BD37542FS-E2 [ROHM]
Consumer Circuit, BICMOS, PDSO32, SSOP-32;型号: | BD37542FS-E2 |
厂家: | ROHM |
描述: | Consumer Circuit, BICMOS, PDSO32, SSOP-32 信息通信管理 光电二极管 商用集成电路 |
文件: | 总36页 (文件大小:1591K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Sound Processor with Built-in 3-band Equalizer
BD37542FS
General Description
Key Specifications
BD37542FS is a sound processor with built-in 3-band
equalizer for car audio. The functions are stereo input
selector (which can switch single and ground isolation
input), input-gain control, main volume, loudness, 5ch
fader volume, LPF for subwoofer and mixing input.
Moreover, “Advanced switch circuit”, which is an
original ROHM technology, can reduce various
switching noise (ex. No-signal, low frequency like 20Hz
& large signal inputs). Also, “Advanced switch” makes
control of microcomputer easier, and can construct a
high quality car audio system.
Power Supply Voltage Range:
7.0V to 9.5V
38mA(Typ)
Circuit Current (No Signal):
Total Harmonic Distortion 1:
(FRONT,REAR)
0.001%(Typ)
Total Harmonic Distortion 2:
(SUBWOOFER)
0.002%(Typ)
2.3Vrms (Typ)
-100dB (Typ)
Maximum Input Voltage:
Cross-talk Between Selectors:
Volume Control Range:
Output Noise Voltage 1:
(FRONT,REAR)
+15 dB to -79dB
3.8µVrms(Typ)
Output Noise Voltage 2:
(SUBWOOFER)
4.8µVrms(Typ)
1.8µVrms(Typ)
-40°C to +85°C
Features
Residual Output Noise Voltage:
Operating Temperature Range:
Reduced switching noise of input gain control,
mute, main volume, fader volume, bass, middle,
treble, loudness, mixing by using advanced switch
circuit.
Package
W(Typ) x D(Typ) x H(Max)
Built-in differential input selector that can make
various combination of single-ended / differential
input.
Built-in ground isolation amplifier inputs, which is
ideal for external stereo input.
Built-in input gain controller reduces switching
noise for volume of a portable audio input.
Decreased the number of external components
due to built-in 3-band equalizer filter, LPF for
subwoofer. It is possible to control Q, GV, fO of
3-band equalizer, fC of LPF, and GV of loudness by
I2C BUS control.
It is possible to adjust the gain of the bass, middle,
treble up to ±20dB with 1 dB step gain adjustment.
It is equipped with output terminals for Subwoofer.
Moreover, the stereo signal output of the front and
rear can also be chosen by the I2C BUS control.
Built-in mixing input and mixing attenuator.
Energy-saving design resulting in low-current
consumption is achieved by utilizing the Bi-CMOS
process. It has the advantage in quality over
scaling down the power heat control of the internal
regulators.
SSOP-A32
13.60 mm x 7.80mm x 2.01mm
Input terminals and output terminals are organized
and separately laid out to keep the signal flow in
one direction which results in simpler and smaller
PCB layout.
It is possible to control the I2C BUS by 3.3V / 5V.
Applications
It is optimal for car audio systems. It can also be used
for audio equipment of mini Compo, micro Compo, TV,
etc.
○Product structure:Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
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BD37542FS
Typical Application Circuit
BD37542FS
Pin Configuration
TOP VIEW
32
31
FIL
A1
A2
1
2
GND
B1
B2
3
4
30 SDA
29 SCL
28 VCC
C1
C2
5
6
27
26
25
OUTF1
OUTF2
OUTR1
DP1
DN
7
8
9
DP2
24
23
OUTR2
OUTS1
EP1 10
EN1 11
22
OUTS2
21 TEST
EN2 12
EP2 13
20
19
18
17
N.C.
MIN
14
15
MUTE
LDA2
LDB2
LDA1
LDB1
16
Pin Descriptions
Pin No.
Pin Name
Description
A input terminal of 1ch
A input terminal of 2ch
B input terminal of 1ch
Pin No.
17
18
19
20
Pin Name
LDB2
LDA2
MUTE
N.C.
Description
1
2
3
A1
A2
B1
B2
Loudness setting terminal of 2ch
Loudness setting terminal of 2ch
External compulsory mute terminal
No Connection
4
B input terminal of 2ch
5
6
7
8
C1
C2
DP1
DN
DP2
EP1
EN1
EN2
EP2
MIN
LDA1
C input terminal of 1ch
C input terminal of 2ch
21
22
23
24
25
26
27
28
TEST
OUTS2
OUTS1
OUTR2
OUTR1
OUTF2
OUTF1
VCC
Test Pin
Subwoofer output terminal of 2ch
Subwoofer output terminal of 1ch
Rear output terminal of 2ch
Rear output terminal of 1ch
Front output terminal of 2ch
Front output terminal of 1ch
Power supply terminal
I2C Communication clock terminal
I2C Communication data terminal
GND terminal
D positive input terminal of 1ch
D negative input terminal
D positive input terminal of 2ch
E positive input terminal of 1ch
E negative input terminal of 1ch
E negative input terminal of 2ch
E positive input terminal of 2ch
Mixing input terminal
9
10
11
12
13
14
15
29
30
31
SCL
SDA
GND
Loudness setting terminal of 1ch
16
LDB1
Loudness setting terminal of 1ch
32
FIL
VCC/2 terminal
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Block Diagram
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCC
GND
VCC/2
I2C BUS LOGIC
Fader
■
Gain:+15dB to -79dB/1dB step
★no pop noise
■LPF
fc=55/85/120/160Hz
Loudness
■
Gain: 20dB to 0dB/1dB step
★no pop noise
■3 Band P-EQ (Tone control)
Gain: +20dB to -20dB/1dB step
★no pop noise
LPF
・Bass:f0=60/80/100/120Hz
Q=0.5/1.0/1.5/2.0
・Meddle:f0=500/1k/1.5k/2.5kHz
Q=0.75/1/1.25/1.5
★Loudness
・Treble:f0=7.5k/10k/12.5k/15kHz
Q=0.75/1.25
■Volume
Gain: +15dB to -79dB/1dB step
★3 Band P-EQ
(Tone control)
★no pop noise
■Input Gain
Gain: +20dB to -0dB/1dB step
★no pop noise
★Volume/Mute
★Input Gain
Input selector (3 single-end and 2 stereo ISO)
GND GND
ISO amp ISO amp
GND
ISO amp
GND
ISO amp
100k
100k
100k
100k
100k
100k
250k
250k
250k
250k
250k
250k 250k
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
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Absolute Maximum Ratings (Ta=25°C)
Parameter
Power Supply Voltage
Input Voltage
Symbol
VCC
Rating
10.0
Unit
V
VIN
VCC+0.3 to GND-0.3
V
(Note 1)
Power Dissipation
Pd
0.95
W
°C
Storage Temperature
Tstg
-55 to +150
(Note 1) When mounted on the standard board (70 x 70 x 1.6 mm3), derate by 7.6mW/°C for Ta above 25°C.
