NBB-310-PCBA-41X [RFMD]
CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO 12GHz; 级联宽带的GaAs MMIC放大器直流到12GHz的
| 型号： | NBB-310-PCBA-41X |
| 厂家： | 
RF MICRO DEVICES |
| 描述： | CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO 12GHz |
| 文件： | 总12页 (文件大小：281K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NBB-310
CASCADABLE BROADBAND
GaAs MMIC AMPLIFIER DC TO 12GHz
RoHS Compliant & Pb-Free Product
Package Style: Micro-X, 4-Pin, Ceramic
Features
Reliable, Low-Cost HBT Design
13dB Gain
GND
4
MARKING - N6
High P1dB of +15.2dBm at
6GHz
RF IN
1
3 RF OUT
Single Power Supply Operation
50Ω I/O Matched for High Freq.
Use
2
GND
Applications
Narrow and Broadband Commer-
cial and Military Radio Designs
Linear and Saturated Amplifiers
Functional Block Diagram
Gain Stage or Driver Amplifiers
for MWRadio/Optical Designs
(PTP/PMP/
LMDS/UNII/VSAT/WLAN/Cellu-
lar/DWDM)
Product Description
The NBB-310 cascadable broadband InGaP/GaAs MMIC amplifier is a low-cost,
high-performance solution for general purpose RF and microwave amplification
needs. This 50Ω gain block is based on a reliable HBT proprietary MMIC design,
providing unsurpassed performance for small-signal applications. Designed with an
external bias resistor, the NBB-310 provides flexibility and stability. The NBB-310 is
packaged in a low-cost, surface-mount ceramic package, providing ease of assem-
bly for high-volume tape-and-reel requirements. It is available in either packaged or
chip (NBB-310-D) form, where its gold metallization is ideal for hybrid circuit
designs.
Ordering Information
NBB-310
NBB-310-T1
NBB-310-D
Cascadable Broadband GaAs MMIC Amplifier DC to 12GHz
Tape & Reel, 1000 Pieces
NBB-310 Chip Form (100 pieces minimum order)
NBB-310-PCBA-41X Fully Assembled Evaluation Board
NBB-X-K1 Extended Frequency InGaP Amp Designer’s Tool Kit
Optimum Technology Matching® Applied
GaAs HBT
GaAs MESFET
InGaP HBT
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
9
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A11 DS070327
1 of 12
NBB-310
Absolute Maximum Ratings
Parameter
RF Input Power
Rating
+20
Unit
dBm
mW
mA
Caution! ESD sensitive device.
Power Dissipation
350
Device Current
70
The information in this publication is believed to be accurate and reliable. How-
ever, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use,
nor for any infringement of patents, or other rights of third parties, resulting
from its use. No license is granted by implication or otherwise under any patent
or patent rights of RFMD. RFMD reserves the right to change component cir-
cuitry, recommended application circuitry and specifications at any time without
prior notice.
Channel Temperature
Operating Temperature
Storage Temperature
200
°C
-45 to +85
-65 to +150
°C
°C
Exceeding any one or a combination of these limits may cause permanent
damage.
Specification
Parameter
Unit
Condition
Min.
Typ.
Max.
