BD41033FJ-C (开发中)

Datasheet

LIN Transceiver for Automotive

BD41033FJ-C

General Description

Key Specifications

◼ Supply Voltage:

BD41033FJ-C is the best transceiver for BUS system

which need LIN (Local Interconnect Network)

Commander and Responder protocol communication

function.

5.0 V to 27.0 V

3 μA (Typ)

◼ Supply Current (Sleep Mode):

◼ Supply Current

(Normal Mode, Recessive):

◼ Supply Current

550 μA (Typ)

900 μA (Typ)

Low power consumption in sleep mode is implemented.

(Normal Mode, Dominant):

Features

◼ AEC-Q100 Qualified^{(Note 1)}

Package

W (Typ) x D (Typ) x H (Max)

4.9 mm x 6.0 mm x 1.65 mm

◼ Functional Safety Supportive Automotive Products

◼ Compliant to LIN2.x/ISO17987-4: 2016 (12V)

◼ Absolute Maximum Ratings of the LIN Pin is -27V to

+40V

SOP-J8

◼ Max Transmission Rate 20 kbps

◼ Low Electro Magnetic Interference (EMI)

◼ High Electro Magnetic Susceptibility (EMS)

◼ High Impedance at Power Off for BUS

◼ Interface Voltage to Micro Controller corresponds to

3.3 V/5.0 V

◼ Integrated Termination Resistor (R_SLAVE) for LIN

Responder

◼ Low Power Consumption in Sleep Mode

◼ Transmit Data (TXD) Dominant Time-out Function

◼ Resistant to LIN-BAT/GND Short-circuit

◼ Integrated Thermal Shutdown

(Note 1) Grade1

Application

◼ LIN Communication for Automotive Networks.

Typical Application Circuit

LIN

BUS Line

V_ECU

Only

Commander node

3.3 V/5.0 V

2.4 kΩ

VDD

BAT

RXD

100 nF

TXD

1 kΩ

Micro

Controller

BD41033FJ-C

NSLP

LIN

GND

(1)

(1) Commander: C = 1 nF; Responder: C = 220 pF

〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.

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Pin Configuration

(TOP VIEW)

RXD

NSLP

N.C.

1

2

3

4

8

7

6

5

N.C.

BAT

LIN

TXD

GND

Pin Descriptions

Pin No.

Pin Name

RXD

Function

Received data output pin (Open Drain)

Sleep mode: Hi-Z output

1

Standby mode: L output

Normal mode: Received data output

Sleep control input pin (“L” Active mode)

L input: Change to Sleep mode

H input: Change to Normal mode

2

NSLP

3

4

5

6

7

8

N.C.

TXD

GND

LIN

Not connected

Transmission data input pin

Ground

LIN input and output pin

Power supply pin

Not connected

BAT

N.C.

Block Diagram

7

BAT

Under

Internal

Voltage

Regulator

Lock Out

Power

on

Reset

Control

Sleep/Normal

Thermal

Shutdown

2

4

1

NSLP

TXD

Timer

6

LIN

Transmitter

Slope Control

Dominant

Timeout

Counter

Receiver

-

t_BUS

Timer

BAT

RXD

5

GND

+

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Description of Functions

1. Sleep mode

In sleep mode, this IC stops transmit/receive functions and enters the low power consumption status.

While normal mode the L status of the NSLP pin exceeds t_GOTOSLEEPor more, this IC changes to Sleep mode. When the

NSLP pin set to L from H while the TXD pin is L, this IC may change to Standby mode after changing to Sleep mode. To

change to Sleep mode, the TXD pin should set H before the NSLP pin set to L from H.

2. Standby mode

In standby mode, this IC notify the mode change to Standby mode to Micro controller by outputting L from the RXD pin.

While sleep mode after the LIN pin input is set to Dominant signal and exceeds t_BUSor more, this IC changes to Standby

mode when the LIN pin input is set to Recessive signal from Dominant signal.

Hereinafter, this mode change is defined as Remote Wake-up.

