficiency - Output Power
100
90
80
70
60
50
40
30
20
10
0
2
Vcc=9V
Vcc=10.5V
1
Vcc=6V
Vcc=10.5V
RL=8Ω
RL=8Ω
fin=1kHz
fin=1kHz
0
0
0
2
4
6
5
10
15
OUTPUT POWER (W/ch)
TOTAL OUTPUT POWER (W)
Fig. 9 Efficiency - Output Power
Fig. 10 Current Consumption - Output Power
50
-10
Vcc=9V
RL=8Ω
L
R =8Ω
-30
-50
No signal
Gain=29.6dB
No signal
40
30
20
10
0
-70
-90
Sampling
-110
-130
-150
ShutDown
10
100
1000
10000
100000
4
6
8
10
12
FREQUENCY (Hz)
VCC(V)
Fig. 11 50 Current Consumption - Supply Voltage
Fig. 12 Output Noise Voltage FFT
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2010.05 - Rev.B
4/14
© 2010 ROHM Co., Ltd. All rights reserved.
Technical Note
BD5413EFV
●Electrical characteristic curves (Reference data) – Continued
Vcc=9V
L
Vcc=9V
R
Ω
=8
RL
=8
Ω
SDX
Pin14
SDX
Pin14
Po=500mW
fin=100Hz
Po=500mW
fin=100Hz
5V/div
2V/div
5V/div
TS
Pin22
TS
Pin22
2V/div
2V/div
2V/div
Speaker
Output
Speaker
Output
200msec/div
200msec/div
Fig. 13 Waveform at Soft Mute Reset
Fig. 14 Waveform at Soft Mute
Vcc=9V
L
R =8Ω
VCCA
Po=500mW
fin=1kHz
5V/div
2V/div
FIL
Pin2
Speaker
Output
20msec/div
Fig. 15 Waveform at Instantaneous Power
Interruption (20msec/div)
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2010.05 - Rev.B
5/14
© 2010 ROHM Co., Ltd. All rights reserved.
Technical Note
BD5413EFV
●Electrical characteristic curves (Reference data) – Continued
(2) Under Stereo Operation (RL=16 Ω)
100
100
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
Vcc=6V
RL=16Ω
fin=1kHz
20
Vcc=6V
RL=8Ω
fin=1kHz
10
0
0
6
2
4
0
2
4
OUTPUT POWER (W/ch)
OUTPUT POWER (W/ch)
Fig. 16 Output Power - Supply Voltage
Fig. 17 Efficiency - Output Power
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
Vcc=9V
RL=16Ω
fin=1kHz
Vcc=10.5V
RL=16Ω
fin=1kHz
0
2
4
0
2
4
OUTPUT POWER (W/ch)
OUTPUT POWER (W/ch)
Fig. 18 Efficiency - Output Power
Fig. 19 Efficiency - Output Power
2
1.5
1
Vcc=10.5V
Vcc=9V
Vcc=6V
0.5
0
R =16
L
Ω
fin=1kHz
0
2
4
6
8
TOTAL OUTPUT POWER (W)
Fig. 20 Current Consumption - Output Power
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2010.05 - Rev.B
6/14
© 2010 ROHM Co., Ltd. All rights reserved.
Technical Note
BD5413EFV
●Electrical characteristic curves (Reference data) – Continued
(3) Under Stereo Operation (RL=6Ω)
100
90
80
70
60
50
40
30
100
90
80
70
60
50
40
30
20
10
0
Vcc=10.5V
RL=6Ω
Vcc=9V
20
RL=6Ω
10
fin=1kHz
fin=1kHz
0
0
2
4
6
0
2
4
6
OUTPUT POWER (W/ch)
OUTPUT POWER (W/ch)
Fig. 21 Output Power - Supply Voltage
Fig. 22 Efficiency - Output Power
100
90
80
70
60
50
40
30
20
10
0
R=6Ω
14
12
10
8
L
fin=1kHz
THD=10%
6
4
Vcc=6V
RL=6Ω
2
fin=1kHz
0
4
6
8
10
12
0
2
4
6
VCC (V)
OUTPUT POWER (W/ch)
Fig. 23 Efficiency - Output Power
Fig. 24 Efficiency - Output Power
2
1
0
Vcc=9V
Vcc=10.5V
Vcc=6V
RL=6Ω
fin=1kHz
0
5
10
15
TOTAL OUTPUT POWER (W)
Fig. 25 Current Consumption - Output Power
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2010.05 - Rev.B
7/14
© 2010 ROHM Co., Ltd. All rights reserved.
