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BD41044FJ-C [ROHM]

BD41044FJ-C是用于CAN-FD通信的收发器LSI（符合ISO11898-2：2016标准）。配备CAN-FD通信所需的发送器和接收器电路功能（最高5Mbps）。;
BD41044FJ-C
型号： BD41044FJ-C
厂家： ROHM    ROHM
描述：

BD41044FJ-C是用于CAN-FD通信的收发器LSI（符合ISO11898-2：2016标准）。配备CAN-FD通信所需的发送器和接收器电路功能（最高5Mbps）。

通信
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Datasheet  
CAN FD Transceiver for Automotive  
BD41044FJ-C  
General Description  
Key Specifications  
BD41044FJ-C is  
a
transceiver LSI for CAN-FD  
Recommended Operating Voltage Range:  
communication (Fully ISO 11898-2:2016 compliant).  
It is equipped with circuitry that functions as transmitter  
and receiver, necessary for High-speed CAN-FD  
communication (up to 5Mbps)  
4.75V to 5.25V  
VCC, TXD, RXD, STB Absolute Maximum Rating:  
-0.3V to +7.0V  
CANH, CANL, SPLIT Absolute Maximum Rating:  
-27V to +40V  
Features  
AEC-Q100 Qualified(Note 1)  
Package  
SOP-J8  
W(Typ) x D(Typ) x H(Max)  
4.90mm x 6.00mm x 1.65mm  
Transmission Rate of 40kbps to 5Mbps  
Power Saving Mode Correspondence  
SPLIT Voltage Output for Stabilizing Recessive  
Bus Level  
Under Voltage Detection Function  
Thermal Shutdown (TSD) Function  
TXD Dominant Time-out Function  
(Normal Mode)  
CAN Bus Dominant Time-out Function  
(Standby Mode)  
Bus Wake-up Capability  
(Note 1) Grade1  
Application  
CAN Communication for Automotive Networks  
Typical Application Circuit  
VBAT  
VBAT  
5V  
Regulator  
5V  
Regulator  
VCC  
VCC  
CANH  
60Ω(Note 2)  
VCC  
VCC  
CANH  
RXD  
CANH  
CANH  
RXD  
BD41044FJ-C  
(Transceiver)  
60Ω(Note 2)  
BD41044FJ-C  
(Transceiver)  
Micro  
Contoroller  
Micro  
Contoroller  
SPLIT  
SPLIT  
60Ω(Note 2)  
60Ω(Note 2)  
TXD  
STB  
TXD  
4.7nF(Note 2)  
4.7nF(Note 2)  
CANL  
STB  
CANL  
GND  
GND  
CANL  
GND  
GND  
CANL  
CAN Bus Line  
(Note 2) Resistor value, capacitor value and connection about SPLIT should be selected by ECU specification.  
Capacitor value should be selected between 1nF to 100nF.  
Figure 1. Typical Application Circuit  
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays  
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BD41044FJ-C  
Pin Configuration  
SOP-J8  
1
2
3
4
8
7
6
5
TXD  
STB  
GND  
CANH  
VCC  
RXD  
CANL  
SPLIT  
Figure 2. Pin Configuration(TOP VIEW)  
Pin Descriptions  
Table 1. Pin Description  
Function  
Pin No.  
Pin Name  
1
2
3
4
5
6
7
TXD  
GND  
Transmission data input pin with pull-up resistance.  
Ground  
VCC  
Power supply  
RXD  
Receive data output  
SPLIT  
CANL  
CANH  
Common-mode stabilization output  
LOW-level CAN bus line  
HIGH-level CAN bus line  
Mode control input with pull-up resistance.  
HIGH : Standby mode  
8
STB  
LOW : Normal mode.  
