SBB-5000 [RFMD]

0.05GHz to 6GHz, CASCADABLE ACTIVE BIAS InGaP HBT MMIC AMPLIFIER; 0.05GHZ到6GHz ,可级联的有源偏置的InGaP HBT MMIC放大器
SBB-5000
型号: SBB-5000
厂家: RF MICRO DEVICES    RF MICRO DEVICES
描述:

0.05GHz to 6GHz, CASCADABLE ACTIVE BIAS InGaP HBT MMIC AMPLIFIER
0.05GHZ到6GHz ,可级联的有源偏置的InGaP HBT MMIC放大器

放大器
文件: 总6页 (文件大小:202K)
中文:  中文翻译
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SBB-5000  
0.05GHz to  
6GHz, Cascad-  
able Active  
Bias InGaP  
HBT MMIC  
Amplifier  
Preliminary  
SBB-5000  
0.05GHz to 6GHz, CASCADABLE ACTIVE BIAS  
InGaP HBT MMIC AMPLIFIER  
Package: Bare Die  
Product Description  
Features  
RFMD’s SBB-5000 is a high performance InGaP HBT MMIC amplifier utilizing a Dar-  
lington configuration with an active bias network. The active bias network provides  
stable current over temperature and process Beta variations. Its efficient operation  
from a single 5V supply and its compact size (0.59mmx0.70mm) make it ideal for  
high-density multi-chip module applications. It is well-suited for high linearity 5V  
gain block applications and it is internally matched to 50Ω.  
„
OIP3=35dBm @ 2000MHz  
=20.5dBm @ 2000MHz  
„
P
1dB  
„
„
Single Fixed 5V Supply  
Compact Die Size  
(0.59mmx0.70mm)  
RFMD can provide 100% DC screening, visual inspection, and Hi-Rel water qualifi-  
cation. Die can be delivered at the wafer level or picked to gel  
„
„
Patented Thermal Design &  
Bias Circuit  
or waffle paks.  
Optimum Technology  
Matching® Applied  
Low Thermal Resistance  
Gain and Return Loss versus Frequency  
VS=5V, IS=75mA  
GaAs HBT  
GaAs MESFET  
InGaP HBT  
SiGe BiCMOS  
Si BiCMOS  
SiGe HBT  
30.0  
20.0  
10.0  
0.0  
Applications  
„
PA Driver Amplifier  
9
„
RF Pre-driver and RF Receive  
Path  
GSG Probe Data with Bias Tees  
ZS=ZL=50 Ohms, T=25°C  
„
„
Military Communications  
Test and Instrumentation  
-10.0  
-20.0  
-30.0  
-40.0  
GaAs pHEMT  
Si CMOS  
IRL  
Gain  
ORL  
Si BJT  
GaN HEMT  
RF MEMS  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
Frequency (GHz)  
Specification  
Typ.  
Parameter  
Unit  
Condition  
Min.  
50  
Max.  
6000  
Frequency of Operation  
Small Signal Gain  
MHz  
dB  
dB  
20.5  
20.5  
20.0  
21.0  
20.5  
17.0  
37.0  
35.0  
30.0  
15.0  
12.0  
75.0  
3.9  
Frequency=500MHz  
Frequency=2000Mhz  
Frequency=4000MHz  
Frequency=500MHz  
Frequency=2000MHz  
Frequency=4000MHz  
Frequency=500MHz  
Frequency=2000MHz  
Frequency=4000MHz  
Frequency=2000MHz  
Frequency=2000MHz  
dB  
Output Power at 1dB Compression  
Output IP3  
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
dB  
dB  
mA  
dB  
Input Return Loss  
Output Return Loss  
Current  
Noise Figure  
Frequency=2000MHz  
Thermal Resistance  
69.9  
°C/W  
Junction to lead (89 pkg)  
Test Conditions: Z =50Ω, V =5V, I =75mA, T=25°C, OIP3 Tone Spacing=1MHz, P /tone=0dBm. GSG Probe Data with Bias Tees.  
0
D
D
OUT  
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-  
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.  
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or techni-  
cal support, contact RFMD at (+1) 336-678-5570 or sales-sup-  
EDS-106102 Rev A  
1 of 6  
Preliminary  
SBB-5000  
Absolute Maximum Ratings  
Parameter  
Caution! ESD sensitive device.  
Rating  
100  
Unit  
mA  
V
Exceeding any one or a combination of the Absolute Maximum Rating conditions may  
cause permanent damage to the device. Extended application of Absolute Maximum  
Rating conditions to the device may reduce device reliability. Specified typical perfor-  
mance or functional operation of the device under Absolute Maximum Rating condi-  
tions is not implied.  
Total Current (I )  
D
Device Voltage (V )  
5.5  
D
Power Dissipation  
0.55  
W
RoHS status based on EUDirective2002/95/EC (at time of this document revision).  
Operating Lead Temperature (T )  
L
-40 to +85  
°C  
The information in this publication is believed to be accurate and reliable. However, no  
responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any  
infringement of patents, or other rights of third parties, resulting from its use. No  
license is granted by implication or otherwise under any patent or patent rights of  
RFMD. RFMD reserves the right to change component circuitry, recommended appli-  