Thermal resistance θja = 131.6(°C/W)
Material : A FR4 grass epoxy board(3% or less of copper foil area)
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Power Supply Voltage
Temperature
Symbol
Min
7.0
-40
Typ
-
Max
9.5
Unit
V
VCC
Topr
+85
°C
-
Electrical Characteristics
(Unless specified otherwise, Ta=25°C, VCC=8.5V, f=1kHz, VIN=1Vrms, Rg=600Ω, RL=10kΩ, A1 input, Input gain 0dB, Mute
OFF, Volume 0dB, Tone control 0dB, Loudness 0dB, LPF OFF, Mixing OFF, Fader 0dB)
Limit
Parameter
Symbol
Unit
Conditions
No signal
Min
-
Typ
38
0
Max
48
Circuit Current (No Signal)
Voltage Gain
IQ
mA
dB
dB
GV
CB
-1.5
-1.5
+1.5
+1.5
GV=20log(VOUT/VIN)
CB = GV1-GV2
Channel Balance
0
TotalHarmonic Distortion1
(FRONT,REAR)
TotalHarmonic Distortion2
(SUBWOOFER)
Output Noise Voltage 1
(FRONT,REAR) *
Output Noise Voltage 2
(SUBWOOFER) *
VOUT=1Vrms
BW=400Hz-30KHz
VOUT=1Vrms
BW=400Hz-30KHz
Rg = 0Ω
BW = IHF-A
Rg = 0Ω
BW = IHF-A
Fader = -∞dB
Rg = 0Ω
BW = IHF-A
Rg = 0Ω
CTC=20log(VOUT/VIN)
BW = IHF-A
f=1kHz
VRR=100mVrms
RR=20log(VCC IN/VOUT
THD+N1
THD+N2
VNO1
0.001
0.002
3.8
0.05
0.05
15
%
-
-
-
-
%
μVrms
μVrms
VNO2
4.8
15
Residual Output Noise Voltage *
Crosstalk Between Channels *
Ripple Rejection
VNOR
CTC
RR
1.8
-100
-70
10
-90
-40
μVrms
dB
-
-
-
dB
)
Input Impedance(A, B,C)
Input Impedance(D, E)
RIN_S
RIN_D
70
100
250
130
325
kΩ
kΩ
175
VIM at THD+N(VOUT)=1%
BW=400Hz-30KHz
Rg = 0Ω
CTS=20log(VOUT/VIN)
BW = IHF-A
Maximum Input Voltage
VIM
2.1
2.3
Vrms
dB
-
Crosstalk Between Selectors *
CTS
-100
-90
-
XP1 and XN input
XP2 and XN input
CMRR=20log(VIN/VOUT
Common Mode Rejection Ratio *
CMRR
50
65
-
dB
)
BW = IHF-A,[*X…D,E]
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Electrical Characteristics - continued
Parameter
Limit
Typ
Symbol
GIN_MIN
Unit
dB
Conditions
Input gain 0dB
Min
-2
Max
+2
Minimum Input Gain
0
VIN=100mVrms
GIN=20log(VOUT/VIN)
Input gain 20dB
VIN=100mVrms
Maximum Input Gain
Gain Set Error
GIN_MAX
GIN_ERR
GMUTE
18
-2
20
0
22
+2
dB
dB
dB
GIN=20log(VOUT/VIN)
GAIN=+1dB to +20dB
Mute ON
GMUTE=20log(VOUT/VIN)
BW = IHF-A
Mute Attenuation *
-
-105
-85
Volume = 15dB
VIN=100mVrms
GV=20log(VOUT/VIN)
Volume = -∞dB
GV=20log(VOUT/VIN)
BW = IHF-A
Maximum Gain
GV MAX
13
15
17
dB
Maximum Attenuation *
GV_MIN
-100
0
-85
+2
dB
dB
-
GAIN & ATT=+15dB to
-15dB
GV_ERR1
-2
Attenuation Set Error 1
GV_ERR2
GV_ERR3
-3
-4
0
0
+3
+4
dB
dB
ATT=-16dB to -47dB
ATT=-48DB to -79DB
Attenuation Set Error 2
Attenuation Set Error 3
Gain=+20dB f=100Hz
VIN=100mVrms
Maximum Boost Gain
18
20
22
dB
GB_BST
GB=20log (VOUT/VIN)
Gain=-20dB f=100Hz
VIN=2Vrms
GB=20log (VOUT/VIN)
Gain=-20dB to +20dB
f=100Hz
Maximum Cut Gain
Gain Set Error
-22
-2
-20
0
-18
+2
22
dB
dB
dB
GB_CUT
GB_ERR
GM_BST
Gain=+20dB f=1kHz
VIN=100mVrms
Maximum Boost Gain
18
20
GM=20log (VOUT/VIN)
Gain=-20dB f=1kHz
VIN=2Vrms
GM=20log (VOUT/VIN)
Gain=-20dB to +20dB
f=1kHz
Maximum Cut Gain
Gain Set Error
-22
-2
-20
0
-18
+2
22
dB
dB
dB
GM_CUT
GM_ERR
GT_BST
Gain=+20dB f=10kHz
VIN=100mVrms
Maximum Boost Gain
18
20
GT=20log (VOUT/VIN)
Gain=-20dB f=10kHz
VIN=2Vrms
Maximum Cut Gain
GT_CUT
-22
-20
-18
dB
GT=20log (VOUT/VIN)
Gain=-20dB to +20dB
f=10kHz
Gain Set Error
GT_ERR
RIN_M
-2
0
+2
35
dB
19
27
kΩ
Input Impedance
VIM at THD+N(VOUT)=1%
BW=400Hz-30KHz
MIX=OFF
VIM_M
2.0
2.2
-
Vrms
Maximum Input Voltage
Maximum Attenuation
Maximum Gain
GMX_MIN
GMX_MAX
-
-100
7
-85
9
dB
dB
GMX=20log(VOUT/VIN)
BW=INF-A
ATT=+6dB
5
GMX=20log(VOUT/VIN)
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Electrical Characteristics - continued
Parameter
Limit
Typ
Symbol
GF_BST
GF_MIN
Unit
dB