Block Diagram  
VCC  
3
TXD  
INPUT  
VCC  
VCC  
TXD  
1
DOMINANT  
TIME-OUT  
CANH  
7
DRIVER  
CANL  
SLOPE  
6
CONTROL  
TSD  
&
UVLO  
STB  
INPUT  
VCC  
STB  
8
MODE  
CONTROL  
COMMON  
VOLTAGE  
DRIVER  
VREF  
IREF  
RXD  
OUTPUT  
VCC  
RECEIVER  
STANDBY  
SPLIT  
RXD  
SPLIT  
4
5
WAKE-UP  
FILTER  
RECEIVER  
NORMAL  
2
GND  
Figure 3. Block Diagram  
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BD41044FJ-C  
Mode of Operation  
BD41044FJ-C operates on Power-OFF mode, Standby mode or Normal mode depending on the logic state of STB pin and  
voltage of VCC (see Figure 4 for the state transition of each mode of operation)  
Power offモード  
H or Hi-z  
Hi-z  
RXD  
CAN bus  
SPLIT  
Hi-z  
VCC>VUVOFF  
VCC≤VUVOFF  
Standbyモード  
H (No wake-up request detected)  
L (Wake-up request detected)  
RXD  
Pull down  
Hi-z  
CAN bus  
SPLIT  
STB=LOW  
and  
VCC>VUVSTB  
STB=HIGH  
or  
VCC≤VUVSTB  
Normalモード  
H (CAN bus=Recessive)  
L (CAN bus=Dominant)  
RXD  
Recessive  
Dominant  
(TXD=H)  
(TXD=L)  
VCC/2  
CAN bus  
SPLIT  
Figure 4. State Transition Chart  
A diode is inserted on the RXD pin at the VCC side to prevent the reverse current to VCC.  
But a diode becomes invalid in Normal mode.  
When it changed to Normal mode by STB=LOW while TXD=LOW, Dominant output to CAN bus is stopped.  
After TXD=HIGH once and then TXD=LOW again, Dominant output to CAN bus is started.  
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Mode of Operation – continued  
1. Power-OFF Mode  
The Power OFF mode is the state in which the transceiver function is turned off due to an abnormal drop in VCC. In this  
mode, the IC cannot receive the Wake-up signal from CAN bus.  
2. Standby Mode  
The Standby Mode is the state in which electric power is saved by turning off all circuits except those with Receiver  
Standby, Wake up Filter and Dominate Time-out functions. RXD will output the wake up signal from CAN bus.  
3. Normal Mode  
The Normal mode is the state in which the transceiver is available for normal CAN communication. It transmits and  
receives data via the bus lines CANH and CANL. In this mode, TXD can transmit data to the CAN bus and RXD can  
receive data from the CAN bus. In addition, SPLIT outputs the voltage of VCC/2.  
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BD41044FJ-C  
Absolute Maximum Ratings  
Table 2. Absolute Maximum Ratings  
Parameter  
Supply Voltage  
Symbol  
Rating  
-0.3 to +7.0  
-0.3 to +7.0  
-0.3 to +7.0  
-27 to +40  
-5.0 to +10.0  
150  
Unit  
V
VCC  
VSTB, VTXD  
VRXD  
Input Voltage  
V
Output Voltage  
V
Input/Output Voltage  
VCANH, VCANL, VSPLIT  
VDIFF  
V
Differencial Voltage  
between CANH and CANL  
V
Junction Max Temperature  
Storage Temperature  
Tjmax  
°C  
°C  
Tstg  
-55 to +150  
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit  
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is  
operated over the absolute maximum ratings.  
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the  
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by  
increasing board size and copper area so as not to exceed the maximum junction temperature rating.  
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Thermal Resistance(Note 3)  
Table 3. Thermal Resistance  
Symbol  
Thermal Resistance (Typ)  
Parameter  
Unit  
1s(Note 5)  
2s2p(Note 6)  
SOP-J8  
Junction to Ambient  
θJA  
149.3  
18  
76.9  
11  
°C/W  
°C/W  
Junction to Top Characterization Parameter(Note 4)  
ΨJT  
(Note 3) Based on JESD51-2A(Still-Air)  
(Note 4) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside  
surface of the component package.  