Technical Note
BD5413EFV
●Pin Assignment Diagram
Top View
GNDA
FIL
1
2
24 IN1
FIL
23 IN2
Soft
Shutdown
VCCA
TEST
3
22 TS
PWM1
PWM2
N.C.
21 VCCP 2P
4
DRIVER
2P
20
19
VCCP1P
OUT1P
GNDP1
GNDP1
OUT1N
VCCP1N
5
OUT 2P
GNDP 2
DRIVER
1P
6
18 GNDP2
17 OUT2N
16 VCCP 2N
15 FC
7
DRIVER
2N
8
DRIVER
1N
9
Sampling
Frequency
Control
10
ERROR
Shutdown
Control
ERR 11
Protections & Logic
14 SDX
Power - off Detector
Output Short Protection
VCCD 12
13
GNDD
High Temperature Protection
Fig. 26 Pin Assignment
●Outer Dimensions and Inscriptions
(Maximum size including burr: 6.15) (5.0)
Type
D5413EFV
Lot No.
Fig. 27 Outer Dimensions and Inscriptions of the HTSSOP-B24 Package
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.05 - Rev.B
8/14
Technical Note
BD5413EFV
●Pin configuration (Pin Voltage: Typical Value)
No.
Symbol
Pin voltage
Pin description
Internal equalizing circuit
3
ch1: Analog signal input pin
ch2: Analog signal input pin
24
23
IN1
IN2
20
k
1/2VCC
23/24
Input an audio signal via a capacitor.
1
5
6
5
6
VCCP1P
OUT1P
GNDP1
OUT1N
VCCP1N
Vcc
Vcc to 0V
0V
ch1: Positive power system power supply pin
ch1: Positive PWM signal output pin
Make connection to the output LPF.
7 , 8
7, 8
9
ch1: Power GND pin
10
ch1: Negative PWM signal output pin
Make connection to the output LPF.
Vcc to 0V
Vcc
9
10
ch1: Negative power system power supply pin
7 , 8
12
Error output pin
H: 5V
L: 0V
100
11
ERROR
Pin for notifying an operation error
H: Error
L: Normal operation
ON /OFF
11
13
300k
12
13
VCCD
GNDD
VCC
0V
Control power supply pin
Control GND pin
12
Shut-down control pin
225k
14
13
14
SDX
-
H: Shut-down OFF
L: Shut-down ON
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.05 - Rev.B
9/14
Technical Note
BD5413EFV
●Pin configuration - Continued
No.
Symbol
Pin voltage
Pin description
Do not use the TEST pin.
Internal equalizing circuit
4
TEST
VCC
Keep this pin open or connect it to VCC for
regular use.
12
22
Shut-down ON/OFF
Constant setting pin
100
22
TS
0 to 4V
Connect a capacitor.
13
16
17
16
17
VCCP2N
OUT2N
GNDP2
OUT2P
VCCP2P
VCCA
Vcc
Vcc to 0V
0V
ch2: Negative power system power supply pin
ch2: Negative PWM signal output pin
Make connection to the output LPF.
18 , 19
21
18,
19
ch2: Power GND pin
ch2: Positive PWM signal output pin
Make connection to the output LPF.
20
21
3
Vcc to 0V
Vcc
20
ch2: Positive power system power supply pin
Analog system power supply pin
18 , 19
Vcc
3
2
1
Analog signal system bias pin
Connect a capacitor.
