UCC3912PWP [ROCHESTER]
1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO24, GREEN, PLASTIC, TSSOP-24;
| 型号： | UCC3912PWP |
| 厂家： | 
Rochester Electronics |
| 描述： | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO24, GREEN, PLASTIC, TSSOP-24 信息通信管理 光电二极管 |
| 文件： | 总15页 (文件大小：1084K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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SLUS241D − MARCH 1994 - REVISED NOVEMBER 2003
D
D
D
D
D
D
D
D
Integrated 0.15-Ω Power MOSFET
3-V to 8-V Operation
D
Unidirectional Switch
Thermal Shutdown
Fault-Output Indicator
D
D
D
Digital Programmable Current Limit
from 0 A to 3 A
Maximum-Output Current Can Be Set to 1 A
Above the Programmed Fault Level or to a
Full 4 A
Electronic Circuit Breaker Function
1µA I
When Disabled
CC
D
Power SOIC, Low-Thermal Resistance
Packaging
Programmable On-Time
Programmable Start Delay
Fixed 3% Duty Cycle
description
The UCC3912 family of hot swap power managers provides complete power management, hot swap capability,
and circuit breaker functions. The only component required to operate the device, other than supply bypassing,
is the fault timing capacitor, C . All control and housekeeping functions are integrated, and externally
T
programmable. These include the fault current level, maximum output-sourcing current, maximum fault time,
and startup delay. In the event of a constant fault, the internal fixed 3% duty cycle ratio limits average output
power.
The internal 4-bit DAC allows programming of the fault level current from 0 A to 3 A with 0.25-A resolution. The
IMAX control pin sets the maximum sourcing current to 1 A above the fault level when driven low, and to a full
4 A when driven high for applications which require fast output capacitor charging.
When the output current is below the fault level, the output MOSFET is switched on with a nominal on resistance
of 0.15 Ω. When the output current exceeds the fault level, but is less than the maximum sourcing level, the
output remains switched on, but the fault timer starts charging C . Once C charges to a preset threshold, the
T
T
switch is turned off, and remains off for 30 times the programmed fault time. When the output current reaches
the maximum sourcing level, the MOSFET transitions from a switch to a constant current source. (continued)
block diagram
H = 4 A
2
3
VIN
VIN
IMAX 10
30 mV
V
REVERSE VOLTAGE
COMPARATOR
CHARGE
PUMP
−
+
OUT
CURRENT SENSE
4 A
POWER
FET
+
−
MAX CURRENT
LEVEL
LINEAR CURRENT AMPLIFIER
H = OPEN
1 A
ABOVE
FAULT
ON TIME
CONTROL
14 VOUT
15 VOUT
CURRENT FAULT
LEVEL 0A TO 3 A
+
−
3% DUTY
CYCLE
THERMAL
SHUTDOWN
OVERCURRENT
COMPARATOR
1.5 V
0 A−3 A
0.25
RES
+
−
INTERNAL
BIAS
1
SHTDWN
6
7
8
9
5
4
13 12
11
16
UDG-99146
B3 B2 B1 B0
4 BIT DAC
GND
CT
FAULT
HEATSINK
GND PINS
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2003, Texas Instruments Incorporated
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SLUS241D − MARCH 1994 - REVISED NOVEMBER 2003
description (continued)
The UCC3912 family is designed for unidirectional current flow, emulating an ideal diode in series with the power
switch. This feature is particularly attractive in applications where many devices are powering a common bus,
such as with SCSI Termpwr.
The UCC3912 family can be put into sleep mode drawing only 1-µA of supply current. The SHTDWN pin has
a preset threshold hysteresis which allows the user the ability to set a time delay upon startup to achieve
sequencing of power. Other features include an open drain FAULT output indicator, thermal shutdown, under
voltage lockout, and a low thermal resistance small outline package.
†}
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 V
FAULT sink current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
FAULT voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to V
IN
Output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Self Limiting
Input voltage
(B0, B1, B2, B3, IMAX, SHTDWN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to V
IN
Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to 150°C
stg
Operating junction temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to 150°C
J
Lead temperature (soldering, 10 sec.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
†
‡
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Currents are positive into, negative out of the specified terminal. Consult Packaging Section of the Interface Products Data book (TI Literature
Number SLUD002) for thermal limitations and considerations of packages.
package information
TSSOP-24,
PWP Package
(TOP VIEW)
DIL-16, SOIC-16
N, DP Package
(TOP VIEW)
SHTDWN1
N/C 2
24 FAULT
23 N/C
VIN 3
22 VOUT
21 VOUT
20 GND*
19 GND*
18 GND*
17 GND*
16 GND*
15 CT
VIN
4
GND* 5
GND* 6
GND* 7
GND* 8
EGND* 9
B3 10
B2 11
14 IMAX
13 B0
B1 12
*Pin 5 serves as lowest impedance to the electrical
ground; Pins 4, 12, and 13 serve as heat sink/ground.