(Note 5) Using a PCB board based on JESD51-3(Table 4).  
(Note 6) Using a PCB board based on JESD51-7(Table 5).  
Table 4. 1 Layer Board  
Layer Number of  
Material  
FR-4  
Board Size  
Measurement Board  
Single  
114.3mm x 76.2mm x 1.57mmt  
Top  
Copper Pattern  
Thickness  
70µm  
Footprints and Traces  
Table 5. 4 Layers Board  
Board Size  
Layer Number of  
Measurement Board  
Material  
FR-4  
4 Layers  
114.3mm x 76.2mm x 1.6mmt  
2 Internal Layers  
Top  
Copper Pattern  
Bottom  
Copper Pattern  
74.2mm x 74.2mm  
Thickness  
70µm  
Copper Pattern  
Thickness  
35µm  
Thickness  
70µm  
Footprints and Traces  
74.2mm x 74.2mm  
Recommended Operating Conditions  
Table 6. Recommended Operating Ranges  
Limit  
Parameter  
Symbol  
Unit  
Conditions  
Min  
4.75  
-40  
Typ  
5.00  
+25  
4.7  
Max  
5.25  
Supply Voltage Range  
VCC  
Topr  
V
Operating Temperature Range  
Capacitance of Pin SPLIT(Note 7)  
+125  
°C  
CSPLIT  
1.0  
100.0  
nF  
(Note 7) Set the capacity of the condenser not to surpass a range of the value of standard in consideration of temperature characteristics and dc-bias properties.  
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Electrical Characteristics  
The following specifications are 4.75V≤VCC≤5.25V, conditions of -40°C≤Topr≤125°C  
The Typ level is VCC=5V, Topr=25°C unless otherwise specified.  
Table 7. Electrical Characteristics (VCC)  
Limit  
Parameter  
Symbol  
Unit  
µA  
Conditions  
Standby mode;  
Min  
-
Typ  
10  
Max  
15  
Operating Current 1  
ICCSTB  
STB=HIGH  
Normal mode,  
Recessive;  
STB=LOW  
TXD=HIGH  
RLOAD=60Ω  
Normal mode,  
Dominant;  
Operating Current 2  
Operating Current 3  
ICCREC  
-
-
5.0  
45  
7.5  
65  
mA  
mA  
ICCDOM  
STB=LOW  
TXD=LOW  
RLOAD=60Ω  
Under Voltage Detection Voltage 1  
Under Voltage Detection Voltage 2  
VUVSTB  
VUVOFF  
3.50  
1.30  
-
-
4.75  
2.95  
V
V
Table 8. Electrical Characteristics (STB)  
Limit  
Parameter  
Symbol  
Unit  
Conditions  
Min  
0.7 x  
VCC  
Typ  
Max  
VCC  
HIGH Level Input Voltage  
LOW Level Input Voltage  
VIH_STB  
VIL_STB  
-
V
V
+0.3 x  
VCC  
0.0  
-
HIGH Level Input Current  
LOW Level Input Current  
IIH_STB  
IIL_STB  
-1  
-
-
+1  
-1  
µA  
µA  
VSTB=VCC  
VSTB=0V  
-15  
Table 9. Electrical Characteristics (TXD)  
Limit  
Parameter  
Symbol  
Unit  
Conditions  
Min  
Typ  
-
Max  
VCC  
0.7 x  
VCC  
HIGH Level Input Voltage  
LOW Level Input Voltage  
VIH_TXD  
V
V
+0.3 x  
VCC  
VIL_TXD  
IIH_TXD  
IIL_TXD  
0.0  
-
HIGH Level Input Current  
LOW Level Input Current  
-5  
-
+5  
µA  
µA  
VTXD=VCC  
VTXD=0V  
-260  
-150  
-30  
Table 10. Electrical Characteristics (RXD)  
Limit  
Parameter  
Symbol  
Unit  
Conditions  
Min  
-8  
Typ  
-