Conditions
Fader=15dB
VIN=100mVrms
GF=20log(VOUT/VIN)
Fader = -∞dB
Min
13
Max
17
Maximum Boost Gain
Maximum Attenuation *
15
-100
-90
dB
-
GF=20log(VOUT/VIN)
BW = IHF-A
Gain Set Error
GF_ERR
GF_ERR1
GF_ERR2
GF_ERR3
ROUT
-2
-2
-3
-4
-
0
0
+2
+2
+3
+4
50
dB
dB
dB
dB
Ω
Gain=+1dB to +15dB
ATT=-1dB to -15dB
ATT=-16dB to -47dB
ATT=-48dB to -79dB
VIN =100mVrms
Attenuation Set Error 1
Attenuation Set Error 2
Attenuation Set Error 3
Output Impedance
0
0
-
THD+N=1%
BW=400Hz-30KHz
Maximum Output Voltage
Maximum Gain
VOM
2
2.2
20
0
Vrms
dB
-
23
+2
Gain 20dB
VIN=100mVrms
GL=20log(VOUT/VIN)
GL_MAX
17
Gain Set Error
GL_ERR
-2
dB
Gain=+1dB to +20dB
VP-9690A(Average value detection, effective value display) filter by Matsushita Communication is used for * measurement.
Phase between input / output is same.
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Typical Performance Curves
10
1
10
50
40
30
20
10
0
10kHz
1kHz
1
100Hz
0.1
0.1
0.01
0.001
0.01
0.001
0.001 0.01
0.1
1
10
0
2
4
6
8
10
Output Voltage : VOUT [Vrms]
CC [V]
Power SupplyVoltage : V
Figure 1. Circuit Current (No Signal) vs Power Supply
Voltage
Figure 2. Total Harmonic Distortion vs Output Voltage
5
4
3
25
BASS GAIN : -20dB to +20dB
/1dB step
fO : 60Hz Q : 0.5
20
15
2
Gain=0dB
10
5
1
0
0
-1
-2
-3
-4
-5
-5
-10
-15
-20
-25
10
100
1k
10k
100k
10
100
1k
10k
100k
Frequency (Hz)
Frequency [Hz]
Figure 3. Gain vs Frequency
Figure 4. Bass Gain vs Frequency
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Typical Performance Curves – continued
25
20
15
10
5
25
Q : 0.5/1/1.5/2
BASS GAIN : ±20dB
fo : 60Hz
fO : 60/80/100/120Hz
BASS GAIN : ±20dB
Q : 0.5
20
15
10
5
0
0
-5
-5
-10
-15
-20
-25
-10
-15
-20
-25
10
100
1k
10k
100k
10
100
1k
10k
100k
Frequency [Hz]
Frequency [Hz]
Figure 5. Bass fO vs Frequency
Figure 6. Bass Q vs Frequency
25
20
15
10
5
25
fO : 500/1k/1.5k/2.5kHz
MIDDLE GAIN :
-20dB to +20dB /1dB step
20
15
10
5
0
0
-5
-5
-10
-15
-20
-25
-10
-15
-20
-25
fO: 500Hz
Q : 0.75
MIDDLE GAIN:
±20dB
Q : 0.75
10
100
1k
10k
100k
10
100
1k
10k
100k
Frequency [Hz]
Frequency [Hz]
Figure 7. Middle Gain vs Frequency
Figure 8. Middle fo vs Frequency
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BD37542FS
Typical Performance Curves – continued
25
20
15
10
5
25
TREBLE GAIN :
-20dB to +20dB /1dB step
fO : 7.5kHz Q : 0.75
Q : 0.75/1/1.25/1.5
20
15
10
5
0
0
-5
-5
-10
-15
-20
-25
-10
-15
MIDDLE GAIN :
±20dB
fO : 500Hz
-20
-25
10
100
1k
10k
100k
10
100
1k
10k
100k
Frequency [Hz]
Figure 10. Treble Gain vs Frequency
Frequency [Hz]
Figure 9. Middle Q vs Frequency
25
20
15
10
5
25
Q : 0.75/1.25
TREBLE GAIN : ±20dB
f
O : 7.5k/10k/12.5k/15kHz
20
15
10
5
TREBLE GAIN : ±20dB
Q : 0.75
f
O : 7.5kHz
0
0
-5
-5
-10
-10
-15
-20
-25
-15
-20
-25
10
100
1k
10k
100k
10
100
1k
10k
100k
Frequency (Hz)
Frequency [Hz]
Figure 12. Treble Q vs Frequency
Figure 11. Treble fo vs Frequency
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Typical Performance Curves – continued
1000
100
10
1000
DIN-Audio
IHF-A
Din-Audio
IHF-A
100
10
1
1
-80 -70 -60 -50 -40 -30 -20 -10
0
10 20
-20 -15 -10 -5
0
5
10 15 20
Volume Gain [dB]
Bass Gain[dB]
Figure 13. Output Noise vs Volume Gain
Figure 14. Output Noise vs Bass Gain
1000
1000
DIN-Audio
IHF-A
DIN-Audio
IHF-A
100
10
1
100
10
1
-20 -15 -10 -5
0
5
10 15 20
-20 -15 -10 -5 0 5 10 15 20
MiddleGain[dB]
Treble Gain [dB]
Figure 15. Output Noise vs Middle Gain
Figure 16. Output Noise vs Treble Gain
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Typical Performance Curves – continued
0
-10
-20
-30
-40
-50
-60
-70
2.5
2.0
1.5
1.0
0.5
0.0