These pins should be connected to large etch areas to
help dissipate heat. For N package, pins 4, 12, and 13
are N/C.
*Pin 9 serves as lowest impedance to the electrical ground;
other GND pins serve as heat sink/ground. These pins should
be connected to large etch areas to help dissipate heat.
2
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ꢔ
SLUS241D − MARCH 1994 - REVISED NOVEMBER 2003
electrical characteristics, these specifications apply for T = −40°C to 85°C for the UCC2912;
A
T
= 0°C to 70°C for the UCC3912, VIN = 5 V, IMAX = 0.4 V, SHTDWN = 2.4 V
A
(unless otherwise stated)
supply section
PARAMETER
Voltage input range
Supply current
TEST CONDITIONS
MIN
3.0
TYP
MAX
8.0
UNITS
V
1.0
0.5
2.0
5.0
mA
µA
Sleep mode current
SHTDWN = 0.2 V
NOTE 1: All voltages are with respect to ground. Current is positive into and negative out of the specified terminal.
output section
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
V
I
I
I
I
I
I
= 1 A
= 2 A
= 3 A
= 1A,
= 2 A,
= 3 A,
0.15
0.3
0.22
0.45
0.68
0.27
0.56
0.8
OUT
OUT
OUT
OUT
OUT
OUT
V
0.45
0.17
0.35
0.5
V
Voltage drop
VIN = 3 V
V
VIN = 3 V
V
VIN = 3 V
V
Reverse leakage current
Initial startup time
V
< V
OUT
,
SHTDWN = 0.2 V, V
= 5 V
OUT
5
20
µA
µs
ns
°C
°C
IN
See Note 2
See Note 2
See Note 2
See Note 2
100
100
170
10
Short circuit response
Thermal shutdown
Thermal hysteresis
NOTE 1: All voltages are with respect to ground. Current is positive into and negative out of the specified terminal.
NOTE 2: Ensured by design. Not production tested.
DAC section
PARAMETER
TEST CONDITIONS
Code = 0000−0011
MIN
TYP
MAX
UNITS
µA
A
Output leakage
0
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
2.25
2.50
2.75
3.0
20
0.45
0.75
1.0
Code = 0100
Code = 0101
0.1
0.25
0.5
A
Code = 0110
A
Code = 0111
0.75
1.0
1.25
1.5
A
Code = 1000
A
Code = 1001
1.25
1.5
1.75
2.0
A
Trip current
Code = 1010
A
Code = 1011
1.7
2.3
A
Code = 1100
1.9
2.58
2.9
A
Code = 1101
2.1
A
Code = 1110
2.3
3.2
A
Code = 1111
2.5
3.5
A
Maximum output current
Code = 0000 to 0011
UCC2912 Code = 0100 to 1111,
UCC3912 Code = 0100 to 1111,
0.02
2.0
mA
A
I
I
I
= 0 V
0.5
0.5
3.0
1.0
1.0
4.0
MAX
MAX
MAX
Maximum output current over trip
(current source mode)
= 0 V
1.8
A
Maximum output current (current source mode)
Code = 0100 to 1111,
= 2.4 V
5.2
A
NOTE 1: All voltages are with respect to ground. Current is positive into and negative out of the specified terminal.