Max  
-1  
Normal Mode Time Output HIGH  
Current  
Normal Mode Time Output LOW  
Current  
IOH_RXD  
IOL_RXD  
mA  
mA  
VRXD=VCC-0.4V  
VRXD=0.4V  
1
-
12  
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Electrical Characteristics – continued  
Table 11. Electrical Characteristics (SPLIT)  
Limit  
Parameter  
Symbol  
Unit  
Conditions  
ILOAD=-500µA  
Min  
Typ  
-
Max  
0.3 x  
VCC  
0.3 x  
VCC  
0.45 x  
VCC  
0.7 x  
VCC  
0.7 x  
VCC  
0.55 x  
VCC  
Output Voltage 1  
Output Voltage 2  
Output Voltage 3  
VILN_SPLIT  
VILP_SPLIT  
V
V
V
-
-
ILOAD=500µA  
VRL_SPLIT  
IIL_SPLIT  
IIH_SPLIT  
RLOAD=1MΩ  
Leakage Current 1  
Leakage Current 2  
-5  
-5  
-
-
+5  
+5  
µA  
µA  
VSPLIT=-27V  
VSPLIT=40V  
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Electrical Characteristics – continued  
Table 12. Electrical Characteristics (CANH, CANL)  
Limit  
Typ  
Parameter  
Symbol  
Unit  
Conditions  
Min  
-12.0  
2.75  
0.50  
Max  
+12.0  
4.50  
Common Voltage Range  
VCM_CAN  
VDOM_CANH  
VDOM_CANL  
+2.5  
3.50  
1.50  
V
V
V
CANH Dominant Output Voltage  
CANL Dominant Output Voltage  
RLOAD = 50Ω to 65Ω  
RLOAD = 50Ω to 65Ω  
2.25  
CANH–CANL  
Dominant Output Voltage  
CANH–CANL  
VDOM_DIFF  
VDOM_DIFF2  
1.5  
1.5  
-
-
3.0  
5.0  
V
V
RLOAD = 50Ω to 65Ω  
RLOAD = 2240Ω  
Dominant Output Voltage2  
RLOAD = 60Ω  
CSPLIT = 4.7nF  
fTXD = 250kHz, 1.0MHz  
CANH+CANL  
Output Waveform Symmetry  
0.9 x  
VCC  
1.1 x  
VCC  
VAC_SYM  
-
V
CANH+CANL–VCC  
Dominant Output Voltage  
VDOM_SYM  
VREC_CANH  
VREC_CANL  
VREC_DIFF1  
VREC_DIFF2  
-400  
2.0  
-
+400  
3.0  
mV  
V
RLOAD=60Ω  
no Load  
0.5 x  
VCC  
0.5 x  
VCC  
CANH Recessive Output Voltage  
CANL Recessive Output Voltage  
2.0  
3.0  
V
no Load  
CANH–CANL  
Recessive Output Voltage 1  
CANH–CANL  
-50  
-
-
+50  
+12  
mV  
mV  
no Load  
-120  
RLOAD=60Ω  
Recessive Output Voltage 2  
CANH Dominant Output Current  
CANL Dominant Output Current  
CANH Recessive Output Current  
CANL Recessive Output Current  
CANH Standby Output Voltage  
CANL Standby Output Voltage  
IDOM_CANH  
IDOM_CANL  
IREC_CANH  
IREC_CANL  
VSTB_CANH  
VSTB_CANL  
-100  
-
-
-
-
-
-
-
-
mA  
mA  
mA  
mA  
V
VCANH=-3V  
100  
+5  
VCANL=18V  
-5  
VCANH=-27V to +40V  
VCANL=-27V to +40V  
no Load  
-5  
+5  
-0.1  
-0.1  
+0.1  
+0.1  
V
no Load  
CANH–CANL  
Stanby Differential Output Voltage  
VDIFF_STB  
IOFF_CANH  
IOFF_CANL  
-0.2  
-3  
-
-
-
+0.2  
+3  
V
no load  
VCC=0V  
VCANH=5V  
VCC=0V  
VCANL=5V  
CANH Leakage Current  
CANL Leakage Current  
µA  
µA  
-3  
+3  
CANH Input Impedance  
CANL Input Impedance  
RI_CANH  
RI_CANL  
RI_OFFSET  
6
6
15  
15  
28  
28  
kΩ  
kΩ  
-2.0V≤VCANH≤+7.0V  
-2.0V≤VCANL≤+7.0V  
CANH, CANL  