V =+5V, I =50mA, Z =50Ω, T =+25°C
Overall
D
CC
0
A
Small Signal Power Gain, S21
12.5
12.0
11.0
9.0
13.0
12.5
11.5
dB
dB
dB
dB
dB
f=0.1GHz to 1.0GHz
f=1.0GHz to 4.0GHz
f=4.0GHz to 8.0GHz
f=8.0GHz to 12.0GHz
f=0.1GHz to 8.0GHz
f=0.1GHz to 7.0GHz
f=7.0GHz to 10.0GHz
10.0
Gain Flatness, GF
±0.6
1.4:1
1.75:1
2.0:1
12.0
Input and Output VSWR
f=10.0GHz to 12.0GHz
BW3 (3dB)
Bandwidth, BW
GHz
Output Power @
-1dB Compression, P1dB
13.8
15.2
14.5
12.0
4.9
dBm
dBm
dBm
dBm
dB
f=2.0GHz
f=6.0GHz
f=8.0GHz
f=12.0GHz
f=3.0GHz
Noise Figure, NF
Third Order Intercept, IP3
Reverse Isolation, S12
+24.0
-17
dBm
dB
f=2.0GHz
f=0.1GHz to 12.0GHz
Device Voltage, V
4.4
4.65
4.9
V
D
Gain Temperature Coefficient,
-0.0015
dB/°C
δG /δT
T
MTTF versus Temperature
@ ICC=50mA
Case Temperature
Junction Temperature
MTTF
85
139
°C
°C
>1,000,000
hours
Thermal Resistance
θ
216
°C/W
JC
JT – TCASE
--------------------------
= θJC(°C ⁄ Watt)
VD ⋅ ICC
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
2 of 12
Rev A11 DS070327
NBB-310
Pin
1
Function
RF IN
Description
Interface Schematic
RF input pin. This pin is NOT internally DC blocked. A DC blocking capacitor,
suitable for the frequency of operation, should be used in most applica-
tions. DC coupling of the input is not allowed, because this will override the
internal feedback loop and cause temperature instability.
Ground connection. For best performance, keep traces physically short
and connect immediately to ground plane.
2
3
GND
RF output and bias pin. Biasing is accomplished with an external series
RF OUT
resistor and choke inductor to V . The resistor is selected to set the DC
CC
RF OUT
current into this pin to a desired level. The resistor value is determined by
the following equation:
(VCC – VDEVICE
)
-------------------------------------------
R =
ICC
RF IN
Care should also be taken in the resistor selection to ensure that the cur-
rent into the part never exceeds maximum datasheet operating current
over the planned operating temperature. This means that a resistor
between the supply and this pin is always required, even if a supply near
8.0V is available, to provide DC feedback to prevent thermal runaway.
Because DC is present on this pin, a DC blocking capacitor, suitable for the
frequency of operation, should be used in most applications. The supply
side of the bias network should also be well bypassed.
Same as pin 2.
4
GND
Package Drawing
45°
0.055
(1.40)
UNITS:
Inches
(mm)
0.040
(1.02)
0.070
(1.78)
0.020
0.200 sq.
(5.08)
0.005
(0.13)
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A11 DS070327
3 of 12
NBB-310
Typical Bias Configuration
Application notes related to biasing circuit, device footprint, and thermal considerations are available on request.
VCC
RCC
4
2
L choke
(optional)
1
3
In
Out
C block
C block
VDEVICE
VD = 5 V
Recommended Bias Resistor Values
Supply Voltage, V (V)
8
10
12
140
15
20
300
CC
Bias Resistor, R (Ω)
60
100
200
CC
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
4 of 12
Rev A11 DS070327
NBB-310
Chip Outline Drawing - NBB-310-D
Chip Dimensions: 0.017” x 0.017” x 0.004”
UNITS:
Inches
(mm)
Back of chip is ground.
OUTPUT
INPUT
0.017 ± 0.001
(0.44 ± 0.03)
GND
VIA
0.017 ± 0.001
(0.44 ± 0.03)
0.004 ± 0.001
(0.10 ± 0.03)
Sales Criteria - Unpackaged Die
Die Sales Information
• All segmented die are sold 100% DC-tested. Testing parameters for wafer-level sales of die material shall be nego-
tiated on a case-by-case basis.
• Segmented die are selected for customer shipment in accordance with RFMD Document #6000152 - Die Product
Final Visual Inspection Criteria1.
• Segmented die has a minimum sales volume of 100 pieces per order. A maximum of 400 die per carrier is allow-
able.
Die Packaging
• All die are packaged in GelPak ESD protective containers with the following specification:
O.D.=2"X2", Capacity=400 Die (20X20 segments), Retention Level=High(X0).
• GelPak ESD protective containers are placed in a static shield bag. RFMD recommends that once the bag is
opened the GelPak/s should be stored in a controlled nitrogen environment. Do not press on the cover of a closed
GelPak, handle by the edges only. Do not vacuum seal bags containing GelPak containers.
• Precaution must be taken to minimize vibration of packaging during handling, as die can shift during transit 2.
Package Storage
• Unit packages should be kept in a dry nitrogen environment for optimal assembly, performance, and reliability.