10
100
1k
10k
100k
100
1000
10000
100000
Frequency [Hz]
RLOAD [ohm]
Figure 18. Output Voltage vs RLOAD
Figure 17. CMRR vs Frequency
Figure 20. Advanced Switch 2
Figure 19. Advanced Switch 1
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BD37542FS
Timing Chart
CONTROL SIGNAL SPECIFICATION
(1) Electrical Specifications and Timing for Bus Lines and I/O Stages
SDA
tBUF
tHD;STAT
tF
tSP
tR
tLOW
SCL
tSU;STOT
Sr
tSU;STAT
tHD;STA
tSU;DAT
tHD;DAT
tHIGH
S
P
P
Figure 21. I2C-bus Signal Timing Diagram
Table 1 Characteristics of the SDA and SCL bus lines for I2C-bus devices (Ta=25°C, VCC=8.5V)
Fast-modeI2C-bus
Parameter
Symbol
Unit
Min
0
1.3
Max
400
-
kHz
1
2
SCL clock frequency
fSCL
tBUF
Bus free time between a STOP and START condition
Hold time (repeated) START condition. After this period, the first clock
pulse is generated
μS
3
tHD;STA
0.6
-
μS
4
5
6
7
8
9
LOW period of the SCL clock
HIGH period of the SCL clock
Set-up time for a repeated START condition
Data hold time:
Data set-up time
tLOW
tHIGH
tSU;STA
tHD;DAT
tSU;DAT
tSU;STO
1.3
0.6
0.6
-
-
-
-
-
-
μS
μS
μS
μS
ns
0.06 (Note)
120
0.6
Set-up time for STOP condition
μS
All values refer to VIH Min and VIL Max Levels (see Table 2).
(Note) A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIH Min of the SCL signal) in order to bridge the
undefined region of the falling edge of SCL.
For 7(tHD;DAT), 8(tSU;DAT), make the setup in which the margin is full.
Table 2 Characteristics of the SDA and SCL I/O stages for I2C-bus devices
Fast-modedevices
Parameter
Symbol
Unit
Min
-0.3
2.3
0
Max
+1
5
50
0.4
+10
10
11
12
13
LOW level input voltage:
HIGH level input voltage:
Pulse width of spikes which must be suppressed by the input filter.
LOW level output voltage: at 3mA sink current
VIL
VIH
tSP
VOL1
II
V
V
ns
V
0
14 Input current each I/O pin with an input voltage between 0.4V and 4.5V.
-10
μA
t
t
t
t
HD;STA
HD;DAT
SU;DAT
SU;STO
:
2
µ
s
:
1
µ
s
:
1
µ
s
:2µs
SCL
tBUF
tLOW
:3µs
tHIGH
:1µs
:4
µ
s
SDA
SCL clock frequency : 250kHz
Figure 22. A Command Timing Example in the I2C Data Transmission
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TSZ22111・15・001
BD37542FS
(2) I2C BUS FORMAT
MSB
Slave Address
8bit
LSB
MSB
Select Address
8bit
LSB
MSB
LSB
S
1bit
A
1bit
A
1bit
Data
8bit
A
P
1bit 1bit
S
= Start condition (Recognition of start bit)
Slave Address = Recognition of slave address. The first 7 bits correspond to the slave address.
The least significant bit is “L” which corresponds to write mode.
A
= ACKNOWLEDGE bit (Recognition of acknowledgement)
Select Address = Select address corresponding to volume, bass or treble.
Data
P
= Data on every volume and tone.
= Stop condition (Recognition of stop bit)
(3) I2C BUS Interface Protocol
(a) Basic Format
S
Slave Address
MSB LSB
A
Select Address
MSB LSB
A
Data
MSB
A
LSB
P
(b) Automatic Increment (Select Address increases (+1) according to the number of data.)
S
Slave Address
MSB LSB
A
Select Address
MSB LSB
A
Data1
MSB LSB
A
Data2
MSB
A
DataN
MSB
A
P
・・・・
LSB
LSB
(Example) ①Data1 shall be set as data of address specified by Select Address.
②Data2 shall be set as data of address specified by Select Address +1.
③DataN shall be set as data of address specified by Select Address +N-1.
(c) Configuration Unavailable for Transmission (In this case, only Select Address1 is set.)
Slave Address Select Address1 Data Select Address 2 Data
MSB LSB MSB LSB MSB LSB MSB LSB MSB LSB
S
A
A
A
A
A
P
(Note)If any data is transmitted as Select Address 2 next to data, it is recognized
as data, not as Select Address 2.