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SLUS241D − MARCH 1994 - REVISED NOVEMBER 2003
electrical characteristics, these specifications apply for T = −40°C to 85°C for the UCC2912;
A
T
= 0°C to 70°C for the UCC3912, VIN = 5 V, IMAX = 0.4 V, SHTDWN = 2.4 V
A
(unless otherwise stated)
timer section
PARAMETER
TEST CONDITIONS
MIN
−45.0
0.72
0.72
2.0
TYP
-36.0
MAX
−22.0
1.57
1.50
6.0
UNITS
µA
µA
µA
%
CT charge current
V
V
V
V
= 1.0 V
= 1.0 V
= 1.0 V
CT
UCC2912
UCC3912
1.20
1.20
3.0
CT
CT discharge current
CT
Output duty cycle
CT fault threshold
CT reset threshold
= 0 V
OUT
1.3
1.5
1.7
V
0.4
0.5
0.6
V
NOTE 1: All voltages are with respect to ground. Current is positive into and negative out of the specified terminal.
shutdown section
PARAMETER
Shutdown threshold
TEST CONDITIONS
MIN
1.1
TYP
MAX
UNITS
V
1.5
100
100
1.9
Shutdown hysteresis
Input current
mV
nA
SHTDWN = 1 V
500
fault output section
PARAMETER
Output leakage current
Low level output voltage
TEST CONDITIONS
TEST CONDITIONS
MIN
MIN
TYP
MAX
500
0.8
UNITS
nA
I
= 10 mA
0.4
V
OUT
TTL input dc characteristics section
PARAMETER
TYP
MAX
UNITS
V
TTL input voltage high
TTL input voltage low
TTL input high current
TTL input low current
(can be connected to V
IN
)
2.0
0.8
10
1
V
V
V
= 2.4 V
= 0.4 V
3
µA
µA
IH
IL
NOTE 1: All voltages are with respect to ground. Current is positive into and negative out of the specified terminal.
pin description
B0−B3: These pins provide digital input to the DAC which sets the fault current threshold. They can be used
to provide a digital soft-start, adaptive current limiting.
CT: A capacitor connected to ground sets the maximum fault time. The maximum fault time must be more than
the time to charge the external capacitance in one cycle. The maximum fault time is defined as
3
FAULT = 27.8 × 10 × CT. Once the fault time is reached the output will shutdown for a time given by:
3
T
= 833 × 10 × CT, this equates to a 3% duty cycle.
SD
FAULT: Open drain output which pulls low upon any condition which causes the output to open: fault, thermal
shutdown, or shutdown.
IMAX: When this pin is set to logic low the maximum sourcing current will always be 1 A above the programmed
fault level. When set to logic high, the maximum sourcing current will be a constant 4 A for applications which
require fast charging of load capacitance.
4
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SLUS241D − MARCH 1994 - REVISED NOVEMBER 2003
pin description (continued)
SHTDWN: When this pin is brought to a logic low, the IC is put into a sleep mode drawing typically less than
1 µA of I . The input threshold is hysteretic, allowing the user to program a startup delay with an external RC
CC
circuit.
VIN: Input voltage to the UCC3912. The recommended voltage range is 3 V to 8 V. Both VIN pins should be
connected together and to the power source.
VOUT: Output voltage from the UCC3912. When switched the output voltage will be approximately
V
− (0.15 Ω × I
). Both VOUT pins should be connected together and to the load.
IN
OUT
APPLICATION INFORMATION
4
12 13
5
GND
HEAT SINK
GND PINS
V
V
OUT
IN
2
3
14
15
VIN
VOUT
R1
R
L
C
C
OUT
IN
D1
UCC2912
UCC3912
LED
R
V
SD
IN
S6
16 FAULT
11 CT
SHTDWN
1
C
SD
B3
B2
7
B1
8
B0 IMAX
C
T
6
9
10
V
IN
DIP
SWITCH
S1
S2
S3
S4
S5
NOTE: For demonstration board schematic see Design Note DN-58 (TI Literature Number SLUA187).
UDG-99171
Figure 1. Evaluation Circuit
protecting the UCC3912 from voltage transients
The parasitic inductance associated with the power distribution can cause a voltage spike at V if the load
IN
current is suddenly interrupted by the UCC3912. It is important to limit the peak of this spike to less than 8 V
to prevent damage to the UCC3912. This voltage spike can be minimized by:
D
D
D
Reducing the power distribution inductance (e.g., twist the positive and negative leads of the power supply
feeding V , locate the power supply close to the UCC3912, use a PCB ground plane,...etc.).
IN
Decoupling V with a capacitor, C (refer to Figure 1), located close to pins 2 and 3. This capacitor is
IN
IN
typically less than 1 µF to limit the inrush current.
Clamping the voltage at V below 8 V with a zener diode, D1 (refer to Figure 1), located close to pins 2
IN
and 3.