2
1
FILA
1/2VCC
GNDA
0V
Analog signal system GND pin
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.05 - Rev.B
10/14
Technical Note
BD5413EFV
●Application Circuit Diagram
(1)Application Circuit Diagram with a Load of 8Ω for Stereo Operation
・Vcc=6V to 10.5V
C19
0.47µ
INPUT
ch-1
GNDA
VCC
1
2
24
23
22
21
20
19
18
17
16
15
14
13
C1
47µ
C18
FIL
0.47µ
C2
10µ
INPUT
ch-2
C3
C17
2.2µ
0.1µ
Soft
GNDD
3
Shutdown
VCCP2
TEST
PWM1
PWM2
4
C16
0.1µ
C12
+
VCCP1
L4
33µH
10µ
DRIVER
2P
5
C5
10µ 0.1µ
+
C4
C15
0.1µ
L1
33µH
DRIVER
1P
6
C14
0.47µ
C6
0.1µ
SP ch2
(8Ω)
C13
0.1µ
C7
0.47µ
7
GNDP2
SP ch1
(8Ω)
L3
33µH
C8
0.1µ
DRIVER
2N
8
GNDP1
C11
0.1µ
L2
33µH
DRIVER
1N
9
C9
0.1µ
Sampling
Frequency
Control
300kHz
250kHz
200kHz
10
11
12
Protections & Logic
ERROR
Shutdown
Control
SHUTDOWN
GNDD
ERROR OUTPUT
VCC
Power-off Detector
Output Short Protection
High Temperature Protection
0.1µ
C10
Fig.28 Circuit Diagram with a Load of 8Ω for Stereo Operation
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.05 - Rev.B
11/14
Technical Note
BD5413EFV
(2)BOMs of Boards for Stereo Operation
Table 1 BOMs of Boards with Loads of 8Ω, 6Ω and 16Ω for Stereo Operation
Configuration
mm inch
HTSSOP-B24
Rated
voltage
Temperature
characteristics
No. Item
Part Number
Vendor
Value
Tolerance
Quantity
Reference
1
2
3
4
5
6
7
IC
C
C
C
C
C
C
BD5413EFV
ROHM
MURATA
MURATA
MURATA
MURATA
MURATA
CHEM1-00N
-
-
-
-
±10%
1
1
1
6
1
2
2
IC1
GRM32EB31A476KE20
GRM21BB31C106KE15
GRM188B11C104KA01
GRM188B30J225KE18
GRM188B11C474KA87
EMZA350ADA100ME61G
3225
2012
1608
1608
1608
1210
0805
0603
0603
0603
47µF
10µF
0.1µF
2.2µF
0.47µF
10µF
10V
16V
16V
6.3V
16V
35V
±10%
±10%
±10%
±10%
±10%
±20%
C1
±10%
C2
±10%
C3, C4, C9, C10, C11, C16
±10%
C17
±10%
C18, C19
C5, C12
5.3×5.3
+20%, -25%
BOM of Board with a Load Resistance of 8Ω
Configuration
Rated
voltage
Temperature
characteristics
No. Item
Part Number
Vendor
Value
Tolerance
Quantity
Reference
mm
1608
1608
inch
0603
0603
8
9
C
C
GRM188B11C104KA01
GRM188B11C474KA87
MURATA
MURATA
0.1µF
16V
16V
±10%
±10%
±10%
±10%
4
2
C6, C8, C13, C15
C7, C14
0.47µF
Configuration
mm
DC
Resistance
Rated
DC Current
No. Item
Part Number
Vendor
TDK
Value
33µH
Tolerance
±10%
Quantity
4
Reference
10
L
TSL0808RA-330K1R4-PF
Ф8.5,8.3
92mΩmax
1.4A max
L1, L2, L3, L4
BOM of Board with a Load Resistance of 6Ω
Configuration
Rated
voltage
Temperature
characteristics
No. Item
Part Number
Vendor
Value
Tolerance
Quantity
Reference
mm
inch
8
9
C
C
GRM188B11C474KA87
GRM188B11C474KA87
MURATA
MURATA
1608
1608
0603
0603
0.47µF
0.47µF
16V
16V
±10%
±10%
±10%
±10%
4
2
C6, C8, C13, C15
C7, C14
Configuration
mm
DC
Resistance
Rated
DC Current
No. Item
Part Number
Vendor
TDK
Value
22µH
Tolerance
±10%
Quantity
4
Reference
10
L
TSL0808RA-220K1R7-PF
Ф8.5,8.3
70mΩmax
1.7A max
L1, L2, L3, L4
BOM of Board with a Load Resistance of 16Ω
Configuration
Rated
voltage
Temperature
characteristics
No. Item
Part Number
Vendor
Value
Tolerance
Quantity
Reference
mm
inch
8
9
C
C
GRM188B11C104KA01
GRM188B11C224KA01
MURATA
MURATA
1608
1608
0603
0603
0.01µF
0.22µF
16V
16V
±10%
±10%
±10%
±10%
4
2
C6, C8, C13, C15
C7, C14
Configuration
mm
DC
Resistance
Rated
DC Current
No. Item
Part Number
Vendor
TDK
Value
68µH
Tolerance
±10%
Quantity
4
Reference
10
L
TSL0808RA-680K1R0-PF
Ф8.5,8.3
160mΩmax
1A max
L1, L2, L3, L4
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.05 - Rev.B
12/14
Technical Note
BD5413EFV
●Notes for use
1. About absolute maximum ratings
If an applied voltage or an operating temperature exceeds an absolute maximum rating, it may cause destruction of a
device. A result of destruction, whether it is short mode or open mode, is not predictable. Therefore, provide a physical
safety measure such as fuse, against a special mode that may violate conditions of absolute maximum ratings.