(4) Slave Address
MSB
A6
1
LSB
R/W
0
A5
0
A4
0
A3
0
A2
0
A1
0
A0
0
80H
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BD37542FS
(5) Select Address & Data
Select
Address
(hex)
Items
D7
D6
0
D5
D4
D3
0
D2
1
D1
D0
Advanced switch time
of Input Gain/Volume
Tone/Fader/Loudness
Mixing
Advanced
switch
ON/OFF
Advanced switch
time of Mute
Initial setup 1
01
LPF
Phase
0
Full-diff
Type
Subwoofer Output
Select
Initial setup 2
Initial setup 3
Input Selector
02
03
05
0
0
0
0
0
Subwoofer LPF fC
0
0
0
0
1
0
Input selector
Input Gain
Mute
ON/OFF
Input gain
06
0
0
Volume gain
Fader 1ch Front
Fader 2ch Front
Fader 1ch Rear
Fader 2ch Rear
Fader Subwoofer
Mixing
Bass setup
Middle setup
Treble setup
20
28
29
2A
2B
2C
30
41
44
47
Volume Gain / Attenuation
Fader Gain / Attenuation
Fader Gain / Attenuation
Fader Gain / Attenuation
Fader Gain / Attenuation
Fader Gain / Attenuation
Mixing Gain / Attenuation
0
0
0
0
0
0
Bass fO
0
0
0
0
0
0
Bass Q
Middle Q
Middle fO
Treble fO
0
Treble Q
Bass
Boost/
Cut
Middle
Boost/
Cut
Treble
Boost/
Cut
Bass gain
Middle gain
Treble gain
51
54
57
0
0
0
0
0
0
Bass Gain
Middle Gain
Treble Gain
Loudness Gain
System Reset
75
FE
0
1
Loudness Hicut
Loudness Gain
0
0
0
0
0
0
1
: Advanced switch
Note
1. The Advance Switch works in the latch part while changing from one function to another.
2. Upon continuous data transfer, the Select Address rolls over because of the automatic increment function, as
shown below.
→01→02→03→05→06→20→28→29→2A→2B→2C
→30→41→44→47→51→54→57→75
3. Advanced switch is not used for the function of input selector, subwoofer output select, etc. Therefore, please apply
mute on the side when changing these settings.
4. When using mute function of this IC at the time of changing input selector, please switch mute ON/OFF while
waiting for advanced-mute time.
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BD37542FS
Select address 01 (hex)
Time
D7
D6
0
D5
D4
D3
0
D2
1
D1
0
0
1
1
D0
0
1
0
1
0.6msec
1.0msec
1.4msec
3.2msec
Advanced switch time
of Input gain/Volume
Tone/Fader/Loudness
Mixing
Advanced
Switch
ON/OFF
MSB
gain/Volume/Tone/Fader/
Loudness/Mixing
LSB
Time
D7
D6
0
D5
0
0
1
1
D4
0
1
0
1
D3
D2
D1
D0
4.7 msec
7.1 msec
11.2 msec
14.4 msec
Advanced
Switch
ON/OFF
Advanced switch
Time of Mute
0
1
Mode
OFF
ON
D7
0
D6
0
D5
D4
D3
0
D2
1
D1
D0
Advanced switch time
of Input gain/Volume
Tone/Fader/Loudness
Mixing
Advanced switch
Time of Mute
1
Select address 02(hex)
fc
D6
0
D7
D5
D4
D3
D2
D1
0
0
1
1
0
D0
OFF
55Hz
85Hz
0
0
0
0
1
0
1
0
1
0
LPF
Phase
Subwoofer Output
Select
0
120Hz
160Hz
Prohibition
Other setting
Mode
D7
D6
0
D5
0
0
1
1
D4
0
1
0
1
D3
0
D2
D2
D1
D0
LPF
Front
Rear
LPF
Phase
Subwoofer LPF fc
Prohibition
Phase
D7
0
D6
0
D5
D4
D3
0
D1
D0
0°
Subwoofer output
select
Subwoofer LPF fc
180°
1
: Initial condition
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BD37542FS
Select address 05(hex)
MSB
Input Selector
LSB
D0
0
Mode
OUTF1 OUTF2
D7
D6
D5
D4
0
D3
0
D2
D1
0
0
A
B
A1
B1
A2
B2
0
0
0
0
1
C
C1
C2
0
0
0
1
0
D single
E1 single
E2 single
A diff
DP1
EP1
EN2
A1
DP2
EN1
EP2
B1
0
0
0
1
1
0
0
0
1
1
1
1
0
0
0
1
0
1
1
1
0
0
1
1
0
Full-
diff bias
type
0
0
select
C diff
B2
C2
D diff
E full diff
DP1
EP1
DP2
EP2
0
0
0
0
1
1
1
0
0
1
0
0
0
0
1
Input SHORT
Prohibition
Other setting
Input SHORT : The input impedance of each input terminal is lowered from 100kΩ(Typ) to 6 kΩ(Typ).
(For quick charge of coupling capacitor)
Mode
D7
0
1
D6
0
D5
0
D4
D3
D2
D1
D0
Negative Input
Bias
Input Selector
: Initial condition
EP1
10
1ch
1ch signal input
1ch
Differential
Negative input type
EN1
11
For Ground –isolation type.