3. Normal mode

In normal mode, this IC can transmit/receive data via the LIN BUS line. At receiving operation, this IC outputs signal from

the RXD pin to Micro Controller from the LIN pin input signal. At transmitting operation, this IC outputs signal to the LIN

pin with shaping as LIN BUS wave from the TXD pin input signal of Micro Controller.

While Sleep mode or Standby mode the H status of the NSLP pin exceeds t_GOTONORMor more, this IC changes to Normal

mode.

Sleep mode

V_BAT≤ V_POR

V_BAT> V_POR

Unpowered

state

All mode

RXD: Hi-Z

Transmitter: OFF

t_{(NSLP = L)}≥ t_GOTOSLEEP

LIN = Recessive

after t_{(LIN = Dominant)}≥ t_BUS

t_{(NSLP = H)}≥ t_GOTONORM

Normal mode

Standby mode

t_{(NSLP = H)}≥ t_GOTONORM

RXD: LIN BUS data

Transmitter: ON

RXD: L

Transmitter: OFF

Figure 1. State diagram

Table 1. Operating modes

Mode

NSLP

RXD

Transmitter

OFF

R_SLAVE

Comments

Sleepmode

Standbymode

Normalmode

L

H

Hi-Z

L

30 kΩ (Typ)

Low power consumption sate

OFF

NotificationsateofRemoteWake-up detection

Datatransmitand receive enablestate

LIN BUSdata

ON

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Description of Functions – continued

4. Fail-safe function

When the L time of the TXD pin exceeds t_DOM,DTC (Dominant Timeout Counter) circuit detects abnormal and stops the

output of transmitter described in Figure 6. This IC returns to a state where transmission operation is possible after the

TXD pin is set to H.

When the junction temperature of IC exceeds the detection temperature 170 °C (Typ), TSD (Thermal Shutdown) circuit

detects abnormal and stops the output of transmitter. Because the detection temperature has hysteresis, this IC returns

to a state where transmission operation is possible after the junction temperature drops 13 °C (Typ) from the detection

temperature.

UVLO (Under Voltage Lock Out) circuit and POR (Power on Reset) circuit detect abnormal of V_BATvoltage drop.

When V_BATdrops less than V_UVLO, this IC detects abnormal and stops the output of transmitter. This IC returns to a state

where transmission operation is possible after V_BATexceeds V_UVLOor more. When V_BATalso drops less than V_POR, this IC

changes to Unpowered state and resets status.

Table 2. Operation explanation when Fail-safe function detects abnormal

Fail-safeFunction

DTC

State Transition

No change

Transmitter Output

RXD Output

LIN BUSdata

Hi-Z

TSD

No change

UVLO

No change

Changeto

Unpoweredstate

POR

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Absolute Maximum Ratings (Ta = 25 °C)

Parameter

Symbol

V_BAT

Rating

Unit

Supply Voltage

-0.3 to +40.0

-0.3 to +7.0

-27 to +40

+150

V

Input Voltage

V_NSLP, V_TXD

V_RXD

Output Voltage

V

Input/Output Voltage

Maximum Junction Temperature

Storage Temperature Range

V_LIN

V

Tjmax

Tstg

°C

V

-55 to +150

±4000

Electro Static Discharge (HBM)^{(Note 2)}

V_ESD

(Note 2) Based on JEDEC.

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing

board size and copper area so as not to exceed the maximum junction temperature rating.

Thermal Resistance ^{(Note 3)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 5)}

2s2p^{(Note 6)}

SOP-J8

Junction to Ambient

θ_JA

149.3

18

76.9

11

°C/W

Junction to Top Characterization Parameter^{(Note 4)}

Ψ_JT

(Note 3) Based on JESD51-2A (Still-Air).

(Note 4) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 5) Using a PCB board based on JESD51-3.