cation circuitry and specifications at any time without prior notice.  
RF Input Power  
+12 (TBR)*  
-55 to +150  
+150  
dBm  
°C  
Storage Temperature Range  
Operating Junction Temperature (T )  
J
°C  
ESD Rating - Human Body Model  
(HBM)  
Class 1C  
* TBR=To Be Reviewed  
Operation of this device beyond any one of these limits may cause permanent dam-  
age. For reliable continuous operation, the device voltage and current must not  
exceed the maximum operating values specified in the table on page one.  
Bias Conditions should also satisfy the following expression:  
I V <(T -T )/R , j-l  
D
D
J
L
TH  
Typical Performance (GSG Probe Data with Bias Tees) VD=5V, ID=75mA, T=25°C, Z=50Ω  
Parameter  
Units  
dB  
dBm  
500MHz 1000MHz 1500MHz 2000MHz 3000MHz 4000MHz  
Small Signal Gain  
20.5  
37.0  
20.5  
36.0  
20.5  
35.0  
20.5  
35.0  
20.5  
33.0  
20.0  
30.0  
Output 3rd Order Intercept Point  
(see note 1)  
Output Power at 1dB Compression  
Input Return Loss  
dBm  
dB  
dB  
dB  
dB  
21.0  
27.0  
22.0  
22.1  
3.8  
20.5  
21.0  
18.0  
22.5  
4.0  
20.5  
17.0  
14.6  
22.4  
3.9  
20.5  
15.0  
12.0  
22.9  
3.9  
19.5  
11.0  
9.0  
23.0  
4.0  
17.0  
9.5  
7.2  
23.0  
3.8  
Output Return Loss  
Reverse Isolation  
Noise Figure  
Note 1: 0dBm/tone, 1MHz spacing  
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or techni-  
cal support, contact RFMD at (+1) 336-678-5570 or sales-sup-  
2 of 6  
EDS-106102 Rev A  
Preliminary  
SBB-5000  
Typical Performance (GSG Probe Data with Bias Tees) VD=5.0V, ID=75mA  
P1dB versus Frequency  
OIP3 versus Frequency  
(0dBm/Tone, 1MHz Spacing)  
24.0  
22.0  
20.0  
18.0  
16.0  
14.0  
12.0  
10.0  
45.0  
40.0  
35.0  
30.0  
25.0  
20.0  
-20°C  
25°C  
85°C  
-20°C  
25°C  
85°C  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
Frequency (GHz)  
Frequency (GHz)  
Current versus Voltage  
Noise Figure versus Frequency  
90.0  
85.0  
80.0  
75.0  
70.0  
65.0  
60.0  
55.0  
50.0  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
-20°C  
25°C  
85°C  
25°C  
85°C  
4.8  
4.9  
5.0  
5.1  
5.2  
5.3  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
VD (V)  
Frequency (GHz)  
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or techni-  
cal support, contact RFMD at (+1) 336-678-5570 or sales-sup-  
EDS-106102 Rev A  
3 of 6  
Preliminary  
SBB-5000  
Typical Performance (GSG Probe Data with Bias Tees) VD=5.0V, ID=75mA  
S11 versus Frequency  
S21 versus Frequency  
0.0  
24.0  
22.0  
20.0  
18.0  
16.0  
14.0  
-20°C  
25°C  
85°C  
-5.0  
-10.0  
-15.0  
-20.0  
-25.0  
-30.0  
-20°C  
25°C  
85°C  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
Frequency (GHz)  
Frequency (GHz)  
S12 versus Frequency  
S22 versus Frequency  
0.0  
-5.0  
0.0  
-5.0  
-10.0  
-15.0  
-20.0  
-25.0  
-30.0  
-10.0  
-15.0  
-20.0  
-25.0  
-30.0  
-20°C  
25°C  
85°C  
-20°C  
25°C  
85°C  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
Frequency (GHz)  
Frequency (GHz)  
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or techni-  
cal support, contact RFMD at (+1) 336-678-5570 or sales-sup-  
4 of 6  
EDS-106102 Rev A  
Preliminary  
SBB-5000  
Pin  
Function  
RF IN  
RF OUT  
DIE  
Description  
This pad is DC coupled and matched to 50Ω. An external DC block is required.  
This pad is DC coupled and matched to 50Ω. DC bias is applied through this pad.  
Die backside must be connected to RF/DC ground using silver filled conductive epoxy.  
BACKSIDE  
Notes:  
1. All dimensions in inches [millimeters].  
2. Die thickness is 0.004 [0.100].  
3. Typical bond pad is 0.003x0.006  
4. Backside metallization: Gold.  
5. Bond pad metallization: Gold.  
6. Backside is ground.  
Die Dimensions  
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or techni-  
cal support, contact RFMD at (+1) 336-678-5570 or sales-sup-  
EDS-106102 Rev A  
5 of 6  
Preliminary  
SBB-5000  
Device Assembly  
Ordering Information  
Part Number  
Description  
Devices/Container  
SBB-5000  
Bare Die  
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or techni-  
cal support, contact RFMD at (+1) 336-678-5570 or sales-sup-  
6 of 6  
EDS-106102 Rev A  

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