EN2
12
2ch
EP2
13
Differential
2ch
2ch signal input
Bias type
EP1
10
1ch
1ch signal input
1ch
Differential
For differential amplifier type
EN1
11
EN2
12
2ch
2ch signal input
2ch
Differential
EP2
13
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TSZ22111・15・001
BD37542FS
Select address 06 (hex)
MSB
Input Gain
D4
LSB
D0
0
Mode
D7
D6
D5
D3
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
1
D2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
0
D1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0dB
1dB
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
2dB
0
3dB
1
4dB
0
5dB
1
6dB
0
7dB
1
8dB
0
9dB
1
10dB
11dB
12dB
13dB
14dB
15dB
16dB
17dB
18dB
19dB
20dB
0
1
Mute
ON/OFF
0
0
0
1
0
1
0
1
0
1
0
1
Prohibition
:
1
:
1
:
1
:
1
:
1
Mode
D7
0
1
D6
0
D5
0
D4
D3
D2
D1
D0
OFF
ON
Input Gain
Select address 20, 28, 29, 2A, 2B, 2C (hex)
Gain & ATT
D7
0
D6
0
D5
0
D4
0
D3
0
D2
0
D1
0
D0
0
0
0
0
0
0
0
0
1
Prohibition
:
:
:
:
:
:
:
:
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
1
15dB
14dB
13dB
:
:
:
:
:
:
:
:
:
-77dB
-78dB
-79dB
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
1
1
1
1
0
1
1
1
0
0
1
1
0
1
0
1
0
Prohibition
:
:
:
:
:
:
:
:
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
-∞dB
: Initial condition
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TSZ22111・15・001
BD37542FS
Select address 30(hex)
Gain & ATT
Prohibition
D7
0
0
D6
0
0
D5
0
0
D4
0
0
D3
0
0
D2
0
0
D1
0
0
D0
0
1
:
:
:
:
:
:
:
:
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
1
1
0
1
0
1
7dB
6dB
5dB
:
:
:
:
:
:
:
:
:
-77dB
-78dB
-79dB
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
1
1
1
1
0
1
1
1
0
0
1
1
0
1
0
1
0
Prohibition
MIX OFF
:
1
1
:
1
1
:
1
1
:
1
1
:
1
1
:
1
1
:
1
1
:
0
1
Select address 41(hex)
Q factor
D7
0
D6
0
D5
D4
D3
0
D2
0
D1
0
0
1
1
D0
0
1
0
1
0.5
1.0
1.5
2.0
Bass fO
O
fO
D7
0
D6
0
D5
0
0
1
1
D4
0
1
0
1
D3
D2
0
D1
D0
60Hz
80Hz
100Hz
120Hz
Bass
Q factor
0
Select address 44(hex)
Q factor
D7
0
D6
0
D5
D4
D3
0
D2
0
D1
0
0
1
1
D0
0
1
0
1
0.75
1.0
1.25
1.5
Middle fO
O
fO
D7
0
D6
0
D5
0
0
1
1
D4
0
1
0
1
D3
0
D2
0
D1
D0
500Hz
1kHz
1.5kHz
2.5kHz
Middle
Q factor
: Initial condition
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BD37542FS
Select address 47 (hex)
Q factor
D7
0
D6
0
D5
D4
D3
0
D2
0
D1
0
D0
0
1
0.75
1.25
Treble fO
O
fO
D7
0
D6
0
D5
0
0
1
1
D4
0
1
0
1
D3
0
D2
0
D1
0
D0
7.5kHz
10kHz
12.5kHz
15kHz
Treble
Q factor
Select address 51, 54, 57 (hex)
MSB
D7
Bass/Middle/Treble Gain
LSB
D0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
:
0
1
Gain
D6
D5
D4
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
:
1
1
D3
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
:
1
1
D2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
:
1
1
D1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
:
1
1
0dB
1dB
2dB
3dB
4dB
5dB
6dB
7dB
8dB
9dB
10dB
11dB
12dB
13dB
14dB
15dB
16dB
17dB
18dB
19dB
20dB
Bass/
Middle/
Treble
Boost
/cut
0
0
Prohibition
Mode
D7
0
1
D6
0
D5
0
D4
D3
D2
D1
D0
Boost
Cut
Bass/Middle/Treble Gain
:Initial condition
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TSZ22111・15・001
BD37542FS
Select address 75 (hex)
Mode
D7
0
D6
0
0
1
1
D5
0
1
0
1
D4
D3
D2
D1
D0
Hicut1
Hicut2
Hicut3
Hicut4
Loudness Gain
Gain
D7
D6
D5
D4
0
0
D3
0
0
D2
0
0
D1
0
0
D0
0
1
0dB
1dB
2dB
0
0
0
1
0
3dB
0
0
0
1
1
4dB
5dB
6dB
7dB
8dB
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
:
1
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
:
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
:
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
:
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
:
1
9dB
10dB
11dB
12dB
13dB
14dB
15dB
16dB
17dB
18dB
19dB
20dB
0
Loudness Hicut
Prohibition
: Initial condition
(6) About Power ON Reset
Built-in IC initialization is made during power ON of the supply voltage. Please send initial data to all addresses at
supply voltage on. And please turn on mute until this initial data is sent.
Limit
Parameter
Symbol
tRISE
Unit
Conditions
Min
33
Typ
Max
Rise Time of VCC
µsec VCC rise time from 0V to 5V
V
-
-
VCC Voltage of
Release Power ON
Reset
VPOR
4.1
-
-
(7) About External Compulsory Mute Terminal
It is possible to force mute externally by setting an input voltage to the MUTE terminal.
Mute Voltage Condition
Mode
GND to 1.0V
2.3V to VCC
MUTE ON
MUTE OFF
Establish the voltage of MUTE in the condition you want to set.
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BD37542FS
Application Information
1. Function and Specifications
Function
Specifications
・Stereo input
・Single-End/Diff/Full-Diff
(Possible to set the number of single-end/diff/full-diff as follows )
Single-End
Differential
Full-Differential
Mode 1
Mode 2
Mode 3
Mode 4
Mode 5
Mode 6
0
1
3
4
5
6
3
2
1
0
1
0
1
1
1
1
0
0
Input
selector
Table.1 Combination of input selector
・+20dB to 0dB (1dB step)
Input gain
Mute
・Possible to use “Advanced switch” for prevention of switching noise.
・Possible to use “Advanced switch” for prevention of switching noise.
・+15dB to -79dB (1dB step), -∞dB
Volume
・Possible to use “Advanced switch” for prevention of switching noise.
・+20dB to -20dB (1dB step)
・Q=0.5, 1, 1.5, 2
Bass
・fO=60, 80, 100, 120Hz
・Possible to use “Advanced switch” for prevention of switching noise.
・+20dB to -20dB (1dB step)
・Q=0.75, 1, 1.25, 1.5
Middle
Treble
・fO =500, 1k, 1.5k 2.5kHz
・Possible to use “Advanced switch” for prevention of switching noise.
・+20dB to -20dB (1dB step)
・Q=0.75, 1.25
・fO =7.5k, 10k, 12.5k, 15kHz
・Possible to use “Advanced switch” for prevention of switching noise.