(Note 6) Using a PCB board based on JESD51-7.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3 mm x 76.2 mm x 1.57 mmt

Top

Copper Pattern

Thickness

70 µm

Footprints and Traces

Layer Number of

Measurement Board

Material

FR-4

Board Size

114.3 mm x 76.2 mm x 1.6 mmt

2 Internal Layers

4 Layers

Top

Copper Pattern

Bottom

Copper Pattern

74.2 mm x 74.2 mm

Thickness

70 µm

Copper Pattern

Thickness

35 µm

Thickness

70 µm

Footprints and Traces

74.2 mm x 74.2 mm

Recommended Operating Conditions

Limit

Parameter

Symbol

Unit

Min

Typ

12.0

+25

Max

27.0

+125

Supply Voltage

Operating Temperature

V_BAT

Topr

5.0

-40

V

°C

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Electrical Characteristics (Ta = -40 °C to +125 °C; V_BAT= 5 V to 27 V; R_L= 500 Ω; typical values are given at

Ta = 25 °C, V_BAT= 12 V, unless otherwise specified)

V_CC= 5 V

100 nF

R_RXD

BAT

RXD

NSLP

TXD

R_L

C_RXD

LIN

GND

C_L

Figure 2. Simplified test circuit

Limit

Parameter

Symbol

Unit

Conditions

Min

Typ

Max

BAT

Sleep mode

Supply Current 1

(Sleep Mode)

V_LIN= V_BAT

V_TXD= 0 V

I_BAT1

-

3

8

μA

V_NSLP= 0 V

Standby mode

V_LIN= V_BAT

V_TXD= 0 V

V_NSLP= 0 V

Standby mode

V_BAT= 12 V

V_LIN= 0 V

Supply Current 2

(Standby Mode, Recessive)

I_BAT2

500

1200

2000

Supply Current 3

(Standby Mode, Dominant)

I_BAT3

-

850

μA

V_TXD= 0 V

V_NSLP= 0 V

Normal mode

V_LIN= V_BAT

V_TXD= 5 V

V_NSLP= 5 V

Normal mode

V_BAT= 12 V

V_TXD= 0 V

Supply Current 4

(Normal Mode, Recessive)

I_BAT4

-

550

900

1300

2000

μA

Supply Current 5

(Normal Mode, Dominant)

I_BAT5

V_NSLP= 5 V

UVLO Threshold Voltage

POR Threshold Voltage

TXD

V_UVLO

V_POR

-

4.9

4.3

V

High Level Input Voltage

Low Level Input Voltage

Hysteresis Input Voltage

Input Pull-down Resistor

Low Level Input Current

NSLP

V_{IH_TXD}

V_{IL_TXD}

V_{HYS_TXD}

R_TXD

2.0

-0.3

0.03

125

-5.0

-

7.0

V

+0.8

0.50

800

-

V

350

0.0

kΩ

μA

V_TXD= 5 V

V_TXD= 0 V

I_{IL_TXD}

+5.0

High Level Input Voltage

Low Level Input Voltage

Hysteresis Input Voltage

Input Pull-down Resistor

Low Level Input Current

V_{IH_NSLP}

V_{IL_NSLP}

V_{HYS_NSLP}

R_NSLP

2.0

-0.3

0.03

125

-5.0

-

7.0

V

+0.8

0.50

800

-

V

350

0.0

kΩ

μA

V_NSLP= 5 V

V_NSLP= 0 V

I_{IL_NSLP}

+5.0

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Electrical Characteristics (Ta = -40 °C to +125 °C; V_BAT= 5 V to 27 V; R_L= 500 Ω; typical values are given at Ta