Input Impedance Offset  
CANH, CANL  
Differential Input Impedance  
Differential Input Voltage Range  
“Recessive” (Normal Mode)  
Differential Input Voltage Range  
“Dominant” (Normal Mode)  
Normal Mode  
-3  
12  
-
30  
-
+3  
52  
%
kΩ  
V
VCANH=+5.0V, VCANL=+5.0V  
-2.0V≤VCANH≤+7.0V  
-2.0V≤VCANL≤+7.0V  
-12.0V≤VCANH≤+12.0V  
-12.0V≤VCANL≤+12.0V  
-12.0V≤VCANH≤+12.0V  
-12.0V≤VCANL≤+12.0V  
RI_DIFF  
VRX_NRM_R  
VRX_NRM_D  
-3.0  
0.9  
+0.5  
8.0  
-
V
-12.0V≤VCANH≤+12.0V  
-12.0V≤VCANL≤+12.0V  
Receiver Detection Voltage  
Hysteresis  
VRX_NRM_HYS  
100  
-
300  
mV  
Differential Input Voltage Range  
“Recessive” (Standby Mode)  
Differential Input Voltage Range  
“Dominant” (Standby Mode)  
-12.0V≤VCANH≤+12.0V  
-12.0V≤VCANL≤+12.0V  
-12.0V≤VCANH≤+12.0V  
-12.0V≤VCANL≤+12.0V  
VRX_STB_R  
VRX_STB_D  
-3.0  
-
-
+0.4  
8.00  
V
V
1.15  
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Electrical Characteristics – continued  
Table 13. Electrical Characteristics (Timing)  
Limit  
Typ  
Parameter  
Symbol  
Unit  
Conditions  
RLOAD=60Ω  
CLOAD=100pF  
RLOAD=60Ω  
Min  
-
Max  
140  
Delay Time  
tTXD_DOM  
tTXD_REC  
-
-
-
-
-
-
ns  
ns  
ns  
ns  
ns  
ns  
from TXD to Bus Dominant  
Delay Time  
-
-
140  
140  
140  
220  
220  
from TXD to Bus Recessive  
Delay Time  
from Bus Dominant to RXD  
CLOAD=100pF  
tDOM_RXD  
tREC_RXD  
tTXD_RXD_F  
tTXD_RXD_R  
CRXD=15pF  
CRXD=15pF  
Delay Time  
-
from Bus Recessive to RXD  
Propagation Delay  
from TXD to RXD Fall  
Propagation Delay  
RLOAD=60Ω  
CLOAD=100pF  
RLOAD=60Ω  
CLOAD=100pF  
fTXD=1.0MHz  
RLOAD=60Ω  
CLOAD=100pF  
CRXD=15pF  
fTXD=2.5MHz  
RLOAD=60Ω  
CLOAD=100pF  
CRXD=15pF  
fTXD=1.0MHz  
RLOAD=60Ω  
CLOAD=100pF  
CRXD=15pF  
fTXD=2.5MHz  
RLOAD=60Ω  
CLOAD=100pF  
CRXD=15pF  
fTXD=1.0MHz  
RLOAD=60Ω  
CLOAD=100pF  
CRXD=15pF  
fTXD=2.5MHz  
RLOAD=60Ω  
CLOAD=100pF  
CRXD=15pF  
60  
60  
from TXD to RXD Rise  
Transmitted Recessive Bit Width1  
Transmitted Recessive Bit Width2  
Bit Time on Pin RXD1  
tbit_BUS2  
tbit_BUS5  
tbit_RXD2  
tbit_RXD5  
Δtrec2  
435  
155  
400  
120  
-65  
-
-
-
-
-
-
530  
210  
550  
220  
+40  
+15  
ns  
ns  
ns  
ns  
ns  
ns  
Bit Time on Pin RXD2  
Receiver Timing Symmetry1  
Receiver Timing Symmetry2  
Δtrec5  
-45  
Bus Wake-up Time  
tBUS_WK  
tSTB_NRM  
tDOM_TON  
tDOM_TOS  
0.5  
7
-
-
-
-
5.0  
47  
µs  
µs  
VRX_STB_D=1.15V to 5.00V  
Standby to Normal Mode  
TXD Dominant Time-out  
Bus Dominant Time-out  
0.8  
0.8  
10.0  
10.0  
ms  
ms  
In Normal Mode  
In Standby Mode  
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Timing Chart  
CANH  
CANL  
CANH-CANL1.15V  
RXD  
30%  
tBUS_WK  
Figure 5. Standby Mode Function  
50%  
TXD  
CANH  
CANL  
0.9V  
CANH-CANL  
0.5V  