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SLUS241D − MARCH 1994 - REVISED NOVEMBER 2003
APPLICATION INFORMATION
UDG-93019-4
Figure 2. Load Current, Timing-Capacitor Voltage, and Output Voltage of the UCC3912 Under Fault
Conditions.
estimating maximum load capacitance
For hot-swap applications, the rate at which the total output capacitance can be charged depends on the
maximum output current available and the nature of the load. For a constant-current current-limited controller,
the output will come up if the load asks for less than the maximum available short-circuit current.
To ensure recovery of a duty-cycle from a short-circuited load condition, there is a maximum total output
capacitance which can be charged for a given unit ON time (fault time). The design value of ON or fault time
can be adjusted by changing the timing capacitor C .
T
For worst-case constant-current load of value just less than the trip limit; C
can be estimated from:
OUT(max)
3
28 10 CT
[ ǒIMAX
Ǔ
C
* I
ǒ Ǔ
OUT(max)
LOAD
V
OUT
where V
is the output voltage.
OUT
6
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SLUS241D − MARCH 1994 - REVISED NOVEMBER 2003
APPLICATION INFORMATION
For a resistive load of value RL, the value of C
can be estimated from:
OUT(max)
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3
28 10 CT
C
[
OUT(max)
ȡ
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ȧ
ȧ
ȧRL ȏn
1
ȧ
ȧ
ȧ
ȧ
V
ȧ
ȧ
ȧ
ȧ
OUT
Ȣ1*
Ȥ
ǒ Ǔ
I
RL
MAX
Ȣ
Ȥ
The overcurrent comparator senses both the DAC output and a representation of the output current. When the
output current exceeds the programmed level the timing capacitor C charges with 36 µA of current. If the fault
T
occurs for the time it takes for C to charge up to 1.5 V, the fault latch is set and the output switch is opened.
T
The output remains opened until C discharges to 0.5 V with a 1.2-µA current source. Once the 0.5 V is reached
T
the output is enabled and will either appear as a switch, if the fault is removed, or a current source if the fault
remains. If the over current condition is still present, then C will begin charging, starting the cycle over, resulting
T
in approximately a 3% on time.
UDG-94019-1
Figure 3. UCC3912 On-Time Circuitry
7
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ꢋ
ꢔ
ꢆ
ꢇ
ꢋ
ꢊ
ꢌ
ꢍ
ꢎ
ꢏ
ꢈ
ꢐ
ꢑ
ꢒꢊ
ꢆ
ꢆ
ꢈꢒ
ꢎ
ꢇ
ꢋ
ꢊ
ꢓ
ꢊ
ꢉ
ꢎ
ꢇ
SLUS241D − MARCH 1994 - REVISED NOVEMBER 2003
APPLICATION INFORMATION
UDG-94019-1
Figure 4. R
vs. Temperature at 2-A Load Current.
DS(on)
safety recommendations
Although the UCC3912 family is designed to provide system protection for all fault conditions, all integrated
circuits can ultimately fail short. For this reason, if the UCC3912 is intended for use in safety critical applications
where UL or some other safety rating is required, a redundant safety device such as a fuse should be placed
in series with the device. The UCC3912 will prevent the fuse from blowing virtually for all fault conditions,
increasing system reliability and reducing maintenance cost, in addition to providing the hot swap benefits of
the device.
8
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
UCC2912DP
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
16
16
16
16
16
16
24
24
24
24
16
16
16
16
24
24
24
24
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
UCC2912DPG4
UCC2912DPR
SOIC
SOIC
D
D
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
UCC2912DPRG4
UCC2912N
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
PDIP
N
25 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
UCC2912NG4
PDIP
N
25 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
UCC2912PWP
UCC2912PWPG4
UCC2912PWPR
UCC2912PWPRG4
UCC3912DP
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
PW
PW
PW
PW
D
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
UCC3912DPG4
UCC3912DPTR
UCC3912DPTRG4
UCC3912PWP
UCC3912PWPG4
UCC3912PWPTR
UCC3912PWPTRG4
SOIC
D
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jul-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
UCC2912PWPR
UCC3912PWPTR
TSSOP
TSSOP
PW
PW
24
24
2000
2000
330.0
330.0
16.4
16.4
6.95
6.95
8.3
8.3
1.6
1.6
8.0
8.0
16.0
16.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jul-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
UCC2912PWPR
UCC3912PWPTR
TSSOP
TSSOP
PW
PW
24
24
2000
2000
346.0
346.0
346.0
346.0
33.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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