= 25 °C, V_BAT= 12 V, unless otherwise specified) – continued

Limit

Parameter

Symbol

Unit

Conditions

Min

Typ

Max

RXD

Normal mode

mA V_LIN= 0 V

V_RXD= 0.4 V

Normal mode

μA V_LIN= V_BAT

V_RXD= 5 V

Low Level Output Current

I_OL

1.3

3.5

0.0

-

High Level Leakage Current

LIN

I_OZH

-5.0

+5.0

V_TXD= 0 V

V

V_{O_DOM1}

V_{O_DOM2}

R_SLAVE

-

1.4

2.2

50

V_BAT= 7 V

LIN Dominant Output Voltage

V_TXD= 0 V

V_BAT= 18 V

V

V_LIN= 0 V

V_BAT= 12 V

Pull-up Resistance

20

30

kΩ

Capacitance of LIN Pin^{(Note 7)}

Bus Short Circuit Current

C_LIN

-

30

pF

V_LIN= V_BAT= 18 V

V_TXD= 0 V

I_{BUS_LIM}

40

200

mA

V_LIN= 0 V

mA V_BAT= 12 V

V_TXD= 5 V

V_LIN= 18 V

μA V_BAT= 7 V

V_TXD= 5 V

Receiver Leakage Current (Dominant) I_{BUS_PAS_dom}

-0.6

-

Receiver Leakage Current

I_{BUS_PAS_rec}

20

(Recessive)

V_BAT= V_GND= 12 V

V_LIN= 0 V to 18 V

V_BAT= 0 V

V_LIN= 18 V

Loss of Ground Leakage Current

Loss of Battery Leakage Current

Receiver Low Level Input Voltage

Receiver High Level Input Voltage

Receiver Center Voltage

I_{BUS_NO_GND}

I_{BUS_NO_BAT}

V_BUSdom

V_BUSrec

-0.75

-

+0.10

10

mA

-

μA

0.4 x

V_BAT

V

V_BAT= 7 V to 27 V

0.6 x

V_BAT

-

0.475 x 0.500 x 0.525 x

V_BATV_BATV_BAT

0.100 x 0.140 x 0.175 x

V_BAT= 7 V to 27 V

V_{BUS_CNT}= (V_BUSdom+ V_BUSrec) /2

V_BAT= 7 V to 27 V

V_{BUS_CNT}

V_HYS

Receiver Hysteresis Voltage

V_BAT

V_HYS= V_BUSrec- V_BUSdom

Serial Diode Voltage in R_SLAVE

Path^{(Note 7)}

V_SerDiode

0.4

0.7

1.0

V

Load current = 0.9 mA

(Note 7) It is a design guarantee parameter, not tested in production.

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Electrical Characteristics (Ta = -40 °C to +125 °C; V_BAT= 5 V to 27 V; R_L= 500 Ω; typical values are given at Ta

= 25 °C, V_BAT= 12 V, unless otherwise specified) – continued

Limit

Parameter

AC Characteristics

Symbol

Unit

Conditions

Min

Typ

Max

C_RXD= 20 pF

R_RXD= 2.4 kΩ

t_{rx_sym}= t_{rx_pdf}- t_{rx_pdr}

t_{rx_pdr}

t_{rx_pdf}

-

6.0

μs

RXD Propagation Delay

Symmetry

t_{rx_sym}

-2.0

0.0

+2.0

μs

TH_{Rec (max)}= 0.744 x V_BAT

TH_{Dom (max)}= 0.581 x V_BAT

V_BAT= 7 V to 18 V

Duty Cycle1^{(Note 8)}

Duty Cycle2^{(Note 8)}

Duty Cycle3^{(Note 8)}

D1

0.396

-

t_BIT= 50 μs

D1 = t_{Bus_rec (min)}/ (2 x t_BIT

)

TH_{Rec (min)}= 0.422 x V_BAT

TH_{Dom (min)}= 0.284 x V_BAT

V_BAT= 7.6 V to 18 V

D2

D3

D4

-

0.417

-

0.581

-

t_BIT= 50 μs

D2 = t_{Bus_rec (max)}/ (2 x t_BIT

TH_{Rec (max)}= 0.778 x V_BAT

)

TH_{Dom (max)}= 0.616 x V_BAT

V_BAT= 7 V to 18 V

t_BIT= 96 μs

-

D3 = t_{Bus_rec (min)}/ (2 x t_BIT

)

TH_{Rec (min)}= 0.389 x V_BAT

TH_{Dom (min)}= 0.251 x V_BAT

V_BAT= 7.6 V to 18 V

t_BIT= 96 μs

Duty Cycle4^{(Note 8)}

0.590

D4 = t_{Bus_rec (max)}/ (2 x t_BIT

)