RXD  
50%  
tTXD_DOM  
tTXD_REC  
tDOM_RXD  
tREC_RXD  
Figure 6. Normal Mode Function  
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BD41044FJ-C  
Timing Chart – continued  
STB  
50%  
0.25 X VCC  
CANH  
CANL  
0.25 X VCC  
SPLIT  
Mode  
tSTB_NRM  
Standby mode  
Normal mode  
Figure 7. Transition from Standby Mode to Normal Mode  
70%  
30%  
TXD  
tBit(TXD)  
tTXD_RXD_F  
5 x tBit(TXD)  
CANH  
CANL  
0.9V  
CANH-CANL  
0.5V  
tbit_BUS2, tbit_BUS5  
70%  
RXD  
30%  
tTXD_RXD_R  
tbit_RXD2, tbit_RXD5  
According to ISO11898-2:2016.  
Figure 8. CAN FD Normal Mode Operating  
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BD41044FJ-C  
Fail Safe Function  
1. Thermal Shut Down  
Thermal shut down is a function to automatically stop output to the CAN bus during an abnormal heat generation overrun.  
When the junction temperature of the IC becomes higher than a sensed temperature (Typ 170°C), CAN bus changes to  
the Recessive state. When the junction temperature of the IC is less than the detection release temperature(Typ 155°C),  
the thermal shut down function is cancelled by setting TXD HIGH.  
Attention: The sensed temperature reaches 150°C to 190°C, and the hysteresis temperature is 5°C to 30 °C. The sensed  
temperature/hysteresis temperature is not inspected for shipped samples. In addition, please avoid system designs that  
operate near the absolute maximum ratings as the temperature protective circuits activate when the limits are exceeded.  
TXD  
CANH  
CANL  
CANH-CANL  
RXD  
Tj < TSD disable  
temperature  
Tj < TSD disable  
temperature  
Tj > TSD enable  
temperature  
and TXD = HIGH  
Thermal shut dow n is enable  
Thermal shut dow n is disable  
Figure 9. Thermal Shutdown Operating  
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BD41044FJ-C  
Fail Safe Function – continued  
2. TXD Dominant Time-out  
TXD dominant time-out is a function to automatically stop the output to CAN bus when TXD is set LOW during Normal  
mode. If TXD dominant time-out is enabled, CAN bus changes to the Recessive state. The TXD dominant time-out is  
released by setting TXD to HIGH.  
tDOM_TON  
50%  
TXD  
CANH  
CANL  
CANH-CANL  
0.5V  
RXD  
TXD dominant time-out  
TXD=HIGH  
is enable  
TXD dominant time-out  
is disable  
Figure 10. TXD Dominant Time-out Operating  
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BD41044FJ-C  
Fail Safe Function – continued  
3. CAN Bus Dominant Time-out  
CAN Bus Dominant Time-out is a function to automatically stop the LOW output to RXD when CAN bus is set to Dominant  
during Standby Mode. If CAN bus dominant time-out is enabled, RXD becomes HIGH. The CAN bus dominant time-out is  
released by setting the CAN bus to Recessive.  