・+15dB to -79dB(1dB step), -∞dB
Fader
・Possible to use “Advanced switch” for prevention of switching noise.
・20dB to 0dB(1dB step)
Loudness
LPF
・Possible to use “Advanced switch” for prevention of switching noise.
・fC=55/85/120Hz/160Hz, pass
・Phase shift (0°/180°)
・Monaural input
Mixing
・+7dB to -79dB (1dB step), -∞dB
・Possible to use “Advanced switch” for prevention of switching noise.
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BD37542FS
2. Volume / Fader Volume / Mixing Attenuation Data
(dB)
(dB)
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0
+15
+14
+13
+12
+11
+10
+9
+8
+7
+6
+5
+4
+3
+2
+1
0
-1
-2
-3
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
-33
-34
-35
-36
-37
-38
-39
-40
-41
-42
-43
-44
-45
-46
-47
-48
-49
-50
-51
-52
-53
-54
-55
-56
-57
-58
-59
-60
-61
-62
-63
-64
-65
-66
-67
-68
-69
-70
-71
-72
-73
-74
-75
-76
-77
-78
-79
-∞
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
-4
-5
-6
-7
-8
-9
-10
-11
-12
-13
-14
-15
-16
-17
-18
-19
-20
-21
-22
-23
-24
-25
-26
-27
-28
-29
-30
-31
-32
Mixing Adjustable range is +7dB to -∞dB.
:Initial condition
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3. Application Circuit
MUTE
FIL
32
GND
SDA
30
SCL
29
VCC
OUTF1 OUTF2 OUTR1 OUTR2 OUTS1 OUTS2
0.1μ
10μ
10μ
10μ
10μ
10μ
10μ
10μ
10μ
TEST
21
31
28
27
26
25
24
23
22
20
19
18
17
VCC
GND
VCC/2
I2C BUS LOGIC
■
Fader
Gain:+15dB to -79dB/1dB step
★no pop noise
■LPF
fc=55/85/120/160Hz
Loudness
■
Gain: 20dB to 0dB/1dB step
★no pop noise
■3 Band P-EQ (Tone control)
Gain: +20dB to -20dB/1dB step
LPF
★no pop noise
・Bass:f0=60/80/100/120Hz
Q=0.5/1.0/1.5/2.0
・Meddle:f0=500/1k/1.5k/2.5kHz
Q=0.75/1/1.25/1.5
・Treble:f0=7.5k/10k/12.5k/15kHz
★Loudness
Q=0.75/1.25
■Volume
Gain: +15dB to -79dB/1dB step
★3 Band P-EQ
(Tone control)
★no pop noise
■Input Gain
Gain: +20dB to -0dB/1dB step
★no pop noise
★Volume/Mute
★Input Gain
Input selector (3 single-end and 2 stereo ISO)
GND GND
ISO amp ISO amp
GND
ISO amp
GND
ISO amp
100k
100k
100k
100k
100k
100k
250k
250k
250k
250k
250k
250k
250k
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
2.2μ
2.2μ
10μ
2.2μ
2.2μ
2.2μ
2.2μ
2.2μ
2.2μ
2.2μ
10μ
2.2μ
2.2μ
2.2μ
MIN
Single2
Single3
Single1
GND Isolation1 or
Single4
Full Differential or
Single5, Single6
GND Isolation2
GND Isolation3
(Note) About single input 1 to 3, it is possible to change from
(Note) About GND Isolation1 and Full Differential, it is possible to change from
single input to GND Isolation input 2,3.
differential input to single input 4 to 6.
Unit
R : [Ω]
C : [F]
Figure 23. BD37543FS
Notes on wiring
①Please connect the decoupling capacitor of the power supply in the shortest possible distance to GND.
②GND lines shall be one-point connected.
③Wiring pattern of Digital shall be away from that of analog unit and crosstalk shall not be acceptable.
④If possible, SDA and SCL lines of I2C BUS shall not be parallel.
The lines shall be shielded, if they are adjacent to each other.
⑤If possible, analog input lines should not be parallel. The lines should be shielded, if they are adjacent to each other.
⑥About TEST pin (Pin 21), please leave it OPEN.
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Power Dissipation
About the thermal design of the IC
Characteristics of an IC have a great deal to do with the temperature at which it is used, and exceeding absolute maximum
ratings may degrade and destroy elements. Careful consideration must be given to the heat of the IC from the two
standpoints of immediate damage and long-term reliability of operation.
Reference data
SSOP-A32
1.5
1.0
0.5
0.0
measurement Condition : ROHM Standard board
board Size : 70 x 70 x 1.6 (mm3)
material : A FR4 grass epoxy board
(3% or less of copper foil area)
0.95W
θja = 131.6°C/W
85
0
25
50
75
100
125
150
Ambient Temperature : Ta (°C)
Figure 24. Temperature Derating Curve
(Note) Values are actual measurements and are not guaranteed.
Power dissipation values vary according to the board on which the IC is mounted.
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I/O Equivalent Circuits
Terminal Terminal
Terminal
Voltage
Equivalent Circuit
Terminal Description
A terminal for signal input.
No.
Name
VCC
The input impedance is 100kΩ(typ).
1
2
3
4
5
6
A1
A2
B1
B2
C1
C2
4.25
4.25
4.25
4.25
100kΩ
GND
VCC
Input terminal available to
Single/Differential mode.
The input impedance is 250kΩ(Typ).
7
8
DP1
DN
9
DP2
EP1
EN1
EN2
EP2
10
11
12
13
kΩ
250
GND
VCC
The loudness characteristic setting
terminal.
15
18
LDA1
LDA2
1.65V
GND
VCC
The loudness characteristic setting
terminal.
16
17
LDB1
LDB2
GND
A
terminal for external compulsory
VCC
mute. If terminal voltage is High level, the
mute is OFF. And if the terminal voltage is
Low level, the mute is on.