Wake-up LIN Dominant Time

t_BUS

30

-

70

5

150

10

μs

Normal Mode Change

Time^{(Note 9)}

Change time to Normal mode from

Sleep/Standby mode

t_GOTONORM

Change time to Sleep mode from

Normal mode

Sleep Mode Change Time^{(Note 9)}

t_GOTOSLEEP

t_DOM

-

5

10

20

μs

TXD Dominant Timeout Time

6

12

ms

V_TXD= 0 V

(Note 8) Load conditions of bus (C_L; R_L) is prescribed as all right three conditions. (1 nF; 1 kΩ / 6.8 nF; 660 Ω / 10 nF; 500 Ω)

(Note 9) It is a design guarantee parameter, not tested in production.

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Timing Chart

t_BIT

TXD

LIN

t_{Bus_dom}

t_{Bus_rec}

(max)

(min)

TH_{Rec (max)}

TH_{Dom (max)}

TH_{Rec (min)}

TH_{Dom (min)}

t_{Bus_rec}

t_{Bus_dom}

(max)

(min)

RXD

(output of receiving Node1)

t_{rx_pdf}

t_{rx_pdr}

RXD

(output of receiving Node2)

t_{rx_pdr}

t_{rx_pdf}

Figure 3. BUS timing parameter

LIN

t < t_BUS

t_BUS

TXD

RXD

t_GOTONORM

NSLP

Mode

Sleep

Standby

Normal

Figure 4. Change to Standby mode by remote wake-up and

Change to Normal mode by the NSLP pin(Sleep→Standby→Normal)

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Timing Chart – continued

LIN

TXD

RXD

NSLP

Mode

t_GOTONORM

t_GOTOSLEEP

Sleep

Normal

Figure 5. Change to Normal mode and Sleep mode by the NSLP pin(Sleep→Normal→Sleep)

t_DOM

TXD

LIN

RXD

Figure 6. Fail-safe operation by the detection of TXD Dominant Timeout

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I/O Equivalence Circuits

(1) RXD

(2) NSLP

NSLP

RXD

(4) TXD

(6) LIN

BAT

TXD

LIN

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing

of connections.

7. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

8. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

9. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power

supply or ground line.

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Operational Notes – continued

10. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 7. Example of Monolithic IC Structure

11. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

12. Thermal Shutdown Circuit (TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj

falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat

damage.

13. Functional Safety

“ISO 26262 Process Compliant to Support ASIL-*”

A product that has been developed based on an ISO 26262 design process compliant to the ASIL level described in

the datasheet.

“Safety Mechanism is Implemented to Support Functional Safety (ASIL-*)”

A product that has implemented safety mechanism to meet ASIL level requirements described in the datasheet.

“Functional Safety Supportive Automotive Products”

A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the

functional safety.

Note: “ASIL-*” is stands for the ratings of “ASIL-A”, “-B”, “-C” or “-D” specified by each product's datasheet.

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Ordering Information

B D 4 1 0 3 3 F J

-

C E 2

Package

Product Rank

FJ: SOP-J8

C: for Automotive

Packaging and forming specification

E2: Embossed tape and reel

Marking Diagram

SOP-J8 (TOP VIEW)

Part Number Marking

LOT Number

4 1 0 3 3

Pin 1 Mark

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0L4L0H601480-1-2

24.Aug.2022 Rev.001

14/16

BD41033FJ-C

Physical Dimension and Packing Information

Package Name

SOP-J8

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0L4L0H601480-1-2

24.Aug.2022 Rev.001

15/16

BD41033FJ-C

Revision History

Date

Revision

001

Changes

24.Aug.2022

New Release

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0L4L0H601480-1-2

24.Aug.2022 Rev.001

16/16

Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

,

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.004


型号：	BD41033FJ-C (开发中)
厂家：	ROHM
描述：	BD41033FJ-C is the best transceiver for BUS system which need LIN (Local Interconnect Network) Commander and Responder protocol communication function. Low power consumption in sleep mode is implemented.
文件：	总19页 (文件大小：935K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD41033FJ-C (开发中) [ROHM]

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