CANH  
CANL  
tDOM_TOS  
1.15V  
CANH-CANL  
70%  
RXD  
CAN bus = Recessive  
CAN bus dominant time-out  
is enable  
CAN bus dominant time-out  
Figure 11. RXD Dominant Time-out Operating  
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BD41044FJ-C  
Evaluation Circuit Diagram  
1. tTXD_DOM, tTXD_REC, tTXD_RXD_F, tTXD_RXD_R, tbit_BUS2, tbit_BUS5, tbit_RXD2, tbit_RXD5, Δtrec2, Δtrec5  
5V  
100nF  
47µF  
VCC  
CANH  
CANH  
RXD  
BD41044FJ-C  
(Transceiver)  
RLOAD  
=60Ω  
CLOAD  
=100pF  
OPEN  
TXD  
SPLIT  
STB  
CANL  
GND  
CANL  
15pF  
2. tDOM_RXD, tREC_RXD  
5V  
100nF  
47µF  
VCC  
CANH  
CANH  
RXD  
BD41044FJ-C  
(Transceiver)  
OPEN  
OPEN  
SPLIT  
TXD  
STB  
CANL  
GND  
CANL  
15pF  
3. VAC_SYM  
5V  
100nF  
47µF  
VCC  
CANH  
OPEN  
CANH  
RXD  
RLOAD  
=30Ω  
BD41044FJ-C  
(Transceiver)  
SPLIT  
TXD  
STB  
RLOAD  
=30Ω  
CANL  
GND  
CANL  
CSPLIT  
=4.7nF  
Figure 12. Evaluation Circuit Diagram  
16/22  
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BD41044FJ-C  
I/O Equivalent Circuits  
(1)TXD  
(4)RXD  
VCC  
TXD  
RXD  
(5)SPLIT  
(6)CANL  
CANL  
SPLIT  
(7)CANH  
(8)STB  
VCC  
STB  
CANH  
Figure 13. I/O Equivalent Circuits  
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BD41044FJ-C  
Operational Notes  
1.  
Reverse Connection of Power Supply  
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when  
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power  
supply pins.  
2.  
Power Supply Lines  
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at  
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic  
capacitors.  
3.  
4.  
Ground Voltage  
Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a  
voltage below that of the ground pin at any time, even during transient condition.  
Ground Wiring Pattern  
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but  
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal  
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations  
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.  
5.  
6.  
Recommended Operating Conditions  
The function and operation of the IC are guaranteed within the range specified by the recommended operating  
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical  
characteristics.  
Inrush Current  
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow  
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power  
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and  
routing of connections.  
7.  
8.  
Operation Under Strong Electromagnetic Field  
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.  
Testing on Application Boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may  
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply  
should always be turned off completely before connecting or removing it from the test setup during the inspection  
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during  
transport and storage.  
9.  
Inter-pin Short and Mounting Errors  
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in  
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.  
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and  
unintentional solder bridge deposited in between pins during assembly to name a few.  
10. Unused Input Pins  
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and  
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge  
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause  
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power  
supply or ground line.  
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BD41044FJ-C  
Operational Notes – continued  
11. Regarding the Input Pin of the IC  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them  
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a  
parasitic diode or transistor. For example (refer to figure below):  
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.  
When GND > Pin B, the P-N junction operates as a parasitic transistor.  
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual  
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to  
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be  
avoided.  