0.58×VCC
250kΩ
-
19
MUTE
1.65V
GND
Values in the pin explanation and input/output equivalent circuit are reference values only and are not guaranteed.
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I/O Equivalent Circuits – continued
Terminal Terminal
Terminal
Voltage
Equivalent Circuit
Terminal Description
No.
Name
VCC
A terminal for fader and Subwoofer output.
22
23
24
25
26
27
OUTS2
OUTS1
OUTR2
OUTR1
OUTF2
OUTF1
4.25
8.5
-
GND
Power supply terminal.
28
VCC
A terminal for clock input of I2C BUS
communication.
VCC
29
SCL
1.65V
GND
VCC
A terminal for data input of I2C BUS
communication.
-
30
31
32
SDA
GND
FIL
1.65V
GND
VCC
Ground terminal.
0
1/2 VCC terminal.
Voltage for reference bias of analog signal
system. The simple precharge circuit and
simple discharge circuit for an external
capacitor are built in.
50k
50k
4.25
GND
VCC
A terminal for signal input.
The input impedance is 27kΩ (Typ).
14
21
MIN
4.25
27KΩ
GND
TEST
-
TEST terminal
Values in the pin explanation and input/output equivalent circuit are reference values only and are not guaranteed
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
7.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
9.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 25. Example of monolithic IC structure
13. About Signal Input
(a) About Input Coupling Capacitor Constant Value
The constant value of input coupling capacitor C(F) is decided with respect to the input impedance RIN(Ω) at
the input signal terminal of the IC. The first HPF characteristic of RC is composed.
G〔dB〕
C〔F〕
0
RIN
〔Ω〕
A(f)
SSH
f〔Hz〕
INPUT
2
2 fCRIN
A
f
2
1 2 fCRIN
(b) About the Input Selector SHORT
SHORT mode is the command which makes switch SSH =ON of input selector part so that the input impedance
RIN of all terminals becomes small. Switch SSH is OFF when SHORT command is not selected.
The constant time brought about by the small resistance inside and the capacitor outside the LSI becomes
small when this command is used. The charge time of the capacitor becomes short. Since SHORT mode turns
ON the switch of SSH and makes it low impedance, please use it at no signal condition.
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Operational Notes – continued
14. About Mute Terminal (Pin 19) when Power Supply is OFF
There should be no applied voltage across the Mute terminal (Pin 19) when power-supply is OFF.
If in case voltage is supplied to mute terminal, please insert a series resistor (about 2.2kΩ) to Mute terminal.
(Please refer to Application Circuit Diagram.)
15. About TEST Pin
TEST Pin should be left as OPEN.
Pin 21 is TEST Pin.
16. About MIX
(1) About Specification of Fader -∞ at MIX ON.
Mix_signal is added to Main_signal after Fader_Gain(+15dB to -79dB) like the figure. When Fader is set at -∞,
the signal after a MIX signal is added is done with MUTE because the -∞ circuit of Fader is in the step after
the addition circuit.
+15dB to -79dB
+7dB to -79dB
Figure 26. About Front Fader and MIX
(2) About Advanced Switching of MIX_Gain/ATT
When advanced switching of MIX_Gain/ATT works, MIX goes a switching movement that it passes through the
state of MIX_OFF like in B figure below (from current settingof MIX_Gain/ATT to MIX_OFF to a target setting of
MIX_Gain/ATT).
A
B
Fader_Gain/ATT 0dB to -6dB
advanced switching
MIX_Gain/ATT 0dB to -6dB
advanced switching
Figure 27. Advanced Switching Movement when MIX_Gain/ATT is Changed
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BD37542FS
Operational Notes – continued
17. About the External Parts Setting of Loudness Circuit
This IC is equipped with a Loudness circuit.
The Loudness gain is fixed inside the IC but its frequency characteristic can be changed freely by adjusting the
external part filter. The circuit composition of the Loudness part is shown below. Incidentally, when not using the
Loudness circuit, please short the pins between LDA1(Pin 15) and LDB1(Pin 16), and between LDA2(Pin 18) and
LDB2(Pin 17), so as to avoid the inner amplifier inputs to become floating.
Loudness
LDA1
LDB1
LDB2
LDA2
15
16
17
18
56kR
56kR
1
1
1000p
1000p
R2
R2
C1
C1
4.7k
4.7k
R3
R3
4.7k 4.7k
0.047μ
0.047μ
C2
C2
Figure 28. About the External Parts Setting of Loudness Circuit
The Loudness frequency characteristics are decided according to Figure 28. G_LOUD can be made 20dB when
external parts used are the same with Figure 28 (the recommended value). G_LOUD is the amount of effect of
Loudness when Loudness Gain is set at 20dB (P.20).
When Loudness frequency characteristics are changed, each parameter (Gain, Frequency) shown in Figure 28 can
be decided using the following approximate equation below.
(Note) Design fc2 value more than one digit bigger than fc1 to get effect on Loudness.
Loudness cut-off frequency
1
fc1
Hz
2πC2
R1 R3
1
fc2
Hz
2πC1
R2 R3
Loudness Gain (The amount of effect of Loudness)
R3
G_LOUD 20log
G_HICUT 20log
dB
R R3
1
R3
dB
R // R2 R3
1
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BD37542FS
Ordering Information
B D
3
7
5
4
2
F
S
-
E 2
Part Number
Package
Packaging and forming specification
E2: Embossed tape and reel
FS: SSOP-A32
Marking Diagram
SSOP-A32 (TOP VIEW)
Part Number Marking
LOT Number
BD37542FS
1PIN MARK
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BD37542FS
Physical Dimension, Tape and Reel Information
Package Name
SSOP-A32
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TSZ22111・15・001
BD37542FS
Revision History
Date
Revision
001
Changes
16.Dec.2015
New Release
www.rohm.com
TSZ02201-0C2C0E100570-1-2
16.Dec.2015 Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
Daattaasshheeeett
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.002
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.002
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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