• Precaution must be taken to minimize vibration of packaging during handling, as die can shift during transit2.
Die Handling
• Proper ESD precautions must be taken when handling die material.
• Die should be handled using vacuum pick-up equipment, or handled along the long side with a sharp pair of twee-
zers. Do not touch die with any part of the body.
• When using automated pick-up and placement equipment, ensure that force impact is set correctly. Excessive force
may damage GaAs devices.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A11 DS070327
5 of 12
NBB-310
Die Attach
• The die attach process mechanically attaches the die to the circuit substrate. In addition, the utilization of proper die
attach processes electrically connect the ground to the trace on which the chip is mounted. It also establishes the
thermal path by which heat can leave the chip.
• Die should be mounted to a clean, flat surface. Epoxy or eutectic die attach are both acceptable attachment meth-
ods. Top and bottom metallization are gold. Conductive silver-filled epoxies are recommended. This procedure
involves the use of epoxy to form a joint between the backside gold of the chip and the metallized area of the sub-
strate.
• All connections should be made on the topside of the die. It is essential to performance that the backside be well
grounded and that the length of topside interconnects be minimized.
• Some die utilize vias for effective grounding. Care must be exercised when mounting die to preclude excess run-out
on the topside.
Die Wire Bonding
• Electrical connections to the chip are made through wire bonds. Either wedge or ball bonding methods are accept-
able practices for wire bonding.
• All bond wires should be made as short as possible.
Notes
1RFMD Document #6000152 - Die Product Final Visual Inspection Criteria. This document provides guidance for die inspec-
tion personnel to determine final visual acceptance of die product prior to shipping to customers.
2RFMD takes precautions to ensure that die product is shipped in accordance with quality standards established to minimize
material shift. However, due to the physical size of die-level product, RFMD does not guarantee that material will not shift dur-
ing transit, especially under extreme handling circumstances. Product replacement due to material shift will be at the discre-
tion of RFMD.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
6 of 12
Rev A11 DS070327
NBB-310
Extended Frequency InGaP Amplifier Designer’s Tool Kit
NBB-X-K1
This tool kit was created to assist in the design-in of the RFMD NBB- and NLB-series InGap HBT gain block amplifiers. Each tool
kit contains the following.
• 5 each NBB-300, NBB-310 and NBB-400 Ceramic Micro-X Amplifiers
• 5 each NLB-300, NLB-310 and NLB-400 Plastic Micro-X Amplifiers
• 2 Broadband Evaluation Boards and High Frequency SMA Connectors
• Broadband Bias Instructions and Specification Summary Index for ease of operation
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A11 DS070327
7 of 12
NBB-310
Tape and Reel Dimensions
All Dimensions in Millimeters
Carrier tape basic dimensions are based on EIA 481. The pocket is designed to hold the part for shipping and loading onto SMT
manufacturing equipment, while protecting the body and the solder terminals from damaging stresses. The individual pocket
design can vary from vendor to vendor, but width and pitch will be consistent.
Carrier tape is wound or placed onto a shipping reel 178 mm (7 inches) in diameter. The center hub design is large enough to
ensure the radius formed by the carrier tape around it does not put unnecessary stress on the parts.
Prior to shipping, moisture sensitive parts (MSL Level 2a-5a) are baked and placed into the pockets of the carrier tape. A cover
tape is sealed over the top of the entire length of the carrier tape. The reel is sealed in a moisture barrier ESD bag with the
appropriate units of desiccant and a humidity indicator card, which is placed in a cardboard shipping box. It is important to
note that unused moisture sensitive parts need to be resealed in the moisture barrier bag. If the reels exceed the exposure
limit and need to be rebaked, most carrier tape and shipping reels are not rated as bakeable at 125°C. If baking is required,
devices may be baked according to section 4, table 4-1, column 8 of Joint Industry Standard IPC/JEDEC J-STD-033.
Table 1 provides useful information for carrier tape and reels used for shipping the devices described in this document.