Resistor  
Transistor (NPN)  
Pin A  
Pin B  
Pin B  
B
E
C
Pin A  
B
C
E
P
P+  
P+  
N
P+  
P
P+  
N
N
N
N
N
N
N
Parasitic  
Elements  
Parasitic  
Elements  
P Substrate  
GND GND  
P Substrate  
GND  
GND  
Parasitic  
Elements  
Parasitic  
Elements  
N Region  
close-by  
Figure 14. Example of monolithic IC structure  
12. Ceramic Capacitor  
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with  
temperature and the decrease in nominal capacitance due to DC bias and others.  
13. Area of Safe Operation (ASO)  
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within  
the Area of Safe Operation (ASO).  
14. Thermal Shutdown Circuit(TSD)  
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always  
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the  
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj  
falls below the TSD threshold, the circuits are automatically restored to normal operation.  
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no  
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from  
heat damage.  
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19/22  
TSZ22111 • 15 • 001  
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BD41044FJ-C  
Ordering Information  
B D 4 1 0 4  
4
F
J
-
CE2  
Part Number  
Package  
FJ:SOP-J8  
Packaging and forming specification  
C: Automotive  
E2: Embossed tape and reel  
Marking Diagram  
SOP-J8(TOP VIEW)  
Part Number Marking  
4 1 0 4 4  
LOT Number  
Pin 1 Mark  
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20/22  
TSZ22111 • 15 • 001  
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BD41044FJ-C  
Physical Dimension and Packing Information  
Package Name  
SOP-J8  
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BD41044FJ-C  
Revision History  
Date  
15.Feb.2018  
Revision  
001  
Changes  
New Release  
P1 Typical Application Circuit  
Added explanation of resistor valude, capacitor value, connection about SPLIT.  
P2 Block Diagram  
Deleated “STB” in RXD OUTPUT block.  
P3 Mode of Operation  
Modified to “H or Hi-Z” from “Hi-Z” at RXD in Power off mode.  
Modified to “STB=LOW and VCC>VUVSTB” from “STB=LOW and TXD=HIGH and  
VCC>VUVSTB” at the conditions to change to Normal mode from Standby mode.  
Added explanation of a diode at the RXD pin.  
Added explanation of the operation when it changed to the Normal mode by  
STB=LOW while TXD=LOW.  
P7 Table 8. Electrical Characteristics (STB)  
HIGH Level Input Voltage Modified the max value to “VCC” from “VCC+0.3”.  
LOW Level Input Voltage Modified the min value to “0.0” from “-0.3”.  
P7 Table 9. Electrical Characteristics (TXD)  
HIGH Level Input Voltage Modified the max value to “VCC” from “VCC+0.3”.  
LOW Level Input Voltage Modified the min value to “0.0” from “-0.3”.  
P11 Figure 6  
27.Dec.2018  
002  
Deleted “tTXD_RXD_F” and “tTXD_RXD_R”.  
Modified the RXD threshold value to “50%”.  
P12 Figure 7  
Modified to “0.25 x VCC” from “0.5 x VCC”.  
P12 Figure 8  
Modified format.  
P16 Application Example  
Deleted  
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Notice  
Precaution on using ROHM Products  
(Note 1)  
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment  
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,  
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales  
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any  
ROHM’s Products for Specific Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASSⅢ  
CLASSⅣ  
CLASSⅡb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.  
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the  
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our  
Products under any special or extraordinary environments or conditions (as exemplified below), your independent  
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.  
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble  
cleaning agents for cleaning residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in  
the range that does not exceed the maximum junction temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must  
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,  
please consult with the ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice-PAA-E  
Rev.004  
© 2015 ROHM Co., Ltd. All rights reserved.  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign  
trade act, please consult with ROHM in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data.  
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the  
Products with other articles such as components, circuits, systems or external equipment (including software).  
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM  
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to  
manufacture or sell products containing the Products, subject to the terms and conditions herein.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice-PAA-E  
Rev.004  
© 2015 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.  
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this document is current as of the issuing date and subject to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales  
representative.  
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2015 ROHM Co., Ltd. All rights reserved.  

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