2. About power supply line
As return of current regenerated by back EMF of output coil happens, take steps such as putting capacitor between
power supply and GND as a electric pathway for the regenerated current. Be sure that there is no problem with each
property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If the
connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage
on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute
maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp
diode between the power supply and GND pins.
3. Potential of GND (1, 7, 8, 13, 18 and 19 pins)
Potential of the GND terminal must be the lowest under any operating conditions.
4. About thermal design
Perform thermal design with sufficient margins, in consideration of maximum power dissipation Pd under actual operating
conditions. This product has an exposed frame on the back of the package, and it is assumed that the frame is used with
measures to improve efficiency of heat dissipation. In addition to front surface of board, provide a heat dissipation pattern
as widely as possible on the back also.
A class-D power amplifier has heat dissipation efficiency far higher than that of conventional analog power amplifier and
generates less heat. However, extra attention must be paid in thermal design so that a power dissipation Pdiss should not
exceed the maximum power dissipation Pd.
Tjmax: Maximum temperature junction = 150[℃]
Ta: Operating ambient temperature [℃]
θja: Package thermal resistance [℃/W]
Po: Output power [W]
Tjmax- Ta
θja
Pd Po
〔 W〕
Maximum power dissipation
Power dissipation
1
Pdiss PO
-1 〔 W〕
η
η: Efficiency
5. About operations in strong electric field
Note that the device may malfunction in a strong electric field.
6. Thermal shutdown (TSD) circuit
This product is provided with a built-in thermal shutdown circuit. When the thermal shutdown circuit operates, the output
transistors are placed under open status. The thermal shutdown circuit is primarily intended to shut down the IC avoiding
thermal runaway under abnormal conditions with a chip temperature exceeding Tjmax = 150℃, and is not intended to
protect and secure an electrical appliance. Accordingly, do not use this circuit function to protect a customer's electrical
appliance.
7. About shorting between pins and installation failure
Be careful about direction and displacement of an IC when installing it onto the board. Faulty installation may destroy the
IC when the device is energized. In addition, a foreign matter getting in between IC pins, pins and power supply, and
pins and GND may cause shorting and destruction of the IC.
8. About power-on or power-off sequence
Set the SDX pin (pin 14) to “L” level before initiating the power-on sequence. Similarly, set the SDX pin (pin 14) to “L”
level before initiating the power-off sequence. If such a setting is made, pop reduction is achieved at power-on or power-
off sequence. In addition, note that all power supply pins shall be made active or inactive at the same time.
9. About error output pin (pin 11)
When a high temperature protection function or VCC/GND shorting protection function is activated, an error flag is output
via an error output pin. Because the error output pin is primarily intended to indicate the state of BD5413EFV and is
available only to protect BD5413EFV, it cannot be used for any other purposes.
10.About TEST pin (pin 4)
Do not use the TEST pin. Keep this pin open or connect it to VCC for regular use.
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2010.05 - Rev.B
13/14
© 2010 ROHM Co., Ltd. All rights reserved.
Technical Note
BD5413EFV
●Ordering part number
B D
- E
2
5
4
1
3
E
F
V
Part No
BD.
Part No.
5413
Package
EFV:HTSSOP-B24
Packaging and forming specification
E2: Embossed tape and reel
HTSSOP-B24
<Tape and Reel information>
7.8 0.1
(MAX 8.15 include BURR)
Tape
Embossed carrier tape (with dry pack)
+
−
(5.0)
6°
4°
4°
Quantity
2000pcs
24
13
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
12
1PIN MARK
0.325
+0.05
0.17
-
0.03
S
0.65
0.08
S
+0.05
Direction of feed
1pin
M
0.24
0.08
-
0.04
Reel
Order quantity needs to be multiple of the minimum quantity.
∗
(Unit : mm)
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.05 - Rev.B
14/14
Notice
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