Table 1. Tape and Reel
Reel
Diameter
Inch (mm)
Hub
Diameter
Inch (mm)
Width
(mm)
Pocket Pitch
(mm)
Units per
Reel
RFMD Part Number
Feed
NBB-310
7 (178)
2.4 (61)
12
8
Single
1000
Notes:
Ao = 5.8 ±.1
Bo = 6.1 ±.1
F = 5.50 ±.05
Ko = 2.0 ±.1
P = 8.0 ±.1
1. All dimensions are in millimeters (mm).
2. Unless otherwise specified, all dimension tolerances per EIA-481.
3. 10 sprocket hole pitch cumulative tolerance ±.02.
W = 12.0 ±.3
4.0
See Note 3
+.1
Ø1.5
.0
2.00±.05
0.30±.05
1.75
W
15 inch Trailer
Top View
15 inch Leader
Pin 1
Location
Sprocket holes toward
rear of reel
F
Bo
3.1±.1
1.3±.1
Ko
1.3±.1
3.1±.1
P
Ao
Direction of Feed
Figure 1. Carrier Tape Drawing with Part Orientation
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
8 of 12
Rev A11 DS070327
NBB-310
P1dB versus Frequency at 25°C
POUT/Gain versus PIN at 6 GHz
20.0
15.0
10.0
5.0
20.0
18.0
16.0
14.0
12.0
10.0
8.0
6.0
4.0
2.0
Pout (dBm)
Gain (dB)
0.0
0.0
-2.0
1.0
3.0
5.0
7.0
9.0
11.0
13.0
15.0
-14.0
-9.0
-4.0
1.0
6.0
Frequency (GHz)
PIN (dBm)
Third Order Intercept versus Frequency at 25°C
POUT/Gain versus PIN at 14 GHz
18.0
16.0
14.0
12.0
10.0
8.0
30.0
25.0
20.0
15.0
10.0
5.0
6.0
4.0
Pout (dBm)
Gain (dB)
2.0
0.0
0.0
-15.0
-10.0
-5.0
0.0
5.0
10.0
1.0
3.0
5.0
7.0
9.0
11.0
13.0
15.0
Frequency (GHz)
PIN (dBm)
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A11 DS070327
9 of 12
NBB-310
Note: The s-parameter gain results shown below include device performance as well as evaluation board and connector loss
variations. The insertion losses of the evaluation board and connectors are as follows:
1GHz to 4GHz=-0.06dB
5GHz to 9GHz=-0.22dB
10GHz to 14GHz=-0.50dB
15GHz to 20GHz=-1.08dB
S11 versus Frequency, Over Temperature
S12 versus Frequency, Over Temperature
0.0
-10.0
-20.0
-30.0
-40.0
-50.0
-60.0
0.0
-2.0
+25 C
-40 C
+85 C
-4.0
-6.0
-8.0
-10.0
-12.0
-14.0
-16.0
-18.0
-20.0
+25 C
-40 C
+85 C
0.0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
Frequency (GHz)
Frequency (GHz)
S21 versus Frequency, Over Temperature
S22 versus Frequency, Over Temperature
16.0
14.0
12.0
10.0
8.0
0.0
-5.0
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
-40.0
-45.0
-50.0
6.0
4.0
+25 C
-40 C
+85 C
+25 C
-40 C
+85 C
2.0
0.0
0.0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
0.0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
Frequency (GHz)
Frequency (GHz)
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
10 of 12
Rev A11 DS070327
NBB-310
RoHS* Banned Material Content
RoHS Compliant:
Yes
0.019
0439
-
Package total weight in grams (g):
Compliance Date Code:
Bill of Materials Revision:
Pb Free Category:
e3
Parts Per Million (PPM)
Bill of Materials
Pb
0
Cd
0
Hg
0
Cr VI
PBB
PBDE
Die
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Molding Compound
Lead Frame
Die Attach Epoxy
Wire
0
0
0
0
0
0
0
0
0
0
0
0
Solder Plating
0
0
0
This RoHS banned material content declaration was prepared solely on information, including analytical
data, provided to RFMD by its suppliers, and applies to the Bill of Materials (BOM) revision noted
* DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 27 January 2003 on the restriction of the
use of certain hazardous substances in electrical and electronic equipment
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A11 DS070327
11 of 12
NBB-310
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
12 of 12
Rev A11 DS070327
相关型号：
©2020 ICPDF网 联系我们和版权申明